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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Weld 2214 gray one-part epoxy adhesive is compatible with metal materials with a 40 min @ 250F cure time. Delivers great performance with a shear strength of 4500 psi, tensile strength of 10000 psi and peel strength of 5 piw. Minimum to maximum operating temperatures are -67
- Features: Leveling / Filling Compound
- Use Temperature: -67 to 250 F
- Viscosity: 1.00E6 cP
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Weld 2214 gray one-part epoxy adhesive is compatible with metal materials with a 40 min @ 250F cure time. Delivers great performance with a shear strength of 4500 psi, tensile strength of 10000 psi and peel strength of 5 piw. Minimum to maximum operating temperatures are -67
- Features: Leveling / Filling Compound
- Use Temperature: -67 to 250 F
- Viscosity: 1.00E6 cP
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Weld 2214 gray one-part epoxy adhesive is compatible with metal materials with a 40 min @ 250F cure time. Delivers great performance with a shear strength of 4500 psi, tensile strength of 10000 psi and peel strength of 5 piw. Minimum to maximum operating temperatures are -67
- Features: Leveling / Filling Compound
- Use Temperature: -67 to 250 F
- Viscosity: 1.00E6 cP
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Weld 2214 gray one-part epoxy adhesive is compatible with metal materials with a 40 min @ 250F cure time. Delivers great performance with a shear strength of 4500 psi, tensile strength of 10000 psi and peel strength of 5 piw. Minimum to maximum operating temperatures are -67
- Features: Leveling / Filling Compound
- Use Temperature: -67 to 250 F
- Viscosity: 1.00E6 cP
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® A856FR is a two part, non-brominated, fire retardant, laminating resin that cures at room temperature with elevated temperature cure capabilities. INSTAbond® A856FR is designed for aerospace applications where compliance with FAR 853 regulations for flame and smoke density are
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive 2214 is a gray, high-density, deaerated, rigid, aluminum filled, one-part epoxy. Cures in 40 minutes at 250 Degrees F/121 Degrees C. 3M™ Scotch-Weld™ Epoxy Adhesive 2214 is an epoxy adhesive that provides dense
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Strength: 77 to 570 kV/in
- Elongation: 1 to 2 %
- Features: Filled
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1294 Epoxy Adhesive Yellow is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.
- Cure Type / Technology: Two Component System
- Elongation: 1 to 2 %
- Tensile Strength (Break): 2400 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1294 Epoxy Adhesive Yellow is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.
- Cure Type / Technology: Two Component System
- Elongation: 1 to 2 %
- Tensile Strength (Break): 2400 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1294 Epoxy Adhesive Yellow is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals.
- Cure Type / Technology: Two Component System
- Elongation: 1 to 2 %
- Tensile Strength (Break): 2400 psi
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1294 Epoxy Adhesive White is a two component, flame-retardant edge fill epoxy syntactic foam used to provide structural strength for applications like airfract interior honeycomb panels. Provides protection against salt spray, humidity, water, and other chemicals. Low
- Cure Type / Technology: Two Component System
- Elongation: 1 to 2 %
- Tensile Strength (Break): 2400 psi
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Supplier: Master Bond, Inc.
Description: Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical
- Coeff. of Thermal Expansion (CTE): 22.22 to 25 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.5
- Dielectric Strength: 400 to 450 kV/in
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or connection of electrically conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 248 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-FXSG™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG™ is well suited for bonding of dissimilar
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled, Flexible / Dampening
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 320 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less silver
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 77 to 302 F
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Supplier: Graphene Laboratories, Inc.
Description: DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, EMI / RFI Shielding Material, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Use Temperature: 302 to 356 F
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Supplier: Master Bond, Inc.
Description: EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test,
- Applied Thickness / Gap Fill: 3.00E-6 to 7.00E-6 inch
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.5
- Dissimilar Substrates: Yes
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Description: 3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3028 is a 250°F to 350°F (121°C to 176°C) curing, low density, expandable core splice adhesive film. Scotch-Weld AF 3028 adhesive was designed for filling mismatch areas or reinforcing and splicing honeycomb core.
- Applied Thickness / Gap Fill: 0.0500 inch
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Other
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Description: 3M™ Scotch-Weld™ Structural Core Splice Adhesive AF 3024 is a 250°F (121°C) to 350°F (176°C) curing, low density, expandable core splice adhesive film.High expansion (250%). Low sag during cure. Low volatile loss. High performance from -67°F to 350°F (-55°C to 176°C).
- Applied Thickness / Gap Fill: 0.0250 to 0.1000 inch
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Other
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Description: 3M™ Scotch-Weld™ Core Splice Adhesive Film AF 3002 is a 250-350°F (121-177°C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C) temperature
- Applied Thickness / Gap Fill: 0.0700 to 0.0800 inch
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Other
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE EA 9825 AERO is a low-density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350 °F (177 °C). It may also be used for fastener or attachment potting and panel edge reinforcing.
- Industry: Aerospace
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE EA 9820 AERO is an intermediate density, one-component epoxy syntactic for use on honeycomb composite parts requiring high compressive strength at temperatures up to 350 °F (177 °C). It may also be used for fastener or attachment potting and panel edge reinforcing.
- Industry: Aerospace
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Supplier: ASTM International
Description: This specification covers reinforced plastic pipe and fitting system made from epoxy resin and glass-fiber reinforcement, together with adhesive for joint assembly, intended for services in aviation jet turbine fuel lines installed below ground. The fiberglass pipe shall be round and
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Supplier: Richardson RFPD
Description: temperatures Qualification based on AEC-Q200 rev. D Suitable for reflow soldering only Construction RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate) Copper inner electrodes Silver outer electrodes Silver coated copper-invar lead frame Epoxy resin adhesive
- Capacitance Range: 1.5 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 700 volts
- Electrostatic Capacitors: Ceramic
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Supplier: Richardson RFPD
Description: temperatures Qualification based on AEC-Q200 rev. D Suitable for reflow soldering only Construction RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate) Copper inner electrodes Silver outer electrodes Silver coated copper-invar lead frame Epoxy resin adhesive
- Capacitance Range: 10 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 500 volts
- Electrostatic Capacitors: Ceramic
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Supplier: Richardson RFPD
Description: temperatures Qualification based on AEC-Q200 rev. D Suitable for reflow soldering only Construction RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate) Copper inner electrodes Silver outer electrodes Silver coated copper-invar lead frame Epoxy resin adhesive
- Capacitance Range: 0.5000 microF
- Capacitance Tolerance: 20 (+/- %)
- DC Rated Voltage Range (WVDC): 900 volts
- Electrostatic Capacitors: Ceramic
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Supplier: Richardson RFPD
Description: Increasing capacitance with DC bias up to operating voltage High capacitance density Minimized dielectric loss at high temperatures High reliability Construction RoHS-compatible PLZT ceramic (lead lanthanum zirconium titanate) Copper inner electrodes Silver outer electrodes Silver coated
- Capacitance Range: 0.2500 microF
- Capacitance Tolerance: 20 (+/- %)
- Configuration / Form Factor: Leaded Capacitor
- DC Rated Voltage Range (WVDC): 900 volts
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Supplier: Legrand
Description: Workstation Connectivity Activation Inserts mounted in the raceway or with pre-punched activation openings. AL4400 is designed to meet most installation requirements for UTP, STP, fiber optic, and electrical wiring. FEATURES Accommodates high density communication cabling for networks
- Cover Style: Snap-on
- Material: Other Material
- Style: Lay-in Wireway
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Supplier: Legrand
Description: for electrical wiring. FEATURES Three-channel, two-cover, 2 1/4" [57mm] deep aluminum. Accommodates high density communication cabling for networks and phone systems. Prewired raceway. Manufactured to specified job site lengths, electrically prewired and
- Cover Style: Snap-on
- Material: Other Material
- Style: Lay-in Wireway
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Supplier: Legrand
Description: density communication cabling for networks and phone systems. Prewired raceway. Manufactured to specified job site lengths, electrically prewired and assembled – ready to install. Reduces on-site installation time and costs. Snap fit cover. Provides
- Cover Style: Snap-on
- Material: Other Material
- Style: Lay-in Wireway
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Supplier: Shanghai Optics
Description: density of greater than 5.0) from ±1% of the laser wavelength. The narrow bandwidth typical FWHM is less than 0.38% of laser wavelength. Notch filters, which reject one specific band and transmit all other light, are also available. Environmental Stability of Shanghai Optics Laser
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Supplier: FX PCB Co., Ltd.
Description: glass fiber-reinforced epoxy resin. A single-sided rigid PCB has a lower manufacturing cost than a single-sided flexible PCB. Single Layer Flex PCB Manufacturer’s Capability: when you are designing your flexible printed circuit boards, you may need to know the
- Thickness: 0.0157 inches
- Type: Film / Flexible Substrate
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-4700 boards and a high temperature ambient-cure epoxy adhesive are stacked together to form a bonded block of foam. The bonded blocks are vacuum bagged to ensure thin bond lines, then it is cured, and prepared for machining. 2.Machining A rough cut of the tool is made (read more)
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Experimental Evaluation and Prediction of Formability of Adhesive Bonded Steel Sheets at Different Adhesive Properties
TABLE 2 Density of epoxy adhesive with different CB wt. %.
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Forming performance of adhesive bonded steel sheets reinforced with metallic wires
The density of epoxy adhesive at hardener/resin ratio of 1:1 was found to be 7.76× .
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Ultrasonic measurements related to evolution of structure in curing epoxy resins
to a crosslinked solid in resin–hardener systems. density of epoxy adhesives does not change signifi- .
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Diluted epoxy adhesives II. Relationship of shrinkage during cure to lap shear strengths
where do = initial density of the epoxy adhesive and d, = density of the cured sample.
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Finite Element Modeling of RC Beams Strengthened in Flexure Using FRP Material
Tensile strength and density of this epoxy adhesive were 30MPa and 1.31kg/lit, respectively.
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Direct magnetoelectric effect in two-layer composite structures Tb0.12 Dy0.2 Fe0.68 -PbZr0.53 Ti0.47 O3 at bending and longitudinal vibrations
… sample length (the sample length was taken to be equal to the PZT layer length); 〈ρ〉 = ρEVE +ρTDFVTDF + ρPZTVPZT is the effective density of the TDF–PZT composite; ρE, ρTDF, and ρPZT are the densities of the epoxy adhesive , ferromagnet TDF, and piezoelectric …
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A Container Based on Polymer Composite Materials for the Ultimate Disposal of Spent Nuclear Fuel and Radioactive Waste
… then turned to the design of the container itself with special concern given to the design of the lid, and a simple threaded lid, sealed with a slow cur- ing, constant density epoxy or a cyanoacrylate adhe- sive , was deemed preferable to …
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Power electronic conversion systems for deepwater applications
A synopsis of types of materials for potting electronics (table 1), reveals that low- density epoxy bonded syntactic foam adheres best and shrinks the least on curing.
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Radio frequency plasma processing to produce chromium sputter targets
Both cylinder faces were plane polished and glued to steel plugs with Scotch-Weld Brand Epoxy Adhesive 2214 Hi- Density (3M Inc., St. Paul, MN) (Fig. 2).
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Epoxy adhesive used in optical fiber/passive component: kinetics, voids and reliability
As discussed in epoxies and adhesives , the density , size, spatial distribution and the rate of changes are all of critical importance to device reliability.