Products & Services
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Supplier: Nordson EFD
Description: -cure & light-cure Adhesives The complete system includes the 741MD-SS needle dispense valve, ValveMate™ 8000 controller, fluid reservoir, and dispense tip. For even faster throughput, integrate with an EFD automated dispensing system. Also available, the
- Applications: Adhesive / Silicone, Lubricants
- Batch (Syringe): Yes
- Dispensing Application Type: Dot
- Number of Components: Single Component Dispensing
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Supplier: Protavic America, Inc.
Description: PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum
- Coeff. of Thermal Expansion (CTE): 35 to 147 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum adhesive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
- Substrate / Material Compatibility: Metal
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for
- Coeff. of Thermal Expansion (CTE): 22.22 to 55.56 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Flexible / Dampening, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed or pin transferred. It offers fast in-line cure at low temperature. One
- Coeff. of Thermal Expansion (CTE): 22.22 to 66.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Koford Engineering, LLC
Description: E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Electronics
- Substrate / Material Compatibility: Other
- Use Temperature: 257 to 392 F
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Supplier: Nordson EFD
Description: -back Diaphragm life exceeds 50 million cycles Compatible Fluids Brazing pastes Epoxies Greases Paste fluxes RTVs Sealants Solder resists The complete system includes the 725D Series valve, ValveMate™ 8000 controller, fluid reservoir, and dispense tip. Integrate with an EFD
- Applications: Adhesive / Silicone, Flux / Solder
- Continuous Feed: Yes
- Dispensing Application Type: Bead, Dot
- Number of Components: Single Component Dispensing
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Supplier: Cammda Corporation
Description: CAMMDA's Micro-Fluid Ratiometer™ is an economical precision metering system for two component epoxies and silicones, that offers smaller shot cup mixing without weighing or measuring. Lightweight and portable, it is ideal for maintenance shops and repair depots. The metering ratio is
- Dispensed From: Can / Pail / Drum
- Dispensing Application Type: Fill ("Potting")
- Mounting: Machine Mounted
- Type: Meter, Mix and Dispense
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Supplier: PVA - Precision Valve & Automation
Description: The FC100-1LT-1-S is a turnkey manual dispensing system typically used to dispense repeatable volumes of adhesives and epoxies. With an all stainless steel and Teflon construction this system can also be used to handle a wide variety of other fluid
- Dispensed From: Can / Pail / Drum
- Dispensing Application Type: Bead, Dot, Fill ("Potting")
- Mounting: Hand Held
- Type: Meter, Mix and Dispense
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly
- Coeff. of Thermal Expansion (CTE): 31.11 µin/in-F
- Cure Type / Technology: Single Component System
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Supplier: EXACT Dispensing Systems
Description: Available in both a standard shut off or snuffback model, the 400 Series Autovalve is used in combination with our line of Meter/Mix and Dispense systems for mixing plural component reactive materials. This would include adhesives, epoxies, urethanes, and silicones. Their
- Applications: Adhesive / Silicone, Other
- Valve Dispensing Technology: Positive Displacement Valve
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive DP420 is a toughened, off white, two-part epoxy. 2:1 mix ratio, 20 minute work life and handling strength in 2 hours. 3M™ Scotch-Weld™ EPX™ 200 mL applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP420 has medium viscosity that allows for
- Coeff. of Thermal Expansion (CTE): 85 to 147 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 690 kV/in
- Industry: Aerospace, OEM / Industrial
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Supplier: Epoxies Etc...
Description: 20-3005 is a two component chemical resistance epoxy system. It was developed for potting, coating, and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates and will cure at low temperatures. 20-3005 has a
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.61
- Elongation: 3.2 %
- Features: Encapsulating / Potting
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M™ Scotch-Weld™ EPX™ 200 mL applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP125 has medium viscosity that allows for
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 6.3
- Dielectric Strength: 680 to 765 kV/in
- Elongation: 120 to 150 %
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3629C, Epoxy, Surface mount adhesive LOCTITE® 3629C epoxy is formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed provide controlled dot size and shape, making it particularly suitable for high speed
- Cure Type / Technology: Single Component System
- Viscosity: 165000 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CE 3513, Epoxy, Assembly LOCTITE® ABLESTIK CE 3513 adhesive is designed for use in automated assembly and in-line curing operations. Electrically conductive One component Low viscosity No bleed Good dispense behavior Fast cure at high temperatures Long shelf
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 2.5 W/m-K
- Use Temperature: 302 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and
- Cure Type / Technology: Single Component System
- Viscosity: Up to 4000 cP
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive DP100 FR is a flame retardant, two-part epoxy. 1:1 mix ratio, 3-5 minute work life and handling strength in 20 minutes. 3M™ Scotch-Weld™ EPX™ 400 mL applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP100 FR meets UL94 V
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Flame Retardant (e.g. UL 94 Rated)
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Wood / Wood Product
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3621 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical
- Cure Type / Technology: Single Component System
- Dielectric Strength: 1016 kV/in
- Thermal Conductivity: 0.3000 W/m-K
- Viscosity: 500 to 3000 cP
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3621 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical
- Cure Type / Technology: Single Component System
- Dielectric Strength: 1016 kV/in
- Thermal Conductivity: 0.3000 W/m-K
- Viscosity: 500 to 3000 cP
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 24 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, glass, and transparent materials. It offers low viscosity, easy dispensing, optical clarity, and
- Cure Type / Technology: Two Component System
- Dielectric Strength: 419 kV/in
- Viscosity: 30 to 800 cP
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3609 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 0.4000 W/m-K
- Viscosity: 160 to 2000 cP
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F. This unique formulation offers high physical strength properties, good
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.5
- Dielectric Strength: 430 kV/in
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting
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Supplier: Foshan RTSTEC Automation Co., Ltd
Description: precised glue dispensing. Adhesive epoxy dispensing system,AB glue dispensing equipment,liquid dispenser robot is for easy programming with teaching pendant, it is applicable for various glue types as Silicon,AB adhesive,epoxy resin adhesive,
- Applications: Assembly, Dispensing (e.g., Gluing, Sealing, Filling)
- Drive System: Electric, Pneumatic
- Number of Axes: 3 #
- Robot System: Yes
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Strength: 440 kV/in
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Filled, Flexible / Dampening, Laminating / Composites, Non-corrosive Cure
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive DP190 is a gray, two-part epoxy. 1:1 mix ratio, 90 minute work life and handling strength in 12 hours. 3M™ Scotch-Weld™ EPX™ Plus II applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP190 has medium viscosity that allows for easy
- Coeff. of Thermal Expansion (CTE): 62 to 177 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 6.5
- Dielectric Strength: 830 kV/in
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Supplier: Nordson EFD
Description: cleaned without disassembly of the valve body Flush valve manifold – for cleaning the mixing nozzle with air or solvent Optional stainless steel valve – recommended for corrosive acrylics or epoxies Optional Polytuff, PTFE, Viton®*, and EP seals – for
- Applications: Adhesive / Silicone
- Dispense Rate: 7.58 to 11.36 L/min
- Number of Components: Multiple Component Dispensing
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Supplier: Nordson EFD
Description: cleaned without disassembly of the valve body Flush valve manifold – for cleaning the mixing nozzle with air or solvent Optional stainless steel valve – recommended for corrosive acrylics or epoxies Optional Polytuff, PTFE, Viton®*, and EP seals – for
- Applications: Adhesive / Silicone
- Number of Components: Multiple Component Dispensing
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.9
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material
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Supplier: Foshan RTSTEC Automation Co., Ltd
Description: precised glue dispensing. Adhesive epoxy dispensing system,AB glue dispensing equipment,liquid dispenser robot is for easy programming with teaching pendant, it is applicable for various glue types as Silicon,AB adhesive,epoxy resin adhesive,
- Applications: Assembly, Dispensing (e.g., Gluing, Sealing, Filling)
- Drive System: Electric, Pneumatic
- Number of Axes: 3 #
- Robot System: Yes
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Supplier: Cammda Corporation
Description: . Camm-Pakits™ are used to package epoxy, urethane and silicone systems in a wide range of viscosities for both industrial and consumer use. The Camm-Pakit™ is manufactured with a newly developed tri-laminate barrier film which is highly resistant to most epoxy systems. A
- Dispensed From: Other
- Dispensing Application Type: Fill ("Potting")
- Mounting: Hand Held
- Type: Dispense Only
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Supplier: Foshan RTSTEC Automation Co., Ltd
Description: , coating, sealing, filling, dripping, linear/arc/round coating, etc. in the product process.The Dispensing Systems has the capability to integrate the gluing system with XYZ movements for precised glue dispensing. Adhesive epoxy dispensing
- Applications: Assembly
- Drive System: Electric, Pneumatic
- Number of Axes: 3 #
- Robot System: Yes
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Supplier: RS Components, Ltd.
Description: hardening. At a storage or transport temperature below 10 °C, the product may contain small clots as a result of crystallisation, which impedes its use with dispensing systems. Upon heating to max. 50 °C, crystals dissolve again. ER 2183 RS stock no. 337-5919 â?? high thermal
- Use Temperature: -40 to 266 F
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Supplier: Techcon
Description: highest tolerances and manufactured to the strictest degree of precision insuring world class accuracy and repeatability in drop-to-drop dispensing volume. Jet Tech's compact size and modular design aids integration into robotic systems. The valve features fully adjustable parameter
- Applications: Adhesive / Silicone, Other
- Batch (Syringe): Yes
- Dispensing Application Type: Dot, Fill ("Potting")
- Media Viscosity: 7000 to 2.00E6 cps
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Supplier: FORREST Technical Coatings
Description: sells a rugged steel manual double-barrel caulking gun with an easy-grip handle and 1:1 or 2:1 dispensing capabilities. Electric and pneumatic caulking guns also available for order. Available in bulk as well as cartridges. Bulk epoxy adhesive is sold in quarts, gallons, 5
- Chemistry: Other
- Form: Cartridge
- Industry: Other
- Substrate / Surface: Asphalt, Concrete / Masonry, Wood
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Supplier: Techcon
Description: The TS5624 Disposable Diaphragm Valve features a “first to market” Disposable Material Path. Difficult fluids such as CA’s and pre-mixed 2-part epoxies, can now be dispensed without the need of frequent cleaning, by simply replacing the entire wetted area in a matter of
- Batch (Syringe): Yes
- Dispensing Application Type: Bead, Dot
- Media Viscosity: 1 to 50000 cps
- Valve Dispensing Technology: Diaphragm Valve
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Supplier: Techsil Limited
Description: TB2273D from ThreeBond is a thixotropic single component epoxy resin adhesive that has high temperature curing capabilities suitable for instant induction curing with HF-coils. After curing the hardened material has excellent electrical and mechanical properties such as good chemical
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Dymax
Description: Dymax 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or
- Cure Type / Technology: UV / Radiation Cured (EB, Light), Single Component System
- Dissimilar Substrates: Yes
- Industry: Other
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Other
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Supplier: RS Components, Ltd.
Description: Static mixing nozzles for use with structural adhesive cartridge systems in adhesive dispensing guns (also known as caulking guns). These static mixing nozzles are designed with a helical mixing baffle, which ensures full mixing. The ends of the mixers can be cut back to
- Media: Adhesives / Resins
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Supplier: RS Components, Ltd.
Description: Static mixing nozzles for use with structural adhesive cartridge systems in adhesive dispensing guns (also known as caulking guns). These static mixing nozzles are designed with a helical mixing baffle, which ensures full mixing. The ends of the mixers can be cut back to
- Media: Adhesives / Resins
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Supplier: RS Components, Ltd.
Description: Static mixing nozzles for use with structural adhesive cartridge systems in adhesive dispensing guns (also known as caulking guns). These static mixing nozzles are designed with a helical mixing baffle, which ensures full mixing. The ends of the mixers can be cut back to
- Media: Adhesives / Resins
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) syringes and cartridges; a blending of two component systems precisely weighed, mixed, degassed, then flash frozen and shipped over night on dry ice. Available for epoxies, silicones, urethanes and polysulfides. PMF syringes come in sizes 55cc and smaller. A -40C freezer necessary for storage. Simply thaw and dispense. (read more)
Browse Industrial Adhesives Datasheets for Ellsworth Adhesives -
“The system’s chemical resistance was successfully tested in chemicals such as 98% sulfuric acid, 25% hydrochloric acid, 20% phosphoric acid, and 15% nitric acid, by soaking cured samples for more than 12 months”, says Senior Product Engineer Rohit Ramnath. “The product (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
YOUR PARTNER FOR CUSTOM PACKAGING KitPackers is a premier packager of one and two component industrial chemicals including adhesives, sealants, coatings, encapsulants, lubricants, greases, cleaners, primers, and a variety of other specialty chemicals. We specialize in (read more)
Browse Packaging Containers Datasheets for Ellsworth Adhesives
Conduct Research Top
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Pressure Control for Adhesive Materials
Robot dispensing of adhesive materials such as epoxies and resins pose pressure control problems that cannot be solved using conventional pressure transducers. The high viscosity of the dispensed material clogs up the conventional transducer pressure port and plumbing. The requirement
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Tech Tip 16 - Understanding & Preventing Epoxy Resin Bleed
Epoxy resin separation ("resin bleed or bleed out") is a phenomenon that can take place when working with filled, adhesive systems dispensed onto various surfaces/substrates. It is often described as a clear, colorless or amber organic stain, surrounding the die attach epoxy; appearing as a shadow
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
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Material & Material Properties: Which Requirements Does the Material Place on the Technology?
The number of adhesives, sealants and casting compounds that can be dispensed is constantly growing. The use of epoxy, polyurethane, silicone or other material types in a process depends on the requirements of the end product. Factors such as viscosity and filler concentration, as well as curing
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Handbook of Adhesion Technology
For medium to large adhesive applications, metering and mixing dispense systems are used for applying adhesives like epoxy , polyurethane, polyester, or silicone formulations.
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Attain Consistent Syringe Dispensing With Micro-Dot
DYMAX Corporation is a leading technology-based company specializing in the formulation, manufacture, and service of advanced assembly adhesives , coatings, epoxies , masking resins, fluid dispensing systems , and light-curing systems.
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MOEMS: packaging and testing
An adhesive bonding system was integrated on the optical workstation to facilitate epoxy dispensing and curing on the miniaturized objective.
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Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping
The reason for using adhesive film is to avoid problems of a poor epoxy paste dispensing system that may result in excessive bleed out, die tilt, inconsistent bond line thickness (BLT), and coverage which directly affect package reliability [1], [3].
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LOCTITE products - Grainger Industrial Supply
These solutions come from the broadest line of technologies available anywhere from a single source, including acrylics, anaerobics, cyanoacrylates, elastomers, epoxies , hot melts, light cure adhesives , silicones, urethanes and related dispensing systems .
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Precision Dispensing System
Molded of polypropylene, this high-end system ensures compatibility with a wider range of dispensing applications including adhesives , sealants, epoxies and coatings.
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P‐64: Influence of Laser Sealing Process on Frit Hermetical Performance
The sintered cap glass is adhered to evaporated EL glass in vacuum alignment system with the assistance of UV epoxy sealant which is dispensed on the cap glass after sintering process.
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Handbook of Adhesives and Sealants, Second Edition > EPOXY, POLYURETHANE, ACRYLIC, AND CYAIMOACRYLATE ADHESIVES
One-component epoxy adhesives are advantageous when it is necessary to eliminate measuring or mixing errors or when dispensing equipment cannot handle multicomponent systems .
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Epoxy Packaging In Dual Or Pre-Mixed/Frozen Syringes From Adhesive Packaging Specialties - Well Suited For Small Applications
APS' packaging for reactive adhesives , sealants or resins in small two-part epoxy delivery systems requires only a minimal amount of material to be dispensed at one time .
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Microwave New Products [New Products]
Adhesive Packaging Specialties, Inc. offers packaging for reactive adhe- sives , sealants, or resins in small, two-part epoxy delivery systems , requiring only a minimal amount of material to be dispensed at one time.