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Supplier: Accuris
Description: CHEMICAL INK, DIELECTRIC (THICK FILM DIELECTRIC PASTE)
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Supplier: Wacker Chemical Corp.
Description: Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating. Application WACKER® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a
- Thermal Conductivity: 0.81 W/m-K
- Dielectric Strength: 254.00000000000054 kV/in
- Dielectric Constant (Relative Permittivity): 3.5
- Type: Electrical Insulation / Dielectric
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Supplier: Sauereisen, Inc.
Description: Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and
- Use Temperature: 1,800 F
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Substrate Compatibility: Ceramic / Glass, Concrete / Masonry, Dissimilar Substrates, Metal, Porous Surfaces, Textiles / Fabrics, Wood / Wood Product
- Chemical System: Ceramic / Inorganic Cement
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
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Supplier: Bluestar Silicones USA Corp.
Description: Stiff, Tacky Dielectric Compound Lubricant and Sealant Description Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric properties
- Use Temperature: -67 to 400 F
- Dielectric Strength: 502.92000000000104 kV/in
- Dielectric Constant (Relative Permittivity): 3
- Features: Electrical Insulation / Dielectric Material
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Supplier: Master Bond, Inc.
Description: Supreme 11HTND withstands thermal cycling, has high bond strength and excellent toughness. It has a paste consistency andis easy to apply.
- Applied Thickness / Gap Fill: 0.002 to 0.004 inch
- Use Temperature: -112 to 400 F
- Coeff. of Thermal Expansion (CTE): 38.888888888888886 to 41.666666666666664 µin/in-F
- Tensile Strength (Break): 7,000 to 8,000 psi
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Supplier: MacDermid Alpha Electronics Solutions
Description: (ceramic) powders, which are electrically insulative, preventing leakage currents if the paste contacts other parts of the assembly. As with all thermal interface materials, we recommend stringent testing before selecting a material for your application. For more information, please refer to
- Use Temperature: 392 F
- Thermal Conductivity: 3 W/m-K
- Dielectric Strength: 457.20000000000095 kV/in
- Viscosity: 42,000 to 48,000 cP
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Supplier: Techsil Limited
Description: metals Fast cure Low odour Excellent weatherability, ozone and chemical resistance Excellent electrical insulation properties Technical Properties Uncured Consistency: Paste Colour: White Tack-Free Time: 5 Mins Cured Shore Hardness: 26 Shore A Elongation: 430% Dielectric Strength:
- Use Temperature: -55 to 200 F
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Techsil Limited
Description: metals Fast cure Low odour Excellent weatherability, ozone and chemical resistance Excellent electrical insulation properties Technical Properties Uncured Consistency: Paste Colour: White Tack-Free Time: 5 Mins Cured Shore Hardness: 26 Shore A Elongation: 430% Dielectric Strength:
- Use Temperature: -55 to 200 F
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Techsil Limited
Description: metals Fast cure Low odour Excellent weatherability, ozone and chemical resistance Excellent electrical insulation properties Technical Properties Uncured Consistency: Paste Colour: Clear Tack-Free Time: 5 Mins Cured Shore Hardness: 26 Shore A Elongation: 430% Dielectric Strength:
- Use Temperature: -55 to 200 F
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: ASTM International
Description: specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.
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Supplier: ASTM International
Description: specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.
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Supplier: Techsil Limited
Description: Momentive TSE392c is a clear non-corrosive silicone adhesive sealant that cures at room temperature. This thixotropic paste material offers excellent adhesion to metals without the use of primers, particularly well suited for electrical/electronic applications. Supplied in a manual 30cc
- Use Temperature: -55 to 200 F
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: Bluestar Silicones USA Corp.
Description: Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric properties and is useful for protecting and sealing electrical and mechanical
- Flash Point: 500 F
- Density / Specific Gravity (@15.6°C, 60°F): 1.03 specific gravity
- Industry Applications: Automotive / Transportation, Electrical / Electronic
- Features: Bearings, Dielectric (Transformer / EDM), Lubricant, Specialty / Other
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Supplier: Master Bond, Inc.
Description: system can be used in optical, fiber-optic, electronic, laser, microelectronic and semiconductor applications, when a robust UV curable paste consistency system is desirable. Product Advantages One component system, no mixing needed Paste consistency Not oxygen inhibited/li>
- Operating / Use Temperature: -80 to 300 F
- Industry: Automotive, Electronics, OEM / Industrial
- Substrate: Ceramic / Porcelain, Glass, Metal, Plastic
- Features: Chemical / Oil Resistant, Dielectric, Protective, Specialty / Other
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Supplier: Master Bond, Inc.
Description: EP21NDCL is an eye-catching system that is optically clear when mixed, even though Part A is translucent and Part B is light amber. It produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. EP21NDCL
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 22.220000000000002 to 25 µin/in-F
- Tensile Strength (Break): 6,500 to 7,500 psi
- Elongation: 5 to 10 %
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Supplier: ASTM International
Description: Dielectric Strength 38 to 41 Mica or Binder Content 19 Molding Test 31 to 37 Organic Binder 20 to 24 Resistivity 42 to 46 Silicone Binder 25 to 30 Stability Under Heat and Pressure 11 to 18 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® N198 BLACK US is a non-slump, RTV-1 oxime cure silicone rubber that cures on contact with moisture in the air. Special features Neutral cure Solvent-free Primerless adhesion to most substrates Available in Black or Gray Application ELASTOSIL® N198 BLACK US is intended for sealing and
- Thermal Conductivity: 0.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 1.3888888888888888 µin/in-F
- Tensile Strength (Break): 50,762.89377501895 psi
- Elongation: 300 %
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Supplier: Allied Electronics, Inc.
Description: Heat Transfer Compound, 350 V⁄MIL Dielectric Strength, 2.5 Specific Gravity Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric
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Supplier: Allied Electronics, Inc.
Description: The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties Will Not Dry Out, Harden or Melt Noncorrosive and Nonflammable Thermally Stable from –40°F
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Supplier: Allied Electronics, Inc.
Description: AC Outlet Analyzer and Wrist Strap Tester Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL QMI536NB-1A5 ) LOCTITE ABLESTIK QMI536NB-1A5 is a non-conductive die attach paste deisgned for applications requiring good dielectric strength.
- Industry: Electronics
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Supplier: Allied Electronics, Inc.
Description: Chemical, Amorphous Silica, Dimethylpolysiloxane Material Provides superior corrosion protection. Lubricates and protects against moisture. Meets MIL S-8660 , broad temperature range (–70°F to +400°F), excellent dielectric properties,prevents high voltage arcing. Flash point is 301 °C.
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 7000C, Epoxy, Die Attach, Dielectric Adhesive LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination
- Viscosity: 4,100 cP
- Coeff. of Thermal Expansion (CTE): 61.88888888888889 µin/in-F
- Features: Electrically Insulating / Dielectric
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 732 Multi-Purpose Sealant Black is a one component, non-slumping, silicone paste that is used for bonding and sealing industrial applications. It offers easy application, acetoxy cure system, flexibility, and good dielectric properties. 90 mL Tube.
- Tensile Strength (Break): 335 psi
- Elongation: 540 %
- Dielectric Strength: 550 kV/in
- Substrate Compatibility: Metal, Plastic, Textiles / Fabrics
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 732 Multi-Purpose Sealant Clear is a one component, non-slumping, silicone paste that is used for bonding and sealing industrial applications. It offers easy application, acetoxy cure system, flexibility, and good dielectric properties. 300 mL Cartridge.
- Tensile Strength (Break): 335 psi
- Elongation: 540 %
- Dielectric Strength: 550 kV/in
- Substrate Compatibility: Metal, Plastic, Textiles / Fabrics
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 732 Multi-Purpose Sealant Black is a one component, non-slumping, silicone paste that is used for bonding and sealing industrial applications. It offers easy application, acetoxy cure system, flexibility, and good dielectric properties. 17.7 kg Pail.
- Tensile Strength (Break): 333.5847305215531 psi
- Elongation: 540 %
- Dielectric Strength: 548.6400000000011 kV/in
- Substrate Compatibility: Metal, Plastic, Textiles / Fabrics
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 732 Multi-Purpose Sealant Black is a one component, non-slumping, silicone paste that is used for bonding and sealing industrial applications. It offers easy application, acetoxy cure system, flexibility, and good dielectric properties. 300 mL Cartridge.
- Tensile Strength (Break): 335 psi
- Elongation: 540 %
- Dielectric Strength: 550 kV/in
- Substrate Compatibility: Metal, Plastic, Textiles / Fabrics
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Features: Electrical Insulation / Dielectric, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
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Supplier: Aremco Products, Inc.
Description: Dielectric, moisture resistant, thermocouples
- Use Temperature: 3,200 F
- Coeff. of Thermal Expansion (CTE): 4 µin/in-F
- Dielectric Strength: 250.00000000000003 kV/in
- Substrate Compatibility: Ceramic / Glass
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure schedules.
- Viscosity: 8,200 cP
- Coeff. of Thermal Expansion (CTE): 32.77777777777778 µin/in-F
- Features: Electrically Insulating / Dielectric
- Substrate Compatibility: Plastic
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to
- Viscosity: 12,760 cP
- Thermal Conductivity: 0.35 W/m-K
- Features: Electrically Insulating / Dielectric, Specialty / Other
- Cure / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: Thick silicone dielectric compound paste that facilitates and improves tune-ups. It prevents voltage leakage around electrical connectors. LOCTITE® LB 8423 is a translucent, thick silicone dielectric compound paste that facilitates and improves tune-ups. It prevents
- Type: Fluid / Oil, Grease / Gel
- Features: Lubricant, Specialty
- Composition / Chemistry: Silicone
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Supplier: Materion Corporation
Description: Materion Microelectronics and Services can provide thick film metallized BeO and alumina (Al2O3) substrates. The refractory metal paste MoMn is screen printed onto the substrate, fired, and then plated with Ni and Au. This classic metallization provides the highest levels of adhesive strength
- Material Type: Alumina / Aluminum Oxide, Beryllia / Beryllium Oxide
- Shape / Form: Bar Stock
- Features: Dielectric Ceramic
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Supplier: MacDermid Alpha Electronics Solutions
Description: protection for electronic assemblies. The advanced coating technology provides significantly higher surface insulation resistance (SIR) and enhanced compatibility with leading no-clean solder pastes compared with conventional UV-curable coatings, helping maintain reliable protection
- Use Temperature: -85 to 302 F
- Dielectric Strength: 355.60000000000076 kV/in
- Dielectric Constant (Relative Permittivity): 2.67
- Features: Conformal / Encapsulating Coating, Electronics, Film / Sheet, Grease / Paste, Liquid, Semiconductors / IC Packaging
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resistance. Unlike conventional pastes or pads, it then chemically cures into a resilient solid, eliminating pump-out and providing permanent dielectric bonding between heatsink and processor. Key benefits include sustained low thermal resistance under continuous power and thermal cycling (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
pressure exceeds 10,000 PSI High-temperature use Low dielectric loss Mass spectrometer leakage test High chemical stability Welding process of ceramics and metals: Cleaning Paste Metallization (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
, followed by a heat cure of 150-200°F for 2-4 hours or longer is typically recommended. It is a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm at 75°F, and dielectric strength of 440 volts/mil at 75°F for a 1/8-inch test specimen (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
pads are ceramic materials with outstanding properties such as high thermal conductivity and high electrical resistance. In addition, it features advantages such as high hardness, corrosion resistance, low dielectric constant and dielectric loss, and low CTE. Aluminum nitride (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Easypoxy® Epoxy Adhesives Two-component, industrial grade epoxies; supplied in convenient two-tube kits and bulk packages. Easypoxy® K-20 & K-22 General purpose, clear/black paste adhesive One of (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS North America LLC
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Practice knowledge Mikrosystemtechnik
Dielectric pastes are after its field pastes for protection glazes, for conductor path crossings and much layer circuits as well as for capacitors.
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Over the influence of the specific area of dielectric powder substances on the electrical properties of siebgedruckter capacitors
As substrates, came A120,-Keramikplattchen with the dimensions 40 x 12,5 mms for insert on a base electrode had been burned before the printing with the dielectric paste .
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Electronic components
To the realization of protection glazes as well as conductor path crossovers (multiple layer circuits), dielectric pastes are available.
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Passive electronic components
The dielectric pastes with ferroelectric additives (" r are used .
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Sensor technique
Dielektrika: The main components of dielectric pastes are BaTiO3 (HDK pastes), TiO2 Mg-, Zn- or CaTiO3 (NDK pastes).
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Electronics for engineers and natural scientists
- The dielectric pastes on the base of glaziers become insulating pastes For application of Isoherschichten by multiple position circuits or by line crossings (amorphously or kristaUin) or the glass-ceramics use.
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Photograph All to know on Photo | Techniques of the Ingénieur
Silk-screen printing is used to spread... in the event of dielectric pasta because they are directly photo-imageables, (they contain elements...
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Handbook of Thick- and Thin-Film Hybrid Microelectronics Complete Document
The conductor layers are printed with DuPont 6160 silver metallization and the dielectric paste is DuPont’s QM 42.
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Advances in Manufacturing Technology
Test Method of Current Leakage for Dielectric Paste .
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Planar LTCC transformers for high voltage flyback converters: Part II.
The designs in that SAND report were all based on a ferrite tape/ dielectric paste system originally developed by NASCENTechnoloy, Inc, who collaborated in the design and manufacturing of the planar LTCC flyback converters.