Products & Services
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Supplier: SK Hynix
Description: WIO2 (Wide IO 2) is the strong candidate of future mobile DRAM achieving high bandwidth (51.2GB/s, up to 68GB/s), advanced power efficiency, and small form factor.
- Capacity: 64 to 2,000 MB
- Clock Speed: 105 to 166 MHz
- Operating Temperature: -22 to 185 F
- Features: 1.2 V, 1.8 V, DDR SDRAM
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Supplier: TT Semiconductor, Inc.
Description: TT Memories is a division of Twilight Technology formed to support the memory marketplace from legacy technologies to state-of-the-art technologies. TT Memories manufactures devices and modules for the Commercial, Industrial, Aerospace, and Defense marketplaces. TT Memories also designs and
- Density: 128,000 kbits
- Operating Temperature: -55 to 125 C
- Supply Voltage: 2.5 V
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Supplier: Corsair Memory
Description: Product Description 512MB DDR Memory , 333MHz Key Features Guaranteed to work on all Intel and AMD platforms World famous Corsair reliability and performance Package Contents One 512MB memory module System Requirements Designed for use with all DDR motherboards
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Supplier: Artesyn Embedded Power
Description: Total Max Power: 99 W Total Max Current: 8 A Input Voltage: 10.8 V to 13.2 V Output Voltage: 1.3 V to 2.5 V Outputs: Dual Size (L x W x H): 3.000" x 0.510" x 1.200" Warranty: 2 years Operating Temperature: 0 to +80C
- DC Input Voltage: 24 volts
- DC Input Current: 0.02 to 0.4 amps
- DC Output Voltage: 1.3 to 2.5 volts
- DC Output Current: 8 amps
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Supplier: Corsair Memory
Description: Product Description 1GB DDR Memory , 333MHz Key Features Guaranteed to work on all Intel and AMD platforms World famous Corsair reliability and performance Package Contents One 1GB memory module System Requirements Designed for use with all DDR motherboards
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Supplier: TT Semiconductor, Inc.
Description: TT Memories is a division of Twilight Technology formed to support the memory marketplace from legacy technologies to state-of-the-art technologies. TT Memories manufactures devices and modules for the Commercial, Industrial, Aerospace, and Defense marketplaces. TT Memories also designs and
- Density: 1,000,000 kbits
- Operating Temperature: -55 to 125 C
- Supply Voltage: 1.5 V
- Features: Other
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Supplier: TT Semiconductor, Inc.
Description: TT Memories is a division of Twilight Technology formed to support the memory marketplace from legacy technologies to state-of-the-art technologies. TT Memories manufactures devices and modules for the Commercial, Industrial, Aerospace, and Defense marketplaces. TT Memories also designs and
- Density: 128,000 kbits
- Operating Temperature: -55 to 125 C
- Supply Voltage: 1.8 V
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Supplier: Amphenol Communications Solutions
Description: DDR2 Memory Modules, Vertical Through-Hole 240 Position DDR2 DIMM Connector, 1.00mm pitch, Amphenol is one of the leading manufacturers of Storage and Server System Connectors. Contact us today for more details of DDR2 Memory Modules, part number 1000563911109LF
- Voltage Rating: 1.8 volts
- Current Rating: 0.75 amps
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Supplier: Corsair Memory
Description: Product Description 1GB DDR Memory kit, 400MHz Key Features Guaranteed to work on all dual channel Intel and AMD platforms World famous Corsair reliability and performance Package Contents Two 512MB memory modules System Requirements Designed for use with all DDR
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Supplier: Corsair Memory
Description: Product Description 512MB DDR SODIMM Memory, 333MHz Key Features Guaranteed to work on Intel and AMD platforms World famous Corsair reliability and performance Package Contents One 512MB SODIMM memory module System Requirements Designed for use with all SODIMM compatible
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Supplier: SK Hynix
Description: SK hynix is introducing 20nm class DDR4 SDRAM and its memory module family, best suited for all server segments such as enterprise, high-end and scale-out server, as well as high-end desktop. DDR4 introduces new and improved features, making DDR4 more capable than the earlier DRAM generations
- Capacity: 256 to 8,000 MB
- Pin Count: 260 to 288 #
- Operating Temperature: 32 to 185 F
- Features: 1.2 V, Other, SDRAM
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of business and
- Capacity: 256 MB
- Clock Speed: 333 MHz
- Pin Count: 184 #
- Features: 2.5 V, DDR SDRAM
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Supplier: Avant Technology
Description: Avant Technology is a leading US manufacturer and global provider of DRAM memory modules and Flash sub-assemblies. From the POS and telecommunications sector, to commercial, networking, server and PC industries; Avant memory solutions are designed to fulfill a variety of business and
- Capacity: 128 MB
- Clock Speed: 266 MHz
- Pin Count: 200 #
- Features: 2.5 V, DDR SDRAM
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Supplier: SK Hynix
Description: SK hynix is introducing 20nm class DDR4 SDRAM and its memory module family, best suited for all server segments such as enterprise, high-end and scale-out server, as well as high-end desktop. DDR4 introduces new and improved features, making DDR4 more capable than the earlier DRAM generations
- Capacity: 16 to 8,000 MB
- Pin Count: 204 to 244 #
- Operating Temperature: -40 to 185 F
- Form Factor: DIMM, SO DIMM
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Supplier: Accuris
Description: LRDIMM DDR3 Memory Buffer (MB)
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Supplier: Newark, An Avnet Company
Description: DDR MEMORY TERMINATION REGULATOR, 6V; Memory Supported:DDR2, DDR3; Source / Sink Current:2A; Supply Voltage Min:1.3V; Supply Voltage Max:6V; IC Case / Package:MSOP-EP; No. of Pins:8Pins; Product Range:- RoHS Compliant: Yes
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Supplier: Win Source Electronics
Description: Win Source Part Number: 942457-DDR2_128Mx8_PC800 Series: * Categories: Memory
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Supplier: Newark, An Avnet Company
Description: DDR MEMORY TERMINATION REG, MSOP-EP; Memory Supported:DDR2, DDR3; Source / Sink Current:2.7A; Supply Voltage Min:3.3V; Supply Voltage Max:5V; IC Case / Package:MSOP-EP; No. of Pins:8Pins; Product Range:- RoHS Compliant: Yes
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Supplier: Texas Instruments
Description: Complete DDR, DDR2, and DDR3 Memory Power Solution, Sync Buck Controller for Embedded Computing 24-VQFN -40 to 85
- Operating Temperature: -40 to 85 C
- Input Voltage (VIN): 3 to 28 volts
- Features: Other, Shutdown (Inhibit) Pin
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Supplier: SK Hynix
Description: WIO2 (Wide IO 2) is the strong candidate of future mobile DRAM achieving high bandwidth (51.2GB/s, up to 68GB/s), advanced power efficiency, and small form factor.
- Capacity: 2,000 to 16,000 MB
- Features: 1.2 V, 1.8 V
- Memory Type: DRAM
- Application: Digital Electronics
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Supplier: Win Source Electronics
Description: Category: IT infrastructure Memory Win Source Part Number: 1419794-IBM EM60 - 8GB DDR4 Memory Manufacturer: IBM
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Supplier: Texas Instruments
Description: DDR2, DDR3 and DDR3L Memory Power Solution Synchronous Buck Controller 20-WQFN -40 to 85
- Operating Temperature: -40 to 85 C
- Input Voltage (VIN): 3 to 28 volts
- Features: Other
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Supplier: Accuris
Description: LRDIMM DDR3 Memory Buffer (MB) Version 1.0
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Supplier: Powell Electronics, Inc.
Description: DDR4 288P VT SMT
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Supplier: Renesas Electronics Corporation
Description: The ISL6537 provides a complete ACPI compliant power solution for up to 4 DIMM dual channel DDR/DDR2 Memory systems. Included are both a synchronous buck controller to supply VsubDDQ/sub during S0/S1 and S3 states. During S0/S1 state, a fully integrated sink-source regulator generates
- Output Voltage (Volt): 0.8 to 5.5 volts
- Input Voltage (VIN): 4.5 to 5.5 volts
- Features: Input Overcurrent Protection, Other
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Supplier: Micross Components, Inc.
Description: Memory Products Offered: MRAM SRAM nvSRAM VRAM SDRAM UVEPROM DRAM EEPROM FRAM Flash
- Density: 256,000 kbits
- Operating Temperature: -55 to 125 C
- Supply Voltage: 1.8 V
- Features: Other
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Supplier: Texas Instruments
Description: 3-A Active Bus Termination/ DDR Memory DC/DC Converter 20-HTSSOP -40 to 85
- Input Voltage (VIN): 3 to 6 volts
- Output Current (IOUT): 3 amps
- Quiescent Current (IQ): 0.0062 amps
- Operating Temperature: -40 to 85 C
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Supplier: Amphenol Communications Solutions
Description: DDR5 SMT, DDR5 Memory Module Sockets,Vertical, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch, 30μin Gold on Contact Area, Standard Housing and Latch, Metal Tab, With MYLAR., Amphenol is one of the leading manufacturers of Connectors. Contact us today for more details of part number
- Features: Memory Card Connector
- Connector Type: PC Card Connector
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Supplier: Utmel Electronic Limited
Description: 1.5A,DDR MEMORY TERML REDFN 8 220.9MM PBFR Code = 0794
- Operating Current: 0.38 mA
- Operating Temperature: -40 to 125 C
- Features: Other
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Supplier: LCSC Electronics Technology (HK) Limited
Description: FBGA-180 DDR SDRAM ROHS
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Supplier: Win Source Electronics
Description: Category: Memory - Modules Win Source Part Number: 1450384-DDR3_PC1600_SO-DIMM_1Gx64 Manufacturer: Adata
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Description: Integrated Circuits (ICs) - Memory - DDR SDRAM
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Supplier: GSI Technology
Description: GSI's SigmaDDR„¢ SRAMs are the acknowledged leader in the industry with their combination of capacity and performance. SigmaDDR transaction rates are unequaled by any competitors. SigmaDDR SRAMs are synchronous memories with a common read and write data bus. œDDR refers to their ability to
- Density: 18,000 to 288,000 kbits
- Data Rate: 400 to 633 MHz
- Package Type: BGA
- Memory Category: SRAM
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Supplier: Utmel Electronic Limited
Description: Switching Controllers DDR 2/3 Memory Pwr Cntrl
- TJ: -40 to 85 C
- Device Type: CardBus Controller
- Features: Other, RoHS Compliant
Find Suppliers by Category Top
Featured Products Top
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Innodisk, a global leader in industrial-grade memory, announces the release of its DDR5 CAMM2 and LPDDR5X CAMM2 (LPCAMM2) memory modules. With speeds up to 6400 MT/s and 8533 MT/s respectively, and a 60% smaller footprint, the new CAMM2 series is designed to meet the demands of compact, high (read more)
Browse Memory Modules Datasheets for New Yorker Electronics Co., Inc. -
Our DDR5 DIMM socket is the next generation offering of memory hardware designed for high performance computing and server platforms. With the ability to support up to 6.4 GT/s (giga transfers per second) in bandwidth, and a SI performance of 20Ghz, DDR5 sockets deliver on performance while (read more)
Browse IC Interconnect Components Datasheets for TE Connectivity -
/Os with support for DDR2/DDR3 memory and LVDS interfaces, making it suitable for space-conscious embedded designs. Its built-in clock management (4 DCMs, 2 PLLs) ensures stable operation across multiple frequency domains (read more)
Browse Field-Programmable Gate Arrays (FPGA) Datasheets for Win Source Electronics -
-channel DDR4 memory, with both embedded memory and SO-DIMM expansion slot. With a computing performance enhancement of up to 3.5 times, they excel as controllers for traffic management and automated fare collection systems. Additionally, they serve as versatile intelligent edge devices for data (read more)
Browse Data Input Modules Datasheets for Advantech -
including LVTTL, LVCMOS, HSTL, SSTL, and LVDS, along with ChipSync™ source-synchronous interfacing and per-bit deskew, ideal for DDR memory, ADC interfaces, and other timing-sensitive signal applications. Coupled with advanced clock (read more)
Browse Field-Programmable Gate Arrays (FPGA) Datasheets for Win Source Electronics -
.? Greater number of memory channels enable speed intensive applications such as artificial intelligence and machine learning. Next Generation Hardware Supports 8-channel DDR5 DRAM memory up to 6400 MT/s, to increased performance and reduced overall (read more)
Browse Electrical Contacts Datasheets for TE Connectivity -
iC9200 series controller, powered by Yaskawa’s proprietary Triton processor. With support for up to 64 real and 64 virtual axes, high-speed DDR4 memory, integrated EtherCAT and Safety over EtherCAT (FSo (read more)
Browse Motion Control Systems Datasheets for Yaskawa America, Inc. - Motion Division -
& Validation The MSO8804HD excels in high-speed semiconductor validation where signal integrity directly impacts product success. Its 8GHz bandwidth and ultra-low noise floor enable accurate characterization of DDR4/DDR5 memory interfaces, PCIe 4.0/5.0 links, and high-speed SerDes designs. The 12-bit (read more)
Browse Oscilloscopes Datasheets for Uni-Trend US -
interconnections between system devices.? Greater number of memory channels enable speed intensive applications such as artificial intelligence and machine learning. Next Generation Hardware With DDR5 support, LGA 4677 (read more)
Browse IC Sockets and Headers Datasheets for TE Connectivity -
capabilities, enabling effective multitasking and complex computations. Enhanced with DDR5 support, they achieve higher data transfer rates and expanded memory capacity. Their fanless design significantly reduces noise and failure rates, making them an ideal choice for environments with noise-sensitive considerations. (read more)
Browse Network Gateways Datasheets for Advantech
Conduct Research Top
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Smart Computing Article - Memory
. Often, you can press a key (such as ESC) to display the testing information. The key will vary among systems, so consult your system documentation for more information. You may be able to add more RAM to your motherboard than the system can support. A motherboard with three DDR SDRAM (double-data
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How to Use a Rad Hard Switching Regulator as a VTT Terminator
DDR memory is becoming increasingly popular in satellite and space applications. However, no power solution can survive the harsh environments of space while meeting the power requirements of the VTT rail. This article introduces Intersil's ISL70003SEH rad hard switching regulator as a solution
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Switching Regulator Advances Enable Compact, Efficient Power Management Design
the few milliamps needed for standby supplies as well as the over 100A requirements for application-specific integrated circuit (ASIC) voltage regulators. Low-voltage processors, digital signal processors (DSPs), and double data rate (DDR) memories also impose stringent requirements on the power supply.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
family to support DDR-II memory, the JEDEX Conference here was told this week. Micro-Metric debuts measurement tool for IC wafers Micro-Metric Inc. here rolled out a system that provides non-contact depth and linewidth measurement for semiconductor wafers. Intel's processor sales in China surge 39%
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
DDR SDRAM devices to 400-megabits-per-second (400-Mbps) for main memory and to 700-megabits-per-second (700-Mbps) for graphics memory.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
DDR-II device that will actually begin shipping much sooner as a specialty memory for graphics. Skyworks Solutions Inc., apparently unafraid of the downward spiral the wireless handset market finds itself in, is launching into the struggling sector. Photronics' new CEO sees rebound in photomask market
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
over 2001, resulting in "moderate profitability " for the supplier of surround sound and other audio technologies used in digital signal processing (DSP) systems and entertainment products. Fairchild says power supply controller eases DDR, HSTL memory systems design SAN JOSE -- Fairchild Semiconductor
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Smart Computing Article - Power Up Your PC
your PC is the best upgrade you can make, especially at today's prices. AMD compatible motherboards don't use RDRAM, but they can use either DDR-SDRAM or standard SDRAM. You can also choose between the two bus speeds, as we mentioned earlier. Bode says users can also choose between motherboards
More Information Top
Indicates content that may require registration and/or purchase.
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http://www-cs.intel.com/content/dam/doc/design-guide/855gm-855gme-chipset-platform-design-guide.pdf
DDR Memory ECC Functionality Disable ....................................................116 6.6.
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http://www.intel.com/content/dam/doc/datasheet/855pm-chipset-memory-controller-hub-ddr-200-266-mhz-datasheet.pdf
DDR Memory Capacity..............................................................................................
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http://www-us-east.intel.com/content/dam/doc/design-guide/852gm-chipset-platform-guide.pdf
DDR Memory Power Sequencing Requirements.
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http://www-cs.intel.com/content/dam/doc/design-guide/855pm-chipset-platform-guide.pdf
DDR Memory ECC Functionality Disable.
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http://www-cs.intel.com/content/dam/doc/design-guide/852gme-852gmv-852pm-chipset-platforms-guide.pdf
DDR Memory ECC Functionality Disable ....................................................106 6.6.
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http://www.nxp.com/documents/application_note/AN10935.pdf
This application note will focus on connectivity, initialization and board layout guidelines when using SDR and DDR memories with the LPC32x0.
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http://www.nxp.com/documents/user_manual/UM10113.pdf
• 64 Mbits, 128 Mbits or 256 Mbits (8 MB, 16 MB or 32 MB) DDR1 SDRAM connected to the DDR memory controller interface.
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http://www-cs.intel.com/content/dam/doc/design-guide/852gm-chipset-82801db-io-controller-hub-embedded-platform-guide.pdf
DDR Memory Power Sequencing Requirements .