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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of
- Capacity: 256 MB
- Clock Speed: 333 MHz
- Pin Count: 200 #
- Features: 2.5 V, DDR SDRAM
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of
- Capacity: 256 MB
- Clock Speed: 266 MHz
- Pin Count: 184 #
- Features: 2.5 V, DDR SDRAM
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of
- Capacity: 2,000 MB
- Clock Speed: 266 MHz
- Pin Count: 184 #
- Features: 2.5 V, DDR SDRAM, Other
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of
- Capacity: 1,000 MB
- Clock Speed: 667 MHz
- Pin Count: 240 #
- Features: 1.8 V, Other
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Supplier: RS Components, Ltd.
Description: DDR4 Memory Module 260-PIN SO-DIMM 16 GB
- Application: Personal Computing
- Memory Type: RAM
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Supplier: Corsair Memory
Description: Great Looking, Great Overclocking Memory at a Great Price Corsair Vengeance DDR3 memory modules are designed with overclockers in mind. Vengeance DIMMs are built using RAM specially selected for their high-performance potential. Aluminum heat spreaders help
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Supplier: Corsair Memory
Description: Great Looking, Great Overclocking Memory at a Great Price Corsair Vengeance DDR3 memory modules are designed with overclockers in mind. Vengeance DIMMs are built using RAM specially selected for their high-performance potential. Aluminum heat spreaders help
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Supplier: Infineon Technologies AG
Description: CY15B064Q-SXE is a 64-Kbit nonvolatile memory using advanced ferroelectric technology. It combines nonvolatility with RAM-like read and write operations, ensuring reliable data retention for 121 years. This eliminates complexities, overhead, and reliability issues present in other
- Density: 64 kbits
- Operating Temperature: -40 to 125 C
- Supply Voltage: 3 V, 3.6 V
- Memory Category: FRAM
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Supplier: Infineon Technologies AG
Description: robots (AGV, AMR) Power transmission and distribution Designers who used this product also designed with FS13MR12W2M1H_C55 | Silicon Carbide CoolSiC™ MOSFET Modules FF11MR12W2M1H_B70 | Silicon Carbide CoolSiC™ MOSFET Modules S29GL256S10TFV013 | High-performance page mode IRF7240 |
- Density: 256 kbits
- Operating Temperature: -40 to 85 C
- Supply Voltage: 3.6 V
- Memory Category: FRAM
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Supplier: Infineon Technologies AG
Description: Trusted Platform Module OPTIGA TRUST M EXPRESS | OPTIGA™ Trust S25FL064LABMFI013 | Quad SPI Flash IPD80R900P7 | 500V-950V CoolMOS™ N-Channel Power MOSFET OPTIGA TPM SLB 9673 FW26 | OPTIGA™ TPM - Trusted Platform Module
- Density: 2,000 kbits
- Operating Temperature: -40 to 125 C
- Supply Voltage: 1.8 V, 3.6 V
- Memory Category: FRAM
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Supplier: Win Source Electronics
Description: Manufacturer: Microchip Technology Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1219645-5962R0622906VYC Operating Supply Voltage: 3.3 V Number of Elements: 4 Access Time: 18 ns Number of Pins: 68 Categories: RAM Case / Package: Module
- Access Time: 18 ns
- Operating Temperature: -55 C
- Features: Other
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Supplier: Win Source Electronics
Description: Normal, Standard - Top Memory Type: RAM Categories: Connectors, Interconnects Status: Active Popularity: Medium Fake Threat In the Open Market: 58 pct. Supply and Demand Status: Balance Quantity per package: 490
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Supplier: Infineon Technologies AG
Description: Applications Automotive body control module (BCM) Designers who used this product also designed with S25FL512SAGMFA010 | Quad SPI Flash CY15B256Q-SXE | F-RAM (Ferroelectric RAM) S25FL512SAGMFA010 | Quad SPI Flash CY15B256Q-SXE | F-RAM (Ferroelectric RAM)
- Density: 4,000 kbits
- Operating Temperature: -40 to 125 C
- Supply Voltage: 3.6 V
- Features: Other
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Supplier: Radwell International
Description: MEMORY MODULE, 2GB RAM, DDR3, 1333MHZ. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Radwell International
Description: MEMORY MODULE, 2GB RAM, DDR3, 1333MHZ, 204 PIN. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Critical Link, LLC
Description: The MitySOM-A10S is an Intel/Altera Arria 10 SoC SOM (system on module) for a wide range of industrial embedded applications. In addition to the A10 processor, the module includes on-board power supplies, two DDR4 RAM memory subsystems, micro SD card, a USB 2.0 on the go
- Capacity: 2,000 to 4,000 MB
- Operating Temperature: -40 to 185 F
- Ports / Buses: I2C, PCI Express, SPI, USB
- Features: Other
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Supplier: Xoxide
Description: Dragoon-N422, HDT family cooler for RAM module, is designed for the demand of high efficiency cooler to satisfy cooling high temperature RAM module, high clock speeds and raised voltage. The revolutionary thermodynamic design lowers the temperature as well as extends your
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: IC CTRLR ARCNET 2KX8 RAM 48TQFP Product overview: COM20019I3V-HT from Microchip Technology is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and
- Operating Current: 20 mA
- Bandwidth: 0.3125 MB/Sec
- Operating Temperature: -40 to 85 C
- Supply Voltage: -3.3 V, -4.5 V
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: 64K x 16 Static RAM / SRAM Chip Async Single 3.3V 1M-bit 64K x 16 55ns 44-Pin TSOP-II Product overview: CY62126BVLL-55ZI from Infineon Technologies is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules,
- Memory Category: SRAM
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, MEMORY MODULE, ERROR CORRECTING, RAM, PLC3. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Critical Link, LLC
Description: The MitySOM-AM57F is a highly configurable system on module that features a Texas Instruments AM57xx series 1.5 GHz Sitara Processor tightly integrated with the Xilinx Artix-7 Field Programmable Gate Array (FPGA), NOR FLASH, and DDR3 RAM memory subsystems. The design of
- Capacity: 32 MB
- Operating Temperature: -40 to 185 F
- Memory Type: DDR3
- Ports / Buses: I2C, PCI, SATA, SPI, USB
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Supplier: Win Source Electronics
Description: Manufacturer: Sigma Designs Inc. Win Source Part Number: 800381-ZM4102AH-CME3R Series: Z-Wave Packaging: Reel package Operating Temperature Range: -30°C ~ 85°C Package: Module Mounting: SMD Frequency: 921MHz Operating Supply Voltage: 2.1 V ~ 3.6 V Protocol: Z-Wave Data Rate: 100Kbps
- Sensitivity: -99 dBm
- Operating Frequency: 921 MHz
- Operating Temperature: -30 to 85 C
- Supply Voltage: 2.1 to 3.6 volts
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Supplier: Microchip Technology, Inc.
Description: Device Overview Parametrics Name Value Program Memory Type Flash Program Memory Size (KB) 128 CPU Speed (MIPS/DMIPS) 12 SRAM (B) 3,904 Temperature Range (°C) -40 to 85 Operating Voltage Range (V) 2 to 3.6 Pin Count 64
- Features: Other
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1336709-XB3-24DMCM-J Category: RF and Wireless - RF Transceiver Modules and Modems Series: XBee® 3 DigiMesh 2.4 Package: Tray Standard Package: 90 Frequency: 2.4GHz Protocol: Zigbee® Data Rate: 250kbps Memory Size: 1MB Flash, 128kB RAM Antenna Type:
- Sensitivity: -103 dBm
- Output Power: 8 dBm
- Operating Frequency: 2,400 MHz
- Operating Temperature: -40 to 85 C
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Supplier: Radwell International
Description: DISCONTINUED BY MANFUACTURER, MEMORY MODULE, 512 MB RAM, DDR400, SODIMM 3-3-3 (SMALL OUTLINE DUAL IN-LINE). FREE 2 YEAR RADWELL WARRANTY
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Supplier: Corsair Memory
Description: triple channel Intel platforms Red heat sinks with patented DHX Technology Includes Airflow fan kit for superior heat dissipation World famous Corsair reliability and performance Package Contents Three 4GB memory modules System Requirements Designed for use with all DDR3
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Supplier: Radicom Research, Inc.
Description: Radicom Research’s RB730 and 730SD (Shielded) are Bluetooth modules featuring Human Interface Device (HID) support. Based on Broadcom BCM20730 Bluetooth chipset, the modules integrate with PCB antennas, serial EEPROMs, crystals and components for built-in switching regulators to reduce
- Sensitivity: -87 dBm
- Operating Frequency: 2,402 to 2,480 MHz
- Operating Temperature: -20 to 70 C
- Supply Voltage: 2 to 3.6 volts
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Supplier: Microchip Technology, Inc.
Description: Square Root Accelerator Single-cycle hardware multiplier Micro Trace Buffer Memory Protection Unit (MPU) Memories 128KB in-system self-programmable Flash 4KB independent self-programmable Flash for EEPROM emulation 16KB SRAM Main Memory System Power-on reset (POR) and brown-out
- Operating Temperature: -40 to 85 C
- Pin Count: 38
- Memory Category: Flash
- Features: Other
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Supplier: Microchip Technology, Inc.
Description: hardware multiplier Micro Trace Buffer Memory Protection Unit (MPU) Memories 64KB in-system self-programmable Flash 2KB independent self-programmable Flash for EEPROM emulation 8KB SRAM Main Memory System Power-on reset (POR) and brown-out detection (BOD) Internal and external clock
- Operating Temperature: -40 to 85 C
- Pin Count: 26
- Memory Category: Flash
- Features: Other
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Supplier: Allied Electronics, Inc.
Description: ADC, 500 ksps and ±1 LSB 16-Bit Parallel Master Port for Adding QVGA and Memory POR, BOR, LVD, Pull-Ups Multiple Power Management Modes 80 MHz, 1.53 DMIPS/MHz CPU Core Single-Cycle Multiply and Divide Hardware Flash Pre-Fetch Module, 256 Byte Cache Fast Context Switch and Interrupt
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Supplier: Allied Electronics, Inc.
Description: Features: Enhanced Mid-Range Core with 49 Instruction, 16 Stack Levels Flash Program Memory with Self Read/Write Capability Internal 32 MHz Oscillator Integrated Capacitive mTouch Sensing Module Data Signal Modulator Module MI2C, SPI, EUSART with Auto Baud 2 ECCP and 2 CCP
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Supplier: Acromag, Inc.
Description: 0 to 70°C (-40 to 85°C E version) Analog Inputs 16 differential or 32 single-ended inputs (±3.3V, ±5V, ±10V, 0-5V, and 0-10V ranges) 16-bit ADC with 512 sample RAM 10µS conversion time (100KHz) Interrupt upon ADC memory threshold condition (user-programmable data sample threshold)
- Analog Input Channels: 32 #
- Digital I/O Channels: 16 #
- Resolution: 16 bits
- Accuracy: 0.0076 % FS
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Supplier: Acromag, Inc.
Description: The AcroPack® product line updates our popular Industry Pack I/O modules with a PCIe interface format. This tech-refresh design offers a compact size, low-cost I/O, and a rugged form factor. Combining different AcroPack module types on one XMC, VPX, or PCIe carrier allows for a
- Operating Temperature: -40 to 185 F
- Application: General Lab and Industrial
- Data Acquisition: I/O Module
- User Interface: None
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Supplier: Allied Electronics, Inc.
Description: Features: Enhanced Mid-Range Core with 49 Instruction, 16 Stack Levels Flash Program Memory with Self Read/Write Capability Internal 32 MHz Oscillator Integrated Capacitive mTouch Sensing Module Data Signal Modulator Module MI2C, SPI, EUSART with Auto Baud 2 ECCP and 2 CCP
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Supplier: Critical Link, LLC
Description: The MitySOM-A10S is an Intel/Altera Arria 10 SoC SOM (system on module) for a wide range of industrial embedded applications. In addition to the A10 processor, the module includes on-board power supplies, two DDR4 RAM memory subsystems, micro SD card, a USB 2.0 on the go
- Capacity: 28 MB
- Operating Temperature: -40 to 185 F
- Ports / Buses: I2C, PCI, SPI, USB
- Features: Other
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Innodisk, a global leader in industrial-grade memory, announces the release of its DDR5 CAMM2 and LPDDR5X CAMM2 (LPCAMM2) memory modules. With speeds up to 6400 MT/s and 8533 MT/s respectively, and a 60% smaller footprint, the new CAMM2 series is designed to meet the demands of compact, high (read more)
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integration into diverse electronic systems. Featuring high sensitivity of -96dBm and low power operation (5.3mA transmitting, 5.4mA receiving), this module ensures efficient, low-power wireless communication for industrial, consumer, and Io (read more)
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The level of reliability demanded of the NAND-type Flash memory control is constantly rising. To meet this demand, TDK has developed its own NAND Flash memory controller GBDriver with TDK's unique NAND Flash control technology. The GBDriver provides SSD, NAND (read more)
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The Temperature Sensor Module (TSM) infrared thermometer is the low cost solution for non-contact temperature measurements. The sensor is integrated with signal conditioning that reliably produces a calibrated temperature output in a plug-and-play package having many options. Programmable (read more)
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Innodisk introduces its latest PCIe Gen5 SSD series, designed to meet the OCP Data Center NVMe SSD spec v2.0 and power high-demand applications like AI training and big data analytics. With support for U.2, E1.S, E3.S, and the new E3.L form factors, these SSDs offer flexibility for diverse (read more)
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-temperature requirements. N7000 SSDs use 3D TLC BiCS8 NAND and are offered in M.2 2242 and M.2 2280 form factors with capacities from 240 GB to 3.84 TB. A power-optimized, DRAM-less controller architecture with Host Memory Buffer provides responsive and (read more)
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. Ample memory: Integrated 256KB RAM ensures seamless data handling and processing for complex tasks. Wide operating temperature range: Designed to operate reliably from 0 to 70°C (32 to 158°F), ensuring durability in varied industrial environments (read more)
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Swissbit is expanding BiCS5 NAND technology across its industrial and embedded storage portfolio, providing a practical migration path for systems currently using SLC, MLC, or BiCS3-based products. The rollout covers multiple (read more)
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Also, with the new CPU platform, Apple has included 4 GB of DDR3 -1333 memory modules for improved RAM capacity and performance.
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This processor is connected to the RAM memory in the form of two DDR3 modules with a capacity of 4 Gb (256 M × 16), i.e. 8 Gb in total.
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The multi-port memory controller interfaces directly to DDR2 and DDR3 RAM chips and Small Outline Dual In-line Memory Modules (SO-DIMMs).
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However, with the addition to the module of extra memory (e.g., 1 GB DDR3 RAM ), this zero padding is not necessary, and could instead be used to store more data in future implementations (up to an additional 831 neural channels and…
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However, the available memory can be extended with a memory extension module providing an additional amount of 2 GB DDR3 - RAM per FPGA.
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