Products & Services
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Supplier: Data Device Corporation (DDC)
Description: Designed with the unique LabVIEW® & LabVIEW/LabWindows® Real-Time programming environment in mind, DDC’s MIL-STD-1553 and ARINC 429 LabVIEW support package makes the development of LabVIEW applications simple and intuitive. BENEFITS 3 Levels of VI’s enables easy application development
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Supplier: ALL-STATES, Inc.
Description: CIRCUIT BOARD TYPE ADHESIVE BACK MOUNTING 5000 PER CARTON STANDARD PACKAGE 0.16 INCH (CIRCUIT BOARD) MOUNTING HOLE SIZE 1.5 INCH MOUNTING DEPTH 0.072 INCH CIRCUIT BOARD THICKNES ALL-STATES. BRAND PA-16T MODEL
- Mounting: Adhesive Mount
- Type & Shape: PCB Support (No Hole / Solid Post)
- Features: Specialty / Other
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Supplier: Newark, An Avnet Company
Description: DEV BOARD, PROGRAMMING & CLONING, ARM; Supported Families:-; Kit Contents:Programing Board QPK-NRF5X, USB-Micro cable, Flexi Cable and Firmware Package; Features:-; Product Range:-; SVHC:No SVHC (07-Jul-2017) RoHS Compliant: Yes
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Description: Ludlow Tape HBS T-Tak T-Tak Tissue Supported Synthetic Rubber transfer adhesive with 42# kraft paper liner (black print). Applications · Mounting heavy posters & signs.· Promotional displays.· Inventory tags on cartons.· Mounting name plates.· Heavy weight papers and heavy board stocks.·
- Thickness: 0.0060999999999999995 inches
- Peel Strength / Adhesion: 5.125 lbs/in
- Temperature Resistance: -34.44444444444444 to 82.22222222222221 C
- Backing: Paper
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Supplier: Critical Link, LLC
Description: design Board Support Packages Custom imaging design Sensor board development On-board processing Interfaces & protocols Mechanical design Engineering services / Product development Systems engineering Hardware design Software development Mechanical engineering
- Industry: Electrical / Electronics
- Features: North America, Northeast US Only, United States Only
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Supplier: Siemens EDA
Description: Network Assembly support FloTHERM PACK now supports two-resistor and Delphi compact thermal models in the more advanced Network Assembly format in FLOTHERM Enhanced package families TO247 package is now supported, as are Delphi compact thermal models for SOT23
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Supplier: ASTM International
Description: agreement, a producer's or supplier's report shall be furnished at the time of shipment certifying that the product is in compliance with the ASTM specification. Each gypsum panel product or package shall have legibly marked thereon the following: the thickness, the name of the producer or
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Supplier: Newark, An Avnet Company
Description: GANG PROG, FOR EPROM / EEPROM / FLASH MCUS; Supported Families:-; Kit Contents:Gang Programming System; Features:Single and Upgradable Base Unit, Device-specifies Programming Heads for All Packages; Product Range:- RoHS Compliant: No
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Supplier: Wolfspeed
Description: CMPA901A020S also supports reduced board space requirements and highthroughput manufacturing lines.
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Supplier: Global American, Inc.
Description: The LE-37C-G, 3.5" Embedded Mini Board, is designed for the 4th generation Intel® Core™ processors in the FCBGA1364 package and supports one DDR3L 1333/1600MHz SO-DIMM up to 8GB. The platform is based on Intel® HD Graphics 4600 that provides high-end media and graphics
- RAM: 8,000 MB
- Operating Temperature: 32 to 140 F
- Operating Humidity: 10 to 90 %
- Features: CompactFlashTM, Other, Real Clock Timer
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Supplier: TE Connectivity
Description: Mount Retention : Without Wire Insulation Support : Without Operation/Application Circuit Application : Signal Packaging Features Packaging Method : Package Packaging Quantity : 2000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System
- Features: RoHS
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Supplier: Haida International Equipment Co., Ltd.
Description: mode ( can be remain same) Functions: 1. Flexible location motor-driven pulley. It is easy to fix and achieve the velocity change. 2. The height of slope is relatively low so that is benefit of fix the specimen; strong impact resistance board, guarantee the fastness of the structure. 3. The
- Mechanical Test: Impact Toughness
- Display / User Interface: Video / Graphic Display
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Supplier: Infineon Technologies AG
Description: +/-8 kV (HBM) Optimized for high electromagnetic compliance (EMC) Very low electromagnetic emission and high immunity to interference Available in PG-DSO-14 and PG-TSON-14 package Automated Optical Inspection (AOI) support with PG-TSON-14 package Green Product (RoHS compliant)
- Category: Development Board
- Features: Other
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Supplier: Optoma Technology, Inc.
Description: Lamp-Less and PC-Free Projection Deliver Incredible Value Road-warrior professionals will love the Optoma ML500 travel projector with LED technology for its compact size and powerful features which support powerful and effective presentations in a variety of environments without complexity.
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1158054-S8091-46R Category: Cables, Wires - Management>Cable Supports and Fasteners Series: EZ BoardWare Type: Clip, C-Type Color: Silver Features: Corrosion Resistant Package: Tape & Reel Length: 0.197" (5.00mm) Standard Package: 3,000 Height: 0.053"
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1284375-SERDESUB-16USB/NOPB Category: Development Boards, Kits, Programmers>Evaluation and Demonstration Boards and Kits Type: Interface Package: Bulk Standard Package: 1 Function: Serializer, Deserializer (SerDes) Supplied Contents:
- Category: Development Board
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Supplier: Haida International Equipment Co., Ltd.
Description: relatively low so that is benefit of fix the specimen ; strong impact resistance board , guarantee the fastness of the structure . 3. The pulley can be adjusted to horizontal in order to fix the specimen for customer . The angular adjustment can be driven by cylinder which is flexible and
- Mechanical Test: Impact Toughness
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include Single Board Computer, Single
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Supplier: VAST STOCK CO., LIMITED
Description: Development Boards & Kits - Other Processors Evaluation board for MLX75024 and MLX75123, TOF chipset 110deg FOV, 940nm VCSELs Package Contents : EVK75024, Documentation, Technical Support
- Category: Development Board, Development Suite / Kit
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Supplier: Three D Traffic Works
Description: boards. Boards & Rails Product Description & Stock Numbers.pdf FHWA Work Zone Approval Letter WZ-128.pdf TD4000 Plastic Barricade Boards product sheet.pdf Specifications Board Length: 4', 6' , 8', 10', & 12' Board Material: UV Stabilized polymer with cold weather
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Supplier: Richardson RFPD
Description: The PE42448 is a HaRPTM technology-enhanced SP4T RF switch that supports a frequency range from 10 MHz to 6 GHz. It delivers extremely low insertion loss and high linearity with high input power handling capability, making this device ideal for hybrid analog beamforming and in 5G massive MIMO
- Category: Development Board
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Supplier: Qorvo
Description: Qorvo's TGL2223-SM is a wideband, 5-bit digital attenuator using Qorvo's TQPHT15 production 0.15um GaAs pHEMT process. Operating from 1 - 31 GHz, the TGL2223-SM offers a low LSB of 0.5 dB and supports > 15.5 dB of attenuation range with a low RMS step error of < 0.5 dB. Using standard
- Frequency Range: 1 to 31 GHz
- Attenuation: 15.5 dB
- Number of Bits (for Digital Attenuators): 5
- Insertion Loss: 4.2 dB
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Supplier: Critical Link, LLC
Description: feasible, Critical Link works with customers to develop Single Board Computer (SBC) solutions. As with our SOMs, Critical Link has the capability to design SBCs around a variety of processors, memory, and I/O to meet your requirements. Board Support Package (BSP) With the
- Electronic System Design Services: Analog Circuit Design, Computer Hardware and Interfacing Design, Digital System Design, Embedded System Design, FPGA Design, PCB Layout and Design
- Features: North America, Northeast US Only, United States Only
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include development board, programmer, evaluation kit, prototype, Development
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Supplier: Richardson RFPD
Description: modes to support board level system testing.The AD6657A is available in a Pb-free, RoHS-compliant, 144 ball, 10 mm × 10 mm chip scale package ball grid array (CSP_BGA) that is specified over the industrial temperature range of -40°C to +85°C.
- Category: Development Board
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include resistor, SMD, current sense, precision, termination, Resistor Accessories. This
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Supplier: Neousys Technology Inc.
Description: on-board GMSL deserializers for eight synchronized automotive GMSL camera inputs and a pre-installed board support package (BSP) with drivers for selected cameras. The support of GMSL cameras equips NRU-110V with powerful vision capability. Taking advantage of
- RAM: 32 GB
- Features: Other
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Supplier: MacDermid Alpha Electronics Solutions
Description: Grid Array components and improve board-level reliability Halogen-free No halogens intentionally added Restriction of Hazardous Substances compliant Directive EU/2015/863 (amending Annex II to 2011/65/EU) Featured Applications Ball Grid Array reinforcement for high-density assemblies
- Elongation: 10.1 %
- Dielectric Strength: 635.0000000000014 kV/in
- Dielectric Constant (Relative Permittivity): 4.93
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: ACCES I/O Products, Inc.
Description: utilities to generate waveforms in Windows. Third-party support includes a Windows standard DLL interface usable from most popular application programs. Embedded OS support includes Windows Xpe, WES7, etc and CE. Linux support consists of installation files and basic samples for
- Resolution: 12 bits
- Operating Temperature: 32 to 158 F
- Features: Application Software Included, PC/104 (PC/104-Plus, EBX)
- User Interface: Computer Programmable
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Supplier: ELMA Electronic Inc.
Description: GHz (5W) Intel Atom processor E3815 Low power, e.g. the 1-core board variant is typically 10W The board supports air-cooled or fanless versions 4 Gbytes DDR3L DRAM with ECC Optional Fast Boot solution based on the Intel® Firmware Support Package (Intel® FSP)
- CPU Speed: 1,460 to 1,910 MHz
- RAM: 4,000 MB
- Communication Networks: Ethernet
- Processor / CPU: Intel® AtomTM
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Supplier: Renesas Electronics Corporation
Description: The ISL33354E, ISL33357E are two port interface ICs where port 1 is configured as a dual (2 Tx, 2 Rx) RS-232 transceiver, and port 2 is a single RS-485/422 transceiver. An on-board charge pump generates RS-232 compliant ±5V Tx output levels from a single VCC supply as low as 4.5V. The
- ESD: 15 kilovolts
- Technology: RS232, RS485
- Package Type: SSOP
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Supplier: Artesyn Embedded Power
Description: subsystem, local buses and I/O subsystems. The MVME6100 series supports booting a variety of operating systems including a complete range of real-time operating systems and kernels. A VxWorks board support package and Linux support are available for the MVME6100
- Clock Speed: 1,267 MHz
- Main Memory (RAM): 2,000 MB
- CE / FCC Certified: Card is CE / FCC Certified
- Features: Controller / Processor, Other
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Supplier: Renesas Electronics Corporation
Description: The ISL33354E, ISL33357E are two port interface ICs where port 1 is configured as a dual (2 Tx, 2 Rx) RS-232 transceiver, and port 2 is a single RS-485/422 transceiver. An on-board charge pump generates RS-232 compliant ±5V Tx output levels from a single VCC supply as low as 4.5V. The
- ESD: 15 kilovolts
- Package Type: QFN
- Technology: RS232, RS485
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Supplier: ELMA Electronic Inc.
Description: controller 2GB ECC-protected DDR2-400 Dual on-board Gigabit Ethernet interfaces Support for PICMG 2.16 CompactPCI Packet Switching Backplane specification Full PICMG 2.1, R2.0 Hot Swap specification compliance PICMG 2.9 System Management specification support One or two PCI
- CPU Speed: 533 to 667 MHz
- RAM: 2,000 MB
- Computer Bus: CompactPCI (cPCI), PCI
- Processor / CPU: Intel® Core 2 Duo / Celeron®
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Supplier: Radicom Research, Inc.
Description: RS1001STAG sensor tag EVK is a small size of wireless sensor EVK. It can be powered by a coin battery, or from a USB mini-connector directly plug-in, Sensor module can be mounted on board from SMT package or be replaceable from DIP package. The RS1001SSTAG sensor tag is a very
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mismated Board stack height from 8 mm to 13.8 mm Up to 3 Gbps Tape-and-reel packaging 12, 16, 20, 26, 32, 40, 50, 68, and 80 positions Nominal current: 1.4 A Voltage rating: 500 VAC Approval in accordance with UL 1977 (read more)
Browse Power Connectors Datasheets for DigiKey -
CircuitSeal™ is a hermetic sealing and encapsulation process that protects connectors, circuit boards, and electronic assemblies using a low-outgassing, chemically inert epoxy. By fully encapsulating components such as rigid and flex PCBs, hybrid circuits, and flat flex cables, it creates (read more)
Browse Wire to Board Connectors Datasheets for Douglas Electrical Components -
supported by the STM32CubeWBA MCU package, which includes HAL libraries and example projects, and is compatible with popular IDEs such as STM32CubeIDE, IAR Embedded Workbench®, and MDK-ARM. This board is ideal for developers looking to explore Bluetooth LE 5.4 features, including secure (read more)
Browse Sensor Transmitters Datasheets for DigiKey -
saves board space. The device is housed in an industry standard air cavity package and is ideally suited for Radar applications. The device can support both CW and pulsed operations. Evaluation boards are available upon request. (read more)
Browse RF Transistors Datasheets for Qorvo -
is engineered to support efficient power management and space-saving board design. Compact TO-252-3 Package: Simplifies heat dissipation (read more)
Browse IC Interfaces Datasheets for LIXINC Electronics Co., Limited -
antennas, compensators, and roadside units for automotive infrastructure, backhaul and cellular small cells. The device boasts +29 dBm output power, making it one of the highest power solutions on the market today. Its compact, conformally shielded package size will reduce front-end board space by more than 50 percent and the product is supported by the automotive PPAP process. (read more)
Browse RF Modules Datasheets for Skyworks Solutions, Inc. -
The Intel 10M02SCM153C8G FPGA delivers a highly efficient and compact solution for designers working in embedded and industrial systems. Its small package and versatile I/O capabilities make it perfect for applications where board space is limited but reliable (read more)
Browse Field-Programmable Gate Arrays (FPGA) Datasheets for LIXINC Electronics Co., Limited -
their applications. LAN8720AI-CP • Low-power architecture with EEE support • Compact 24-QFN package (read more)
Browse Network and Communication Chips Datasheets for Win Source Electronics -
High efficiency, low profile, on board SMD PCB antenna Wideband coverage for 3G, 4G and 5G FR1 Available in tape & reel packaging for automatic mounting RoHS 2.0 compliant, Road vehicle compliant, REACH compliant Designed for reflow-solder mounting (read more)
Browse Antennas Datasheets for TE Connectivity -
protection against short transient pulses. Designed for high-stress environments, the D2TO35H ensures stable operation and improved system reliability, reducing component count and saving board space. It supports a broad resistance range from 1 Ω to 14 kΩ with ±2% tolerance (read more)
Browse Resistors Datasheets for New Yorker Electronics Co., Inc.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
form packaging collaboration Yields will determine 90-nm foundry champion EDA vendors to support Chartered 90-nm process SST blasts appeals decision
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
New EDA startup promises 'package-aware' chip design software Rio Design Automation is expected to launch Monday with a goal of bridging the gap between the design of ICs and packages and a chip's integration with the rest of the electronics system. EDA startup forms technical advisory board EDA
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
provided an editor 's selection of other significant stories of the week. Xpedion adds four to advisory board Xpedion Design System Inc. will announce the addition of four new members to its technical advisory board. Fraunhofer forms venture capital arm Fraunhofer Gesellschaft, a network of German
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
interactive timing analysis and timing diagram product to include tighter integration with vendor-specific board design and FPGA flows. Denali's Blueprint supporting Spirit 1.1 Denali Software's Blueprint electronic-system level tool now supports version 1.1 of the Spirit Consortium's specification
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Using a USB Flash Drive with an Embedded Host
cation that can run on the Explorer 16 Demo Board with The USB data logger application is available as part ofthe USB PICtail TM Plus Daughter Board. It implements a Microchip's complete USB Embedded Host Support file system with a simple, but powerful, set of commands. Package (see Appendix
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Using Microchip's Micropower LDOs
1 23-6, SOT-223, and MSOP-8 packaging require will bezero), the tolerance of V OUT minimal board space. Shutdown capability, thermal approximately that of V . REF protection, and current limiting are standard in every is a function of both the2. The tolerance of V device. Adjustable output, error
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Micrium-uCOS-III-UserManual.pdf (AN10915.zip\LPC18xx_flash_Keil_IAR_LowPowerAN.zip)
Board Support Package (BSP) ............................................................
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Learning Embedded Linux Using the Yocto Project
It is well supported by Freescale in terms of Board Support Packages (BSPs) and contains a large database of components.
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Home Automation with Intel Galileo
Intel delivers prebuilt images and binaries along with its board support package (BSP) to download the source code and build all related software with your development system.
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Virtualization for ECU Platform Software Testing in Automotive Embedded
Various components of an ECU that would primarily include hardware, board support package , platform software and the algorithm software are integrated and tested.
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Extending IP-XACT to embedded system HW/SW integration
When several product variations or speculative development time exploration is required, the disk bloats easily with hundreds of Board Support Package (BSP), configuration and SW project files.
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Embedded SoPC Design with Nios II Processor and Verilog Examples
In Step 7, the BSP Editor software program examines this file, extracts the needed device drivers from the HAL library, and builds up a BSP ( board support package ) library to support the system.
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Composition of Embedded Systems. Scientific and Industrial Issues
Operating System & Board Support Package .
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Embedded Linux Projects Using Yocto Project Cookbook
Apart from these, it also supports some reference hardware Board Support Packages (BSPs), representative of the architectures just listed.
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Automatic Manufacturing Systems II
The CNC system framework (shown in Fig. 1) based on embedded platform is consist by four layers: System hardware layer, Board support package layer, API function layer and Application layer[3].
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A real-time virtual machine implementation for small microcontrollers
3.2 Developing a real-time board support package for the target .
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