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Supplier: Wacker Chemical Corp.
Description: Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating. Application WACKER® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 3.5
- Dielectric Strength: 254 kV/in
- Features: Electrical Insulation / Dielectric
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Supplier: Accuris
Description: CHEMICAL INK, DIELECTRIC (THICK FILM DIELECTRIC PASTE)
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Supplier: Sauereisen, Inc.
Description: Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and
- Composition: Unfilled
- Cure Type / Technology: Single Component System
- Features: Electrical Insulation / Dielectric, Flame Retardant (e.g. UL 94 Rated)
- Industry: OEM / Industrial
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics,
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Features: Electrical Insulation / Dielectric
- Material Type: Grease / Paste
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Supplier: Bluestar Silicones USA Corp.
Description: Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric properties and is useful for protecting and sealing electrical and mechanical
- Applications: Automotive / Transportation, Electrical / Electronic
- Chemistry / Constituents: Silicone, Synthetic / Semi-synthetic
- Density / Specific Gravity (@15.6°C, 60°F): 1.03 specific gravity
- Features: Sealing / Barrier, Mold Release / Release Agent
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Supplier: Bluestar Silicones USA Corp.
Description: Stiff, Tacky Dielectric Compound Lubricant and Sealant Description Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric
- Dielectric Constant (Relative Permittivity): 3
- Dielectric Strength: 503 kV/in
- Features: Electrical Insulation / Dielectric Material, Grease / Paste
- Use Temperature: -67 to 400 F
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Supplier: Master Bond, Inc.
Description: Supreme 11HTND withstands thermal cycling, has high bond strength and excellent toughness. It has a paste consistency andis easy to apply.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 38.89 to 41.67 µin/in-F
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: Momentive TSE392 W is a white non-corrosive silicone adhesive sealant that cures at room temperature. This thixotropic paste material offers excellent adhesion to metals without the use of primers, particularly well suited for electrical/electroni c applications. Product Benefits
- Use Temperature: -55 to 200 F
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Supplier: Techsil Limited
Description: Momentive TSE392 W is a white non-corrosive silicone adhesive sealant that cures at room temperature. This thixotropic paste material offers excellent adhesion to metals without the use of primers, particularly well suited for electrical/electroni c applications. Product Benefits
- Use Temperature: -55 to 200 F
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Supplier: Master Bond, Inc.
Description: EP21NDCL is an eye-catching system that is optically clear when mixed, even though Part A is translucent and Part B is light amber. It produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. EP21NDCL
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 to 25 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: ASTM International
Description: applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes. 1.3 The
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Supplier: ASTM International
Description: applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes. 1.3 The
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Supplier: Techsil Limited
Description: Momentive TSE392c is a clear non-corrosive silicone adhesive sealant that cures at room temperature. This thixotropic paste material offers excellent adhesion to metals without the use of primers, particularly well suited for electrical/electroni c applications. Product Benefits
- Use Temperature: -55 to 200 F
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Supplier: Techsil Limited
Description: Momentive TSE392c is a clear non-corrosive silicone adhesive sealant that cures at room temperature. This thixotropic paste material offers excellent adhesion to metals without the use of primers, particularly well suited for electrical/electroni c applications. Supplied in a manual 30cc
- Use Temperature: -55 to 200 F
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® N198 BLACK US is a non-slump, RTV-1 oxime cure silicone rubber that cures on contact with moisture in the air. Special features Neutral cure Solvent-free Primerless adhesion to most substrates Available in Black or Gray Application ELASTOSIL® N198 BLACK US is intended for sealing and
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 1.39 µin/in-F
- Composition: Single Component System
- Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Wacker Chemical Corp.
Description: ELASTOSIL® N 198 GREY US is a non-slump, RTV-1 oxime cure silicone rubber that cures on contact with moisture in the air. Special features Neutral cure Solvent-free Primerless adhesion to most substrates Available in Black or Gray Application ELASTOSIL® N 198 GREY US is intended for sealing and
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 1.39 µin/in-F
- Composition: Single Component System
- Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: 3X Ceramic Parts Company Limited
Description: alumina or cerium oxide polishing powder after washing and finishing on thin 6mm thick sticky cloth for about 15 minutes, and the surface finish is 0.5. It can be wrapped in 0.05-0.10mm thin brass strip and coated with 400 purpose silicon carbide paste. Coolant:
- Material Type: Glass Ceramic, Silica / Silicate Materials
- Thermal Conductivity: 1.71 W/m-K
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Supplier: Materion Corporation
Description: Materion Microelectronics and Services can provide thick film metallized BeO and alumina (Al2O3) substrates. The refractory metal paste MoMn is screen printed onto the substrate, fired, and then plated with Ni and Au. This classic metallization provides the highest levels
- Material Type: Alumina / Aluminum Oxide, Beryllia / Beryllium Oxide
- Shape / Form: Bar Stock
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Supplier: ASTM International
Description: 4 to 10 Dielectric Strength 38 to 41 Mica or Binder Content 19 Molding Test 31 to 37 Organic Binder 20 to 24 Resistivity 42 to 46 Silicone Binder 25 to 30 Stability Under Heat and Pressure 11 to 18 1.3 This standard does not purport to address all of the safety concerns, if any, associated
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System UV15-7TK1ANV is a new one component, high viscosity, optically clear, tough UV curable polymer system with extended capability of -80°F to +300°F. It is fully reactive, does not contain any solvents or other volatiles and does not embrittle even upon exposure to low
- Coeff. of Thermal Expansion (CTE): 33 to 39 µin/in-F
- Composition: Single Component System
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Elongation: 2 to 6 %
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Features: Electrical Insulation / Dielectric
- Material Type: Grease / Paste
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Supplier: Aremco Products, Inc.
Description: Dielectric, moisture resistant, thermocouples
- Coeff. of Thermal Expansion (CTE): 4 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 250 kV/in
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Supplier: Aremco Products, Inc.
Description: Dielectric, high strength, heaters, sensors
- Coeff. of Thermal Expansion (CTE): 4.5 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 200 kV/in
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 7000C, Epoxy, Die Attach, Dielectric Adhesive LOCTITE ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination
- Coeff. of Thermal Expansion (CTE): 61.89 µin/in-F
- Features: Electrically Insulating / Dielectric
- Viscosity: 4100 cP
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Supplier: RS Components, Ltd.
Description: heat sinks and heat-generating electronic components such as CPUs, GPU chipsets or power components. High thermal conductivity,Silicon e and Zinc Oxide Free,Lowers the contact resistance between irregular surfaces,Extends the life of electronic components,High dielectric strength
- Material Type: Grease / Paste
- Thermal Conductivity: 1 W/m-K
- Use Temperature: -90.4 to 329 F
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Supplier: RS Components, Ltd.
Description: to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat-generating electronic components. Such as CPUs, GPU chipsets and power components. ,Use to improve the thermal interface between irregular and pitted surfaces. Silicone free,High dielectric
- Material Type: Grease / Paste
- Thermal Conductivity: 1.8 W/m-K
- Use Temperature: -90.4 to 329 F
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Supplier: RS Components, Ltd.
Description: to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat-generating electronic components. Such as CPUs, GPU chipsets and power components. ,Use to improve the thermal interface between irregular and pitted surfaces. Silicone free,High dielectric
- Material Type: Grease / Paste
- Thermal Conductivity: 1.8 W/m-K
- Use Temperature: -90.4 to 329 F
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Supplier: RS Components, Ltd.
Description: to improve the thermal interface contact conductivity between heat sinks, LEDs, motors, and heat-generating electronic components. Such as CPUs, GPU chipsets and power components. ,Use to improve the thermal interface between irregular and pitted surfaces. Silicone free,High dielectric
- Material Type: Grease / Paste
- Thermal Conductivity: 1.8 W/m-K
- Use Temperature: -90.4 to 329 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK QMI538NB, BMI Hybrid, Die Attach, Non-conductive Paste LOCTITE® ABLESTIK QMI538NB is a non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. Please refer to the TDS for alternate cure
- Coeff. of Thermal Expansion (CTE): 32.78 µin/in-F
- Features: Electrically Insulating / Dielectric
- Substrate / Material Compatibility: Plastic
- Viscosity: 8200 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates. Fast and low temperature cure Sag resistant paste Resilient Flexible
- Features: Electrically Insulating / Dielectric
- Viscosity: 150000 cP
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Supplier: Henkel Corporation - Industrial
Description: and low temperature cure Sag resistant paste Resilient Long pot life Flexible epoxy Excellent chemical and humidy resistance Non-conductive
- Features: Electrically Insulating / Dielectric
- Viscosity: 9500 cP
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Supplier: MacDermid Alpha Electronics Solutions
Description: conductivity and a wide temperature range through the use of silicone base oils. Its exceptional properties stem from the novel use of metal oxide (ceramic) powders, which are electrically insulative, preventing leakage currents if the paste contacts other parts of the assembly. As with all
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: the benefits of a non-silicone base oil. The exceptional properties of HTCP result from the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative, ensuring that leakage currents cannot form if the paste comes into contact with other parts of the
- Chemical / Polymer System Type: Silicone
- Features: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
- Material Type: Grease / Paste
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Supplier: Aremco Products, Inc.
Description: Aremco’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high thermal and
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Features: Electrically Conductive, Electrical Insulation / Dielectric
- Industry: Electronics
- Material Type: Grease / Paste
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20.56 to 83.89 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.51
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Supplier: Sauereisen, Inc.
Description: Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size and excellent flow characteristics make No. 2 a
- Composition: Unfilled
- Cure Type / Technology: Single Component System
- Dielectric Constant (Relative Permittivity): 107
- Dielectric Strength: 50.8 kV/in
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end assemblies
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
- Dielectric Strength: 400 to 610 kV/in
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Supplier: Aremco Products, Inc.
Description: Halogen lamps, max temp is 1560 °F in an oxidizing atmosphere
- Coeff. of Thermal Expansion (CTE): 2 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 500 kV/in
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.83
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 4.9
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires their
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20.56 to 98.33 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Features: Electrical Insulation / Dielectric
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 988/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic transparent medium hardness high flexibility (low-stress-adhesive ) rapid heat cure excellent primerless adhesion to many substrates
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Cure Type / Technology: Thermosetting / Crosslinking
- Dielectric Strength: 584 kV/in
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Supplier: Epoxies Etc...
Description: 50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 5 to 5.1
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Supplier: Epoxies Etc...
Description: 20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive electronic
- Chemical / Polymer System Type: Specialty / Other
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 5.5 to 5.8
- Dielectric Strength: 493 to 512 kV/in
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Supplier: Epoxies Etc...
Description: 20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Dielectric Constant (Relative Permittivity): 3.5
- Dielectric Strength: 420 kV/in
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Supplier: Sauereisen, Inc.
Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and
- Composition: Unfilled
- Cure Type / Technology: Single Component System
- Dielectric Constant (Relative Permittivity): 3.5 to 6
- Dielectric Strength: 1.3 to 50.8 kV/in
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Supplier: Master Bond, Inc.
Description: EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets
- Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulation / Dielectric
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resistance. Unlike conventional pastes or pads, it then chemically cures into a resilient solid, eliminating pump-out and providing permanent dielectric bonding between heatsink and processor. Key benefits include sustained low thermal resistance under continuous power and thermal cycling (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
pressure exceeds 10,000 PSI High-temperature use Low dielectric loss Mass spectrometer leakage test High chemical stability Welding process of ceramics and metals: Cleaning Paste Metallization (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
, followed by a heat cure of 150-200°F for 2-4 hours or longer is typically recommended. It is a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm at 75°F, and dielectric strength of 440 volts/mil at 75°F for a 1/8-inch test specimen (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
customized services. LTCC ceramic package shell LTCC (Low Temperature Co-fired Ceramic) is a multilayer ceramic substrate, the main components of which are alumina and glass, and high conductivity metals such as gold, silver, and copper are used as conductor pastes (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
pads are ceramic materials with outstanding properties such as high thermal conductivity and high electrical resistance. In addition, it features advantages such as high hardness, corrosion resistance, low dielectric constant and dielectric loss, and low CTE. Aluminum nitride (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Easypoxy® Epoxy Adhesives Two-component, industrial grade epoxies; supplied in convenient two-tube kits and bulk packages. Easypoxy® K-20 & K-22 General purpose, clear/black paste adhesive One of (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS North America LLC
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Indicates content that may require registration and/or purchase.
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Practice knowledge Mikrosystemtechnik
Dielectric pastes are after its field pastes for protection glazes, for conductor path crossings and much layer circuits as well as for capacitors.
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Over the influence of the specific area of dielectric powder substances on the electrical properties of siebgedruckter capacitors
As substrates, came A120,-Keramikplattchen with the dimensions 40 x 12,5 mms for insert on a base electrode had been burned before the printing with the dielectric paste .
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Electronic components
To the realization of protection glazes as well as conductor path crossovers (multiple layer circuits), dielectric pastes are available.
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Passive electronic components
The dielectric pastes with ferroelectric additives (" r are used .
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Sensor technique
Dielektrika: The main components of dielectric pastes are BaTiO3 (HDK pastes), TiO2 Mg-, Zn- or CaTiO3 (NDK pastes).
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Electronics for engineers and natural scientists
- The dielectric pastes on the base of glaziers become insulating pastes For application of Isoherschichten by multiple position circuits or by line crossings (amorphously or kristaUin) or the glass-ceramics use.
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Photograph All to know on Photo | Techniques of the Ingénieur
Silk-screen printing is used to spread... in the event of dielectric pasta because they are directly photo-imageables, (they contain elements...
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Handbook of Thick- and Thin-Film Hybrid Microelectronics Complete Document
The conductor layers are printed with DuPont 6160 silver metallization and the dielectric paste is DuPont’s QM 42.
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Advances in Manufacturing Technology
Test Method of Current Leakage for Dielectric Paste .
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Planar LTCC transformers for high voltage flyback converters: Part II.
The designs in that SAND report were all based on a ferrite tape/ dielectric paste system originally developed by NASCENTechnoloy, Inc, who collaborated in the design and manufacturing of the planar LTCC flyback converters.