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Supplier: ALL-STATES, Inc.
Description: CIRCUIT BOARD TYPE ADHESIVE BACK MOUNTING 5000 PER CARTON STANDARD PACKAGE 0.16 INCH (CIRCUIT BOARD) MOUNTING HOLE SIZE 1.625 INCH MOUNTING DEPTH 0.072 INCH CIRCUIT BOARD THICKNES ALL-STATES. BRAND PA-26T MODEL
- ANSI Nominal Size: Specialty / Other
- Mounting: Adhesive Mount
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: ALL-STATES, Inc.
Description: CIRCUIT BOARD TYPE ADHESIVE BACK MOUNTING 5000 PER CARTON STANDARD PACKAGE 0.16 INCH (CIRCUIT BOARD) MOUNTING HOLE SIZE 1.5 INCH MOUNTING DEPTH 0.072 INCH CIRCUIT BOARD THICKNES ALL-STATES. BRAND PA-16T MODEL
- ANSI Nominal Size: Specialty / Other
- Mounting: Adhesive Mount
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: ALL-STATES, Inc.
Description: CIRCUIT BOARD TO CIRCUIT BOARD TYPE PUSH IN MOUNTING 5000 PER CARTON STANDARD PACKAGE 0.16 INCH (CIRCUIT BOARD) MOUNTING HOLE SIZE 1.09 INCH MOUNTING DEPTH 0.062 INCH CIRCUIT BOARD THICKNES ALL-STATES. BRAND S-18DL MODEL
- ANSI Nominal Size: Specialty / Other
- Mounting: Snap-in / Clip-on
- Type & Shape: PCB Support (No Hole / Solid Post)
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Supplier: ALL-STATES, Inc.
Description: CIRCUIT BOARD TO CHASSIS TYPE PUSH IN MOUNTING 15000 PER CARTON STANDARD PACKAGE 0.16 INCH (CIRCUIT BOARD), 0.19 INCH (CHASSIS) MOUNTING HOLE SIZE 0.38 INCH MOUNTING DEPTH 0.062 INCH (CIRCUIT BOARD), 0.07 INCH (CHASSIS) CIRCUIT BOARD THICKNES ALL-STATES[R] BRAND
- ANSI Nominal Size: Specialty / Other
- Mounting: Snap-in / Clip-on
- Type & Shape: PCB Support (No Hole / Solid Post)
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Description: name plates.· Heavy weight papers and heavy board stocks.· Board envelope and box fabrication.· Packaging & box closure. Features & Benefits · Exceptional holding strength.· Aggressive adhesive system.· Superior performance on heavier weight papers and heavy board
- Adhesive Type: Rubber
- Coating Type: Single-Sided
- Materials of Construction: Paper
- Peel Strength / Adhesion: 5.12 lbs/in
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Supplier: Advantech
Description: Advantech-Innocore supplies a wide range of software packages and support to accelerate the customer’s development cycle. As well as board support packages with highly robust drivers and edge-to-edge coverage for the hardware platforms, we offer a variety of other
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Supplier: Data Device Corporation (DDC)
Description: Designed with the unique LabVIEW® & LabVIEW/LabWindows® Real-Time programming environment in mind, DDC’s MIL-STD-1553 and ARINC 429 LabVIEW support package makes the development of LabVIEW applications simple and intuitive. BENEFITS 3 Levels of VI’s
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Supplier: Critical Link, LLC
Description: Software Development Our Capabilities: Board design Baseboard design SOM customization Single Board Computer design Board Support Packages Custom imaging design Sensor board development On-board
- Industry: Electrical / Electronics
- Location: North America, United States Only, Northeast US Only
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Supplier: Data Device Corporation (DDC)
Description: Designed with the unique LabVIEW® & LabVIEW/LabWindows® Real-Time programming environment in mind, DDC’s MIL-STD-1553 and ARINC 429 LabVIEW support package makes the development of LabVIEW applications simple and intuitive. BENEFITS 3 Levels of VI’s
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Supplier: Haida International Equipment Co., Ltd.
Description: Usage: Incline impact test machine is simulated the impact strength of packaging in the real circumstance of transport. Slope impact test machine is apply to the pile up of goods, slide of electromechanical, loading of the engine, transportation of product. Incline impact
- Display / Interface: Video / Graphic Display
- Mechanical Test: Impact Toughness
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Supplier: Optoma Technology, Inc.
Description: Lamp-Less and PC-Free Projection Deliver Incredible Value Road-warrior professionals will love the Optoma ML500 travel projector with LED technology for its compact size and powerful features which support powerful and effective presentations in a variety of
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Supplier: Haida International Equipment Co., Ltd.
Description: Usage : Incline impact tester is simulated the impact strength of packaging in the real circumstance of transport. Slope impact test machine is apply to the pile up of goods, slide of electromechanical, loading of the engine , transportation of product . This product is also can
- Mechanical Test: Impact Toughness
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Supplier: Wolfspeed
Description: radar. With 3 stages of gain, this high performance amplifier provides >30dB of large signal gain, potentially lowering the transmit BOM count, and >50% efficiency to support lower system DC power requirements and simplify system thermal management solutions. Packaged in a small 6x6 mm
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1284641-STEVAL-TCS00 3V1 Category: Development Boards, Kits, Programmers>Evaluati on and Demonstration Boards and Kits Type: Interface Package: Box Standard Package: 1 Function: GPIO Expander Supplied Contents: Board(s) Primary
- Category: Development Board
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1284375-SERDESUB-16U SB/NOPB Category: Development Boards, Kits, Programmers>Evaluati on and Demonstration Boards and Kits Type: Interface Package: Bulk Standard Package: 1 Function: Serializer, Deserializer (SerDes) Supplied
- Category: Development Board
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1048051-EVB9514 Category: Development Boards, Kits, Programmers>Evaluati on and Demonstration Boards and Kits Type: Interface Package: Box Standard Package: 1 Function: Ethernet Controller (PHY and MAC) Supplied Contents: Board(s
- Category: Development Board
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Supplier: VAST STOCK CO., LIMITED
Description: Development Boards & Kits - Other Processors Evaluation board for MLX75024 and MLX75123, TOF chipset 110deg FOV, 940nm VCSELs Package Contents : EVK75024, Documentation, Technical Support
- Category: Development Board, Development Suite / Kit
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Supplier: Global American, Inc.
Description: The LE-37C-G, 3.5" Embedded Mini Board, is designed for the 4th generation Intel® Core™ processors in the FCBGA1364 package and supports one DDR3L 1333/1600MHz SO-DIMM up to 8GB. The platform is based on Intel® HD Graphics 4600 that provides high-end media and graphics
- Chipset Type: Intel® Chipset
- CompactFlashTM: Yes
- Features: Real Clock Timer?
- Operating Humidity: 10 to 90 %
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Supplier: Qorvo
Description: attenuation errors. Using standard, negative control voltages from -3.0 V to -5.0 V, coupled with excellent broadband performance, the TGA2226-SM is ideal for supporting a variety of commercial and military applications. The TGL2226–SM is packaged in a 3.0 x 3.0 mm surface mount
- Attenuation: 31.5 dB
- Digital Attenuator: Yes
- Frequency Range: 0.1000 to 15 GHz
- Insertion Loss: 4 dB
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Supplier: Qorvo
Description: standard negative control voltages from -3.3 to -5 V coupled with excellent broadband performance, the TGA2223-SM is ideal for supporting of a variety of commercial and military applications. The TGL2223-SM is packaged in a 3 x 3 (mm) ceramic air-cavity QFN with both RF ports matched
- Attenuation: 15.5 dB
- Digital Attenuator: Yes
- Frequency Range: 1 to 31 GHz
- Insertion Loss: 4.2 dB
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Description: Ludlow Tape HBS M-Tak M-Tak Mylar Supported Synthetic Rubber Transfer Tape with 54# Kraft Paper Liner (black print). Applications · Sealing poly bags, mailers, and envelopes· Corrugated, folding board stock.· Rubber gasketing
- Adhesive Type: Rubber
- Coating Type: Single-Sided
- Materials of Construction: Glass / Fiberglass
- Peel Strength / Adhesion: 4.41 to 6.61 lbs/in
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Supplier: ASTM International
Description: This specification covers sampling; inspection; rejection; certification; packaging and marking; and shipping, handling, and storage of gypsum panel products. When specified by the purchase agreement, samples of gypsum panel products shall be taken at the place of manufacture or at the
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Description: The XPedite7683 is a secure, high-performance, 3U OpenVPX™, single board computer based on the Intel® Xeon® D-1500 family of processors. Providing up to 16 Xeon®-class cores, up to 32 GB of DDR4 ECC SDRAM, and XMC support, the XPedite7683 is an optimal choice for
- Communication Networks: Ethernet
- Hard Drive Support?: Other
- I/O Bus Specifications: USB, VPX, Other
- Ports: Serial Ports, USB
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Supplier: TransPak
Description: Protect products from damage during shipment or while in storage. Edge protectors stabilize strapped or stretch wrapped loads and add extra support for double stacked pallets. Save by ordering in full skid quantities.
- Protective Packaging / Dunnage: Angle / Edge Board
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Supplier: TransPak
Description: Protect products from damage during shipment or while in storage. Edge protectors stabilize strapped or stretch wrapped loads and add extra support for double stacked pallets. Save by ordering in full skid quantities.
- Protective Packaging / Dunnage: Angle / Edge Board
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Supplier: TransPak
Description: Protect products from damage during shipment or while in storage. Edge protectors stabilize strapped or stretch wrapped loads and add extra support for double stacked pallets. Save by ordering in full skid quantities.
- Protective Packaging / Dunnage: Angle / Edge Board
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Supplier: TransPak
Description: Protect products from damage during shipment or while in storage. Edge protectors stabilize strapped or stretch wrapped loads and add extra support for double stacked pallets. Save by ordering in full skid quantities.
- Protective Packaging / Dunnage: Angle / Edge Board
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Supplier: TOP-electronics USA
Description: Quectel BG95-M3-TE-A , adapter board including BG95-M3 module *** The UMTS/LTE EVB kit is required with this adapter board, and can be purchased separately if one is not already available. *** The BG95 is a series of multi-mode LPWA modules supporting LTE Cat M1/Cat
- Category: Development Board
- Supported System: Wireless Systems
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Description: ISO/TS 10303-1625:2006 specifies the application module for AP210 packaged part white box model. ISO/TS 10303-1625:2006 specifies an application module for the representation of discrete parts using a white box model for mechanical analysis purposes. ISO/TS 10303-1625:2006 supports the
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1158054-S8091-46R Category: Cables, Wires - Management>Cable Supports and Fasteners Series: EZ BoardWare Type: Clip, C-Type Color: Silver Features: Corrosion Resistant Package: Tape & Reel Length: 0.197" (5.00mm) Standard Package: 3
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Supplier: Infineon Technologies AG
Description: I2C EEPROM or I2C slave modes Supports Ganged Downstream port Power Control Space-saving 68-pin QFN package Kit Contents Development board (1) USB 3.0 A to Micro-B cable (1) 5V/4A Power Adaptor (1) Quick start guide
- Category: Development Board
- Ports: USB
- Supported System: Other
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Supplier: Renesas Electronics Corporation
Description: The ISL33354E, ISL33357E are two port interface ICs where port 1 is configured as a dual (2 Tx, 2 Rx) RS-232 transceiver, and port 2 is a single RS-485/422 transceiver. An on-board charge pump generates RS-232 compliant ±5V Tx output levels from a single VCC supply as low
- IC Package Type: QFN
- Technology: RS232, RS485
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Supplier: Renesas Electronics Corporation
Description: The ISL33334E, ISL33337E are two port interface ICs where port 1 is configured as a dual (2 Tx, 2 Rx) RS-232 transceiver and port 2 is a single RS-485/RS-422 transceiver. The on-board charge pump generates RS-232 compliant ±5V Tx output levels from a single VCC supply as
- Device Type / Applications: Transceiver
- ESD: 15 kilovolts
- IC Package Type: SSOP
- Technology: RS232, RS485
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Supplier: TE Connectivity
Description: : Signal Packaging Features Packaging Method : Package Packaging Quantity : 2000 Product Type Features Connector & Contact Terminates To : Printed Circuit Board
- Features: RoHS
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Supplier: Neousys Technology Inc.
Description: with on-board GMSL deserializers for eight synchronized automotive GMSL camera inputs and a pre-installed board support package (BSP) with drivers for selected cameras. The support of GMSL cameras equips NRU-110V with powerful vision capability. Taking advantage of
- Processor: Other
- RAM: 32 GB
- Type: Other
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mismated Board stack height from 8 mm to 13.8 mm Up to 3 Gbps Tape-and-reel packaging 12, 16, 20, 26, 32, 40, 50, 68, and 80 positions Nominal current: 1.4 A Voltage rating: 500 VAC Approval in accordance with UL 1977 (read more)
Browse Power Connectors Datasheets for DigiKey -
CircuitSeal™ is a hermetic sealing and encapsulation process that protects connectors, circuit boards, and electronic assemblies using a low-outgassing, chemically inert epoxy. By fully encapsulating components such as rigid and flex PCBs, hybrid circuits, and flat flex cables, it creates (read more)
Browse Wire to Board Connectors Datasheets for Douglas Electrical Components -
supported by the STM32CubeWBA MCU package, which includes HAL libraries and example projects, and is compatible with popular IDEs such as STM32CubeIDE, IAR Embedded Workbench®, and MDK-ARM. This board is ideal for developers looking to explore Bluetooth LE 5.4 features, including secure (read more)
Browse Sensor Transmitters Datasheets for DigiKey -
saves board space. The device is housed in an industry standard air cavity package and is ideally suited for Radar applications. The device can support both CW and pulsed operations. Evaluation boards are available upon request. (read more)
Browse RF Transistors Datasheets for Qorvo -
is engineered to support efficient power management and space-saving board design. Compact TO-252-3 Package: Simplifies heat dissipation (read more)
Browse IC Interfaces Datasheets for LIXINC Electronics Co., Limited -
antennas, compensators, and roadside units for automotive infrastructure, backhaul and cellular small cells. The device boasts +29 dBm output power, making it one of the highest power solutions on the market today. Its compact, conformally shielded package size will reduce front-end board space by more than 50 percent and the product is supported by the automotive PPAP process. (read more)
Browse RF Modules Datasheets for Skyworks Solutions, Inc. -
The Intel 10M02SCM153C8G FPGA delivers a highly efficient and compact solution for designers working in embedded and industrial systems. Its small package and versatile I/O capabilities make it perfect for applications where board space is limited but reliable (read more)
Browse Field-Programmable Gate Arrays (FPGA) Datasheets for LIXINC Electronics Co., Limited -
their applications. LAN8720AI-CP • Low-power architecture with EEE support • Compact 24-QFN package (read more)
Browse Network and Communication Chips Datasheets for Win Source Electronics -
High efficiency, low profile, on board SMD PCB antenna Wideband coverage for 3G, 4G and 5G FR1 Available in tape & reel packaging for automatic mounting RoHS 2.0 compliant, Road vehicle compliant, REACH compliant Designed for reflow-solder mounting (read more)
Browse Antennas Datasheets for TE Connectivity -
protection against short transient pulses. Designed for high-stress environments, the D2TO35H ensures stable operation and improved system reliability, reducing component count and saving board space. It supports a broad resistance range from 1 Ω to 14 kΩ with ±2% tolerance (read more)
Browse Resistors Datasheets for New Yorker Electronics Co., Inc.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
form packaging collaboration Yields will determine 90-nm foundry champion EDA vendors to support Chartered 90-nm process SST blasts appeals decision
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
New EDA startup promises 'package-aware' chip design software Rio Design Automation is expected to launch Monday with a goal of bridging the gap between the design of ICs and packages and a chip's integration with the rest of the electronics system. EDA startup forms technical advisory board EDA
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
provided an editor 's selection of other significant stories of the week. Xpedion adds four to advisory board Xpedion Design System Inc. will announce the addition of four new members to its technical advisory board. Fraunhofer forms venture capital arm Fraunhofer Gesellschaft, a network of German
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
interactive timing analysis and timing diagram product to include tighter integration with vendor-specific board design and FPGA flows. Denali's Blueprint supporting Spirit 1.1 Denali Software's Blueprint electronic-system level tool now supports version 1.1 of the Spirit Consortium's specification
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Using a USB Flash Drive with an Embedded Host
cation that can run on the Explorer 16 Demo Board with The USB data logger application is available as part ofthe USB PICtail TM Plus Daughter Board. It implements a Microchip's complete USB Embedded Host Support file system with a simple, but powerful, set of commands. Package (see Appendix
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Using Microchip's Micropower LDOs
1 23-6, SOT-223, and MSOP-8 packaging require will bezero), the tolerance of V OUT minimal board space. Shutdown capability, thermal approximately that of V . REF protection, and current limiting are standard in every is a function of both the2. The tolerance of V device. Adjustable output, error
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Indicates content that may require registration and/or purchase.
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Micrium-uCOS-III-UserManual.pdf (AN10915.zip\LPC18xx_flash_Keil_IAR_LowPowerAN.zip)
Board Support Package (BSP) ............................................................
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Learning Embedded Linux Using the Yocto Project
It is well supported by Freescale in terms of Board Support Packages (BSPs) and contains a large database of components.
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Home Automation with Intel Galileo
Intel delivers prebuilt images and binaries along with its board support package (BSP) to download the source code and build all related software with your development system.
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Virtualization for ECU Platform Software Testing in Automotive Embedded
Various components of an ECU that would primarily include hardware, board support package , platform software and the algorithm software are integrated and tested.
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Extending IP-XACT to embedded system HW/SW integration
When several product variations or speculative development time exploration is required, the disk bloats easily with hundreds of Board Support Package (BSP), configuration and SW project files.
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Embedded SoPC Design with Nios II Processor and Verilog Examples
In Step 7, the BSP Editor software program examines this file, extracts the needed device drivers from the HAL library, and builds up a BSP ( board support package ) library to support the system.
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Composition of Embedded Systems. Scientific and Industrial Issues
Operating System & Board Support Package .
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Embedded Linux Projects Using Yocto Project Cookbook
Apart from these, it also supports some reference hardware Board Support Packages (BSPs), representative of the architectures just listed.
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Automatic Manufacturing Systems II
The CNC system framework (shown in Fig. 1) based on embedded platform is consist by four layers: System hardware layer, Board support package layer, API function layer and Application layer[3].
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A real-time virtual machine implementation for small microcontrollers
3.2 Developing a real-time board support package for the target .