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Supplier: FX PCB Co., Ltd.
Description: Description What is the Ceramic PCB Substrate? FX PCB listed two kinds of Ceramic PCBs, which are Aluminum Nitride Ceramic PCB and Alumina Ceramic PCB (ALN and AI203) Properties for your reference: BECAUSE OF ITS HIGH THERMAL CONDUCTIVITY, LOW ROUGHNESS, AND
- Thickness: 0.00984251968503937 to 0.014960629921259842 inches
- Electrical Resistivity: 10 ohm-cm
- Features: Specialty / Other
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Supplier: FX PCB Co., Ltd.
Description: Description Aluminum Nitride PCB Manufacturer Fx PCB is a professional manufacturer of Ceramic substrate PCB, and we can make the ALN PCB(Aluminum Nitride PCB) and AI203 circuit boards(Aluminum oxide board). FX PCB manufactures the ceramic PCB using
- Thickness: 0.014960629921259842 to 0.11811023622047244 inches
- Electrical Resistivity: 10 ohm-cm
- Features: Specialty / Other
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Supplier: TE Connectivity
Description: Body Features Weight : 4 G [.141 OZ ] Contact Features Contact Base Material : Silver Alloy PCB Single Relay Contact Arrangement : 1 Form A (NO) PCB Single Relay Contact Current Class : 20 - 30 A PCB Single Relay Terminal Type : PCB-THT Dimensions Height : 9.9 MM [.39
- Coil Nominal DC Power: 0.567 watts
- Features: Other
- Mounting: PC Board
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Supplier: TE Connectivity
Description: 500 Insulation Initial Dielectric Between Contacts & Coil (VRMS) : 500 Insulation Initial Dielectric Between Open Contacts (VRMS) : 500 Mechanical Attachment Mounting Type : Printed Circuit Board Other Current Rating (85°C) : 15, 20 High Power Relays (>75A) : No Relay Type :
- DC Coil Voltage: 12 volts
- Coil Resistance: 254 ohms
- Coil Nominal DC Power: 0.567 watts
- Features: Other
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Supplier: Aratas America LLC
Description: Low-profile 12.3 mm height power relay with maximum switching of 10A Low profile: 12.3 mm in height Max. switching capacity: 2,500 VA (NO) Dielectric strength: 5 kV Clearance and creepage distance: 10 mm. Models with high shock resistance (250 m/s2) are available. Models for P1 load (2
- Relay Type: High Voltage Relay
- Features: Other
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Supplier: Aratas America LLC
Description: High Capacity and High Dielectric Strength Miniature Relay with Fully Sealed Construction in 5 A (8 A) SPST-NO(1a), SPST-NO+SPST-NC(1a1b), DPST-NO(2a), DPST-NC(2b) Types P6B model for connecting sockets are available. High insulation with dielectric strength of
- Relay Type: High Voltage Relay
- Features: Other
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Supplier: Knowles Precision Devices
Description: Class II dielectric) and C0G/NP0. (EIA Class I dielectric). Learn more about capacitor classes with Capacitor Basics and the Novacap Technical Brochure Construction Innovations StackiCapTM Construction (offers a significant reduction in ‘PCB real estate’ for an equivalent
- Configuration / Form Factor: Leaded Capacitor
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Supplier: Lumentum Operations, LLC
Description: The high-power Q306 lasers expand the existing Q-Series® that provides a solution for demanding applications requiring faster throughput. Lumentum Q-Series lasers continue to lead the market for high-power Q-switched diode-pumped UV lasers used for a wide variety of
- Wavelength Range: 354.7 nm
- Laser Power: 12,000 to 40,000 milliwatts
- Beam Area: 0.3 mm²
- Operating Voltage: 200 to 240 volts
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Supplier: Lumentum Operations, LLC
Description: Lumentum Q-Series® lasers lead the market for high-power Q-switched diode-pumped UV and green lasers used for a wide variety of high-precision, micromachining applications. Whether for high-pulse-energy processing of materials such as ceramics, high-repetition-rate
- Wavelength Range: 355 nm
- Laser Power: 2,900 to 11,000 milliwatts
- Beam Area: 0.26 mm²
- Beam Divergence: 1.7999999999999976 to 2.000000000000007 millirad
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Description: High electrical insulation, with dielectric strength up to 8 kV/mm. ◆ Excellent flame resistance, achieving a UL94 V-0 rating. ◆ Curing time adjustable based on temperature. ◆ Two-component structure for easy storage. ◆ Can be precisely controlled for thickness and shape using
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 8 W/m-K
- Dielectric Constant (Relative Permittivity): 7.5
- Industry: Electronics
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Supplier: Allied Electronics, Inc.
Description: Incorporates Environmentally-Friendly, Cadmium-Free Contacts Variety of Contact Forms: SPDT or SPST-NO (Continuous Current Rating: 8 A) Low Profile (0.39 W × 1.12 L × 0.59 H Inches) High Dielectric Strength of 4 kV with 8 mm Creepage/Clearance Sealed Plastic Construction Ideal for
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Supplier: Allied Electronics, Inc.
Description: Incorporates Environmentally-Friendly, Cadmium-Free Contacts Variety of Contact Forms: SPDT or SPST-NO (Continuous Current Rating: 8 A) Low Profile (0.39 W × 1.12 L × 0.59 H Inches) High Dielectric Strength of 4 kV with 8 mm Creepage/Clearance Sealed Plastic Construction Ideal for
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Supplier: Allied Electronics, Inc.
Description: Incorporates Environmentally-Friendly, Cadmium-Free Contacts Variety of Contact Forms: SPDT or SPST-NO (Continuous Current Rating: 8 A) Low Profile (0.39 W × 1.12 L × 0.59 H Inches) High Dielectric Strength of 4 kV with 8 mm Creepage/Clearance Sealed Plastic Construction Ideal for
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Supplier: Allied Electronics, Inc.
Description: Incorporates Environmentally-Friendly, Cadmium-Free Contacts Variety of Contact Forms: SPDT or SPST-NO (Continuous Current Rating: 8 A) Low Profile (0.39 W × 1.12 L × 0.59 H Inches) High Dielectric Strength of 4 kV with 8 mm Creepage/Clearance Sealed Plastic Construction Ideal for
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Supplier: Datatronics™
Description: Feature Designed for SMPS applications. International Safety construction. High dielectric strength capability 3750VRMS Frequency range 25kHz
- Operating Frequency Range: 25,000 Hz
- DCR: 0.7 to 11 ohms
- Other Transformer Types / Applications: Current Sense Transformer
- Mounting: PC / PCB Mount
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Supplier: CoorsTek
Description: thermal conductivity of 170 W/m K Non-toxic alternative to BeO Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors High dielectric strength
- Features: Dielectric / Insulating, Specialty / Other
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Supplier: Henkel Corporation - Electronics
Description: Bergquist introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB (MCPCB’s) line. HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance
- Industry: Electronics
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Supplier: Richardson RFPD
Description: The MLO® Low Pass Filters are low profile passive devices with best in class performance based on AVX’s patented multilayer organic high density interconnect technology. The MLO® low pass filters utilize high dielectric constant and low loss materials to realize high Q
- Bandwidth: 0 to 6,160,000 kHz
- Insertion Loss: 0.9 dB
- Filter Type: Low Pass
- Features: Other
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Supplier: Henkel Corporation - Electronics
Description: the dielectric. This datasheet highlights the performance characteristics of Thermal Clad HT 3 mils (High Temperature) a dielectric resistant to degradation from high temperature exposure and features high dielectric breakdown characteristics.This
- Industry: Electronics
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Supplier: Standex-Meder Electronics
Description: The single in-line SIL RF series high frequency reed relay is capable of switching signals from DC to 1.5GHz. This instrumentation grade RF reed relay is supplied in a rugged thermoset overmolded package. Utilizes minimum PCB area at only 50% compared to our DIP and DIL series.
- Normally Open (NO): 1
- Maximum AC Switching Voltage: 200 volts
- Maximum DC Switching Voltage: 200 volts
- DC Coil Voltage: 5 to 12 volts
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Supplier: Henkel Corporation - Electronics
Description: the dielectric.This datasheet highlights the performance characteristics of Thermal Clad HT 6 mils (High Temperature) a dielectric resistant to degradation from high temperature exposure and features even higher dielectric breakdown characteristics than its 3 mil
- Industry: Electronics
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Supplier: Optima Technology Associates, Inc.
Description: Finishes Thickness from 0.020 to 0.125 inches Cu Cladding from 18 to 70 microns FR4, FR2, CEM1, High Dielectric Laminates Universal BBT with Simultaneous Double-Sided SMD 8 Mil Holes, 4 Mil Traces / Isolation ISO Certified, UL Approved Rigid, Flex, or Combined Constructions Metal core
- PCB Type: Double-Sided Boards, Flexible Boards, Multi-Layer Boards, Rigid-Flexible Boards, SMT Components, Single-Sided Boards, THT Components
- Supplier Capability: Just-In-Time Capability, PCB Assembly, PCB Design / Layout, Production Quantities, Prototype Quantities, Testing and Evaluation
- Features: North America, Northeast US Only, South / Central America Only, United States Only
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Supplier: Win Source Electronics
Description: Limited Depth: 3.2 mm Mount: PCB, Surface Mount RoHS: Compliant Min Operating Temperature: -55 °C Schedule B: 8532240020, 8532240020 Case Code (Imperial): 1812 Voltage Rating (DC): 1 kV REACH SVHC: No SVHC Dielectric: X7R Max Operating Temperature: 125 °C Case Code (Metric): 4532
- Capacitance Range: 0.0022 microF
- Capacitance Tolerance: 10 (+/- %)
- DC Rated Voltage Range (WVDC): 1,000 volts
- AC Rated Voltage (WVAC): 1,000 volts
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Supplier: Win Source Electronics
Description: 1.8034 mm Dielectric Material: Ceramic Height: 1.6 mm Width: 3.2004 mm Dissipation Factor: 2.5 % Categories: Ceramic Capacitors Case / Package: 1812 Case / Package: 4532 Alternative Parts (Cross-Reference): 1812SC562KAT1A; C1210C562KDRACTU; 1825WC562KAT1A; 1210SC562KAT1A; C0805V562KBRACTU;
- Capacitance Range: 0.0056 microF
- Capacitance Tolerance: 10 (+/- %)
- DC Rated Voltage Range (WVDC): 1,500 volts
- AC Rated Voltage (WVAC): 1,500 volts
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Supplier: Adhesive Applications
Description: PolySil™ SP590 offers optimum performance in electrical and thermal insulation. The continuous service temperature range is -100°F to 500°F (-73°C to 260°C) with short term, intermittent service to 600°F (315°C). Provides clean removal in high-temperature masking applications. High
- Thickness: 0.0025 inches
- Peel Strength / Adhesion: 1.625 lbs/in
- Temperature Resistance: -73.33333333333333 to 260 C
- Features: Abrasion / Scratch Resistant, Adhesive Tape, Dielectric / Insulating, Electronics (PCB, Semiconductor) Tape, Industrial Tape, Removable, Thermally Insulating / Insulative
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Supplier: Henkel Corporation - Electronics
Description: Your benefits High thermal conductivity: 1.8W/m-K Eliminates need for mechanical fasteners Low viscosity for ease of screening or stenciling Maintains structural bond in severe-environment applications Heat cure Applications PCB assembly to housing Discrete component to heat
- Features: Electrically Conductive, Thermally Conductive
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond
- Use Temperature: -100 to 300 F
- Thermal Conductivity: 2.88 to 3.6 W/m-K
- Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
- Tensile Strength (Break): 6,000 to 7,000 psi
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Supplier: HAVE, Inc.
Description: 8 pole chassis connector with black chrome metal flange. Compatible with Cannon `EP-Series`. Air tight. TECHNICAL DATA Electrical Rated current/contact: 30 A rms continous, 40 A rms 1 min. Dielectric strength: 4kV peak Rated voltage: 250 V ac Contact resistance: = 3 m (= 10 m for NL4MD-H)
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Supplier: HAVE, Inc.
Description: 4 pole chassis connector, round flange for speaker cabinets. Compatible with Cannon `EP-Series`. Air tight. TECHNICAL DATA Electrical Rated current/contact: 30 A rms continous, 40 A rms1 min. Dielectric strength: 4kV peak Rated voltage: 250 V ac Contact resistance: = 3 m (= 10 m for NL4MD-H)
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Supplier: ValueTronics International, Inc.
Description: Efficiency: 50 to 6 0% at full rated output power at nominal AC input voltage, depending on module voltage Insulation Resistance and Dielectric Withstanding Voltage: 50 mega Ohms at 500 VDC @ 25°C and less than 50% relative humidity Mechanical Size: 19" (4 83 mm) wide by 5- 1/4" (133 mm)
- Type: DC Power Supply
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Rogers PCB is mostly used in high-frequency and high-power applications such as RF and microwave. the Rogers material normally has the advantages of low dielectric loss, stable dielectric constant, high thermal conductivity, thermal stability, etc. That’s why there are so many (read more)
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Indicates content that may require registration and/or purchase.
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High dielectric constant SU8 composite photoresist for embedded capacitors
Embedded capacitors require the use of high dielec- tric constant ( high - k ) materials because of the limited space inside the PCB substrate.
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A study on bandwidth enhancement of 900/1800 dual band LTCC chip antenna by using equivalent circuit analysis
Thus, compared with printed circuit board ( PCB ) technology, LTCC technology can pro- vide 3D multilayer structure and high K dielectric that are both powerful tools to miniaturize RF passive components [6].
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Physical and dielectric properties of BaTiO3–fluoride–glass systems for nitrogen-fireable embedded capacitors
As an embedded capacitor in Cu- printed circuit board ( PCB ) substrates, specifically, thick film dielectrics with a high dielectric constant k >1,000 have a great potential in fabricating high-density packages [3–7].
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Tailored Dielectric Properties of High-k Polymer Composites via Nanoparticle Surface Modification for Embedded Passives Applications
Novel materials for embedded passive applications are in great and urgent demands, for which high dielectric constant ( k ), low dielectric loss and process compatibility with the PCBs are the most important prerequisites.
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Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package
The embedded capacitor uses the high - k thin dielectric film to achieve large capacitance and as it is buried inside the PCB or the package as an additional layer, it eliminates discrete capacitor pad inductance as well as the internal inductance …
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IMS2011: Day 2 Technology Report
This printed circuit board ( PCB ) material has high thermal conductivity of 1.44 W/m- K , z-axis dielectric constant of 3.5., and low loss tangent of 0.0013 at 10 GHz.
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Live From IMS2011: Rogers Boosts Thermal Conductivity In New High-Frequency Laminates
This printed circuit board ( PCB ) material has high thermal conductivity of 1.44 W/m- K , z-axis dielectric constant of 3.5., and low loss tangent of 0.0013 at 10 GHz.
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Circuit Laminate Keeps The Heat Out | Content content from Microwaves & RF
It has a thermal conductivity of 1.44 W/(m- K ) at +80Ca value considerably higher than that of other PCB laminates with similar relative dielectric constant (Dk) values (see figure).
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Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression
Because PCPL consists of two kinds of dielectric materials, it is not feasible to periodically embed the high - K rods inside the package or PCB substrate under the laminated fabrication technique.
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Controlling simultaneous switching noise with built-in decoupling capacitors
The on PCB decap consists of the layer between the L3 power layer and the L4 ground layer as shown in figure 11, if a high - k dielectric material can be used [SI [9].