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  • All-in-One Ball Joint: A Case Study
    A prospective customer was having sourcing, quality, assembly and maintenance issues with some of the ball joint components used on the front suspension of rugged utility vehicles.
  • Heating a steel ball on a pin for an insertion application [MEC]
    To heat a steel ball on a pin to 212 ºF (100 ºC) for insertion into a nylon joint cup assembly to create automatic suspension ball studs...
  • What It Takes To Be A Successful Mechanical Engineer
    Rich Perlberg has been a lead engineer for CCTY Bearing since 2003. He began working on off-road vehicle bearings and steering assemblies as soon as he joined the team. Since then, he has designed cam side rollers, steering assemblies and all-in-one ball joints.
  • Forklift Tie Rod Saves OEM Cost & Improves Service Life
    Tie rods in forklift steering are traditionally metal-on-metal, which requires periodic re-greasing and leads to a shortened lifespan. They also include a coil spring and two cups behind the ball joint. CCTY Bearing's design utilized a metal on nylon, self-lubricating design that eliminated
  • Preventing Bearing Rust with the Right Methodology
    Whether it's on your car or in a bearing, rust is never a good thing. Corrosion is caused by environmental factors such as water, salt water, acid/alkaline solutions or chemical intrusion. Most rod ends, ball joints and tie rods are used in outdoor applications, so rust resistance is vital
  • Introduction of Wedge Capillary for Wire Bonding
    Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding
  • Brief Introduction for Gold Wire Bonding and Laser Welding of Pressure Sensors
    as pressure bonding, bonding, and wire bonding. Of course, gold wire ball bonding is undoubtedly the most commonly used method. The principle is to use heat pressure source or ultrasonic energy to connect chip pads and package pins with gold wires. Because the first solder joint is spherical

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