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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2741, Epoxy, Encapsulant LOCTITE® STYCAST 2741 is designed for electronic embedment and in sealing or cementing of metals, ceramics and plastics. The hardness can be adjusted by varying the amount of LOCTITE CAT 15 used. The technical information shown on this
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 0.3500 W/m-K
- Use Temperature: 67 to 176 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.56 µin/in-F
- Viscosity: 3300 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Viscosity: 25000 cP
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Supplier: Protavic America, Inc.
Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: Epoxies Etc...
Description: 20-3200 is an all purpose, very low viscosity potting, casting, and encapsulating resin system. Its low viscosity is ideal for applications requiring maximum flow around and under components.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in
- Coeff. of Thermal Expansion (CTE): 31.67 µin/in-F
- Viscosity: 6700 cP
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow. It is used for the encapsulation of bare chips mounted to plastic substrates and potting of
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Accuris
Description: STANDARD SPECIFICATION FOR IMPLANTABLE EPOXY ELECTRONIC ENCAPSULANTS
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1385 Epoxy Encapsulant Black is a two component electronic grade epoxy encapsulant. It is used for small or medium castings and formulated for applications requiring resistance to E-85 type fuels. It also benefits from good resistance to water, acids and
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Elongation: 2 %
- Form / Function: Encapsulant / Potting Compound
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Description: The reusable epoxy primer is designed for CSP and BGA applications. It can be cured quickly at moderate temperatures to reduce the pressure on other parts. After curing, the material has excellent mechanical properties and can protect solder joints during thermal cycling.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: One-component epoxy resin adhesive is a filling resin that can be reused in CSP (FBGA) or BGA. It cures quickly as soon as it is heated. It is designed to provide good protection to prevent failure due to mechanical stress. Low viscosity allows filling gaps under CSP or BGA.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Protavic America, Inc.
Description: Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities.Passes NASA outgassing requirements.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Description: The reusable underfill is specially designed for CSP, WLCSP and BGA applications. Its formula is to cure quickly at moderate temperatures to reduce stress on other parts. The material has a higher glass transition temperature and higher fracture toughness, and can provide good protection for solder
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Specialty / Other
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: ResinLab EP691 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 410 kV/in
- Elongation: 4 to 9 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2741 Black, formerly Emerson and Cuming, is a two component, room temperature or heat curing, filled epoxy encapsulant that is used for cementing, sealing, and embedding electronic components, plastics, metal, and ceramics. It offers flexibility and crack
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 406 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: ResinLab EP965 Black is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 410 kV/in
- Elongation: 5 %
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Encapsulants and Potting Compounds - MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009Supplier: Techsil Limited
Description: MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is required. It
- Industry: Electronics
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.94E7 to 2.22E7 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: ASTM International
Description: biocompatibility for such implantable encapsulants. 1.3 The encapsulants covered by this specification are for use in devices intended as long-term implants. 1.4 Limitations- This specification covers only the initial qualification of epoxy encapsulants for implantable
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Supplier: Electro-Lite Corporation
Description: ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: ESD Control / Anti-static
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 2.4
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Supplier: MacDermid Alpha Electronics Solutions
Description: A one-component epoxy system designed to encapsulate the chip component to protect the device and strengthen the solder joints. Product Overview ALPHA HiTech EN21-4210F has a high hardness property, making it ideal for assembling components that require excellent reinforcement
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: ELANTAS North America LLC
Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 25 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
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Supplier: Epoxies Etc...
Description: 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Strength: 600 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulanting / Potting
- Industry: Electronics, OEM / Industrial, Other
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Supplier: Epoxy Technology
Description: EPO-TEK® UV Epoxies are your alternative to traditional oven cured optical products. They are fast curing and photo curable. These UV cure adhesives simplify the handling process by using a single component system. Our adhesives require no mixing, cure in seconds or minutes, and have an
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.78 to 94.44 µin/in-F
- Features: Encapsulanting / Potting
- Index of Refraction: 1.57 to 1.58
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Supplier: R. S. Hughes Company, Inc.
Description: Loctite 3364 black potting & encapsulating compound is compatible with electronics materials with a 60 min cure time. Provides a 45 sec working time. Works in a mix ratio of 1:2. Delivers great performance with a shear strength of 1100 (Wood Pine) psi, 145 (Nylon) psi, 145 (Polycarbonate) psi
- Dielectric Strength: 813 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.4300 W/m-K
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Supplier: Epoxies Etc...
Description: 20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.61
- Elongation: 3.2 %
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Supplier: Electro-Lite Corporation
Description: ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 31.11 µin/in-F
- Dielectric Strength: 450 kV/in
- Features: Encapsulanting / Potting
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Supplier: Hernon Manufacturing, Inc.
Description: Tuffbond® 318 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 318 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 318 is also
- Chemical / Polymer System Type: Ceramic / Inorganic Cement, Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Featured Products Top
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Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Key properties of this B staged epoxy are that it passes the twelve second vertical burn per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F, and toxic gas emmission per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue F. Product Advantages (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
packed electronic assemblies. The epoxy maintains a Shore D hardness of 75-85, offers excellent damp heat resistance and has a good physical strength profile. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Master Bond EP30LP-2 is an optically clear epoxy with superb light transmission properties. This low viscosity, electrical insulator also features outstanding dimensional stability. Featuring easy handling, this compound has a convenient two to one mix ratio by weight or (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.
(read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion.
(read more)
Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions -
Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
and premature failure such as vibration, shock, and stress caused by temperature fluctuation during thermal cycling. Material options for electronic protection include silicones, epoxies, polyurethanes, and other various polymers. Silicones are extremely durable and feature important and (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Potting Materials for Electronic Applications ELANTAS offers a broad range of potting and encapsulation materials for electronic protection (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
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Common Applications for Electronic Epoxy Encapsulant Potting Compounds
Electronic epoxy encapsulant potting compounds are materials used to protect electronic components from environmental factors such as moisture, dust, and temperature changes. These compounds are essential in the electronics industry as they help to improve the durability and reliability
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Electronic Epoxy Encapsulant Potting Compounds in Harsh Environments
Electronic epoxy encapsulant potting compounds are essential for protecting electronic components from harsh environments. These compounds provide a protective barrier that shields electronics from moisture, dust, and other contaminants that can cause damage or failure. In this article, we
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The Benefits And Applications Of Underfill Epoxy Encapsulants In Electronics
Underfill epoxy has become an essential component in ensuring the reliability and durability of electronic devices. This adhesive material is used to fill the gap between a microchip and its substrate, preventing mechanical stress and damage, and protecting against moisture and environmental
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Is Epoxy Stronger than Adhesive?
Epoxy is a term that covers a wide range of thermosetting polymer materials used in a wide range of industries today. They are adhesives, coatings, primers, sealants, and encapsulants with superior mechanical, electrical, and thermal properties. Epoxy products are typically two-part systems
More Information Top
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
380 Epoxy Encapsulants , Adhesives and Potting Compounds for Micro electronics , Military and Medical Applications . . .
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http://www.polysciences.com/SiteData/docs/2012_E-Che/4d5aec85b046969b/2012_E-Chem_unpriced.pdf
High Performance Encapsulants and Adhesives • Epoxy Encapsulants , Adhesives and Potting Compounds for Micro electronics , Military and Medical Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Thermosetting and thermoplastic bisphenol A epoxy/phenoxy resin as encapsulant material
Polymer materials have found extensive applications as encapsulants in micro electronics packaging industry, especially the epoxy resin systems for die attach adhesive, glob top, and underfill etc.
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Development of reworkable underfill from hybrid composite of free radical polymerization system and epoxy resin
The most common chemistry for encapsulants in micro- electronics packaging has been based on thermosetting epoxy curing systems.
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Adhesion/reliability/reworkability study on underfill material from free radical polymerization system and its hybrid composite with epoxy resin
The most common chemistry for encapsulants in micro electronics packaging has been based on thermosetting epoxy systems.
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Application of Py-GC/MS in electronic packaging industry for monitoring curing processes of EMCs
This is the reason why most of the encapsulants and underfills used in the electronics packaging industry are epoxy -based.
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Handbook of PLASTIC AND RUBBER ADDITIVES Volume 1 and 2
Uses: Monomer for polymer systems incl. polyolefins, epoxies , polyesters, PVC, adhesives, coatings, electronics , encapsulants , inks, PU foams, rubber, plastics .
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Handbook of Adhesive Chemical and Compounding Ingredients
Uses: Monomer for polymer systems incl. polyolefins, epoxies , polyes- ters, PVC, adhesives, coatings, electronics , encapsulants , inks, PU foams, rubber, plastics .
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Polymer cure modeling for microelectronics applications
Thermally cured epoxies and other polymers are extensively used in electronics packaging, as encapsulants , underfills, and adhesives, etc.
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Thermo-mechanical properties of epoxy formulations with low glass transition temperatures
In micro electronics industry, epoxy is widely used as molding compounds, underfill encapsulants , and coatings for the protection of integrated circuits from adverse environmental and operational effects of oxygen, moisture, temperature, electrical,current leakage, salt spray, radiation, solvents, chemical, microorganism, mechanical shock …