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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST TGR 1500A, High Performance, Value Compound for High-End Computer Processors BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high end computer processor and a heat sink. Other high watt
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.5 W/m-K
- Use Temperature: 302 F
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Description: Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Description: Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Description: Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent
- Chemical / Polymer System Type: Epoxy (EP), Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Semiconductors / IC Packaging
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Supplier: Techsil Limited
Description: Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primer less adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrically Conductive
- Rubber Based / Elastomeric: Yes
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 979 EC is a RTV-1 amine cure silicone rubber that cures on contact with moisture in the air. Special features Low volume resistivity Thixotropic paste Solvated Excellent adhesion to many substrates Application SEMICOSIL® 979 EC is an electrically conductive adhesive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing, Reactive / Moisture Cured
- Elongation: 200 %
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 8163F-1, Silicone, Die Attach, Non-conductive Adhesive LOCTITE® ABLESTIK ABP 8163F-1 non-conductive die attach adhesive is designed for LED and sensor manufacturing applications High thermal conductivity High reflectivity Excellent
- Compound Type: Thermally Conductive
- Thermal Conductivity: 0.8000 W/m-K
- Viscosity: 21000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive Reworkable
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has a thermal conductivity of 1.8 W/mK.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Thermal Conductivity: 1.8 W/m-K
- Use Temperature: 40 to 257 F
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Supplier: Techsil Limited
Description: Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for
- Features: Electrically Conductive
- Industry: Electronics
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Description: The SHEEN's SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.5 to 15.0 W/m·K. ? Available in various thicknesses from 0.3 to 10.0 mm. ? Highly
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 9
- Dielectric Strength: 2.03E-4 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ? High bonding performance. ? Good stability, long
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Thermal Conductivity: 1.5 W/m-K
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: Thermally conductive silicone pad is a kind of thermally conductive medium, which is used to reduce the contact thermal resistance between the surface of the heat source and the contact surface of the heat dissipation device. It is specially produced for the design scheme of
- Backing: Plastic / Polymer, Silicone
- Features: Anti-static / ESD Control, Dielectric / Insulating, Electrically Conductive, Other
- Temperature Resistance: -40 to 200 C
- Thickness: 0.0118 to 0.2362 inches
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Supplier: Techsil Limited
Description: Techsil® Zemrex C200 is a semi-conductive paste silicone adhesive which offers primer less adhesion to a range of substrates including many metals, plastics and glass. Zemrex C200 uses a moisture vapor cure system, which release an acetic vapor from the sealant surface during
- Compound Type: Electrically Conductive
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Description: . ? Free from siloxane and the risk of silicone oil bleed. ? Self-adhesive for easy application and rework. ? Exceptional tensile strength and abrasion resistance. ? Customizable die-cut shapes to meet specific customer needs. ? Excellent electrical
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Dielectric Strength: 2.03E-4 kV/in
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Description: The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m·K. ? High bonding performance. ? Good stability, long
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Techsil Limited
Description: Momentive TSE322 is a heat curable silicone adhesive sealant which will bond to many substrates without the need for a primer and cures rapidly at elevated temperatures. Product Benefits Easy to use, one-component material Fast cure at elevated temperature
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
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Supplier: Epoxies Etc...
Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 2.5
- Dielectric Strength: 610 kV/in
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Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
- Chemical / Polymer System Type: Silicone
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Plastic
- Viscosity: Up to 150000 cP
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Metal, Plastic
- Viscosity: 11000 to 14000 cP
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Supplier: Budnick Converting, Inc.
Description: SCT20 is a 2 mil double linered electrically conductive silicone transfer tape that is designed for demanding electronics, aerospace, medical, and high-temperature applications. The unique silicone pressure-sensitive adhesive (PSA) conducts electricity anisotropically
- Peel Strength / Adhesion: 2 lbs/in
- Type: Transfer
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Supplier: CHT USA Inc.
Description: CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range.
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, Specialty / Other
- Dielectric Strength: 508 kV/in
- Elongation: 11 %
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Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
- Industry: Other
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 975 TC is a 1-part thermally conductive paste that is curing into self-adhesive gap filling silicone. The thermal paste is able to efficiently fill finest gaps of heat generating and ablating substrates and thus helps to minimize contact resistance. Thermal
- Coeff. of Thermal Expansion (CTE): 8.33 µin/in-F
- Cure Type / Technology: Single Component System
- Dielectric Strength: 279 kV/in
- Elongation: 10 %
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties.
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, RTV / Room Temperature Curing, Specialty / Other
- Dielectric Strength: 635 kV/in
- Elongation: 170 %
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 970 TC A/B is a pasty, but still flowable addition-curing, two component elastomeric silicone that cures at elevated temperature to an thermally conductive silicone rubber. Special features two-component thermal conductivity pasty, still
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Elongation: 90 %
- Features: Electrical Insulation / Dielectric Material
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Supplier: Shenzhen You-San Technology Co., Ltd.
Description: P77000 non-flame retardant silicone self-adhesive tape is composed of self-adhesive, excellent resilience of self-fusing silicone rubber compounded with a layer of easy to separate isolation film. And has excellent high and low temperature resistance, can be used for a
- Backing: Plastic / Polymer, Rubber, Silicone
- Dielectric Strength: 2.20E7 V/m
- Features: Anti-static / ESD Control, Electrically Conductive
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Supplier: ThreeBond International, Inc.
Description: conductive filler. They are used to connect various electrical contacts and for conduction. Silver, nickel, carbon, etc. are used as the electro-conductive fillers, and epoxy resin, urethane resin, silicone resin, and synthetic rubber are used as binders. With different options
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: CHT USA Inc.
Description: CHT’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a
- Cure Type / Technology: Single Component System, Specialty / Other
- Dielectric Strength: 991 kV/in
- Elongation: 94 %
- Features: Flame Retardant (e.g. UL 94 Rated), UL Approved
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the
- Cure Type / Technology: Single Component System
- Industry: Electronics
- Substrate / Material Compatibility: Metal, Plastic
- Viscosity: Up to 600000 cP
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.78 µin/in-F
- Compound Type: Encapsulating / Potting, Leveling / Filling Compound, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
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Supplier: Saint-Gobain Tape Solutions
Description: ThermaCool TR3 is a unique thermally conductive pressure-sensitive acrylic transfer adhesive. The adhesive is supplied with one release liner. This material provides an easy method for adding an adhesive layer to gap filler silicone materials and thermally
- Features: Adhesive Backed, Color Options
- Material: Foam, Silicone Rubber
- Operating Temperature: -20.2 F
- Thickness: 0.0030 inch
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System
- Features: Electrical Insulation / Dielectric Material
- Thermal Conductivity: 2.31 W/m-K
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Supplier: Saint-Gobain Tape Solutions
Description: ThermaCool K271 is manufactured with a 1.0 mil thick thermally conductive DuPont® Kapton® polyimide film. The film is coated with 1.5 mils of thermally conductive acrylic pressure-sensitive adhesive on one side, and 2.0 mils of thermally conductive silicone rubber
- Features: Adhesive Backed, Color Options
- Material: Foam, Silicone Rubber
- Operating Temperature: -20.2 F
- Thickness: 0.0045 inch
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Supplier: Richardson RFPD
Description: The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with
- Compound Type: Thermally Conductive
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive
- Industry: Electronics, OEM / Industrial
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in film with an area of one
- Compound Type: Thermally Conductive
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Supplier: Richardson RFPD
Description: The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in film with an area of one
- Compound Type: Thermally Conductive
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Description: BERGQUIST® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 3.5 W/m-K
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Supplier: Hi-Tech Seals, Inc.
Description: conductivity is assured and electrical shorting is prevented by the insulation characteristics of the adhesives. The acrylic adhesives replace mechanical devices and silicone greases that can trap contaminants.
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Coeff. of Thermal Expansion (CTE): 3.94E-4 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm. H-Putty has a bond line
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 300 kV/in
- Features: UL Approved
- Industry: Electronics
Find Suppliers by Category Top
Featured Products Top
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Heat cured 1-part silicone adhesives cure in minutes reducing production time and improving output. Using platinum catalysts, they do not produce any harmful by-products, which make them suitable for a wide range of applications including electronics. 1-part - no need for (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
Silicone Adhesives – Unique Silicone adhesives are chosen for their ability to remain flexible across a very wide range of temperatures and operating conditions and their resistance to moisture and many (read more)
Browse Elastomers and Rubber Compounds Datasheets for CHT USA Inc. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Datasheets for CHT USA Inc. -
, making it suitable for various sizes and shapes of Bluetooth speakers, and it features self-adhesiveness, eliminating the need for additional surface adhesives and simplifying the assembly process. More importantly, SHEEN thermal conductive silicone sheets have high compressibility and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Datasheets for CHT USA Inc. -
applications? Silicones have become widely used by LED design engineers to provide improved light performance, environmental protection and extended product life. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants (read more)
Browse Industrial Adhesives Datasheets for CHT USA Inc. -
. CHT has several product groups to choose from including optically clear encapsulants & thermally conductive encapsulants & adhesives. Applications Automotive vehicle lighting Signage and displays for sports and advertising Back lighting for LCD (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
of robots demand enhanced heat dissipation, protection, and operational stability. Thermal conductive potting adhesives, which combine thermal conductivity, electrical insulation, and structural encapsulation, have become an indispensable thermal management solution in modules such as robotic (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
MasterSil 151TC is an addition cured silicone offering both flexibility and high temperature resistance. It has very fine particles of a thermally conductive filler that allows it to be applied in sections as thin as 10-15 microns. MasterSil 151TC fits well in applications involving sensitive optical and electronic components where optimum heat dissipation is critical. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
Conduct Research Top
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Electrically Conductive Adhesives
to electronics manufacturing. ECAs are typically composed of an epoxy resin but can also be made of UV cure and silicone adhesives. To overcome the high resistivity of these compounds, the adhesive is loaded with upward of 80 percent conductive materials. These adhesives can be applied in any number of usual
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Silver Filled, Electrically Conductive Adhesives
In the realm of electrically conductive epoxies and silicone, there is nothing like silver. Not only does silver have very high electrical conductivity, it also retains its low resistance over many years, even decades. This is much more desirable than other metals that are highly conductive
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
This paper presents a case history of a failure analysis performed on a die bond adhesion failures. Silicone contamination caused intermittent adhesive failures at the die back metallization/conductive epoxy interface. The source of the silicone contamination was identified as the adhesive film
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Metal
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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Best Non Conductive One Component Epoxy Adhesive Glue For Automotive Plastic to Meta
Design engineers have the privilege to choose from a flurry of options when it comes to joining plastic to metal. Some of the options are easy to apply than others. Silicone, advanced epoxy, UV cure adhesive solutions, and cyanoacrylate are some of the best options engineers use in this regard
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What is Electronic Glue?
Electronic adhesive, also known as electronic adhesive or conductive adhesive, is a specialized adhesive designed for electronic applications, used for bonding, sealing, potting, coating, structural bonding, co coating, and SMT mounting of electronic and electrical components. Its formula can bond
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Case Study - Repositionable Thermal Interface
Our customer, an EMI shielding manufacturer, was producing a conductive, semi-cured silicone at their local location. They reached out to Budnick in hopes of finding a solution for a new application. The customer's new thermal interface material required a repositionable adhesive that would
More Information Top
Indicates content that may require registration and/or purchase.
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Electrical Conductive Adhesives with Nanotechnologies
L. C. Montemayor, “Electrically Conductive Silicone Adhesive ,” Proceedings of SMTA International Conference, Sept. 2002.
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Performance of different types of time domain reflectometry probes for water content measurement in partially saturated rocks
The second is to propose two designs for surface probes in rocks (a conductive silicone adhesive applied as a strip and an aluminum foil tape) and compare the Ka-q relationships obtained with these probes against those obtained with the more commonly …
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http://etd.auburn.edu/bitstream/handle/10415/1624/Yuquan%20%20disseration%200409%20final.pdf?sequence=1
the heat spreader, a non-thermally conductive silicone adhesive was dispensed and co- .
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Conductive Adhesives: Alternative to High Temperature Solders and The Future
Ag- silicone conductive adhesive .
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Electronic Materials and Processes Handbook, Third Edition > Adhesives, Underfills, and Coatings in Electronics Assemblies
For example, on video touch screens, silicone conductive adhesives are used to bond wire.
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Silicone Thermal Interface Materials for Under-Hood Electronics
When cured, thermally conductive silicone adhesives convert to a strong, yet flexible elastomer.
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Silicone Thermal Interface Materials For Automotive Electronics
When cured, thermally conductive silicone adhesives convert to a strong, yet flexible elastomer.
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The Carnegie Planet Finder Spectrograph: a status report
A thermally conductive silicone adhesive is then dispensed along each side of the tubing to increase the thermal coupling between the tube and the plate.
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MOUND LABORATORY PROGRESS REPORT FOR OCTOBER, 1963
The tensile strength for three conductive silicone adhesives Was below the strength of comparable poly- urethane adhesives.