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Supplier: OSRAM Opto Semiconductors
Description: SOLERIQ® S 13, 2700 K - 4000 K (white), CRI min. 90, typ. 710 lm @ 3000 K, 85 °C, typ. 102 lm/W @ 3000 K, 85 °C Product Features Color: 2700 K - 4000 K (white) Color Rendering Index: min. 90 Luminous Flux: typ. 710 lm @ 3000 K, 85 °C Luminous efficacy: typ. 102 lm/W @ 3000 K, 85 °C Viewing angle at
- Color: White
- Color Temperature: 2700 to 4000 K
- Viewing Angle: 120 degrees
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Supplier: OSRAM Opto Semiconductors
Description: SOLERIQ® S 9, 2700 K - 6500 K (white), CRI min. 80, typ. 958 lm @ 3000 K, 85 °C, typ. 1.#INF lm/W @ 3000 K, 85 °C Product Features Color: 2700 K - 6500 K (white) Color Rendering Index: min. 80 Luminous Flux: typ. 958 lm @ 3000 K, 85 °C Luminous efficacy: typ. 1.#INF lm/W @ 3000 K, 85 °C Viewing
- Color: White
- Color Temperature: 2700 to 6500 K
- Viewing Angle: 120 degrees
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Supplier: OSRAM Opto Semiconductors
Description: This “Brilliant Color” version is designed for shop lighting applications. It features a high color quality which is similar to high intensity discharge lamps ( HID). Its brilliant light not only provides a high quality of white but also enables rich and saturated colors which have only been
- Color: White
- Color Temperature: 3250 K
- Viewing Angle: 120 degrees
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Supplier: OSRAM Opto Semiconductors
Description: SOLERIQ® S 9, 2700 K - 4000 K (white), CRI min. 90, typ. 1035 lm @ 3000 K, 85 °C, typ. 99 lm/W @ 3000 K, 85 °C Product Features Color: 2700 K - 4000 K (white) Color Rendering Index: min. 90 Luminous Flux: typ. 1035 lm @ 3000 K, 85 °C Luminous efficacy: typ. 99 lm/W @ 3000 K, 85 °C Viewing angle at
- Color: White
- Color Temperature: 2700 to 4000 K
- Viewing Angle: 120 degrees
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Supplier: Utmel Electronic Limited
Description: LED LIGHTING CHIP-ON-BOARD (COB)
- Color: White, Other
- Forward Current: 2160 milliamps
- Forward Voltage: 34 volts
- Lens Type: Flat Lens
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Supplier: LCSC Electronics Technology (HK) Limited
Description: SMD,12.5x12.5mm Chip On Board (COB) Light Sources ROHS
- Lamp Type: LED Lamps
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, UPGRADED THERMOCOUPLE BOARD, DS3800HMPJ BOARD WITH UPGRADED EEPROM CHIPS, STATUS LED INDICATOR, RESISTIVE NETWORK. FREE 2 YEAR RADWELL WARRANTY
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Supplier: LCSC Electronics Technology (HK) Limited
Description: 22W SMD,13.5x13.5mm Chip On Board (COB) Light Sources ROHS
- Lamp Power: 22 watts
- Lamp Type: LED Lamps
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Supplier: LCSC Electronics Technology (HK) Limited
Description: 90 38V SMD,13.35x13.35 Chip On Board (COB) Light Sources ROHS
- Lamp Type: LED Lamps
- Voltage Type: DC
- Voltage Rating: 38 volts
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Supplier: LCSC Electronics Technology (HK) Limited
Description: 4000K 97 36V White SMD,19x19mm Chip On Board (COB) Light Sources ROHS
- Color: White
- Lamp Type: LED Lamps
- Voltage Type: DC
- Voltage Rating: 36 volts
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Supplier: Ushio America, Inc.
Description: .6W models) Omni-Directional Innovative LED Filament Design – Replicates the Appearance of an Incandescent Filament Lamp No Visible Circuit Boards or Chips – Doesn’t Look Like an LED Lamp Long Life Application Friendly: UV Free & IR
- Color Temperature: 2700 K
- Lamp Power: 0.6000 to 5 watts
- Lamp Type: LED Lamps
- Maximum Overall Length: 3 to 5.71 inch
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1283894-SSL5021BDB12 05UL Category: Development Boards, Kits, Programmers>Evaluati on Boards - LED Drivers Series: GreenChip™ Features: FET Switch Package: Bulk Standard Package: 1 Voltage - Output: 40V ~ 60V Voltage
- Category: Development Board
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1283895-SSL5021BDB12 06UL Category: Development Boards, Kits, Programmers>Evaluati on Boards - LED Drivers Series: GreenChip™ Features: FET Switch Package: Bulk Standard Package: 1 Voltage - Output: 40V ~ 60V Voltage
- Category: Development Board
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Supplier: Broadcom Inc.
Description: This series of right angle mount ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 1.0 mm and a height of only 0.6 mm.
- Color: Orange
- Forward Current: 20 milliamps
- Forward Voltage: 2.2 volts
- Lens Type: Domed Lens
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Supplier: Ushio America, Inc.
Description: Ushio America’s Uphoria LED PAR lamps combine the classic styling of traditional PAR lamps with the advanced technology of Chip-On-Board (COB) LEDs and custom designed optics. This provides a light-weight, energy saving, dimmable LED lamp with the form, fit and function
- Color Temperature: 2700 K
- Lamp Power: 14 watts
- Lamp Type: LED Lamps
- Maximum Overall Length: 4.61 inch
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Supplier: Broadcom Inc.
Description: This ChipLED is designed with the smallest footprint to achieve high density of components on board. The HSMS-C191 has the industry standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and wide viewing angle make this LED exceptional for backlighting applications.
- Color: Red
- Forward Current: 20 milliamps
- Forward Voltage: 2.1 volts
- Lens Type: Domed Lens
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Supplier: Broadcom Inc.
Description: This ChipLED is designed with the smallest footprint to achieve high density of components on board. The HSMD-C191 has the industry standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and wide viewing angle make this LED exceptional for backlighting applications.
- Color: Orange
- Forward Current: 20 milliamps
- Forward Voltage: 2.2 volts
- Lens Type: Domed Lens
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Supplier: Broadcom Inc.
Description: This ChipLED is designed with the smallest footprint to achieve high density of components on board. The HSMH-C191 has the industry standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and wide viewing angle make this LED exceptional for backlighting applications.
- Color: Red
- Forward Current: 25 milliamps
- Forward Voltage: 2.6 volts
- Lens Type: Domed Lens
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Supplier: DigiKey
Description: LED Lighting COBs, Engines, Modules Chip On Board (COB) LED Array White, Cool Square
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Supplier: DigiKey
Description: LED Lighting COBs, Engines, Modules Chip On Board (COB) LED Array White, Warm Square
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Supplier: DigiKey
Description: LED Lighting COBs, Engines, Modules Chip On Board (COB) LED Array White, Warm Starboard
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Supplier: DigiKey
Description: LED Lighting COBs, Engines, Modules Chip On Board (COB) LED Array White, Neutral Square
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Supplier: ProPhotonix, Ltd.
Description: ProPhotonix SpecBright™ LED Ring lights are uniquely uniform while maintaining a very high level of brightness not possible with conventional through-hole or surface mount LED based illuminators at the same distance. This is achieved by placing up to 100 chip-on-board
- Active Area Diameter or Length: 1.77 inch
- Color Temperature: 6700 K
- Illuminator Type: Ring
- Light Source: LED
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Supplier: Infineon Technologies AG
Description: -56V) Highly accurate primary-side control output current typ. ±3% Temperature guard with adaptive thermal management with on-chip sensor Digital control selects automatically best mode of operation, depending on actual requirements QRM (quasi
- Features: RoHS Compliant
- Form Factor: Integrated Circuit (IC)
- Type: Constant Current, Dimmable, Programmable
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Supplier: LED Cool Lights
Description: 5050 60 LED's per meter. Power: One Roll - LED 5050 Tape requires a 12v/3a power supply. Two rolls can be plugged together and a 12v/5a power supply is required. The LED Tape light comes with two female connectors on each end that will plug and play with our low voltage
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Supplier: ARM Inc.
Description: The Keil MCBTMPM360 Evaluation Boards enable you to create and test working programs based on the Toshiba TMPM360 family of ARM Cortex™-M3 processor-based devices. The MCBTMPM360 Evaluation Board is available in three configurations: The MCBTMPM360 Evaluation Board is
- Category: Development Board, Other
- Manufacturer: ARM
- Signal Type: Digital
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Supplier: Win Source Electronics
Description: Manufacturer: Lumileds Win Source Part Number: 806740-LHC1-2790-120 8 Packaging: Tube Type: Chip On Board (COB) Color: White, Warm Current - Max: 1.8A Configuration: Square Viewing Angle: 100° Voltage - Forward (Vf) (Typ): 35.5V Current - Test: 900m
- Lamp Type: LED Lamps
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Supplier: VAST STOCK CO., LIMITED
Description: High Power LEDs - White Warm White 2700K Chip on Board LED
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Supplier: Win Source Electronics
Description: Manufacturer: Lumileds Win Source Part Number: 807635-LHC1-2780-120 2 Packaging: Tube Type: Chip On Board (COB) Color: White Current - Max: 400mA Configuration: Rectangle Viewing Angle: 115° Voltage - Forward (Vf) (Typ): 35.5V Current - Test: 200m
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, GRAPHIC LCD, CHIP-ON-BOARD, 192 X 32 RESOLUTION, USES THE ST7920 CONTROLLER. FREE 2 YEAR RADWELL WARRANTY
- Display Type: Character Display
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Supplier: RS Components, Ltd.
Description: The OSRAM OSTAR Headlamp series are a range of compact light sources in multi chip on board technology with a glass window on top. The OSTAR Headlamp LEDs are designed to give a seamless white colour impression at maximum brightness level, therefore suiting
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Supplier: Infineon Technologies AG
Description: USB HID device, so no additional driver installation required uIO Stick can power a target device Connected device can also be powered by external power supply for higher current 3 on-board status LEDs Additional BSL Updater GUI for BSL communication with Embedded Power devices
- Category: Development Board
- Host Interface: Other
- Ports: USB
- Supported System: Other
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Supplier: ECO Light LED
Description: The Super Nova 4 RGB is truly an amazing RGB LED Module from ECO Light LED. This RGB Module is able to show 16 Million shades of color. This product easily conforms to circular and curved layouts. Each module has 4 Premium Samsung LEDs on Board with 3 in 1 RGB
- Color: Blue, Green, Multi-Colored, Red
- Optical Power Output: 1400 milliwatts
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Supplier: RS Components, Ltd.
Description: A range of Programmable System-on-chip (PSoC®) products from Cypress Semiconductor incorporating analogue sub-systems with capacitive sensing hardware. These configurable devices include an on-board MCU and are aimed primarily at capacitive touch screen applications. Processing Unit
- Interface: Other Interface
- Operating Voltage: Up to 5.5 volts
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The FSCQ1565RTYDTU by ON Semiconductor is a quasi-resonant PWM controller with an integrated 650V high-voltage SENSEFET, designed for medium-power flyback AC-DC power supplies. Combining control logic and power MOSFET in a single chip (read more)
Browse AC-DC Converter Chips Datasheets for Win Source Electronics -
Bivar's LED Surface Mount Chips (read more)
Browse Light Emitting Diodes (LED) Datasheets for bisco industries -
reliability of semiconductors and electronics components. As our devices become smarter, our reliance on them grows. Every electronic device we encounter contains one or more chips made from semiconductors. Smart phones, tablets, laptops, game consoles, household appliances, automotive components (read more)
Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc. -
Rego’s chip coolers are a series of cooling solutions for multi-functional chips. These products are well designed in thermal performance based on our professional manufacturing know how. We have the sophisticated equipment to precisely measure its performance to meet your requirements (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
PLPCOS 450D laser diode has multimode beam and is chip on submount. PLPCOS 450D is ideal for material processing, projection applications demanding reliable operations with a long lifetime and stable output power. PLPCOS 450D - Typical Features — Optical output power (read more)
Browse Diode Lasers Datasheets for World Star Tech -
Cornell Dubilier’s XMPL Series Polymer Chip Capacitor series has been expanded to match applications requiring higher voltage and/or capacitance requirements. With very low ESR and robust ripple current ratings, they will easily outperform surface mount (read more)
Browse Capacitors Datasheets for Cornell Dubilier -
development of LED chip packaging towards flip-flop or vertical technology, ceramic substrates will have a promising future. Ceramic substrates are mainly used for high power LED The heat dissipation of LED will have an important impact on the efficiency, life and reliability of (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Single-sided printed circuit boards is also called single-layer PCBs, are the simplest and most basic circuit boards. The copper foil layer is only on one side, and the other side is normally covered by a solder mask or left as base material. Components and traces are mostly located on the (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
sealed for harsh environments Plug and play - assembled the same as a standard connector Integral PCB Board/LED, Front and Rear Seals, and AT-SR01 End Cap Strain Reliefs come factory assembled on the Plug Use for heavy duty (read more)
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heat is a major factor in how quickly an LED fails. High temperatures accelerate the degradation of various materials within the LED package. This includes the semiconductor chip itself, the phosphor coating, and the (read more)
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
China agrees to talks with U.S. on chip tax MicroUnity files patent suit against Intel, Dell Intel said to buy Wi-Fi chip designer Envara Siltronic to file IPO when market stabilizes Infineon board rift, labor unrest led to Schumacher's ouster The week in review: March 21 to 27 Zilog, X-Fab working
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
VIEW, Calif. -- Mips Technologies Inc. and Ampro Computers Inc. have announced an agreement that will accelerate the development of Mips processor-based systems and chips for embedded applications. Under the terms, Ampro will develop single-board system modules based on MIPS' 32-bit RISC processors
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TO-3P/220/247/254/257/258/264 Aluminum Nitride Ceramic Thermal Pads For MOSFET Transistor IGBT Transistor Heat Sink
, IGBT Transistor Heat Sink, MOS Transistor, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
provided an editor 's selection of other significant stories of the week. Xpedion adds four to advisory board Xpedion Design System Inc. will announce the addition of four new members to its technical advisory board. Fraunhofer forms venture capital arm Fraunhofer Gesellschaft, a network of German
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
of Orca FPGAs configure their parts using software housed on a third-party server farm, and Cadence Design Systems tipped word of a beta program for Web-based verification. Keynoter calls for electronics Renaissance For system-on-a-chip designs to reach full potential requires the electronics
More Information Top
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Chip On Board packaging of light emitting diodes and thermal characterizations
In the following figure are presented some Chip On Board LED demonstrators produced at our CEA institute showing the full potentialities of this technology.
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Thermal Management for LED Applications
The authors of that study concluded that DBC would be most appropriate for chip on board LED appli- cations, particularly LEDs used in pulsed operation that could take advantage of the increased thermal inertia due to the mass of the copper during …
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Effects of light scattering in optical coatings on energy losses in LED devices
Abstract—The effect of light scattering in phosphor containing optical coatings on energy losses in chip on board LED devices is considered.
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Numerical study on the heat dissipation characteristics of high-power LED module
A high power COB ( chip on board ) LED structure is shown in Figure 2(a).
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Page 14. Semiconductor parts with 125 in root number
101mm x 25mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 52 CHIPS, 4.2V 260mA .
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Page 14. Semiconductor parts with 012 in root number
101mm x 25mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 52 CHIPS, 4.2V 260mA .
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Protocol Volume 18 Issue 3 Summer 2013
The newest hot item was the Chip on Board LED technology.
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Page 3. Semiconductor parts with 334 in root number
133mm x 40mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 132 CHIPS, 4.2V 660mA .
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Page 90. Semiconductor parts with 100 in root number
100mm x 25mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 72 CHIPS, 565mm GREEN, 4.2V 360mA .
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Page 3. Semiconductor parts with 754 in root number
75mm x 40mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN 72 CHIPS, 4.2V, 360mA .
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