-
Supplier: Ellsworth Adhesives
Description: Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning
- Viscosity: 25 cP
- Thermal Conductivity: 1.8 W/m-K
- Dielectric Strength: 400.00000000000006 kV/in
- Features: Gap Filling Compound, Leveling / Filling Compound, Thermal / Heat Conductive
-
Supplier: Ellsworth Adhesives
Description: Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical
- Viscosity: 300,000 cP
- Thermal Conductivity: 2 W/m-K
- Dielectric Strength: 500.00000000000006 kV/in
- Features: Gap Filling Compound, Leveling / Filling Compound, Thermal / Heat Conductive
-
Description: BERGQUIST® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging
- Use Temperature: -76 to 392 F
- Thermal Conductivity: 3.5 W/m-K
- Features: Gap Filling Compound, Thermal Compound / Interface (Thermally Conductive), Thermosetting / Crosslinking
- Industry: OEM / Industrial
-
-
Supplier: Henkel Corporation - Industrial
Description: BERGQUIST GAP FILLER TGF 3600, Thermally Conductive, Two-part, Liquid, Gap Filling Material BERGQUIST® GAP FILLER TGF 3600 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior
- Use Temperature: 76 to 392 F
- Thermal Conductivity: 3.6 W/m-K
- Features: Gap Filling Compound, Leveling / Filling Compound, Thermal / Heat Conductive
- Chemical System: Silicone
-
Supplier: Shiu Li Technology Co., Ltd
Description: Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink.
- Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 11 W/m-K
- Dielectric Strength: 203.20000000000041 kV/in
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g
- Viscosity: 120 to 150 cP
- Thermal Conductivity: 1.7 W/m-K
- Dielectric Strength: 482.600000000001 kV/in
- Features: Gap Filling Compound, Leveling / Filling Compound, Thermal / Heat Conductive
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5150 Blue is a one component, high performance, non-curable, thermally conductive gap filler designed to dissipate heat from electronics to a heat sink providing a reliable cooling solution for a wide variety of substrates. It is reworkable, easy to dispense, has low
- Viscosity: 2,360 cP
- Thermal Conductivity: 5 W/m-K
- Dielectric Strength: 261.6200000000006 kV/in
- Industry: Automotive, Electronics, Semiconductors / IC Packaging
-
Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.
- Viscosity: 150,000 cP
- Dielectric Strength: 177.80000000000038 kV/in
- Features: Air Setting / Film Drying, Die Bonding Adhesive / Compound, Gap Filling Sealant / FIP Gasket, Gel, Thermosetting / Crosslinking, Two Component System
- Industry: Electronics
-
Supplier: Techsil Limited
Description: Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications. Product
- Industry: Electronics
- Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Compound, Grease / Paste, Thermal / Heat Conductive
- Chemical System: Silicone
-
Supplier: Newark, An Avnet Company
Description: GAP FILLER 1500 50CC CARTRIDGE; Insulator Body Material:-; Thermal Conductivity:1.8W/m.K; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:10000Mohm-m; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; SVHC:No SVHCRoHS Compliant: Yes
-
Description: risk of silicone oil bleed. ◆ Self-adhesive for easy application and rework. ◆ Exceptional tensile strength and abrasion resistance. ◆ Customizable die-cut shapes to meet specific customer needs. ◆ Excellent electrical insulation properties. ◆ Superior flame resistance, achieving a UL94 V-0
- Use Temperature: -40 to 257 F
- Thermal Conductivity: 3 W/m-K
- Tensile Strength (Break): 7.977026164645835 psi
- Elongation: 70 %
-
Description: protecting sensitive and fragile components. ◆ Self-adhesive for easy application and rework. ◆ Customizable die-cut shapes to meet specific customer needs. ◆ Exceptional tensile strength and abrasion resistance. ◆ Excellent electrical insulation properties. ◆ Superior flame resistance,
- Use Temperature: -58 to 392 F
- Thermal Conductivity: 4 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 30 %
-
Description: BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to
- Use Temperature: -76 to 392 F
- Features: Gap Filling Compound, Pad, Thermal / Heat Conductive
- Industry: OEM / Industrial
- Chemical System: Silicone
-
Supplier: Henkel Corporation - Electronics
Description: GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for
- Industry: Electronics
- Features: Gap Filling Compound, Pad, Thermal Compound / Interface (Thermally Conductive)
-
Description: CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application and rework. ◆ High
- Use Temperature: 320 F
- Thermal Conductivity: 30 W/m-K
- Tensile Strength (Break): 4.35110518071591 psi
- Elongation: 20 %
-
Description: BERGQUIST® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due
- Use Temperature: -76 to 392 F
- Thermal Conductivity: 10 W/m-K
- Industry: OEM / Industrial
- Features: Pad, Thermal / Heat Conductive
-
Description: CoroBond™ CRACK FILLER is a 2 component epoxy paste developed specifically for sealing, smoothing, and fairing applications on concrete, metals, plastics (FRP), wood, or masonry. The smooth consistency and excellent non-sagging properties allow the product to be used on vertical and
- Applied Thickness / Gap Fill: 2 inch
- Use Temperature: 55 to 95 F
- Tensile Strength (Break): 2,600 psi
- Substrate Compatibility: Concrete / Masonry, Metal, Plastic, Wood / Wood Product
-
Description: ArmorSeal®CRACK FILLER is a two-component, fast set epoxy paste developed specifically for sealing, smoothing, and fairing applications on concrete, metals, plastics (FRP), wood, or masonry. The smooth consistency and excellent non-sagging properties allow the product to be used on vertical
- Use Temperature: 55 to 95 F
- Tensile Strength (Break): 2,600 psi
- Substrate Compatibility: Concrete / Masonry, Metal, Plastic, Wood / Wood Product
- Chemical System: Epoxy (EP)
-
Supplier: Henkel Corporation - Electronics
Description: Gap Pad® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The
- Industry: Electronics
- Features: Thermally Conductive
-
Supplier: Henkel Corporation - Electronics
Description: Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for
- Industry: Electronics
- Features: Thermally Conductive
-
Description: 3M™ Scotch-Weld™ Structural Adhesive EC-3587 B/A Gray is a two-part polyurethane that cures at room temperature or with heat to a tough, impact-resistant material. It has excellent adhesion to many metal and plastic substrates. It can be used as structural adhesive, void filler,
- Industry: Aerospace, OEM / Industrial
- Features: Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking, Two Component System
- Substrate Compatibility: Metal, Plastic
- Chemical System: Polyurethane (PU, PUR)
-
Supplier: DigiKey
Description: Thermal Liquid Gap Filler, 2 Part 50cc Cartridge
- Use Temperature: -76 to 392 F
- Thermal Conductivity: 1.8 W/m-K
-
Description: Epoxy used for filling voids and honeycomb core. Cures to a rigid, solvent-resistant material in one hour at 250F (121C). The compound has thixotropic properties for ease of application. Cured material is flame retardant. Meets the flammability requirements of F.A.R. 25.853 (a).
- Use Temperature: -67 to 212 F
- Industry: Aerospace, OEM / Industrial
- Chemical System: Epoxy (EP)
- Features: Flame Retardant (e.g. UL 94 Rated), Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound, Other, Single Component System, Thermosetting / Crosslinking
-
Supplier: Titebond
Description: adhesive on the surface of the flooring. Try to prevent the adhesive from curing on the surface of the prefinished floor. Also, ensure the side gaps and end gaps of the flooring are fit together snugly. While these tasks are being completed, the floor is being "rolled"
- Viscosity: 100,000 cP
- Chemical System: Acrylic / Polyacrylate
-
Supplier: Master Bond, Inc.
Description: housings; interrupter tubes and outdoor instrument transformers. Master Bond Polymer System EP112 does not contain any fillers but is also available in filled modifications with specially surface treated quartz, alumina and other fillers to best meet specific application requirements.
- Viscosity: 50 to 200 cP
- Use Temperature: -60 to 450 F
- Tensile Strength (Break): 10,000 to 11,000 psi
- Elongation: 30 to 5 %
-
Supplier: Master Bond, Inc.
Description: straightforward; 20-30 minutes at 250°F or 10-15 minute at 300°F. EP3UF is distinguished by being thermally conductive and electrically insulative by using very special filler material with ultra small particle sizes. These granules allow EP3UF to be used as an underfill in spaces as small as
- Viscosity: 10,000 to 40,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 1.3 to 1.44 W/m-K
- Tensile Strength (Break): 5,000 to 7,000 psi
-
Supplier: Aremco Products, Inc.
Description: Sets @ RT, good filler, probes, sensors
- Use Temperature: 3,000 F
- Coeff. of Thermal Expansion (CTE): 4.199999999999999 µin/in-F
- Dielectric Strength: 256.0000000000001 kV/in
- Substrate Compatibility: Ceramic / Glass
-
Supplier: Aremco Products, Inc.
Description: Sets @ RT, good filler, oxygen sensors
- Use Temperature: 2,400 F
- Coeff. of Thermal Expansion (CTE): 4.1 µin/in-F
- Dielectric Strength: 200.00000000000003 kV/in
- Substrate Compatibility: Ceramic / Glass
-
Supplier: Boyd
Description: Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its
- Features: Gap Filling Compound, Pad, Thermal / Heat Conductive, Thermal / Heat Insulating
-
Supplier: Master Bond, Inc.
Description: Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
- Viscosity: 30,000 to 50,000 cP
- Use Temperature: -76 to 194 F
- Coeff. of Thermal Expansion (CTE): 19,444,444.444444444 to 22,222,222.22222222 µin/in-F
- Tensile Strength (Break): 2,600 to 2,800 psi
Find Suppliers by Category Top
Featured Products Top
-
Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
Superior Thermal Transfer from New Form-In-Place Gap Filler Fujipoly® America announces the release of its new (read more)
Browse Conductive Compounds Datasheets for Fujipoly® America Corp. -
. Filled PTFE Compounds: Compounded with pigments and fillers like glass, graphite and metal powders for enhanced wear, creep resistance and thermal/electrical performance. Adhesive Grades: Fluorinated adhesive resin compounds made with Fluon (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
product line consists of advanced adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins. Each compound is designed to meet specific application needs and requirements. Master Bond manufactures over 3,000 grades of specially designed formulations. We also offer replacements for competitors’ discontinued products. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
. For more information, view our Thermally Conductive Adhesives page. Encapsulation and potting compounds Using a thermally conductive encapsulant has become (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for CHT USA Inc. -
gaps could be very damaging to either the PCB or delicate components. The liquid dispensable Gap Filler can be applied to very specific areas and at varying thicknesses, thus offering commercial and technical advantages. Non-setting compounds Silicone thermal (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
Management With the continued miniaturization and expanding population of components that comprise electronic devices, mitigation of generated heat is an ongoing issue. CHT offers a series of silicone adhesive sealants, encapsulation and potting compounds, silicone gels, gap fillers and non (read more)
Browse Conformal Coatings Datasheets for CHT USA Inc. -
expected performance results. Adding adhesive functionality, conductive fillers, elastomers or reinforced fillers such as carbon or glass, can enhance and improve the performance of neat ETFE in a variety of ways. AGC Chemicals can customize fluoropolymer compounds to your precise specifications. Contact us with your challenges and pain points to which our material science solutions can help. (read more)
Browse Resins and Compounds Datasheets for AGC Chemicals Americas, Inc. -
. Made with thermally conductive fillers and an adhesive structure, this material conforms well to uneven surfaces and helps reduce air gaps at the interface. As a result, it supports stable thermal transfer, reliable insulation, and secure attachment in compact (read more)
Browse Double Sided and Transfer Tapes Datasheets for Dongguan Sheen Electronic Technology Co., Ltd.
More Information Top
Indicates content that may require registration and/or purchase.
-
States > Minnesota > State > Regulations > Health‚ Department of > [MNR 4620] 4620 - Clean Indoor Air
B. Filler compound applied to gaps in existing asbestos-containing material must contain no asbestos, adhere well to the substrate, and provide a base for the encapsulant.
-
Encyclopedia of Plastics, Polymers, and Resins Volume 3
Category/Applications: Emulsion de- signed for production of water-resistant highly-filled adhesives and fillers, e.g., aq. ceramic tile adhesives, gap fillers with excellent water resistance, water- resistant adhesives for expanded poly- styrene … … tiles; suitable base for compounding into ready-mixed tile .
-
Novel Thermally Conductive Thermoplastic/Ceramic Composite Foams
PMCs.[12–16] In particular, PMCs containing ceramic-based fillers [e.g., alumina (Al2O3), aluminum nitride (AlN), hexagonal boron nitride … … extensively investigated for uses in electronic packaging materials such as adhesives , phase change materials, gap pads, and potting compounds .[12] Ceramic materials are …
-
Adhesives
Although many of today's commercial anaerobic adhesives are still based on acrylic esters (particularlypolyethylene glycol dimethacryl- ates) and cumene hydroperoxide,a wide range of formulations have been developed for faster cure, better heat and impact resistance, better gap filling, etc. Such formulations contain: various initiators, accelerators, plasticizers, stabilizers, fillers , and monomeric or polymeric additives, and acrylics such as those modified with the reaction … … the reaction products of toluene diisocyanate and polypropylenetriol, and Polybutadiene;ultraviolet light radiation curable compounds ; and pressure sensitive substances.
-
States > New Jersey > State > Regulations > Title 7 - Environmental Protection > [N.J.A.C. 7:27] 27 - Air Pollution Control
"Sealant and caulking compound " means a product with adhesive properties that is designed to fill, seal, waterproof, or weatherproof gaps or joints between two surfaces. … resistant caulking compounds (that is, compounds which contain no appreciable level of opaque fillers or pigments, transmit …
-
Alloys and Composites of Polybenzoxazines
Furthermore, the low viscosity resin generally aids in filler mixing during the molding compound preparation. These hypotheses are based on one important assumption that the adhesion between the filler and the matrix resin is good; otherwise, the third phase, an air gap , may occur and will also have a high contribution to the overall conductivity of the …
-
States > New Jersey > State > Proposed Regulations > 2003 Documents > September 15, 2003 > [2003 NJ Proposed nj-p007e258] 7:27 - Prevention of Air Pollution fr...
"Sealant and caulking compound " means a product with adhesive properties that is designed to fill, seal, waterproof, or weatherproof gaps or joints between two surfaces. … resistant caulking compounds (that is, compounds which contain no appreciable level of opaque fillers or pigments, transmit …
-
ZCP2007ISTFA126
Being present in the molding compound formulation, spherical filler particles were also found trapped in the inter-die peripheral gap . … dice at the inter-die peripheral gap must be equivalent to the thickness of the adhesive layer.
-
The effect of mineral surface nature on the mechanical properties of mineral-filled polypropylene composites
Regardless of filler size and shape, intimate contact between the matrix and mineral particles is essential, since air gaps represent points of zero strength. Thus, compound strength is improved by good ‘‘wetting’’ of the mineral by the matrix and further enhanced when the matrix is adhered to the mineral surface via chemical bonding.
-
Program
• Thermally conductive gap filler pads • Silicone-free thermal pads • Phase-change materials (PCM) • Thermal grease and gels • Insulator pads • Thin flexible heat spreaders • Conductive elastomer gaskets • Conductive compounds , adhesives , sealants and caulks • RF and thermal/RF absorbing materials • Coatings — direct metallization and conductive paints .