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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of
- Capacity: 4000 MB
- Clock Speed: 1066 MHz
- Form Factor: SO DIMM
- Memory Type: RAM, DRAM
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of
- Capacity: 2000 MB
- Clock Speed: 1333 MHz
- Form Factor: Other
- Memory Type: RAM, DRAM
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of
- Capacity: 256 MB
- Clock Speed: 266 MHz
- Form Factor: SO DIMM
- Memory Type: RAM, DRAM
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of
- Capacity: 1000 MB
- Clock Speed: 800 MHz
- Form Factor: Other
- Memory Type: RAM, DRAM
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Supplier: Corsair Memory
Description: Great Looking, Great Overclocking Memory at a Great Price Corsair Vengeance DDR3 memory modules are designed with overclockers in mind. Vengeance DIMMs are built using RAM specially selected for their high-performance potential. Aluminum heat spreaders help
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Supplier: Corsair Memory
Description: Great Looking, Great Overclocking Memory at a Great Price Corsair Vengeance DDR3 memory modules are designed with overclockers in mind. Vengeance DIMMs are built using RAM specially selected for their high-performance potential. Aluminum heat spreaders help
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Supplier: Corsair Memory
Description: Great Looking, Great Overclocking Memory at a Great Price Corsair Vengeance DDR3 memory modules are designed with overclockers in mind. Vengeance DIMMs are built using RAM specially selected for their high-performance potential. Aluminum heat spreaders help
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Supplier: Corsair Memory
Description: Great Looking, Great Overclocking Memory at a Great Price Corsair Vengeance DDR3 memory modules are designed with overclockers in mind. Vengeance DIMMs are built using RAM specially selected for their high-performance potential. Aluminum heat spreaders help
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Supplier: Infineon Technologies AG
Description: CYS0644ABZI-S2D44 | 32-bit PSoC™ 6 Arm® Cortex®-M4 / M0+ BTS4130QGA | Classic PROFET™ 12V | Automotive Smart High-Side Switch CY8CMBR3116-LQXI | CAPSENSE™ MBR3 CYBLE-416045-02 | AIROC™ Bluetooth® Modules
- Density: 1024 kbits
- IC Package Type: Other
- Memory Category: FRAM
- Operating Temperature: -40 to 85 C
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Supplier: Infineon Technologies AG
Description: CYS0644ABZI-S2D44 | 32-bit PSoC™ 6 Arm® Cortex®-M4 / M0+ BTS4130QGA | Classic PROFET™ 12V | Automotive Smart High-Side Switch CY8CMBR3116-LQXI | CAPSENSE™ MBR3 CYBLE-416045-02 | AIROC™ Bluetooth® Modules
- Density: 1024 kbits
- IC Package Type: Other
- Memory Category: FRAM
- Operating Temperature: -40 to 85 C
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Supplier: Infineon Technologies AG
Description: M/N/R-Series Motor Control Arm® Cortex®-M4 Microcontroller (MCU) Family CY14MB064Q2A-SXQ | nvSRAM (non-volatile SRAM) S29AL016J55TFNR10 | Standard Interface CYBT-423054-02 | AIROC™ Bluetooth® Modules CY7C1041G-10VXI | Asynchronous
- Density: 1024 kbits
- IC Package Type: Other
- Memory Category: FRAM
- Operating Temperature: -40 to 85 C
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Supplier: RS Components, Ltd.
Description: Transcend aXeRam^TM Overclocking Memory Moduleâ??s provide DDR3-2400 and DDR3-2133 memory kits with high clock speeds, low voltage and high capacity to fulfil the requirements of 3D PC gaming and heavy duty applications. aXeRam
- Applications: Personal Computing
- Capacity: 8000 MB
- Clock Speed: 2400 MHz
- Form Factor: DIMM
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Supplier: RS Components, Ltd.
Description: Transcend aXeRam^TM Overclocking Memory Moduleâ??s provide DDR3-2400 and DDR3-2133 memory kits with high clock speeds, low voltage and high capacity to fulfil the requirements of 3D PC gaming and heavy duty applications. aXeRam
- Applications: Personal Computing
- Capacity: 8000 MB
- Clock Speed: 2133 MHz
- Form Factor: DIMM
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Supplier: RS Components, Ltd.
Description: Crucial DDR3L 1600 MHz Single Rank Registered DIMM. With memory designed for servers DDR3L. DIMM 240 pins. 1600 MHz / PC3-12800. CL11. ECC Desktop/Laptop = Server Capacity = 4 GB Memory Class = DDR3L Module Type = PC3-12800
- Applications: Servers and Networking
- Capacity: 4000 MB
- Memory Type: RAM
- Supply Voltage: Other
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Supplier: RS Components, Ltd.
Description: Transcend offer a range of memory modules that are designed for desktop computers and notebook/laptops. Presenting the DDR2, DDR3 Unbuffered DIMM modules, the DDR2 SODIMM and the DDR3 SODIMM they are high speed low power memory
- Applications: Personal Computing
- Capacity: 8000 MB
- Clock Speed: 1600 MHz
- Form Factor: DIMM
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Supplier: Critical Link, LLC
Description: The MitySOM-A10S is an Intel/Altera Arria 10 SoC SOM (system on module) for a wide range of industrial embedded applications. In addition to the A10 processor, the module includes on-board power supplies, two DDR4 RAM memory subsystems, micro SD card, a USB 2.0 on
- Capacity: 2000 to 4000 MB
- Form Factor: Other
- Memory Type: Other
- Operating Temperature: -40 to 185 F
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Supplier: Infineon Technologies AG
Description: Designers who used this product also designed with IPB017N10N5 | N-Channel Power MOSFET IPB020N10N5LF | N-Channel Power MOSFET IPB107N20N3 G | N-Channel Power MOSFET IPB110N20N3LF | N-Channel Power MOSFET CY62167EV30LL
- Density: 4096 kbits
- IC Package Type: Other
- Memory Category: FRAM
- Operating Temperature: -40 to 85 C
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Supplier: Critical Link, LLC
Description: The MitySOM-AM57F is a highly configurable system on module that features a Texas Instruments AM57xx series 1.5 GHz Sitara Processor tightly integrated with the Xilinx Artix-7 Field Programmable Gate Array (FPGA), NOR FLASH, and DDR3 RAM memory subsystems. The
- Capacity: 32 MB
- Form Factor: Other
- Memory Type: DDR3
- Operating Temperature: -40 to 185 F
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Supplier: Win Source Electronics
Description: : RAM Case / Package: Module Popularity: Medium Fake Threat In the Open Market: 67 pct. Supply and Demand Status: Limited Mount: Surface Mount RoHS: Non-Compliant Min Operating Temperature: -55 °C Max Supply Voltage: 3.6 V Min Supply Voltage: 3 V Max Operating
- Access Time: 18 ns
- IC Package Type: Other
- Operating Temperature: -55 C
- Supply Voltage: Other
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Supplier: Critical Link, LLC
Description: The MitySOM-iMX6 is based on NXP Semiconductors iMX6 family of processors with ARM Cortex-A9 at speeds up to 1.2 GHz. The family offers industrial performance in a small form factor and features different combinations of RAM and Flash memory, a complete list of interfaces and
- Capacity: 4000 to 8000 MB
- Form Factor: Other
- Memory Type: DDR3
- Operating Temperature: -40 to 185 F
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Supplier: Critical Link, LLC
Description: core and is combined with a NEON coprocessor with double-precision FPU (one per core). The MitySOM-5CSx combines a Cyclone V with up to 2GB of DDR3 CPU/FPGA RAM with ECC, 512MB of dedicated DDR3 FPGA RAM (optional) and up to 48MB of QSPI NOR Flash creating a
- Capacity: 2000 MB
- Form Factor: Other
- Memory Type: DDR3
- Operating Temperature: -40 to 185 F
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Supplier: Xoxide
Description: Dragoon-N422, HDT family cooler for RAM module, is designed for the demand of high efficiency cooler to satisfy cooling high temperature RAM module, high clock speeds and raised voltage. The revolutionary thermodynamic design lowers the temperature as well as extends your
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Supplier: Win Source Electronics
Description: Categories: RAM Case / Package: Module Max Frequency: 133 MHz Alternative Parts (Cross-Reference): MT18LSDT3272G-133G2M T18LSDT3272G133G2; Popularity: Low Fake Threat In the Open Market: 40 pct. Supply and Demand Status: Shortage Maximum Operating Temperature: 55
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Supplier: Radicom Research, Inc.
Description: external BOM costs. The RB730 and RB730SD Bluetooth modules integrate the entire profiles, applications, and Bluetooth protocol stack. They are fully compliant with the Bluetooth SIG specifications for human interface devices. The RB730 and RB730SD are fully compliant with version 3.0
- Applications: Mobile / Wireless Systems
- Features: RoHS, Antenna Connector
- Form Factor / Package: Through Hole Technology (THT)
- Operating Frequency: 2402 to 2480 MHz
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Supplier: Win Source Electronics
Description: Manufacturer: Microchip Technology Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1027040-WS128K32NV-1 7H1M Packaging: Bulk Mounting: SMD (SMT) Operating Supply Voltage: 3.3 V Number of Pins: 66 Categories: RAM
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Supplier: Microchip Technology, Inc.
Description: Device Overview Parametrics Name Value Program Memory Type Flash Program Memory Size (KB) 128 CPU Speed (MIPS/DMIPS) 12 SRAM (B) 3,904 Temperature Range (°C) -40 to 85 Operating Voltage Range (V) 2 to 3.6 Pin Count 64
- Form Factor: Other
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Supplier: Microchip Technology, Inc.
Description: The Microchip PIC32CM series of 5V Cortex M0+ devices is designed for consumer, commercial, industrial and automotive applications in noisy environments. These products feature robust communications peripherals including the SERCOM module and LIN, along with advanced motor control peripherals
- IC Package Type: Other
- Memory Category: Flash
- Operating Temperature: -40 to 85 C
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Supplier: Win Source Electronics
Description: : Surface Mount, Right Angle Mounting Feature: Normal, Standard - Top Memory Type: RAM Categories: Connectors, Interconnects Status: Active Popularity: Medium Fake Threat In the Open Market: 58 pct. Supply and Demand Status: Balance Quantity per package: 490
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Supplier: Allied Electronics, Inc.
Description: Features: Enhanced Mid-Range Core with 49 Instruction, 16 Stack Levels Flash Program Memory with Self Read/Write Capability Internal 32 MHz Oscillator Integrated Capacitive mTouch Sensing Module Data Signal Modulator Module MI
- A/D Converter: Other
- Clock Speed: 32 MHz
- Data Bus: 8 Bit
- IC Package Type: PDIP
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Supplier: Maxim Integrated
Description: The DS1250W 3.3V 4096k NV SRAM is a 4,194,304-bit, fully static, nonvolatile SRAM organized as 524,288 words by 8 bits. Each NV SRAM has a self-contained lithium energy source and control circuitry, which constantly monitors VCC for an out-of-tolerance condition. When such a condition
- Density: 4096 kbits
- IC Package Type: Other
- Memory Category: NVRAM
- Operating Temperature: -40 to 85 C
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Supplier: Acromag, Inc.
Description: with 512 sample RAM 10µS conversion time (100KHz) Interrupt upon ADC memory threshold condition (user-programmable data sample threshold) User-programmable interval timer Analog Outputs Eight analog output channels (±10V range
- Accuracy: 0.0076 % FS
- Analog Input Channels: 32 #
- Application: Aerospace / Military, Medical / Biomedical
- Application Software Included: Yes
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Supplier: Embedded Data Systems
Description: most recent three sets of 32-bit times and 32-bit counts. The data record is CRC-16 error checked for accuracy. The CT1 Counter data record contains the three most recent time/count values. This consists of 3 8-byte fields starting with the most recent time/count value each in 32-bit format.
- Counter Resolution: 32 bits
- Maximum Count Frequency: 0.0500 kHz
- Operating Temperature: -40 to 185 F
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Supplier: Rochester Electronics
Description: 7MPV4145 - 256K X 32 3.3V Static RAM Module
- IC Package Type: Other
- Memory Category: SRAM
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Supplier: ACCES I/O Products, Inc.
Description: 8. The built-in watchdog timer resets the pod if the microcontroller hangs up. Data collected by the pod can be stored in local RAM and accessed later through the computer's serial port. This facilitates stand-alone operation. The module, or pod, address is programmable from 01 to FF
- Connection to Host: Radio / Telemetry, RS232/422/485
- Digital I/O Channels: 8 #
- Form Factor: Stand Alone
- Isolation: Channel-to-Channel Isolation, Isolated Digital Input, Other
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Supplier: Indocomp Systems, Inc.
Description: a 100 base-t LAN controller all in one small size 7.28" by 4.8". The IND-DV370 is built around the most advanced core logic chipset available, the VIA CLE266. The performance that comes with this chipset includes DDR RAM memory optimization and bus design. The IND-DV370 is
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congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and (read more)
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The MitySOM-C10L and MitySOM-C10G series of highly configurable, small form-factor System-on-Modules features an Intel / Altera Cyclone 10 LP (Low Power) or GX field programmable gate array (FPGA) and include on-board power supplies, NOR FLASH and a HyperRAM or DDR3L memory subsystems. The Mity (read more)
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Array (FPGA), NOR FLASH, and DDR3 RAM memory subsystems. The design of the MitySOM-AM57F allows end-users the capability to develop programs/logic images for all of the compute elements on the TI AM57xx as well as for the FPGA. The MitySOM-AM57F provides a complete and flexible digital processing (read more)
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The MitySOM-AM62 family of system-on-modules features the Texas Instruments Sitara AM62x Processor. The module includes (optional) eMMC FLASH, (optional) Octal or Quad SPI NOR FLASH, and DDR4 RAM memory subsystems. A MitySOM-AM62 provides a complete and flexible CPU infrastructure for (read more)
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NORTHVALE, New Jersey, USA – New Yorker Electronics has announced its release of the new Innodisk Industrial-grade DDR5 DRAM modules. The JESD79-5 DDR5 SDRAM offers significant improvements in capacity, speed, voltage and ECC functions. The modules comply with all relevant (read more)
Browse Memory Modules Datasheets for New Yorker Electronics Co., Inc. -
The MitySOM-A10S is an Intel/Altera Arria 10 SoC SOM (system on module) for a wide range of industrial embedded applications. In addition to the A10 processor, the module includes on-board power supplies, two DDR4 RAM memory subsystems, micro SD card, a USB 2.0 on the go (OTG) port, and a (read more)
Browse Computer-on-Module (COM) Datasheets for Critical Link, LLC -
The MitySOM-A10S is an Intel/Altera Arria 10 SoC SOM (system on module) for a wide range of industrial embedded applications. In addition to the A10 processor, the module includes on-board power supplies, two DDR4 RAM memory subsystems, micro SD card, a USB 2.0 on the go (OTG) port, and a (read more)
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Instruments OMAP-L138 456 MHz (max) Applications Processor (OMAP) tightly integrated with the Xilinx Artix-7 Field Programmable Gate Array (FPGA), FLASH (NAND, and NOR) and mDDR2 RAM memory subsystems. The design of the MityDSP-L138F-A7 allows end users the capability to develop programs/logic images for both the OMAP and the FGPA. It is a production-suitable solution for industrial applications. (read more)
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The MitySOM-AM62 family of system-on-modules features the Texas Instruments Sitara AM62x Processor. The module includes (optional) eMMC FLASH, (optional) Octal or Quad SPI NOR FLASH, and DDR4 RAM memory subsystems. A MitySOM-AM62 provides a complete and flexible CPU infrastructure for highly (read more)
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The PPC3-6.5-407 from WINSYSTEMS utilizes the E3800 family of Atom™ processors from Intel® to provide low power and high performance in a compact 6.5-inch Panel PC. Designed for harsh environments and reliability, the design (read more)
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All emulation results are gathered over a 4-cores 3.60 GHz Intel Xeon ES1620 CPU board, equipped with 4x8 GB DIM DDR3 1600Mz RAM memory modules , running Ubuntu 12.04LTS with 64bit Linux kernel version 3.5.
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Apple MacBook Pro A1278 Notebook Computer
Also, with the new CPU platform, Apple has included 4 GB of DDR3 -1333 memory modules for improved RAM capacity and performance.
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Embedded Engineering Education
This processor is connected to the RAM memory in the form of two DDR3 modules with a capacity of 4 Gb (256 M × 16), i.e. 8 Gb in total.
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Desktop Memory RAM DDRIII 1333Mhz 2GB from Taiwan Micropaq Corporation, Taiwan
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The multi-port memory controller interfaces directly to DDR2 and DDR3 RAM chips and Small Outline Dual In-line Memory Modules (SO-DIMMs).
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A direct-to-drive neural data acquisition system
However, with the addition to the module of extra memory (e.g., 1 GB DDR3 RAM ), this zero padding is not necessary, and could instead be used to store more data in future implementations (up to an additional 831 neural channels and…
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High-Performance Computing Using FPGAs
However, the available memory can be extended with a memory extension module providing an additional amount of 2 GB DDR3 - RAM per FPGA.