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Supplier: OSRAM Opto Semiconductors
Description: SOLERIQ® S 19, 2700 K - 4000 K (white), CRI min. 90, typ. 2700 lm @ 3000 K, 85 °C, typ. 111 lm/W @ 3000 K, 85 °C Product Features Color: 2700 K - 4000 K (white) Color Rendering Index: min. 90 Luminous Flux: typ. 2700 lm @ 3000 K, 85 °C Luminous efficacy: typ. 111 lm/W @ 3000 K, 85 °C Viewing angle
- Viewing Angle: 120 degrees
- Color Temperature: 2,700 to 4,000 K
- LED Type: White
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Supplier: Utmel Electronic Limited
Description: LED LIGHTING CHIP-ON-BOARD (COB)
- Forward Voltage: 34 volts
- Forward Current: 2,160 milliamps
- Viewing Angle: 115 degrees
- Lens Type: Flat Lens
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Supplier: LCSC Electronics Technology (HK) Limited
Description: SMD,12.5x12.5mm Chip On Board (COB) Light Sources ROHS
- Lamp Type: LED Lamps
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, UPGRADED THERMOCOUPLE BOARD, DS3800HMPJ BOARD WITH UPGRADED EEPROM CHIPS, STATUS LED INDICATOR, RESISTIVE NETWORK. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1283894-SSL5021BDB1205UL Category: Development Boards, Kits, Programmers>Evaluation Boards - LED Drivers Series: GreenChip™ Features: FET Switch Package: Bulk Standard Package: 1 Voltage - Output: 40V ~ 60V Voltage - Input: 85 ~ 140 VAC Current - Output /
- Category: Development Board
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Supplier: Broadcom Inc.
Description: This series of right angle mount ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 1.0 mm and a height of only 0.6 mm.
- Peak Wavelength: 523 nm
- Forward Voltage: 3.4 volts
- Forward Current: 20 milliamps
- Luminous Intensity: 120 milliCandela
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Supplier: Broadcom Inc.
Description: This ChipLED is designed with the smallest footprint to achieve high density of components on board. The HSMD-C191 has the industry standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The
- Peak Wavelength: 570 nm
- Forward Voltage: 2.2 volts
- Forward Current: 20 milliamps
- Luminous Intensity: 15 milliCandela
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Supplier: Broadcom Inc.
Description: This ChipLED is designed with the smallest footprint to achieve high density of components on board. The HSMY-C191 has the industry standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The
- Peak Wavelength: 589 nm
- Forward Voltage: 2.1 volts
- Forward Current: 20 milliamps
- Luminous Intensity: 2.8 milliCandela
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Supplier: Ushio America, Inc.
Description: Ushio brings modern technology to classic design with U-LED™ filament LED lamps. These lamps provide the timeless look of an incandescent lamp with the energy efficiency of LED technology. U-LED lamps have no visible circuit boards or heat sinks, they’re dimmable*
- Lamp Power: 0.6 to 5 watts
- Rated Average Life: 25,000 to 40,000 hours
- Maximum Overall Length: 3 to 5.71 inch
- Color Temperature: 2,700 K
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Supplier: Broadcom Inc.
Description: TheHSMF-C16x series ofbicolorChipLEDs is designedwith thesmallest footprint to achieve high density of components on board. They have theindustry standard footprint of 1.6 x 0.8 mm anda height of only 0.5mm which are very suitable for cellular phone andmobile equipmentindicators and
- Peak Wavelength: 468 to 595 nm
- Forward Voltage: 1.8 to 3.8 volts
- Forward Current: 10 to 20 milliamps
- Luminous Intensity: 2.8 to 35 milliCandela
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Supplier: DigiKey
Description: LED Lighting COBs, Engines, Modules Chip On Board (COB) LED Array White, Warm Square
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Supplier: Ushio America, Inc.
Description: Ushio America’s Uphoria LED PAR lamps combine the classic styling of traditional PAR lamps with the advanced technology of Chip-On-Board (COB) LEDs and custom designed optics. This provides a light-weight, energy saving, dimmable LED lamp with the form, fit
- Lamp Power: 14 watts
- Rated Average Life: 40,000 hours
- Maximum Overall Length: 4.61 inch
- Color Temperature: 2,700 K
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Supplier: VAST STOCK CO., LIMITED
Description: High Power LEDs - White Warm White 2700K Chip on Board LED
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Supplier: LED Cool Lights
Description: Description LED Cool Lights, 5050-60 LED per meter Tape Light is double the brightness of the original 5050-30 LED per meter! It introduces a Revolution in Lighting with the LED Adhesive Ribbon which features the latest energy efficient LED technology in an
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Supplier: Win Source Electronics
Description: Manufacturer: Sharp Microelectronics Win Source Part Number: 873084-GW5BTC27K00 Series: Mini Zenigata Features: LED Lighting COBs Engines Modules Chip On Board (COB) series White, Warm Rectangle Package: Tray Part Status: Obsolete Categories: Optoelectronics ECCN: EAR99
- Features: LED Lamps
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Supplier: Allied Electronics, Inc.
Description: Lumex OctoLEDs™ devices are the result of a manufacturing breakthrough which combines SMT convenience with through-hole T-5 mm LED size features. This is the 1st time that this high brightness level of up to 7,000 mcd (dependent on color) has ever been available from any conventional
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Supplier: Win Source Electronics
Description: Manufacturer: Bridgelux Win Source Part Number: 865065-BXRE-27G4000-F-23 Series: V Series™ Features: LED Lighting COBs Engines Modules Chip On Board (COB) series White, Warm Square Package: Tray Family Name: BXRE-27 Categories: Optoelectronics ECCN: EAR99 Popularity:
- Features: LED Lamps
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Supplier: ProPhotonix, Ltd.
Description: ProPhotonix SpecBright™ LED Ring lights are uniquely uniform while maintaining a very high level of brightness not possible with conventional through-hole or surface mount LED based illuminators at the same distance. This is achieved by placing up to 100
- Active Area Diameter or Length: 1.7716545 inch
- Wavelength: 470 to 740 nm
- Color Temperature: 6,700 K
- Light Source: LED
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Supplier: ProPhotonix, Ltd.
Description: ProPhotonix SpecBright™ LED Spot lights offer several times the brightness, for modules of comparable size that use conventional through-hole or surface mount LED based illuminators. This is achieved by placing 4 high brightness large chip-on-board LEDs in
- Wavelength: 470 to 870 nm
- Light Source: LED
- Illumination Type: Spot
- Illuminator Features: Strobe
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Supplier: Win Source Electronics
Description: Manufacturer: Lumileds Win Source Part Number: 807635-LHC1-2780-1202 Packaging: Tube Type: Chip On Board (COB) Color: White Current - Max: 400mA Configuration: Rectangle Viewing Angle: 115° Voltage - Forward (Vf) (Typ): 35.5V Current - Test: 200mA Height: 1.50mm Lens Type: Flat
- Features: LED Lamps
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Supplier: ProPhotonix, Ltd.
Description: ProPhotonix SpecBright™ LED Area lights are uniquely uniform while maintaining a very high level of brightness not possible with conventional through-hole or surface mount LED based illuminators. This is achieved by placing up to 100 chip-on-board LEDs,
- Active Area Diameter or Length: 1.7716545 inch
- Wavelength: 470 to 740 nm
- Light Source: LED
- Features: Other
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, GRAPHIC LCD, CHIP-ON-BOARD, 192 X 32 RESOLUTION, USES THE ST7920 CONTROLLER. FREE 2 YEAR RADWELL WARRANTY
- Display Type: Character Display
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Supplier: ARM Inc.
Description: On-Chip Flash: 2MB (TMPM360), 1MB (TMPM362/TMPM364) On-Chip RAM: 128KB (TMPM360), 64KB (TMPM362/TMPM364) USB 2.0 Host (TMPM364 only) CAN 2.0 Interface (TMPM364 only) UART, I2C, and 120 GPIO via PCB headers Potentiometer for ADC Input 5 LEDs and 6 push-buttons Power
- Manufacturer: ARM
- Category: Development Board
- Signal Type: Digital
- Features: Other
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Supplier: Infineon Technologies AG
Description: LEDs to validate power supply (5Volt / 3,3 Volt / 1,5 Volt) – LED indicating /HDRST (ESR0) active state – LED indicating active miniWiggler – LED switched via DAS software – 8 general purpose LEDs – Reset switch – 8-pin Dip switch (Hardware Boot Configuration)
- Category: Development Board
- Features: Other
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Supplier: Infineon Technologies AG
Description: 430VDC Reference board efficiency > 90% Power factor >0.9 and THD < 15% over wide load range Output voltage range can vary by a factor of 4 (e.g. 14V-56V) Highly accurate primary-side control output current typ. ±3% Temperature guard with adaptive thermal management with on-chip
- Type: Constant Current, Dimmable, Programmable
- Form Factor: Integrated Circuit (IC)
- Features: RoHS Compliant
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Supplier: ARM Inc.
Description: the JTAG interface (for program debug using a Keil ULINK family USB-JTAG Adapter and the µVision IDE and Debugger). An on-chip USB interface, two serial interfaces, a speaker, analog input (via potentiometer), and eight LEDs make this board a great starting point for your
- Manufacturer: ARM
- Signal Type: Digital
- Features: JTAG Pin, Other
- Ports: RS232/RS422/RS485, USB
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Supplier: ECO Light LED
Description: Super Nova 2 RGB is truly an amazing RGB LED Module from ECO Light LED. This RGB Module is able to show 16 Million shades of color. This product easily conforms to circular and curved layouts. Each module has 2 Premium Samsung LEDs on Board with 3 in 1 RGB
- Optical Power Output: 720 milliwatts
- LED Type: Blue, Green, Multi-Colored, Red
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Supplier: ECO Light LED
Description: The Super Nova 4 RGB is truly an amazing RGB LED Module from ECO Light LED. This RGB Module is able to show 16 Million shades of color. This product easily conforms to circular and curved layouts. Each module has 4 Premium Samsung LEDs on Board with 3 in 1 RGB
- Optical Power Output: 1,400 milliwatts
- LED Type: Blue, Green, Multi-Colored, Red
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Supplier: Nexperia B.V.
Description: LED driver consisting of a resistor-equipped PNP transistor with two diodes on one chip in a small SOT23 plastic package. Features and benefits Stabilized output current of 10 mA High currrent accuracy at supply voltage variation Reduces component count and board space
- Transistor Grade / Operating Range: Automotive
- Features: Other
- Polarity: PNP
- Package Type: SOT23
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Supplier: Nexperia B.V.
Description: LED driver consisting of a resistor-equipped PNP transistor with two diodes on one chip in a small SOT23 plastic package. Features and benefits Stabilized output current of 20 mA High currrent accuracy at supply voltage variation Reduces component count and board space
- Transistor Grade / Operating Range: Automotive
- Features: Other
- Polarity: PNP
- Package Type: SOT23
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Supplier: Nexperia B.V.
Description: LED driver consisting of resistor-equipped PNP transistor with two diodes on one chip in an SOT457 (SC-74) plastic package. Features and benefits Stabilized output current of 10 mA High current accuracy at supply voltage variation Low voltage overhead of 1.4 V Qualified
- Transistor Grade / Operating Range: Automotive
- Features: Other
- Polarity: PNP
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Supplier: Nexperia B.V.
Description: LED driver consisting of a resistor-equipped NPN transistor with two diodes on one chip in a medium power SOT223 (SC-73) plastic package. Features and benefits Stabilized output current of 10 mA without external resistor Stabilized output current adjustable up to 150 mA when an
- Transistor Grade / Operating Range: Automotive
- Polarity: NPN
- Features: Other
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Supplier: Moxa Inc.
Description: UnixWare 7 Easy maintenance with on-board LEDs and management software 15 KV ESD protection on the board Overview The CP-104EL-A is a smart, 4-port PCI Express board designed for POS and ATM applications. It is a top choice of industrial automation engineers
- Number of ports: 4
- PCI Data Bus: 32-bit
- Features: Bus Interface / Adapter Module
- Standard Type: Networking Module, Serial Communication Module
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The FSCQ1565RTYDTU by ON Semiconductor is a quasi-resonant PWM controller with an integrated 650V high-voltage SENSEFET, designed for medium-power flyback AC-DC power supplies. Combining control logic and power MOSFET in a single chip (read more)
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Browse Polymers and Plastic Resins Datasheets for AGC Chemicals Americas, Inc. -
Rego’s chip coolers are a series of cooling solutions for multi-functional chips. These products are well designed in thermal performance based on our professional manufacturing know how. We have the sophisticated equipment to precisely measure its performance to meet your requirements (read more)
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Browse Capacitors Datasheets for Cornell Dubilier -
development of LED chip packaging towards flip-flop or vertical technology, ceramic substrates will have a promising future. Ceramic substrates are mainly used for high power LED The heat dissipation of LED will have an important impact on the efficiency, life and reliability of (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Single-sided printed circuit boards is also called single-layer PCBs, are the simplest and most basic circuit boards. The copper foil layer is only on one side, and the other side is normally covered by a solder mask or left as base material. Components and traces are mostly located on the (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
sealed for harsh environments Plug and play - assembled the same as a standard connector Integral PCB Board/LED, Front and Rear Seals, and AT-SR01 End Cap Strain Reliefs come factory assembled on the Plug Use for heavy duty (read more)
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heat is a major factor in how quickly an LED fails. High temperatures accelerate the degradation of various materials within the LED package. This includes the semiconductor chip itself, the phosphor coating, and the (read more)
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
China agrees to talks with U.S. on chip tax MicroUnity files patent suit against Intel, Dell Intel said to buy Wi-Fi chip designer Envara Siltronic to file IPO when market stabilizes Infineon board rift, labor unrest led to Schumacher's ouster The week in review: March 21 to 27 Zilog, X-Fab working
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
VIEW, Calif. -- Mips Technologies Inc. and Ampro Computers Inc. have announced an agreement that will accelerate the development of Mips processor-based systems and chips for embedded applications. Under the terms, Ampro will develop single-board system modules based on MIPS' 32-bit RISC processors
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TO-3P/220/247/254/257/258/264 Aluminum Nitride Ceramic Thermal Pads For MOSFET Transistor IGBT Transistor Heat Sink
, IGBT Transistor Heat Sink, MOS Transistor, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
provided an editor 's selection of other significant stories of the week. Xpedion adds four to advisory board Xpedion Design System Inc. will announce the addition of four new members to its technical advisory board. Fraunhofer forms venture capital arm Fraunhofer Gesellschaft, a network of German
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
of Orca FPGAs configure their parts using software housed on a third-party server farm, and Cadence Design Systems tipped word of a beta program for Web-based verification. Keynoter calls for electronics Renaissance For system-on-a-chip designs to reach full potential requires the electronics
More Information Top
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Chip On Board packaging of light emitting diodes and thermal characterizations
In the following figure are presented some Chip On Board LED demonstrators produced at our CEA institute showing the full potentialities of this technology.
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Thermal Management for LED Applications
The authors of that study concluded that DBC would be most appropriate for chip on board LED appli- cations, particularly LEDs used in pulsed operation that could take advantage of the increased thermal inertia due to the mass of the copper during …
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Effects of light scattering in optical coatings on energy losses in LED devices
Abstract—The effect of light scattering in phosphor containing optical coatings on energy losses in chip on board LED devices is considered.
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Numerical study on the heat dissipation characteristics of high-power LED module
A high power COB ( chip on board ) LED structure is shown in Figure 2(a).
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Page 14. Semiconductor parts with 125 in root number
101mm x 25mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 52 CHIPS, 4.2V 260mA .
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Page 14. Semiconductor parts with 012 in root number
101mm x 25mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 52 CHIPS, 4.2V 260mA .
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Protocol Volume 18 Issue 3 Summer 2013
The newest hot item was the Chip on Board LED technology.
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Page 3. Semiconductor parts with 334 in root number
133mm x 40mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 132 CHIPS, 4.2V 660mA .
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Page 90. Semiconductor parts with 100 in root number
100mm x 25mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 72 CHIPS, 565mm GREEN, 4.2V 360mA .
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Page 3. Semiconductor parts with 754 in root number
75mm x 40mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN 72 CHIPS, 4.2V, 360mA .