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Supplier: Allied Electronics, Inc.
Description: UL 94V-0 Flammability Rating, Copper Clad Material Chemicals A 1⁄32" (30 mil) fiberglass laminate with 1 ounce copper. This flame-retardant laminate is translucent in color and made of continuous woven glass cloth impregnated with epoxy resin. Dielectric Constant (1 MHz):
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Supplier: Allied Electronics, Inc.
Description: UL 94V-0 Flammability Rating, Copper Clad Material Chemicals A 1⁄32" (30 mil) fiberglass laminate with 1 ounce copper. This flame-retardant laminate is translucent in color and made of continuous woven glass cloth impregnated with epoxy resin. Dielectric Constant (1 MHz):
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Supplier: Allied Electronics, Inc.
Description: UL 94V-0 Flammability Rating, Copper Clad Material Chemicals A 1⁄32" (30 mil) fiberglass laminate with 1 ounce copper. This flame-retardant laminate is translucent in color and made of continuous woven glass cloth impregnated with epoxy resin. Dielectric Constant (1 MHz):
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Supplier: Allied Electronics, Inc.
Description: UL 94V-0 Flammability Rating, Copper Clad Material Chemicals A 1⁄32" (30 mil) fiberglass laminate with 1 ounce copper. This flame-retardant laminate is translucent in color and made of continuous woven glass cloth impregnated with epoxy resin. Dielectric Constant (1 MHz):
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Description: IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).
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Supplier: CSA Group
Description: IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).
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Description: low dielectric loss is 108HZ, it can reach 2.5×10-4, the dielectric constant is 4, and it can penetrate microwave and infrared rays. Extremely strong corrosion resistance: Will not react with common metals (iron, copper, aluminum, lead, etc.), rare earth metals, precious
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Dielectric Constant (Relative Permittivity): 4 #
- Specialty Ceramic Type: Boron Nitride
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Supplier: BRIM Electronics, Inc.
Description: A polyimide tape film that has a heat-sealable FEP coating over a stranded silver-plated copper conductor. Provides high temperature performance -- +200°C -- with low temperature flexibility & HIGH RADIATION RESISTANCE. Also resistant to cold flow, has high dielectric strength, low
- Rated Voltage: 600 to 1,000 volts
- Nominal Outer Diameter: 0.021 to 0.07 inch
- North American (AWG): 30 to 16 AWG
- Wire Conductor: Copper and Copper Alloys
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Supplier: BRIM Electronics, Inc.
Description: Stranded tinned copper conductor, insulated with Silicone Rubber, lacquered glass braid overall. Suitable as a flexible high temperature lead wire. Rated for 600V, 200°C. Resistant to many acids, alkalis & oils and will retain it's physical properties under extreme conditions. Low
- Rated Voltage: 600 to 1,000 volts
- Nominal Outer Diameter: 0.045 to 0.39 inch
- North American (AWG): 26 to 4 AWG
- Wire Conductor: Copper and Copper Alloys
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Supplier: Harbour Industries, Inc.
Description: PRECISION PTFE DIELECTRICS USED All of the PTFE dielectric coax cables listed are high temperature, high performance constructions exhibiting high dielectric strength and low capacitance in proportion to the cable’s dielectric constant. Harbour manufactures all
- Impedance: 50 to 95 ohms
- Operating Temperature: 250 C
- Cable Shielding: Braid, Foil Braid
- Product Category: Bulk Cable
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Supplier: Daburn Electronics & Cable
Description: Description: Daburn FEP ribbon cable reduces crosstalk, compared to PVC constructions. It provides hi-fidelity and dense signal transmission with low dielectric constant. Its low coefficient of friction and excellent abrasion resistance provide a unique non-adhesive and self
- Number of Conductors: 9 to 64 #
- Rated Voltage: 0.3 kilovolts
- Operating Temperature: -65 to 200 C
- North American (AWG): 28 AWG
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Description: constant and dielectric loss, is non-toxic, and has a coefficient of thermal expansion compatible with silicon. The excellent properties make these materials ideal for highly concentrated semiconductor substrates and electronic device packaging. The most common technical
- Features: Alumina / Aluminum Oxide
- Specialty Ceramic Type: Aluminum Nitride
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Supplier: Thorlabs, Inc.
Description: more productive. A direct outcome of this customer focus is our utmost respect for your time. This drives us to question everything we do. It informs our product design, shapes our approach to manufacturing, and provides clarity for our customer service department. We constantly ask
- Wavelength Range: 250 to 20,000 nm
- Diameter/Width: 12.699993142003704 to 50.799972568014816 mm
- Thickness: 5.8 to 12.200000000000001 mm
- Surface Flatness: λ/10, λ/20
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Supplier: Thorlabs, Inc.
Description: more productive. A direct outcome of this customer focus is our utmost respect for your time. This drives us to question everything we do. It informs our product design, shapes our approach to manufacturing, and provides clarity for our customer service department. We constantly ask
- Wavelength Range: 250 to 20,000 nm
- Diameter/Width: 7.000000000000001 to 101.59994513602963 mm
- Thickness: 2 to 19.1 mm
- Surface Flatness: λ/10, λ/20, λ/5, λ/8
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Supplier: Wiremax
Description: High Voltage FEP Wire High Temperature - 55°C Thru 200°C High Voltage 1 KVDC thru 30 KVDC 28 AWG thru 20 AWG Conductors, Silver plated copper High flexibility Ozone and corona Resistant Small Diameter Nomex Braid offered for abrasive applications Reference: MIL-W-22759 FEP Resins meet
- North American (AWG): 22 AWG
- Rated Voltage: 20 kilovolts
- Standards / Approvals: RoHS
- Cable Insulation: Teflon
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Supplier: FX PCB Co., Ltd.
Description: resin material suitable for HDI (High-density interconnect) Multilayer PCBs and advanced packaging substrates BT Copper-Clad Laminates for SMD LEDs The BT copper-clad laminates, especially the CCL-HL 820 series, are widely used in SMD LED applications. CCL-HL 820WDI is
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Supplier: HAVE, Inc.
Description: maintains a high degree of durability. Each oxygen-free copper conductor is insulated with a unique low k constant, foam polypropylene dielectric that lowers the capacitance and extends the bandwidth of the cable. Low noise is achieved though tight and precision pair twisting
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Supplier: Thermal Wire and Cable LLC
Description: particularly in harsh environments. Teflon PFAH exhibits exceptional high temperature resistance and stress crack resistance with a high flex life. In addition, Teflon PFAH offers high dielectric strength, a low loss dielectric constant, low loss factors, and extremely high
- North American (AWG): 1 AWG
- Number of Conductors: 1 #
- Rated Voltage: 0.6 kilovolts
- Rated Amperage: 440 amps
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Supplier: Quiktron, Inc.
Description: signal propagation and effective shielding against EMI/RFI. This interconnect uses smooth, flawless, large cross-section silver-plated OFC as the signal conductor. A nitrogen-foamed PE insulation exhibits extremely low dielectric constant. Cu Shielding Technology™ provides three layers
- Cable Length: 1.5 ft
- Application: Audio
- Features: Cable Assembly, Other
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Supplier: Quiktron, Inc.
Description: signal propagation and effective shielding against EMI/RFI. This interconnect uses smooth, flawless, large cross-section silver-plated OFC as the signal conductor. A nitrogen-foamed PE insulation exhibits extremely low dielectric constant. Cu Shielding Technology™ provides three layers
- Cable Length: 50 ft
- Application: Audio
- Features: Cable Assembly, Other
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Supplier: Quiktron, Inc.
Description: signal propagation and effective shielding against EMI/RFI. This interconnect uses smooth, flawless, large cross-section silver-plated OFC as the signal conductor. A nitrogen-foamed PE insulation exhibits extremely low dielectric constant. Cu Shielding Technology™ provides three layers
- Cable Length: 25 ft
- Application: Audio
- Features: Cable Assembly, Other
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Supplier: Quiktron, Inc.
Description: signal propagation and effective shielding against EMI/RFI. This interconnect uses smooth, flawless, large cross-section silver-plated OFC as the signal conductor. A nitrogen-foamed PE insulation exhibits extremely low dielectric constant. Cu Shielding Technology™ provides three layers
- Cable Length: 12 ft
- Application: Audio
- Features: Cable Assembly, Other
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Supplier: FX PCB Co., Ltd.
Description: most popular ceramic material for Ceramic PCB. Meanwhile, the price is cheaper than the ALN and Beo. Alumina Ceramic PCB Materials datasheet: Item - Unit - Value - Test Standard Color / White 3.2 Density g/cm³ ≥ 3.7 GB/T 2413 Thermal Conductivity 20℃, W/(m • K) ≥ 24 GB/T 5598
- Thickness: 0.00984251968503937 to 0.014960629921259842 inches
- Electrical Resistivity: 10 ohm-cm
- Features: Specialty / Other
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Description: solid state. Boron Nitride can withstand temperatures above 2000°C in inert and reducing environments. Furthermore, because most molten metals and slags do not wet it, it can be used as a container for most molten metals, including aluminum, sodium, iron, steel, silicon, boron, and
- Material Type: Boron Nitride
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Description: voltage is 3KV/MV, the low dielectric loss is 108HZ, it can reach 2.5×10-4, the dielectric constant is 4, and it can penetrate microwave and infrared rays. Extremely strong corrosion resistance: Will not react with common metals (iron, copper, aluminum, lead, etc.), rare
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Dielectric Constant (Relative Permittivity): 4 #
- Specialty Ceramic Type: Boron Nitride
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Description: low dielectric loss is 108HZ, it can reach 2.5×10-4, the dielectric constant is 4, and it can penetrate microwave and infrared rays. Extremely strong corrosion resistance: Will not react with common metals (iron, copper, aluminum, lead, etc.), rare earth metals, precious
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Dielectric Constant (Relative Permittivity): 4 #
- Specialty Ceramic Type: Boron Nitride
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Description: breakdown voltage is 3KV/MV, the low dielectric loss is 108HZ, it can reach 2.5×10-4, the dielectric constant is 4, and it can penetrate microwave and infrared rays. Extremely strong corrosion resistance: Will not react with common metals (iron, copper, aluminum, lead,
- Thermal Conductivity: 33 W/m-K
- Coeff. of Thermal Expansion (CTE): 2 µm/m-C
- Dielectric Constant (Relative Permittivity): 4 #
- Specialty Ceramic Type: Boron Nitride
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Supplier: FX PCB Co., Ltd.
Description: Description Different types of IMS PCB? IMS (Insulated Metal Substrate) PCB which use metal as substrate material, usually we use Alu or Copper substrate. Below are FX PCB’s capabilities for IMS PCB Single-sided printed circuit boards Double-sided printed circuit boards Multilayer
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Supplier: FX PCB Co., Ltd.
Description: energy. The dielectric constant should be able to tell you the magnitude of the electrical force as well. This is an important factor to think about. Generally, all light boards are intended for use in electrical appliances. Check the material’s ability to store electrical
- Features: East Asia / Pacific Only, United States Only
- Supplier Capability: PCB Assembly
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Featured Products Top
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Low Loss Dielectric Materials Cuming Microwave manufactures a full line of low loss dielectric materials. Our materials range in dielectric constant from 1 (read more)
Browse Foams and Foam Materials Datasheets for Dexmet® Corporation, a part of PPG’s engineered materials division -
Is Polyurethane Dielectric Foam Durable Enough for Aerospace and RF Applications? In the aerospace and RF industries (read more)
Browse Electrical Insulation and Dielectric Materials Datasheets for General Plastics Manufacturing Co. -
Provides optimal signal transmission and receipt for antennae and other electronics Performs in a large variety of usage temperatures, some up to 350oF Does not absorb water Available in custom densities to meet specific dielectric constant and loss tangent (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
High-Performance Dielectric Ceramic Filter - Boosting Communication Efficiency Interquip introduces a new line of dielectric ceramic filters, specifically designed for navigation, mobile communications, and Wi-Fi applications. Utilizing dielectric materials with low loss (read more)
Browse Oscillators Datasheets for Interquip Electronics Co., Ltd. -
S-122 0.6" x 0.8", S-122 roll formed copper electrification bar with plastic cover. This channel is roll formed in corrosion resistant material such as Hot Dipped Galvanized, Copper, Stainless, or Aluminized (read more)
Browse Copper, Brass, and Bronze Alloys Datasheets for MP Metal Products -
products for use as dielectric material in radio frequency (RF) communication systems such as radomes, antennas and others. Located on land, sea and in the air, these (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
.005" up to 0.165", and widths up to 48" depending on the shape. MP Metal Products specializes in private-label manufacturing typically for OEM accounts expecting quality parts delivered on time. Roll Forming Stamping Embossing Press Braking (read more)
Browse Specialty Metal Shapes and Stock Datasheets for MP Metal Products -
T-113 0.375" x 5" wide Copper heat transfer plate for 3/8" PEX tubing. These PEX heat transfer plates are manufactured from copper and are designed to improve performance of the radiant floor heating system by dispersing the heat from (read more)
Browse Datasheets for MP Metal Products -
Knowles Precision Devices
High Q, Ultra-Low ESR, X8G Dielectric Capacitors for Automotive Applications
The AEC-Q200 Ultra-Low ESR X8G range offers a very stable X8R High Q material system that provides excellent low loss performance. The range is tested and approved to automotive specification AEC-Q200. Optimized for lowest possible ESR, the electrode system provides low metal (read more)
Browse Capacitors Datasheets for Knowles Precision Devices -
Systek UVF 100 is a high performance 2 in 1 copper electroplating system for the build-up of IC substrate redistribution layers (RDL). The process is the latest addition to the Systek family of IC substrate manufacturing solutions. Systek UVF 100 is a pattern plating bath (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions
Conduct Research Top
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
chamber geometries by. imposing a dielectrophoresis (DEP) force on the beads. In cDEP the electrodes are not in. direct contact with the fluid sample but are instead capacitively coupled to the mixing. chamber through thin dielectric barriers, which eliminates many of the problems. encountered
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Layout and Physical Design Guidelines for Capacitive Sensing
of material given identical testing condi- ? ? A o r C = tions. This is because the dielectric constant of window d glass is higher than the dielectric of acrylics. Numerous specifications for a particular acrylic or type of glass Another related concern is the proximity of a button to exist
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Influence of temperature on MWCNT bundle, SWCNT bundle and copper interconnects for nanoscaled technology nodes
… is capacitance of per unit length, W, h, t are width, height and thickness copper interconnects and s is separation between two interconnects as per interconnects geometry shown in Fig. 4. e is dielectric constant for copper interconnect and it is …
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Performance and analysis of temperature dependent multi-walled carbon nanotubes as global interconnects at different technology nodes
ε is dielectric constant for copper inter- connect and it is technology dependent.
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1D Copper Nanostructures: Progress, Challenges and Opportunities
The time dependence of surface plasmon resonances of copper nanorods has been reported.[122] The effective medium dielectric constant for copper nanorods in methanol was calculated on the basis of Gans’ theory with the nominal dielectric constant of the medium and …
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High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)
Optical links do not require printed wiring boards (PWB) that are composed of specialized and expensive material designed to minimize loss tangent and dielectric constant for copper data transmission lines.
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Modeling of Photonic Band Gap Crystals and Applications
On the other hand the absorption is higher for aluminum and smaller for copper due to the higher (lower) value of the imaginary part of the dielectric constant for aluminum ( copper ).
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Phenomenological studies of optical properties of Cu nanowires
Since the Drude model in Eq. (2) may not provide an accurate model of empirical dielectric constant data for copper over a wide frequency range, a combination of at least one more dispersion model dielectric functions is suggested to be added …
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Optical studies of dilute CuNi alloys
Briefly we have found the dielectric constant ep for pure copper , and its changes on alloying & = E, - E,. The real and imaginary parts of E have been broken into several contributions, the changes in the region below the interband threshold …
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MRS Online Proceedings Library - Low Dielectric Constant Polymers For On-Chip Interlevel Dielectrics With Copper Metallization - Cambridge Journals Online
• Low Dielectric Constant Polymers For On-Chip Interlevel Dielectrics With Copper MetallizationLow Dielectric Constant Polymers For On-Chip Interlevel Dielectrics With Copper Metallization .
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Low dielectric constant materials
THE NEED FOR COPPER AND LOW DIELECTRIC CONSTANT (LOW ε) MATERIAL Scaling down the feature sizes in microelectronic circuits has proven efficient in improving circuit per- formance and increasing yield at lower cost per func- tiononchip.
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Integration Challenges for Low Dielectric Constant Materials
2 The Need for Copper and Low Dielectric Constant (Low k) Material .