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Supplier: TPL, Inc.
Description: advanced capacitance materials primarily for electromagnetic weapon systems and is a manufacturer of nano-size ceramic dielectric powders, monolithic ceramic capacitors and substrates, as well as specialty dielectric materials. The Micropower Technologies Division is developing endless
- Use Temperature: -67 to 257 F
- Dielectric Constant: 4.75 to 5.03
- Features: Dielectric / Electrically Insulating
- Industry: Electric Power, Electronics, Energy Conversion (Battery/Fuel Cell/PV)
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Supplier: ASTM International
Description: this guide are included for filament-wound polymer-matrix composites, laminar polymer-matrix composites, and ceramic-matrix composites. An example for metal-matrix composites is planned for the next revision. 1.2 The recommended format described in
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Supplier: ND Industries, Inc.
Description: dissimilar materials and a wide range of temperatures. Forms a bond on: fiberglass, steel, aluminum, stainless steel, composite, ABS, PVC, plastic, wood, ceramic, glass, and more.
- Use Temperature: -40 to 200 F
- Chemical System: Acrylic / Polyacrylate
- Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Wood / Wood Product
- Cure / Technology: Reactive / Moisture Cured, Two Component System
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Supplier: SPIE - Education
Description: optomechanical systems, along with thermal management and optoelectronic packaging. Numerous and growing numbers of polymer matrix-, metal matrix-, ceramic matrix- and carbon/carbon composites provide great improvements in stiffness, strength, dimensional stability, thermal
- Type: Course
- Technology / Subject Expertise: Design / Engineering Methods (ESDU, DFx, etc.), Photonics / Optics
- Delivery: On-site / In Plant
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Supplier: TPL, Inc.
Description: ceramic capacitors (MLCC), monolithic ceramic capacitors, ceramic tapes, polymer composites, polymer-ceramic composites, electrode pastes and piezoelectric devices. TPL’s Barium Strontium titanate thin films and composites are finding
- Features: Barium Titanate (BT), Other
- Performance Features: Composite / Ceramic Matrix
- Material Type: Piezoelectric Ceramic
- Shape / Form: Powder / Aggregate (Grain / Grog)
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of
- Use Temperature: -60 to 250 F
- Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
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Supplier: ASTM International
Description: this guide are included for filament-wound polymer-matrix composites, laminar polymer-matrix composites, and ceramic-matrix composites. An example for metal-matrix composites is planned for the next revision. 1.2 The recommended format described in
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Supplier: ASTM International
Description: identification system for grouping different types of SiC-SiC composites into different classes and provides a means of identifying the general structure and properties of a given SiC-SiC composite. It is meant to assist the ceramics community in developing, selecting, and using
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Supplier: ASTM International
Description: composite panels containing, but not limited to, silicon carbide, silicon nitride and carbon matrix and fibers. 1.5 This practice applies to polymer or ceramic matrix composite structures with inspection surfaces that are sufficiently optically opaque to absorb incident
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Supplier: Master Bond, Inc.
Description: Master Bond UV11-3 is an extra-hard, super-abrasion resist-radiation curable coating system for plastic substrates. It is a low viscosity, clear, 100% reactive liquid that can be cured readily by exposure to UV lamps or EB radiation. The cure can be effected in air or under an inert atmosphere such
- Viscosity: 35,000 to 40,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.029 W/m-K
- Coeff. of Thermal Expansion (CTE): 33 µin/in-F
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Supplier: Morgan Advanced Materials
Description: Morgan Technical Ceramics supplies Piezo Composite materials to satisfy the divergent requirements of a wide variety of ultrasound and sonar applications. We offer a range of standard 1-3 composite materials and a large range of custom 1-3 and 2-2 piezo ceramic
- Features: Dielectric Ceramic
- Material Type: Piezoelectric Ceramic
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Supplier: CoorsTek
Description: liner and cup configurations are ceramic-on-ceramic, ceramic-on-polymer, and metal-on-polymer. Combined, >1.4 million ceramic heads and liners are implanted yearly. Toughening Mechanisms CeraSurf®-p alumina matrix composite is comprised of a
- Features: Alumina-Zirconia, Specialty Ceramic
- Applications: Biocompatible / Bioceramics
- Shape / Form: Fabricated / Custom Shape
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: P69000C-B fireproof ceramic silicone tape is mainly processed from fireproof ceramicized silicone rubber and fireproof reinforcing glass fiber, it is a high-strength flexible composite product with good high-temperature resistance and excellent electric insulation. It can resist flame
- Features: Anti-static / ESD Control, Electrically Conductive, Safety / Flagging, Single-Sided Adhesive
- Backing: Glass / Fiberglass, Plastic / Polymer
- Adhesive: Rubber, Silicone
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Supplier: Ensinger North America
Description: TECAPEEK CMF is a composite material based on Victrex® PEEK 450G polymer, that is filled with ceramic. This materials has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often intricate designs necessary for parts such as
- Deflection Temperature (@ 264 psi, 1.8 MPa): 551 to 572 F
- Thermal Conductivity: 0.37499254 W/m-K
- Coeff. of Thermal Expansion (CTE): 30.999999999999996 µin/in-F
- Tensile Strength (Break): 14,122 to 15,200 psi
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Description: Deals with impulse puncture testing in air of ceramic and glass insulator units of class B: cap and pin, pin type (including pin-post type) and class B long rod insulators. May be applied also in tests on Class B insulators of other materials (e.g. polymers and composites).
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Supplier: CSA Group
Description: Deals with impulse puncture testing in air of ceramic and glass insulator units of class B: cap and pin, pin type (including pin-post type) and class B long rod insulators. May be applied also in tests on Class B insulators of other materials (e.g. polymers and composites).
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Supplier: AGC Chemicals Americas, Inc.
Description: Fluon® PFA EA-2000, is an Perfluoro resin which has been functionalized to include an adhesive group within the polymer backbone. The perfluoro backbone gives the material excellent electrical characteristics, and heat and chemical resistance, while the adhesive functionality facilitates
- Tensile Strength (Break): 5,221.326216859092 psi
- Elongation: 460 %
- Dielectric Constant (Relative Permittivity): 2.1
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: United Testing Systems, Inc.
Description: The United Model DSTM testing machine is a computer inclusive, electromechanical, test system designed to accommodate a variety of testing instruments and accessories to test various types of material including ceramics, plastics, polymers, metals and composites. Contact a
- Force Measurement Range: 0 to 562 lbs
- Type: Force / Weight
- Software Support: PC
- Output: Serial
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Supplier: United Testing Systems, Inc.
Description: The United Model DSTM testing machine is a computer inclusive, electromechanical, test system designed to accommodate a variety of testing instruments and accessories to test various types of material including ceramics, plastics, polymers, metals and composites. Contact a
- Force / Load Capacity: 562 lbs
- Stroke / Travel: 30 inch
- Test Speed: 0.00007000000000000005 to 39.99999999999999 in/min
- Display / User Interface: Application Software, Computer Interface
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Supplier: Port Plastics, Inc.
Description: TECAPEEK® CMF white is a composite material based on Victrex® PEEK 450G polymer, that is filled with ceramic. This material has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often-intricate designs necessary for parts such
- Features: Other
- Chemical System: PEEK
- Industry: Semiconductor / IC's
- Type: Thermoplastic
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Supplier: Ensinger, Inc.
Description: TECAPEEK CMF is a composite material based on Victrex® PEEK 450G polymer, that is filled with ceramic. This materials has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often intricate designs necessary for parts such as
- Use Temperature: 500 F
- Thermal Conductivity: 0.37499254 W/m-K
- Water Absorption: 0.06 %
- Tensile Strength (Break): 14,122 to 15,200 psi
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Supplier: Matexcel
Description: Graphene Nanoplatelets: Average thickness - 7 nm 23 wt% Total graphene content Solvent: N-Butyl acetate Proprietary dispersant (2%) Application: An additive to polymers, graphene-based composites Thermally conductive compounds Inks and coatings Heat sinks Electromagnetic Interference
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Supplier: Matexcel
Description: Specific surface area-833 m2/g Color: Black Solid content: 98% Carbon/Oxygen Ratio 10.5 Average flake thickness:1 monolayer Average Particle (lateral) size: ~3-5 microns. Application: Graphene-polymer composite materials Electrically and thermally conductive composites
- Features: Biocompatible / Bioceramics
- Shape / Form: Powder / Aggregate (Grain / Grog)
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Supplier: Matexcel
Description: (1)Small quantity addition can greatly improve the mechanical properties of the composite. (2) To be easily dispersed and ground. Application: Use for reinforcement of polymer composites, such as plastic, resin, rubber, glass fiber and carbon fiber composites. Usage: Wear
- Shape / Form: Powder / Aggregate (Grain / Grog)
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33LV produces high
- Viscosity: 30,000 cP
- Use Temperature: -60 to 500 F
- Dielectric Strength: 410 kV/in
- Dielectric Constant (Relative Permittivity): 5.81
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Supplier: Master Bond, Inc.
Description: temperature range of - 100°F to +550°F. The fully cured EP46HT-1 polymer system features a glass transition temperature over 235°C. Adhesion to metals, glass, ceramics, wood, vulcanized rubber and many plastics is excellent. The hardened System is an electrical insulator. Color of Part
- Viscosity: 15,000 to 20,000 cP
- Use Temperature: -100 to 550 F
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 µin/in-F
- Tensile Strength (Break): 10,600 psi
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Supplier: Matexcel
Description: Composition: Carbon (≥ 46%), Oxygen (≤ 46%) Flake size: 0.5-5 microns Thickness: 1 atomic layer - at least 60%. Color:Brown Application: Graphene-polymer composite materials Ultrastrong graphene oxide paper Transparent conductive coatings Solar cells Supercapacitors Support for
- Features: Biocompatible / Bioceramics
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Supplier: TPL, Inc.
Description: The ultra-fine particle size, 50 to 400 nano meters (nm) of these ceramic powders make them ideal for ultra-thin dielectric layers in composites and ceramic capacitors. TPL has the ability to provide nano-powder formulations to customer specifications. NanOxide™ Powder Products
- Particle / Feature Size: 400 nm
- Material: Ceramic / Carbide
- Type: Nano Powder / Particulate
- Application: Nanoelectronics
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Supplier: TPL, Inc.
Description: The ultra-fine particle size, 50 to 400 nano meters (nm) of these ceramic powders make them ideal for ultra-thin dielectric layers in composites and ceramic capacitors. TPL has the ability to provide nano-powder formulations to customer specifications. NanOxide™ Powder Products
- Particle / Feature Size: 100 nm
- Specific Surface Area (SSA): 12.5 m2/g
- Material: Ceramic / Carbide
- Type: Nano Powder / Particulate
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Supplier: KRÜSS Scientific
Description: the information you need for optimizing wetting and coating processes on very small surfaces. Applications Investigation of synthetic and natural fibers for composites Wettability of contact points in microelectronics Optimization and development of hair care products Wettability of biochips
- Test Media: Adhesives / Coatings, Ceramics / Glass, Metals, Polymers (Plastics, Elastomers), Wood / Wood Product
- Display & Special Features: Computer Interface / Networkable
- Mounting / Loading Options: Laboratory / Batch
- Properties Analyzed: Surface Energy / Tension, Wettability / Contact Angle
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Supplier: FHD Bearings Co., Ltd.
Description: High-Speed Linear Sleeve Bearings Linear Sleeve Bearings, also known as bushings, are cylindrical components designed to provide linear motion with minimal friction. Constructed from materials such as bronze, plastic, or composite polymers, these bearings offer a cost-effective
- Outside Diameter: 0.50000027 inch
- Length: 0.750000405 inch
- Design Units: Metric
- Features: Other
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: Marking area: 60mm*60mm- 250mm*250mm Repetition accuracy±0.005mm Scanning speed5000mm/s Application materials and field: Various of metals, alloy, semiconductor, diamond, jade, sapphire , ceramic, polymer, composite material , resin, photoresist, thin film and glass.
- Type: Complete / Turnkey System
- Laser Operation: Laser Cutting
- Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System
- Workpiece Material: Metal / Conductive Materials, Semiconductors / Electronics
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Dental composites are synthetic polymers filled with reinforcing glass and/or ceramic particles. A typical mixing procedure starts with blending two or more monomers often of significantly different viscosities. Various particle size fillers are then added to the liquid binder and mixed (read more)
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, glass, composites, ceramics and many plastics. It withstands a variety of chemicals such as water, oils, fuels and cleaning agents. This high temperature resistant system is serviceable over the wide temperature range of -60°F to +400°F. As a one part compound, EP3HTS-LO offers (read more)
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ZSCMA2010P573
Powder processing for discontinuous matrix composites Slurry infiltration and consolidation for glass and glass- ceramic composites Polymer infiltration and pyrolysis Chemical vapor infiltration Directed metal oxidation Liquid silicon infiltration .
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Influence of volcanic ash contamination on the flashover voltage of HVAC outdoor suspension insulators
Three ceramic (porcelain or toughened glass) insulators of different profile and one non- ceramic ( composite polymer ) insulator, all commonly used in transmission systems in New Zealand, were chosen for analysis (Table 1, Figure 3).
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Study of the structure of ceramic-polymer functional coatings via nuclear backscattering spectrometry
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Piezoelectric composites for sensor and actuator applications
H. Electrostrictive/ Ceramic Polymer Composites .
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The preparation of 0-3 ceramic polymer composites involves proper consideration regarding the materials to be used.
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Springer Handbook of Nanomaterials
945 26.3.4 Ceramic Polymer Composites as Implants ...............................
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Synthesis and Characterization of Lead-Free Ferroelectric 0.5[Ba(Zr0.2 Ti0.8 )O3 ]–0.5[(Ba0.7 Ca0.3 )TiO3 ]—Polyvinylidene Difluoride 0–3 Composites
Ceramic polymer composites in different volume fractions with different connectivity patterns have been designed and fabricated for improving dielectric, piezo- electric and pyroelectric properties [5, 6].
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Emerging ferroelectric ceramic-polymer composites for sub-THz tunable devices
Fig. 2 shows an image from a scanning electron microscope (SEM) of cross-section of the ferroelectric ceramic polymer composite tape and the printed silver line.
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Poling provides special challenges for 0-3 ceramic polymer composites in which ceramic particles do not form a continuously connected structure across the inter-electrode dimension.
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