Products & Services
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Supplier: PVA - Precision Valve & Automation
Description: The FC100-1LT-1-S is a turnkey manual dispensing system typically used to dispense repeatable volumes of adhesives and epoxies. With an all stainless steel and Teflon construction this system can also be used to handle a wide variety of other fluid chemistries. The FC100,
- Application: Adhesive / Silicone
- Dispensing Type: Bead, Dot, Fill ("Potting")
- Dispensed From: Can / Pail / Drum
- Mounting: Hand Held
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Supplier: Allied Electronics, Inc.
Description: Quik Stick Adhesive, Bisphenol-A Type Epoxy Resin, 1.19 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak
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Supplier: Allied Electronics, Inc.
Description: Quik Stick Adhesive, Bisphenol-A Type Epoxy Resin, 1.19 Specific Gravity The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak
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Supplier: Allied Electronics, Inc.
Description: electronic components is a factor. 3M™ Scotch-Weld™ epoxy adhesive DP190 gray is a 1:1 by volume mix ratio of 3M™ Scotch-Weld™ epoxy adhesive 2216 B⁄A gray and exhibits good peel, shear and environmental aging properties.
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Supplier: Koford Engineering, LLC
Description: E-109 is a high performance silica filled single component adhesive which cure in 5 minutes or less withexcellent shear strength in combination with use temperature of 200°C. Has very low outgassing during curemaking it especially suitable for use in switches, sensors and other electronic
- Use Temperature: 257 to 392 F
- Industry: Electronics
- Chemical System: Epoxy (EP)
- Features: Grease / Paste, Other
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Supplier: Allied Electronics, Inc.
Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive DP125 is a flexible, gray, two-part epoxy. 1:1 mix ratio, 25 minute work life and handling strength in 2.5 hours. 3M™ Scotch-Weld™ EPX™ 200 mL applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP125 has medium viscosity that allows for
- Viscosity: 2,000 to 75,000 cP
- Thermal Conductivity: 0.1505739276 to 0.1540353972 W/m-K
- Tensile Strength (Break): 2,500 to 3,300 psi
- Elongation: 120 to 150 %
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Supplier: Protavic America, Inc.
Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows minimum adhesive
- Viscosity: 8,500 cP
- Thermal Conductivity: 9.23 W/m-K
- Features: Die Bonding Adhesive / Compound, Electrically Conductive, Filled, Liquid, Thermal / Heat Conductive
- Industry: Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3621 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical
- Viscosity: 500 to 3,000 cP
- Thermal Conductivity: 0.3 W/m-K
- Dielectric Strength: 1,016.0000000000022 kV/in
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3621 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical
- Viscosity: 500 to 3,000 cP
- Thermal Conductivity: 0.3 W/m-K
- Dielectric Strength: 1,016.0000000000022 kV/in
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 3609 is a heat curing epoxy adhesive designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. It is suited for applications where medium to high dispense speeds, high dot profile, high wet strength, and good electrical
- Viscosity: 160 to 2,000 cP
- Thermal Conductivity: 0.4 W/m-K
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Epoxies Etc...
Description: 20-3005 is a two component chemical resistance epoxy system. It was developed for potting, coating, and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates and will cure at low temperatures. 20-3005 has a
- Viscosity: 20,000 cP
- Use Temperature: -58 to 284 F
- Tensile Strength (Break): 7,600 psi
- Elongation: 3.2 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 24 Clear, formerly Emerson and Cuming ECCOBOND, is a two component, room temperature curing, epoxy adhesive that is used for bonding plastics, metal, glass, and transparent materials. It offers low viscosity, easy dispensing, optical clarity, and
- Viscosity: 30 to 800 cP
- Dielectric Strength: 419.1000000000009 kV/in
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Nordson EFD
Description: calibration feature provides the ability to maintain exact deposit size when dispensing fluid. The stainless steel shutoff needle seats in the hub of the dispensing tip rather than the valve body. Having fluid cutoff occur as close as possible to the dispensing orifice minimizes
- Application: Adhesive / Silicone, Lubricants
- Dispensed From: Barrel / Syringe
- Material Feed: Batch (Syringe)
- Dispensing Equipment Type: Dispense Only
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Supplier: Foshan RTSTEC Automation Co., Ltd
Description: glue dispensing. Adhesive epoxy dispensing system,AB glue dispensing equipment,liquid dispenser robot is for easy programming with teaching pendant, it is applicable for various glue types as Silicon,AB adhesive,epoxy resin adhesive, hot
- Number of Axes: 3 #
- X-axis Travel: 500.00000000000006 mm
- Y-axis Travel: 500.00000000000006 mm
- Z-axis Travel: 100 mm
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Supplier: Cammda Corporation
Description: CAMMDA's Micro-Fluid Ratiometer™ is an economical precision metering system for two component epoxies and silicones, that offers smaller shot cup mixing without weighing or measuring. Lightweight and portable, it is ideal for maintenance shops and repair depots. The metering ratio is
- Application: Adhesive / Silicone
- Dispensed From: Can / Pail / Drum
- Dispensing Type: Fill ("Potting")
- Mounting: Machine Mounted
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Supplier: EXACT Dispensing Systems
Description: Available in both a standard shut off or snuffback model, the 400 Series Autovalve is used in combination with our line of Meter/Mix and Dispense systems for mixing plural component reactive materials. This would include adhesives, epoxies, urethanes, and silicones. Their unique design
- Application: Adhesive / Silicone
- Features: Other
- Valve Dispensing Technology: Positive Displacement Valve
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Supplier: Nordson EFD
Description: pastes Epoxies Greases Paste fluxes RTVs Sealants Solder resists The complete system includes the 725D Series valve, ValveMate™ 8000 controller, fluid reservoir, and dispense tip. Integrate with an EFD automated dispensing system for even faster throughput.
- Application: Adhesive / Silicone, Flux / Solder
- Dispensing Application: Bead, Dot
- Material Feed: Continuous Feed
- Valve Dispensing Technology: Positive Displacement Valve
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 8380, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8380 electrically conductive adhesive is designed for advanced, high volume, reel-to-reel smart card applications. This adhesive is specially formulated to increase assembly
- Coeff. of Thermal Expansion (CTE): 31.11111111111111 µin/in-F
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfill applications featuring rapid curing at temperatures as low as 220-250°F. This unique formulation offers high physical strength properties, good
- Viscosity: 1,000 to 1,500 cP
- Use Temperature: -80 to 300 F
- Tensile Strength (Break): 5,000 psi
- Dielectric Strength: 430.00000000000006 kV/in
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3629C, Epoxy, Surface mount adhesive LOCTITE® 3629C epoxy is formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering. It is designed provide controlled dot size and shape, making it particularly suitable for high speed
- Viscosity: 165,000 cP
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package
- Coeff. of Thermal Expansion (CTE): 30 µin/in-F
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CE 3513, Epoxy, Assembly LOCTITE® ABLESTIK CE 3513 adhesive is designed for use in automated assembly and in-line curing operations. Electrically conductive One component Low viscosity No bleed Good dispense behavior Fast cure at high temperatures Long shelf life at
- Viscosity: 45,000 cP
- Use Temperature: 302 F
- Thermal Conductivity: 2.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 µin/in-F
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive DP190 is a gray, two-part epoxy. 1:1 mix ratio, 90 minute work life and handling strength in 12 hours. 3M™ Scotch-Weld™ EPX™ Plus II applicator. 3M™ Scotch-Weld™ Epoxy Adhesive DP190 has medium viscosity that allows for easy
- Viscosity: 40,000 to 150,000 cP
- Thermal Conductivity: 0.380761656 W/m-K
- Coeff. of Thermal Expansion (CTE): 61.99999999999999 to 177 µin/in-F
- Tensile Strength (Break): 3,500 psi
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Supplier: Foshan RTSTEC Automation Co., Ltd
Description: glue dispensing. Adhesive epoxy dispensing system,AB glue dispensing equipment,liquid dispenser robot is for easy programming with teaching pendant, it is applicable for various glue types as Silicon,AB adhesive,epoxy resin adhesive, hot
- Number of Axes: 3 #
- X-axis Travel: 500.00000000000006 mm
- Y-axis Travel: 500.00000000000006 mm
- Z-axis Travel: 100 mm
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Supplier: Foshan RTSTEC Automation Co., Ltd
Description: filling, dripping, linear/arc/round coating, etc. in the product process.The Dispensing Systems has the capability to integrate the gluing system with XYZ movements for precised glue dispensing. Adhesive epoxy dispensing system, AB glue
- Number of Axes: 3 #
- X-axis Travel: 500.00000000000006 mm
- Y-axis Travel: 500.00000000000006 mm
- Z-axis Travel: 100 mm
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C,
- Viscosity: 60,000 to 70,000 cP
- Use Temperature: -60 to 400 F
- Tensile Strength (Break): 7,500 psi
- Dielectric Constant (Relative Permittivity): 3.9
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below
- Viscosity: 60,000 to 70,000 cP
- Use Temperature: -60 to 400 F
- Tensile Strength (Break): 7,500 psi
- Dielectric Constant (Relative Permittivity): 3.9
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP30P is a two component, transparent, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a
- Viscosity: 2,500 cP
- Use Temperature: -60 to 250 F
- Dielectric Strength: 440 kV/in
- Index of Refraction: 1.56
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Supplier: FORREST Technical Coatings
Description: Adhesive passes WSDOT Spec 9-26.2. USE CASES FOR FIRMMARKER® EPOXY ADHESIVE Affixing traffic markers Bonding concrete to concrete Bonding wood to concrete Bonding concrete to asphalt BENEFITS OF FIRMMARKER® EPOXY ADHESIVE Cartridge mixes and dispenses at time of
- Substrate: Asphalt, Concrete / Masonry, Wood
- Form: Cartridge
- Features: Coating, Other
- Location / Orientation: Exterior, Pavement / Walkway
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Supplier: Techsil Limited
Description: TB2273D from ThreeBond is a thixotropic single component epoxy resin adhesive that has high temperature curing capabilities suitable for instant induction curing with HF-coils. After curing the hardened material has excellent electrical and mechanical properties such as good chemical
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Nordson EFD
Description: Experience a new level of accuracy, consistency, and process control when dispensing fluids that change viscosity with Nordson EFD’s Ultimus™ V High Precision Dispenser. Ideal for applications that involve two-part epoxies, UV-cure adhesives, and other fluids that thicken over time or
- Application: Adhesive / Silicone
- Dispensed From: Barrel / Syringe
- Dispensing Equipment Type: Dispense Only
- Dispensing Type: Dot
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Supplier: Cammda Corporation
Description: package epoxy, urethane and silicone systems in a wide range of viscosities for both industrial and consumer use. The Camm-Pakit™ is manufactured with a newly developed tri-laminate barrier film which is highly resistant to most epoxy systems. A burstable membrane seal is
- Application: Adhesive / Silicone
- Dispensing Equipment Type: Dispense Only
- Dispensing Type: Fill ("Potting")
- Mounting: Hand Held
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Supplier: Nordson EFD
Description: eliminates pressure buildup in the lines, preventing off-ratio dispensing. The valve also incorporates a snuff-back feature that minimizes or eliminates the possibility of material dripping or stringing when the valve shuts off. Series 450 XT Snuff Back Valve In response to consumer demand,
- Application: Adhesive / Silicone
- Number of Components: Multiple Component Dispensing
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Supplier: Techcon
Description: VFKIT will be required to make the connection. Dispensing Tips: For the complete dispensing tip offering please contact us Disposable material path – no cleaning Compact size and weight Excellent moisture sensitive resistance No special tools required Low cost of ownership Accurate and
- Media Viscosity: 1 to 50,000 cps
- Material Feed: Batch (Syringe)
- Dispensing Application: Bead, Dot
- Valve Dispensing Technology: Diaphragm Valve
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Featured Products Top
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) syringes and cartridges; a blending of two component systems precisely weighed, mixed, degassed, then flash frozen and shipped over night on dry ice. Available for epoxies, silicones, urethanes and polysulfides. PMF syringes come in sizes 55cc and smaller. A -40C freezer necessary for storage. Simply thaw and dispense. (read more)
Browse Industrial Adhesives Datasheets for Ellsworth Adhesives -
“The system’s chemical resistance was successfully tested in chemicals such as 98% sulfuric acid, 25% hydrochloric acid, 20% phosphoric acid, and 15% nitric acid, by soaking cured samples for more than 12 months”, says Senior Product Engineer Rohit Ramnath. “The product (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
YOUR PARTNER FOR CUSTOM PACKAGING KitPackers is a premier packager of one and two component industrial chemicals including adhesives, sealants, coatings, encapsulants, lubricants, greases, cleaners, primers, and a variety of other specialty chemicals. We specialize in (read more)
Browse Packaging Containers Datasheets for Ellsworth Adhesives
Conduct Research Top
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Pressure Control for Adhesive Materials
Robot dispensing of adhesive materials such as epoxies and resins pose pressure control problems that cannot be solved using conventional pressure transducers. The high viscosity of the dispensed material clogs up the conventional transducer pressure port and plumbing. The requirement
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Tech Tip 16 - Understanding & Preventing Epoxy Resin Bleed
Epoxy resin separation ("resin bleed or bleed out") is a phenomenon that can take place when working with filled, adhesive systems dispensed onto various surfaces/substrates. It is often described as a clear, colorless or amber organic stain, surrounding the die attach epoxy; appearing as a shadow
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
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Material & Material Properties: Which Requirements Does the Material Place on the Technology?
The number of adhesives, sealants and casting compounds that can be dispensed is constantly growing. The use of epoxy, polyurethane, silicone or other material types in a process depends on the requirements of the end product. Factors such as viscosity and filler concentration, as well as curing
More Information Top
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Handbook of Adhesion Technology
For medium to large adhesive applications, metering and mixing dispense systems are used for applying adhesives like epoxy , polyurethane, polyester, or silicone formulations.
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Attain Consistent Syringe Dispensing With Micro-Dot
DYMAX Corporation is a leading technology-based company specializing in the formulation, manufacture, and service of advanced assembly adhesives , coatings, epoxies , masking resins, fluid dispensing systems , and light-curing systems.
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MOEMS: packaging and testing
An adhesive bonding system was integrated on the optical workstation to facilitate epoxy dispensing and curing on the miniaturized objective.
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Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping
The reason for using adhesive film is to avoid problems of a poor epoxy paste dispensing system that may result in excessive bleed out, die tilt, inconsistent bond line thickness (BLT), and coverage which directly affect package reliability [1], [3].
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LOCTITE products - Grainger Industrial Supply
These solutions come from the broadest line of technologies available anywhere from a single source, including acrylics, anaerobics, cyanoacrylates, elastomers, epoxies , hot melts, light cure adhesives , silicones, urethanes and related dispensing systems .
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Precision Dispensing System
Molded of polypropylene, this high-end system ensures compatibility with a wider range of dispensing applications including adhesives , sealants, epoxies and coatings.
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P‐64: Influence of Laser Sealing Process on Frit Hermetical Performance
The sintered cap glass is adhered to evaporated EL glass in vacuum alignment system with the assistance of UV epoxy sealant which is dispensed on the cap glass after sintering process.
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Handbook of Adhesives and Sealants, Second Edition > EPOXY, POLYURETHANE, ACRYLIC, AND CYAIMOACRYLATE ADHESIVES
One-component epoxy adhesives are advantageous when it is necessary to eliminate measuring or mixing errors or when dispensing equipment cannot handle multicomponent systems .
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Epoxy Packaging In Dual Or Pre-Mixed/Frozen Syringes From Adhesive Packaging Specialties - Well Suited For Small Applications
APS' packaging for reactive adhesives , sealants or resins in small two-part epoxy delivery systems requires only a minimal amount of material to be dispensed at one time .
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Microwave New Products [New Products]
Adhesive Packaging Specialties, Inc. offers packaging for reactive adhe- sives , sealants, or resins in small, two-part epoxy delivery systems , requiring only a minimal amount of material to be dispensed at one time.