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Supplier: Sharp Microelectronics of the Americas
Description: High resolution. High speed. Low power. It's the winning formula for your next camera module product solution. Choose from solutions that include 4K2K, HD, Full-HD and HDR modes, among others. View our product line-up below for a variety of optical formats and features to match your program's exact
- Pixel Size: 5 µm
- Optical Format: 1 inch, 2/3 inch
- Image Sensor Type: Color, Monochrome
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Supplier: SK Hynix
Description: SK hynix manufactures CIS on CMOS technology, offering compact from factors, higher speed and superior image quality. SK hynix is enhancing its technical excellence in accelerating technology development to provide advanced quality products and ability to lead market needs.
- Horizontal Pixels: 4,208
- Vertical Pixels: 3,120
- Pixel Size: 1.4 µm
- Maximum Frame Rate: 30 fps
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Supplier: CMOSIS nv
Description: The CMV300 is a high speed CMOS image sensor with 640 by 480 pixels (1/3" optical format) developed for machine vision applications.The image array consists of 7.4μm x 7.4μm pipelined global shutter pixels allowing exposure during read out and CDS operation. The user can
- Horizontal Pixels: 640
- Vertical Pixels: 480
- Pixel Size: 7.4 µm
- Maximum Frame Rate: 480 fps
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Supplier: CMOSIS nv
Description: The CHR70M is a high resolution CMOS image sensor with 10000 by 7096 pixels. The image array consists of 3.1μm x 3.1μm pinned diode pixels which share a number of transistors (2 pixels sharing). The image sensor has 8 analog outputs, each running at 30MHz.
- Horizontal Pixels: 10,000
- Vertical Pixels: 7,096
- Pixel Size: 3.1 µm
- Maximum Frame Rate: 3 fps
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Supplier: CMOSIS nv
Description: The CMV8000 is a global shutter CMOS image sensor with 3360 by 2496 pixels in a 4/3“ optical format. The image array consists of 5.5 um by 5.5 um pipelined global shutter pixels, which allow exposure during read out while performing CDS operation reducing fixed pattern
- Horizontal Pixels: 3,360
- Vertical Pixels: 2,496
- Pixel Size: 5.5 µm
- Maximum Frame Rate: 104 fps
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Supplier: CMOSIS nv
Description: needed for read- out and exposure of the image sensor while external exposure triggering remains possible. The CMV20000 is derived from a custom CMOS image sensor. This sensor is not for sale for traffic applications.
- Horizontal Pixels: 5,120
- Vertical Pixels: 3,840
- Pixel Size: 6.4 µm
- Maximum Frame Rate: 30 fps
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Supplier: BAE Systems - Fairchild Imaging
Description: pixels. The sensor supports both Rolling Shutter and Global Shutter readout modes. The sensor has two ADC channels per row with one optimized for very low light levels and the other optimized for high light levels, allowing high dynamic range data collection in a single image.
- Horizontal Pixels: 1,920
- Vertical Pixels: 1,080
- Pixel Size: 6.5 µm
- Maximum Frame Rate: 100 fps
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Supplier: BAE Systems - Fairchild Imaging
Description: The Fairchild Imaging CIS2521F is a large format, ultra low-noise CMOS image sensor intended for scientific and industrial applications requiring high quality imaging under extremely low light conditions. The device features an array of 5 transistor (5T) pixels on a 6.5µm pitch
- Horizontal Pixels: 2,560
- Vertical Pixels: 2,160
- Pixel Size: 6.5 µm
- Maximum Frame Rate: 100 fps
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Supplier: VAST STOCK CO., LIMITED
Description: Image Sensors 1.2 MP 1/3 CMOS Image Sensor
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Supplier: Acme Chip Technology Co., Limited
Description: IC IMAGE SENSOR 4MP RGBIR RW
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Supplier: Teledyne DALSA
Description: Teledyne DALSA is pleased to offer new and expanded VNIR (visible to near infrared) multispectral image sensor capability for remote sensing applications, such as environmental observation, defense and security and other earth observation applications. Capabilities Monolithic
- Horizontal Pixels: 12,000
- Image Sensor Type: Color
- Array Type: Linear Array
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Supplier: Newark, An Avnet Company
Description: CMOS IMAGE SENSOR, 1.3MP, DEMO KIT; Kit Application Type:Sensing - Image, Light; Silicon Manufacturer:Aptina Imaging; Silicon Core Number:MT9M131; Application Sub Type:Image Sensor; Product Range:- RoHS Compliant: Yes
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Supplier: Win Source Electronics
Description: Alternative Parts (Cross-Reference): Cross Manufacturer: onsemi Category: Sensors, Transducers Optical Sensors Image Sensors, Camera Package: Tray Product Status: Active Type: CMOS Pixel Size: 8µm x 8µm Active Pixel Array: 1696H x 1710V Frames per Second: 485
- Horizontal Pixels: 1,696
- Vertical Pixels: 1,710
- Pixel Size: 8 µm
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Supplier: Newark, An Avnet Company
Description: CMOS IMAGE SENSOR, 2MP, HEADBOARD; Kit Application Type:Sensing - Image, Light; Silicon Manufacturer:Aptina Imaging; Silicon Core Number:MT9D131; Application Sub Type:Image Sensor; Kit Contents:Image sensor and lens; Product Range:- RoHS
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Supplier: Win Source Electronics
Description: Manufacturer: AMIS Category: Sensors, Transducers - Optical Sensors - Image Sensors, Camera Packaging: Bulk Part Status: Obsolete Sensor Type: Internal Output Type: Inverted Voltage - Supply: 3V Trigger Type: Positive Edge Package / Case: 4-SMD, No Lead Operating
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Description: SENSOR IMAGE CMOS 3MP 56-CSP2
- Operating Temperature: -4 to 158 F
- Imaging Technology: CMOS
- Features: Other
- Camera Function: Video
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Supplier: Hamamatsu Photonics Europe
Description: CMOS area image sensors for X-ray imaging The S10831 is a CMOS area image sensor suitable for intra-oral X-ray imaging in dental diagnosis. S10831 has 2.21 megapixels (1300 × 1700) with a pixel size of 20 × 20 μm. An FOP (fiber optic plate) is used as an
- Pixel Size: 20 µm
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Supplier: ODG (Origin Data Global)
Description: IC IMAGE SENSOR CMOS 128LBGA
- Sensor Technology: Optical Linear Encoder
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Supplier: Newark, An Avnet Company
Description: EVAL BRD, 0.35MP 1.3" CMOS IMAGE SENSOR ROHS COMPLIANT: YES
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Supplier: Newark, An Avnet Company
Description: EVAL BRD, 2MP 1/3" CMOS IMAGE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:On Semiconductor; Silicon Core Number:AR0238CSSC12SHRA0-DR; Application Sub Type:Image Sensor; Kit Contents:Eval Board AR0238CSSC12SHRA0-DR; RoHS Compliant: Yes
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Supplier: DigiKey
Description: CMOS with Processor Image Sensor 1280H x 800V 3µm x 3µm
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Supplier: Hamamatsu Photonics Europe
Description: Image sensor with 320 × 256 pixels developed for two-dimensional infrared imaging (Spectral response range: 1.30 to 2.15 μm) The G14673-0808W has a hybrid structure consisting of a CMOS readout circuit (ROIC: readout integrated circuit) and back-illuminated InGaAs photodiodes.
- Horizontal Pixels: 320
- Pixel Size: 20 µm
- Maximum Frame Rate: 509 fps
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Supplier: Win Source Electronics
Description: Manufacturer: OmniVision Technologies Inc Win Source Part Number: 888241-OVM7692-RACA Series: CameraCubeChip™, OmniPixel3-HS™ Operating Temperature Range: -30°C ~ 70°C (TJ) Features: CMOS with Processor Image Sensor 640H x 480V 1.75µm x 1.75µm Module Package: Reel - TR Package:
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Supplier: Win Source Electronics
Description: Manufacturer: OmniVision Technologies Inc Win Source Part Number: 888224-OV03640-V56A-2D Series: CameraChip™, OmniPixel3™ Operating Temperature Range: -20°C ~ 70°C (TA) Features: CMOS with Processor Image Sensor 2048H x 1536V 1.75µm x 1.75µm Package: 56-CSP2 Package: Tray Part
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Supplier: Hamamatsu Photonics Europe
Description: Non-cooled type, single video line (256 pixels) Near infrared image sensor (0.9 to 1.9 µm) The G16824-256DG is a compact InGaAs linear image sensor designed for near infrared multichannel spectrophotometry. It consists of an InGaAs photodiode array and a CMOS chip
- Applications: Industrial
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Supplier: Fiberscope.net by MEDIT
Description: The ImagePRO USB 3.0 borescope video camera is an exceptionally compact device with a new 1/25” interline color Sony CMOS sensor capable of capturing high quality QSXGA resolution images. This low-light sensitive camera cheap provides with 8-bit output and 2592 (H) x 1944 (V)
- Horizontal Resolution: 640 to 2,592 lines
- Maximum Frame Rate: 14 to 126 fps
- Width / Diameter: 1.1023628 inch
- Height: 1.1023628 inch
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Supplier: SPIE - Education
Description: This course provides a brief review of general theory, architecture and operation of CCD and CMOS imagers. In depth discussions then focus on four key operational imager features which collectively limit overall sensor performance (i.e., charge generation, charge collection, charge
- Industry: Aerospace / Defense
- Type: Continuing Education Credit (CEU), Course
- Delivery: Off Site (Conference / Seminar)
- Technology / Subject Expertise: Photonics / Optics
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Supplier: Toshiba Imaging Systems Division
Description: fluorescing agents. While the IK-HD5 is not an approved IEC60601 medical device, its imaging capabilities are well-suited as a component of surgical microscopy, endoscopy, IR inspection and defense imaging systems. Image Sensor 3-CMOS, 1/2.9 inch, 2.1MP progressive Output
- Lens Mount: C-Mount
- Imaging Technology: CMOS, Digital
- Monochrome / Color: Color
- Shutter Control: Electronic Shutter, External Trigger Input
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Supplier: Sentech America
Description: The STC-MBE132U3V USB 3.0 color camera features a 1/1.8" e2v CMOS sensor, 1.3MP resolution, 60 fps, and an ultra compact 28 (W) x 28 (H) x 33.8 (D) mm size. Utilizing the powerful USB3 Vision standard, this camera is machine vision ready! Scanning System Progressive Shutter Type
- Maximum Frame Rate: 60 fps
- Shutter Speed: 0.0000159999999999936 to 0.9700000000000021 seconds
- Width / Diameter: 1.1023628 inch
- Height: 1.1023628 inch
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Supplier: Sentech America
Description: No STC-MCS322U3V Image Sensor 1/1.8” 3.2M Progressive Color CMOS（Sony: IMX252LQR-C） Shutter Type Global Shutter Active Picture Element 2048 (H) x 1536 (V) Cell Size 3.45 (H) x 3.45 (V) µm
- Maximum Frame Rate: 121 fps
- Width / Diameter: 1.1023628 inch
- Height: 1.1023628 inch
- Length: 1.574804 inch
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Supplier: Hamamatsu Photonics Europe
Description: Built-in timing generator and signal processing circuit; 3.3 V single supply operation The S9226-04 is a small Cmos linear image sensor designed for image input applications. The signal processing circuit has a charge amplifier with excellent input/output characteristics.
- Horizontal Pixels: 1,024
- Pixel Size: 125 µm
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Supplier: Teledyne DALSA
Description: Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors. In
- Horizontal Resolution: 4,096 to 5,120 lines
- Maximum Frame Rate: 80 to 120 fps
- Vertical Resolution: 4,096 to 5,120 lines
- Features: Auto-Lens, CMOS, Other
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Hamamatsu Photonics announces its latest product release: the easy-to-use C16795 series image sensor module. Featuring a high dynamic range of typically 3500, it is capable of high-speed operations at up to 503 frames/s. With an integrated InGaAs area image sensor allowing (read more)
Browse CMOS Image Sensors Datasheets for Hamamatsu Photonics Europe -
1. Product overview The lSL700DE is a highly-integrated CMOs photoelectric sensor lC designed forhigh-speed, programmable diffuse-reflective sensing. lt integrates an LED/laser emitter driver, a transimpedance/analog chain with sample (read more)
Browse Photoelectric Sensors Datasheets for Intellisense Microelectronics Ltd. -
-resolution fully integrated line scan imaging modules. These easy-to-use Contact Image Sensors (CIS) combine sensors, lenses, and lights all-in-one, offering a lower cost inspection system for many demanding machine vision applications. AxCIS is powered by Teledyne’s new quadlinear CMOS (read more)
Browse CMOS Image Sensors Datasheets for Teledyne DALSA -
Highly accurate with an unmatched measurement speed, the new generation Ruler3000 3D cameras will be the number one choice for machine vision system integrators and industrial applications. Being powered by the unique 3D CMOS sensor from SICK tailored for superior image processing, their (read more)
Browse Machine Vision Systems Datasheets for SICK -
?High-sensitivity, low-noise 19 M pixel CMOS sensor enables imaging of fine specimen detail and obtains high signal to noise images even at low electron doses. ?A Global shutter and high frame rate (58 fps/full pixel mode) enable image series acquisitions with less (read more)
Browse CMOS Cameras Datasheets for JEOL USA, Inc. -
1. Product Overview The IMS ISL700_64A is a highly integrated CMOS photoelectric sensor that integrates 64 photodiodes(PDs) and their associated signal-processing circuitry. It is widely used in multi-mode smart photoelectric sensors based on distance measurement (read more)
Browse Optical Triangulation Position Sensors Datasheets for Intellisense Microelectronics Ltd. -
Advanced manufacturing requires high-precision 3D measurement solutions capable of inspecting complex surfaces, reflective materials, and micro-scale features. Engineers need inspection sensors that deliver accurate data acquisition, fast scanning speed, and reliable measurement (read more)
Browse Dimensional and Profile Scanners Datasheets for Hypersen Technologies Co., Ltd. -
Pleora’s iPORT NTx-U3 Embedded Video Interface hardware provides a straightforward way to integrate USB 3.0 video connectivity into cameras and imaging systems. The embedded hardware converts video data to packets at throughputs up to 3 Gbps. The packetized video is sent with low (read more)
Browse Video Processor Boards Datasheets for Pleora Technologies Inc. -
. Their hybrid CMOS readout circuit, paired with back-illuminated InGaAs photodiodes, ensures exceptional image quality and operational stability. A standout feature is the integrated 3-stage thermoelectric cooling system, which dramatically reduces thermal noise, enabling accurate detection (read more)
Browse Uncategorized Products Datasheets for Hamamatsu Photonics Europe -
. Powered by Teledyne’s multiline CMOS image sensors, AxCIS delivers superior image quality with up to a 60 kHz x 3-line rate of native RGB colors, at a pixel size of 28 µm or 900 dpi resolution, so that defects can be detected with (read more)
Browse CMOS Cameras Datasheets for Teledyne DALSA
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
and costs for customers. Image sensor offers better sensitivity for Web cams, surveillance Developed specifically to address the low-light sensitivity demands of the fast-growing notebook PC market, the low power, small profile OV7740 delivers 6800mV/lux-sec sensitivity. AMD cuts 900 additional jobs
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Advanced Microsystems for Automotive Applications 2006
The intended road safety applications and recognition tasks suitable for the 3D CMOS image sensor comprise: Near to intermediate front and side distance range of cars (20 m - 25 m) Lateral proximity of trucks (blind spot surveillance) 3D-algorithms for object (obstacles…
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Efficient full-flow process simulation for 3D structures including stress modeling
Fig. 2 Results of process simulation for a 3D CMOS image sensor structure, including optical layers .
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Four-transistor pinned photodiodes in standard CMOS technologies for time-of-flight sensors
New Circuits and Sstems Conf. (Montreal, QC) pp 325–8 [14] Spickerman A et al 2011 CMOS 3D image sensor based on pulse modulated time-of-flight principle and intrinsic lateral drift-field photodiode pixels Proc. ESSCIRC (Helsinki, September 2011) pp 111–4 [15…
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Applications of CMOS image sensors: state-of-the-art
For car safety applications, a 64 x 8 pixel 3D CMOS image sensor based on the time-of-flight principle (TOF) was developed and successfully tested.
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The Xbox One System on a Chip and Kinect Sensor
In order to meet these challenging and, in some cases, contradictory requirements, Microsoft developed a full custom 3D CMOS image sensor and system based on time-of-flight technology.4 .
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Current assisted photonic mixing demodulator implemented in 0.18μm standard CMOS technology
These test devices represent the first step towards integrating a high resolution TOF based 3D CMOS image sensor .
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A Low Cost 3D Tracker for Parallax Barrier Display
The tracker is a novel 3D CMOS Image Sensor based on Time of Flight (TOF) principle using innovating photon gating techniques.
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3D IC Integration and Packaging > 3D Si Integration
Chapters 9 through 13, respectively discuss the thermal management of 3D IC integration systems, embedded 3D hybrid integration, 3D LED and IC integration, 3D MEMS and IC integration, and 3D CMOS image sensor and IC integration.
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3D IC Integration and Packaging
…integration • 3D IC integration with passive interposer • Thermal management of 2.5D/3D IC integration • Embedded 3D hybrid integration • 3D LED and IC integration • 3D MEMS and IC integration • 3D CMOS image sensors and IC integration •…
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3D camera technology trade-off and breadboard demonstration for space applications
Spickermann, A., Durini, D., Süss, A., Ulfig, W., Brockherde, W., Hosticka, B., J., Schwope, S., Grabmaier, A.: CMOS 3D image sensor based on pulse modulated time-of-flight principle and intrinsic lateral drift-field photodiode pixels.