Chemical / Materials Processing Silicon Carbide and Silicon Carbide Ceramics
from Xiamen Unipretec Ceramic Technology Co., Ltd.
Aluminum oxide ceramic is a high-performance ceramic material, also known as alumina ceramic material. Composed of high-purity alumina powder, this non-metallic material is manufactured via pressing, molding, sintering, and other processes. According to the alumina content, it is classified as 92... [See More]
- Applications: Refractory or High Temperature Insulation; Bioceramics; Chemical or material processing; Corrosion resistant; Electronics or semiconductors; HV / Electrical
- Density: 3.6 to 3.95
- Max Use Temperature: 1200 to 1650
- Performance Features: Porous material
from Xiamen Unipretec Ceramic Technology Co., Ltd.
Ceramic structural balls are typically used in bearings and have a supporting function. Ceramic bearing balls are a crucial component of deep groove ball bearings, angular contact bearings, self-aligning ball bearings, thrust ball bearings, etc. [See More]
- Applications: Refractory or High Temperature Insulation; Chemical or material processing; Corrosion resistant; HV / Electrical
- Bond & Processing: Sintered / Fired
- Density: 3.2 to 6
from Xiamen Unipretec Ceramic Technology Co., Ltd.
A ceramic wafer chuck is a specialized tool employed in the semiconductor industry to hold wafers in a secure position. It functions as a stable platform that guarantees consistent contact and precise positioning of the wafer during many procedures, including lithography, etching, deposition,... [See More]
- Applications: Chemical or material processing; HV / Electrical
- Bond & Processing: Sintered / Fired
- Shape / Form: WaferCarrier
from Saint-Gobain NorPro
For many years, Saint-Gobain NorPro has been known for its range of very low surface area macroporous alpha-alumina-based carrier materials. Inert to their environment in most circumstances, the carriers play a vitally active role in many catalytic reactions. Other low-surface area catalyst carrier... [See More]
- Applications: Chemical or material processing; Customer Specified
- Width / OD: 0.1181 to 19.69
- Shape / Form: Hollow Stock (Tube, Pipe, Column) (optional feature); Custom Shape; Grannular Fill; Ferrule / Eyelet (optional feature)
- Density: 0.5599 to 1.36
from Saint-Gobain Performance Ceramics & Refractories
Technical Data. Hexoloy ® SA SiC is a pressureless, sintered form of alpha silicon carbide, with a density greater than 98 percent theoretical. It has a very fine grain structure (4 - 10 microns) for excellent wear resistance and contains no free silicon, which makes it highly chemically... [See More]
- Applications: Refractory or High Temperature Insulation; Abrasion Resistant; Chemical or material processing; Corrosion resistant; Wear resistant parts or tooling
- Max Use Temperature: 1900
- Shape / Form: KilnFurniture; Spout; WaferCarrier; Custom Shape
- Thermal Conductivity: 126
from CoorsTek
Chamber domes (sometimes referred to as lids) are used to create a clean, inert, and protected environment in deposition chambers. Chemical reactions inside the chamber deposit thin layers of metallic, dielectric, or semiconductive material onto the wafers. Chamber lids and liners are exposed to... [See More]
- Applications: Chemical or material processing
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
from Aremco Products, Inc.
Bonds SiC and Graphite Parts, principal use is high vacuum fixtures [See More]
- Applications: Refractory or High Temperature Insulation; Abrasives, ceramics or glass manufacturing; Chemical or material processing; Corrosion resistant; HV / Electrical; Fiberoptics, Radiant Heaters, Temp Probe
- CTE: 4.32E6
- Max Use Temperature: 1371
from Saint-Gobain Performance Ceramics & Refractories
Hexoloy ® SE SiC offers an excellent alternative material to metals, superalloys and other ceramics for applications such as chemical processing, high temperature furnaces, and other demanding, severe environment applications. Hexoloy SE SiC provides a full range of exceptional properties in one... [See More]
- Applications: Refractory or High Temperature Insulation; Chemical or material processing; Foundry / Metal Processing
- Max Use Temperature: 1900
- Shape / Form: Custom Shape
- Thermal Conductivity: 34.8
from CoorsTek
Rings cover the wafer edge and perimeter, protecting critical chamber components and extending their useful life. Since they are directly exposed to the deposition process, strong plasma durability and high purity are critical to final wafer yield. SEMICONDUCTOR DEPOSITION PROCESSING. Semiconductor... [See More]
- Applications: Chemical or material processing
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide
from CoorsTek
CoorsTek advanced, high-purity ceramic components are built to withstand the extreme environments in plasma etch (or "dry" etch) chambers — including vapor phase chemical etchants, high voltage RF (radio frequency) and microwave plasma, volatile byproducts, and aggressive cleaning cycles. ETCH... [See More]
- Applications: Chemical or material processing
- Shape / Form: Custom Shape
- Composition: Aluminas (Al2O3): PlasmaPure™, Sapphal™ Aluminum Nitride; PureSiC® Silicon Carbide