Epoxy Electronics Encapsulants

Description: STANDARD SPECIFICATION FOR IMPLANTABLE EPOXY ELECTRONIC ENCAPSULANTS

Description: Standard Specification for Implantable Epoxy Electronic Encapsulants

Description: This specification covers thermoset plastics based on diglycidyl ethers of bisphenol A and amino functional curing agents or amine catalysts for implantable epoxy electronic encapsulants. Encapsulants shall be classified depending on contact with tissues or physiological

Description: STANDARD SPECIFICATION FOR IMPLANTABLE EPOXY ELECTRONIC ENCAPSULANTS - INCLUDES STANDARD + REDLINE (PDF)

Description: LOCTITE STYCAST ES 4322FC liquid epoxy encapsulant is for protection of semiconductor devices. It is a high flow material which requires a cavity flow control barrier to prevent excessive flow. It is used for the encapsulation of bare chips mounted to plastic substrates and potting of

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: 20-3200 is an all purpose, very low viscosity potting, casting, and encapsulating resin system. Its low viscosity is ideal for applications requiring maximum flow around and under components.

• Use Temperature: -67 to 338 F
• Thermal Conductivity: 0.49037486 W/m-K
• Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F
• Tensile Strength (Break): 10,500 psi

Description: ResinLab EP1385 Epoxy Encapsulant Black is a two component electronic grade epoxy encapsulant. It is used for small or medium castings and formulated for applications requiring resistance to E-85 type fuels. It also benefits from good resistance to water, acids and

• Elongation: 2 %
• Tensile Strength (Break): 7,500 psi
• Viscosity: 5,000 cP
• Features: Encapsulant / Potting Compound

Description: ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation properties in extreme conditions. Highly filled providing low

• Thermal Conductivity: 0.73 W/m-K
• Elongation: 10 to 15 %
• Tensile Strength (Break): 2,500 psi
• Dielectric Strength: 425.00000000000006 kV/in

Description: ResinLab EP1350 Black is a two component, low viscosity, high performing epoxy encapsulant designed for electronic potting and encapsulating. Features a very high Tg, low CTE, and superior electrical insulation properties in extreme conditions. Highly filled providing low

• Thermal Conductivity: 0.73 W/m-K
• Elongation: 10 to 15 %
• Tensile Strength (Break): 2,500 psi
• Dielectric Strength: 425.00000000000006 kV/in

Description: Henkel Loctite STYCAST 2741 Black, formerly Emerson and Cuming, is a two component, room temperature or heat curing, filled epoxy encapsulant that is used for cementing, sealing, and embedding electronic components, plastics, metal, and ceramics. It offers flexibility and crack

• Viscosity: 20,000 to 40,000 cP
• Thermal Conductivity: 0.33 W/m-K
• Dielectric Strength: 406.40000000000083 kV/in
• Features: Ceramic / Glass, Encapsulating / Potting Compound, Metal, Plastic

Description: Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.

• Viscosity: 30,000 to 50,000 cP
• Use Temperature: -76 to 194 F
• Coeff. of Thermal Expansion (CTE): 19,444,444.444444444 to 22,222,222.22222222 µin/in-F
• Tensile Strength (Break): 2,600 to 2,800 psi

Description: LOCTITE STYCAST 2850KT CAT 24LV EPOXY ENCAPSULANT THERMAL EPOXY, 2 PART (ORDER CATALYST SEPARATELY) 3 LB CONTAINER

Description: LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant LOCTITE® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize

• Coeff. of Thermal Expansion (CTE): 33.55555555555556 µin/in-F
• Viscosity: 3,300 cP
• Chemical System: Epoxy (EP)

Description: DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy

• Viscosity: 32,500 to 50,000 cP
• Features: Electronics, Encapsulating / Potting, Specialty / Other
• Chemical System: Epoxy (EP)
• Industry: Semiconductors / IC Packaging

Description: (Known as ABLESTIK ABLEBOND 933-1 moisture resistant chip encapsulant ) LOCTITE ECCOBOND 933 one component epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimized stress effects on components and wiring during

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound

Description: 20-3050 is a heat cure, 100% solids, high performance epoxy system. 20-3050 is a filled system resulting in excellent dimensional stability and extremely low shrinkage. This product has excellent electrical insulation properties.

• Viscosity: 2,893 to 18,553 cP
• Type: Electrical Insulation / Dielectric
• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound, Liquid

Description: The reusable epoxy primer is designed for CSP and BGA applications. It can be cured quickly at moderate temperatures to reduce the pressure on other parts. After curing, the material has excellent mechanical properties and can protect solder joints during thermal cycling.

• Features: Electronics, Specialty / Other
• Chemical System: Epoxy (EP)

Description: 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.

• Viscosity: 5,000 cP
• Use Temperature: -40 to 250 F
• Tensile Strength (Break): 2,500 psi
• Dielectric Strength: 599.9999999999991 kV/in

Description: Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding,

• Applied Thickness / Gap Fill: 0.002 to 0.006 inch
• Viscosity: 150 to 300 cP
• Use Temperature: -452.47 to 400 F
• Coeff. of Thermal Expansion (CTE): 22,222,222.22222222 to 25,000,000 µin/in-F

Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and

• Viscosity: 1,500 cP
• Use Temperature: -55 to 125 F
• Dielectric Constant (Relative Permittivity): 4.41 to 4.63
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulanting / Potting, Filled / Reinforced, Flexible / Dampening, Liquid, Metal, Paper / Paperboard, Plastic, UV / Radiation Cured (EB, Light)

Description: MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)

Description: MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is required. It

• Industry: Electronics
• Chemical System: Epoxy (EP)

Description: Scotch-Weld™ epoxy potting compound⁄adhesive DP270 is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black. Scotch-Weld epoxy potting compound⁄adhesive

Description: 3M Scotch-Weld™ Epoxy Potting Compound-Adhesives Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1

Description: 20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.

• Viscosity: 12,000 cP
• Use Temperature: -94 to 500 F
• Thermal Conductivity: 0.5769116 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.11111111111111 µin/in-F

Description: Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements.

• Viscosity: 30,500 cP
• Use Temperature: -55 to 140 F
• Tensile Strength (Break): 3,800 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound, Flame Retardant / UL 94V-0 Rated
• Chemical System: Epoxy (EP)

Description: Thermal Epoxy, 2 Part (Order Catalyst Separately) 20 lb Container

• Use Temperature: -67 to 311 F
• Thermal Conductivity: 2.78 W/m-K
• Chemical System: Epoxy (EP)

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Viscosity: 5,000 to 7,000 cP
• Use Temperature: 662 F
• Thermal Conductivity: 0.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 42.22222222222222 µin/in-F

Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.

• Viscosity: 40,000 cP
• Use Temperature: -55 to 150 F
• Thermal Conductivity: 1.15 W/m-K
• Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F

Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing

• Use Temperature: 500 F
• Coeff. of Thermal Expansion (CTE): 21.11111111111111 µin/in-F
• Elongation: 2 %
• Dielectric Strength: 540 kV/in

Description: ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates.

• Dielectric Strength: 5,199.999999999988 kV/in
• Dielectric Constant (Relative Permittivity): 2.4
• Viscosity: 400 to 800 cP
• Form / Function: Conformal / Encapsulating Coating

Description: ThreeBond TB2210 is a black epoxy resin which cures to a tough 92 Shore D Hardness. The fast curing nature of this epoxy resin allows for considerable energy savings and facilitates the automation of assembly works thus enabling an integration of On-Line manufacturing process without

• Features: Encapsulant / Potting Compound
• Chemical System: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile

• Viscosity: 6,000 to 12,000 cP
• Use Temperature: 662 F
• Thermal Conductivity: 0.7 W/m-K
• Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 72.22222222222221 µin/in-F

Description: (Known as HYSOL EE1117-HD3561 epoxy system ) LOCTITE STYCAST HD 3561 epoxy system is designed for use as a sealant or for potting electronic devices. It is specially formulated for LED display backfill applications.

• Industry: Electronics (PCB / SMT Assembly)
• Features: Encapsulant / Potting Compound