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Supplier: Henkel Corporation - Industrial
Description: thermal cycling yet maintain enough modulus to prevent pump-out from the interface. BERGQUIST GAP FILLER TGF 3600 will lightly adhere to surfaces, thus improving surface area contact. BERGQUIST GAP FILLER TGF 3600 is not designed to be a structural adhesive.
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 3.6 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Ellsworth Adhesives
Description: Bergquist Gap Filler 1500 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for fragile electronic assemblies and filling difficult air voids and gaps. It offers excellent shear thinning
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Material Form: Gap Filling Compound
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Supplier: Ellsworth Adhesives
Description: Bergquist Gap Filler 2000 Thermally Conductive Adhesive is a two component, liquid gap filling material that is designed as a form-in-place elastomer for coupling hot electronic components. It cures at room or elevated temperatures and offers mechanical and chemical
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 500 kV/in
- Material Form: Gap Filling Compound
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Description: BERGQUIST® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging
- Chemical / Polymer System Type: Silicone
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: OEM / Industrial
- Thermal Conductivity: 3.5 W/m-K
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Supplier: Fujipoly® America Corp.
Description: Silicone Gap Filler Pad for Absorption of Electromagnetic Wave Features Effective to absorb and damp a wide range of electromagnetic waves. Also effective as a high performance thermal interface material. Easily filling small gaps of IC chip surface
- Applied Thickness / Gap Fill: 0.0197 to 0.0984 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Henkel Corporation - Industrial
Description: exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. BERGQUIST GAP PAD TGP 3500ULM maintains a
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 3.5 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Henkel Corporation - Industrial
Description: pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for high performance applications requiring low assembly stress. BERGQUIST GAP PAD TGP HC3000 maintains a conformable nature that allows for excellent interfacing
- Chemical / Polymer System Type: Silicone
- Material Type: Gap Filling Compound
- Thermal Conductivity: 0.3000 W/m-K
- Use Temperature: 76 to 392 F
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Supplier: Shiu Li Technology Co., Ltd
Description: Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink.
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 203 kV/in
- Features: UL Approved
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5150 Blue is a one component, high performance, non-curable, thermally conductive gap filler designed to dissipate heat from electronics to a heat sink providing a reliable cooling solution for a wide variety of substrates. It is reworkable, easy to dispense, has low
- Cure Type / Technology: Single Component System
- Dielectric Strength: 262 kV/in
- Features: Leveling / Filling Compound, Thermal / Heat Conductive
- Industry: Automotive, Electronics, Semiconductors / IC Packaging
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY T-work 9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work 9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat.
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 203 kV/in
- Features: UL Approved
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces,
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 203 kV/in
- Features: UL Approved
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: Air Setting / Film Drying, Thermosetting / Crosslinking
- Dielectric Strength: 178 kV/in
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 203 kV/in
- Features: UL Approved
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Supplier: Techsil Limited
Description: . Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications. Product
- Compound Type: Thermal Compound / Heat Conductive
- Features: Flame Retardant (e.g. UL 94 Rated)
- Industry: Electronics
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Description: . ? Free from siloxane and the risk of silicone oil bleed. ? Self-adhesive for easy application and rework. ? Exceptional tensile strength and abrasion resistance. ? Customizable die-cut shapes to meet specific customer needs. ? Excellent electrical
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Dielectric Strength: 2.03E-4 kV/in
- Elongation: 70 %
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two component, silicone material that is used to dissipate heat from electronic devices, EV modules, and other heat-generating components. It is non-flowable and cures at room temperature or heat accelerated. 720 g
- Cure Type / Technology: Two Component System
- Dielectric Strength: 483 kV/in
- Features: Leveling / Filling Compound, Thermal / Heat Conductive
- Thermal Conductivity: 1.7 W/m-K
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Description: compressible, soft, reducing assembly stress and protecting sensitive and fragile components. ? Self-adhesive for easy application and rework. ? Customizable die-cut shapes to meet specific customer needs. ? Exceptional tensile strength and abrasion resistance
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 8
- Dielectric Strength: 2.03E-4 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Henkel Corporation - Electronics
Description: GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for
- Industry: Electronics
- Material Type: Gap Filling Compound, Pad
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Supplier: Henkel Corporation - Electronics
Description: Gap Pad® 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 10000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use. Thermal
- Compound Type: Thermal Compound / Heat Conductive
- Industry: OEM / Industrial
- Thermal Conductivity: 10 W/m-K
- Use Temperature: -76 to 392 F
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Supplier: Henkel Corporation - Industrial
Description: applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing
- Compound Type: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Use Temperature: 140 to 392 F
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Description: filler package and ultra low modulus resin formulation. BERGQUIST GAP PAD TGP 7000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use. Options and Configurations Sheet
- Compound Type: Thermal Compound / Heat Conductive
- Industry: OEM / Industrial
- Use Temperature: -76 to 392 F
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Supplier: Henkel Corporation - Electronics
Description: Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation. The enhanced material is well suited for
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: DigiKey
Description: Thermal Gel Gap Filler 10cc Syringe
- Thermal Conductivity: 0.7000 W/m-K
- Use Temperature: -67 to 392 F
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Supplier: DigiKey
Description: Thermal Liquid Gap Filler 360cc Cartridge
- Thermal Conductivity: 2.3 W/m-K
- Use Temperature: -49 to 302 F
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Supplier: DigiKey
Description: Thermal Gel Gap Filler 10cc Syringe
- Thermal Conductivity: 3.5 W/m-K
- Use Temperature: -67 to 392 F
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Supplier: DigiKey
Description: Thermal Gel Gap Filler 300cc Cartridge
- Thermal Conductivity: 0.7000 W/m-K
- Use Temperature: -67 to 392 F
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Supplier: Aremco Products, Inc.
Description: Sets @ RT, good filler, oxygen sensors
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 4.1 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Aremco Products, Inc.
Description: High strength, good filler, halogen lamps
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 4 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Aremco Products, Inc.
Description: Sets @ RT, good filler, probes, sensors
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 4.2 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Titebond
Description: filler/leveling compounds must be portland based cementious materials and have a compressive strength equal to or greater that 3000 psi when cured. Acceptable Subfloor Materials For use with hardwood flooring over all standard subfloors including: plywood, underlayment grade
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Viscosity: 100000 cP
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Description: 3M™ Scotch-Weld™ Structural Adhesive EC-3587 B/A Gray is a two-part polyurethane that cures at room temperature or with heat to a tough, impact-resistant material. It has excellent adhesion to many metal and plastic substrates. It can be used as structural adhesive, void filler,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Features: Gap Filling Sealant / FIP Gasket, Grease / Paste, Leveling / Filling Compound
- Industry: Aerospace, OEM / Industrial
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Supplier: Master Bond, Inc.
Description: straightforward; 20-30 minutes at 250°F or 10-15 minute at 300°F. EP3UF is distinguished by being thermally conductive and electrically insulative by using very special filler material with ultra small particle sizes. These granules allow EP3UF to be used as an underfill in spaces as small
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Reactive / Moisture Cured, Single Component System
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Supplier: Graphene Laboratories, Inc.
Description: and fillers, ensuring high performance and adaptability to a wide range of conditions. Moreover, a defining feature of the G6E-TSHV™ Epoxy is its incorporation of a proprietary graphene additive. Loading the adhesive with graphene enhances its cracking resistance, making it more
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Features: Electrically Conductive Compound (Adhesive, Grease), Grease / Paste
- Filled / Reinforced: Yes
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Supplier: RS Components, Ltd.
Description: T-flex 600 Seriesâ?¢ is an exceptionally soft, highly compressible, highly conductive gap filling interface pad. Its outstanding properties are the result of a proprietary boron nitride filler in the composition. While extremely soft, T-flex 600 recovers to more than 90% of its
- Chemical / Polymer System Type: Specialty / Other
- Compound Type: Thermally Conductive
- Thermal Conductivity: 3 W/m-K
- Use Temperature: -49 to 392 F
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More Information Top
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States > Minnesota > State > Regulations > Health‚ Department of > [MNR 4620] 4620 - Clean Indoor Air
B. Filler compound applied to gaps in existing asbestos-containing material must contain no asbestos, adhere well to the substrate, and provide a base for the encapsulant.
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Encyclopedia of Plastics, Polymers, and Resins Volume 3
Category/Applications: Emulsion de- signed for production of water-resistant highly-filled adhesives and fillers, e.g., aq. ceramic tile adhesives, gap fillers with excellent water resistance, water- resistant adhesives for expanded poly- styrene … … tiles; suitable base for compounding into ready-mixed tile .
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Novel Thermally Conductive Thermoplastic/Ceramic Composite Foams
PMCs.[12–16] In particular, PMCs containing ceramic-based fillers [e.g., alumina (Al2O3), aluminum nitride (AlN), hexagonal boron nitride … … extensively investigated for uses in electronic packaging materials such as adhesives , phase change materials, gap pads, and potting compounds .[12] Ceramic materials are …
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Adhesives
Although many of today's commercial anaerobic adhesives are still based on acrylic esters (particularlypolyethylene glycol dimethacryl- ates) and cumene hydroperoxide,a wide range of formulations have been developed for faster cure, better heat and impact resistance, better gap filling, etc. Such formulations contain: various initiators, accelerators, plasticizers, stabilizers, fillers , and monomeric or polymeric additives, and acrylics such as those modified with the reaction … … the reaction products of toluene diisocyanate and polypropylenetriol, and Polybutadiene;ultraviolet light radiation curable compounds ; and pressure sensitive substances.
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States > New Jersey > State > Regulations > Title 7 - Environmental Protection > [N.J.A.C. 7:27] 27 - Air Pollution Control
"Sealant and caulking compound " means a product with adhesive properties that is designed to fill, seal, waterproof, or weatherproof gaps or joints between two surfaces. … resistant caulking compounds (that is, compounds which contain no appreciable level of opaque fillers or pigments, transmit …
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Alloys and Composites of Polybenzoxazines
Furthermore, the low viscosity resin generally aids in filler mixing during the molding compound preparation. These hypotheses are based on one important assumption that the adhesion between the filler and the matrix resin is good; otherwise, the third phase, an air gap , may occur and will also have a high contribution to the overall conductivity of the …
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States > New Jersey > State > Proposed Regulations > 2003 Documents > September 15, 2003 > [2003 NJ Proposed nj-p007e258] 7:27 - Prevention of Air Pollution fr...
"Sealant and caulking compound " means a product with adhesive properties that is designed to fill, seal, waterproof, or weatherproof gaps or joints between two surfaces. … resistant caulking compounds (that is, compounds which contain no appreciable level of opaque fillers or pigments, transmit …
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ZCP2007ISTFA126
Being present in the molding compound formulation, spherical filler particles were also found trapped in the inter-die peripheral gap . … dice at the inter-die peripheral gap must be equivalent to the thickness of the adhesive layer.
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The effect of mineral surface nature on the mechanical properties of mineral-filled polypropylene composites
Regardless of filler size and shape, intimate contact between the matrix and mineral particles is essential, since air gaps represent points of zero strength. Thus, compound strength is improved by good ‘‘wetting’’ of the mineral by the matrix and further enhanced when the matrix is adhered to the mineral surface via chemical bonding.
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Program
• Thermally conductive gap filler pads • Silicone-free thermal pads • Phase-change materials (PCM) • Thermal grease and gels • Insulator pads • Thin flexible heat spreaders • Conductive elastomer gaskets • Conductive compounds , adhesives , sealants and caulks • RF and thermal/RF absorbing materials • Coatings — direct metallization and conductive paints .
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