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Supplier: Indium Corporation
Description: When to Use AuSn Eutectic Solder Die-Attach: Thermal requirements often mandate a high-melting die-attach solder. With a melting point of 280°C, eutectic AuSn often satisfies these demands. Hi-Reliability Applications: AuSn’s compatibility with gold
- Alloy: Other
- Form / Shape: Preform
- Lead Free: Yes
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Supplier: Accuris
Description: SOLDER, EUTECTIC LOW DROSS
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Supplier: SAE International
Description: Technical Standard
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Supplier: Accuris
Description: Solder, Tin - Lead, Eutectic 63Sn - 37Pb
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Supplier: Indium Corporation
Description: at less than 300F, well below the melting point of Tin-lead eutectic solders. The major component of fusible alloys is bismuth. Besides producing low melting point, bismuth also gives these materials the unique characteristic of expanding on freezing. This expansion, which can continue
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Supplier: SAE International
Description: This specification covers a tin-lead alloy in the form of bars, ingots, pellets, ribbon, and round wire.
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Supplier: SAE International
Description: This specification covers a tin-lead alloy in the form of bars, ingots, pellets, ribbon, and round wire.
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Supplier: Accuris
Description: SOLDER, TIN - LEAD, EUTECTIC 63Sn - 37Pb
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Supplier: Accuris
Description: Tin - Lead Alloy Eutectic Solder 63Sn - 37Pb (UNS L13630)
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Supplier: Indium Corporation
Description: at less than 300F, well below the melting point of Tin-lead eutectic solders. The major component of fusible alloys is bismuth. Besides producing low melting point, bismuth also gives these materials the unique characteristic of expanding on freezing. This expansion, which can continue
- Applications: Other
- Fusible Alloy: Yes
- Metal / Alloy Types: White / Low Melting (UNS L), Bismuth / Bismuth Alloys, Indium / Indium Alloys, Lead / Lead Alloy, Tin / Tin Alloy
- Overall Length: 4.25 inch
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Supplier: Indium Corporation
Description: at less than 300F, well below the melting point of Tin-lead eutectic solders. The major component of fusible alloys is bismuth. Besides producing low melting point, bismuth also gives these materials the unique characteristic of expanding on freezing. This expansion, which can continue
- Applications: Other
- Fusible Alloy: Yes
- Metal / Alloy Types: White / Low Melting (UNS L), Bismuth / Bismuth Alloys, Indium / Indium Alloys, Lead / Lead Alloy, Tin / Tin Alloy, Other / Miscellaneous Nonferrous (UNS M)
- Shape / Form: Semi-finished Shape / Mill Stock, Bar Stock
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Supplier: MacDermid Alpha Electronics Solutions
Description: Eutectic tin/copper alloy with controlled metallic dopants to regulate grain structure and minimize copper dissolution. Product Overview K100LD is a eutectic tin/copper alloy with controlled metallic dopants that control the grain structure within the solder joint and minimize
- Lead Free: Yes
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: MacDermid Alpha Electronics Solutions
Description: Enables low temperature SMT assembly technology to minimize rework in multiple reflow applications. Product Overview ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux
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Supplier: Lake Shore Cryotronics, Inc.
Description: This is a low melting point solder, nearly identical to what is commonly called Wood’s Metal. An alloy of bismuth, tin, lead, and cadmium, it is an eutectic alloy with a sharply defined melting point of 343.16 K (70 °C). Ostalloy® 158 has proven itself in production processes
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Supplier: RS Components, Ltd.
Description: ISO-Tin electronic solder, eutectic alloy in pressed triangular bars. For all conventional soldering methods, wave soldering, drag soldering and dip soldering Percent Lead = 37% Product Form = Stick Melting Point = +183°C Percent Tin = 63% Product Weight =
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire, Other
- Melting Range: 361 F
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Supplier: RS Components, Ltd.
Description: A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards. Thermal damage to components can be minimised due to lower temperatures. 5 cores of Ersin® flux Wire Diameter = 0.71mm Percent Lead = 36% Product Form = Wire
- Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 354 F
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Supplier: RS Components, Ltd.
Description: A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards. Thermal damage to components can be minimised due to lower temperatures. 5 cores of Ersin® flux Wire Diameter = 1.22mm Percent Lead = 36% Product Form = Wire
- Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 354 F
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Supplier: RS Components, Ltd.
Description: A tin/lead solder which exhibits a very sharp (eutectic) melting transition and is ideal for repairs on fabricated boards. Thermal damage to components can be minimised due to lower temperatures. 5 cores of Ersin® flux Wire Diameter = 0.5 - 0.56mm Percent Lead = 36% Product Form = Wire
- Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 354 F
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Supplier: CSA Group
Description: alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability
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Description: alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability
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Description: in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or
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Description: determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are
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Supplier: ASTM International
Description: lead eutectic, and alloys in the form of solid bars, ingots, powder and special forms, and in the form of solid ribbon and wire. The composition of the alloys shall conform to the chemical requirements for bismuth, lead, tin, cadmium, indium, silver, copper, antimony, and zinc. Alloys shall
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Supplier: CSA Group
Description: IEC 60068-2-58:2015+A1:2 017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near
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Supplier: CSA Group
Description: IEC 60068-2-58:2015 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near
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Description: IEC 60068-2-58:2015+A1:2 017 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near
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Supplier: CSA Group
Description: constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
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Description: constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
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Supplier: SAE International
Description: This technical report identifies the requirements for an LFCP for ADHP soldered electronic products built fully or partially with Pb-free materials and assembly processes. An LFCP documents the specific Pb-free materials and assembly processes used to assure customers their ADHP
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Supplier: MacDermid Alpha Electronics Solutions
Description: High-activity, water-soluble paste flux that offers excellent solder wetting, easy cleaning, and low voiding performance. Product Overview ALPHA WS-608 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. It
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Supplier: MacDermid Alpha Electronics Solutions
Description: Water-soluble paste flux for wafer-level ball attach in Fan-in and Fan-out applications. Product Overview ALPHA WS9180-MHV water-soluble, halide-free flux is engineered for use in the attachment of lead-free or tin-lead eutectic spheres onto BGA or CSP components, as well as ball
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Supplier: Advanced Interconnections Corp.
Description: Using our exclusive, field-proven eutectic solder ball terminal design, the SMT Adapter from Advanced provides a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection with our BGA Sockets for LGA to BGA conversion or board to board applications.
- Contact / Pin Type: Low Profile Pins, Solder Tail Pins, Other
- Contact Plating: Gold Plating, Other
- Contacts Pitch: 0.8000 to 1.27 mm
- Features: Machined Pins
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Description: DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with
- Applications: Other
- Material Type: Specialty Ceramic
- Performance Features: Metallized / Silvered
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL XCE3104XL ) LOCTITE ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for the stencil and screen print applications. It uses a unique blend of fillers with tightly controlled particle sizes to provide fine pitch printing performance using standard SMT
- Industry: Electronics
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Supplier: Technic, Inc.
Description: Replenishable PGC based immersion gold chemistry. It will deposit 2-4 microinches of gold on electroless nickel in 10 minutes. Techni IM Gold AT 6000 has a high tolerance for metallic contamination, yielding a longer bath life which lowers operating cost. The deposit is self-limiting and provides at
- Chemical / Process: Gold Plating
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Supplier: Henkel Corporation - Electronics
Description: Hysol® FluxFill™ FF2200 is a reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. The material is formulated to provide the required flux for eutectic solder joint formation. It also provides the necessary
- Coeff. of Thermal Expansion (CTE): 41.67 µin/in-F
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound
- Viscosity: 3600 cP
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Supplier: Cree, Inc.
Description: enables a Lambertian radiation pattern. Additionally, these LEDs are die attachable with conductive epoxy, solder paste or solder preforms, as well as the eutectic method
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Supplier: Belmont Metals, Inc.
Description: Low Melting (Fusible) Alloys Featuring 158°F, 203°F radiation shielding alloys, pipe bending alloys, and low temperature solders. Eutectic: melting points from 117° – 281°F.Non-eutectic: melting points from 107° – 338°F.Mellottes metal, Rose
- Fusible Alloy Types: Bismuth / Bismuth Alloys
- Shape / Form: Semi-finished Shape / Mill Stock, Bar Stock, Strip, Ingot, Wire / Shaped Wire, Other
- Tensile Strength (UTS, Break): 5990 psi
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Supplier: Palomar Technologies, Inc
Description: , which can load parts onto the wire bonder while it is bonding. High Vacuum Furnace Applications MEMS Package Sealing Infrared Sensor Package Sealing Crystal Oscillator Package Sealing Hermetic Package Sealing Wafer Level Packaging Void-Free Eutectic Die Attach Low Moisture Package Sealing
- Application: Brazing / Soldering, Curing, Industrial, Other
- Computer Interface: Yes
- Configuration: Top Loading
- Controller Type: Programmable
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Supplier: Henkel Corporation - Industrial
Description: solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading. LOCTITE ABLESTIK 2600BT adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials. High thermal
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Features: Thermal / Heat Conductive
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Supplier: Richardson RFPD
Description: uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM
- Frequency Range: 17000 to 26000 MHz
- Maximum Gain: 19 dB
- Output Power( P1dB): 23 dBm
- Package Type: Other
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bump-on-polymer processes Single and multiple layer Cu redistribution with several polymer repassivation material choices Eutectic Sn/Pb, Pb-free and high-Pb solder alloys Design services and custom test vehicle fabrication Downloads (read more)
Browse IC Interfaces Datasheets for Micross Components, Inc. -
and metal brazing, solder can not infiltrate the ceramic surface, so it can not directly connect ceramics with metal. In order to solve the problem of infiltration between solders and ceramics, after years of practical research, two methods have been summarized: ceramic metallization method (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
Conduct Research Top
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Gold Tin Eutectic Solder - High Reliability
Gold tin eutectic solder (AuSn20, or 80%gold, 20%tin by weight) is used in a variety of applications requiring a high reliability, high melting solder joint. This includes die-attach and even lid-attach for hermetically-sealed ceramic packages. When used as a die-attach solder alloy for LED or RF
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Solder Reflow Recommendation
), melting and eutectic temperatures also change, requiring modification to the solder reflow profile
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High Melting Lead-Free Mixed BiAgX (R) Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006 with the replacement of the eutectic SnPb system by the SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far from mature.
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Achieving High-Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
In this study, the reliability of low-Ag SAC alloy doped with Mn (SACm (R)) was evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys.
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Tech Tip 12 - Compatible Metallization
Silver epoxy adhesives (ECAs) have been widely used in semiconductor and electronic packaging industries since the 1960s, as a reliable connection method instead of soldering or eutectic joining of metals.
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Direct Bonded Copper Ceramic Substrates
DBC ceramic substrate, short for Direct Bonded Copper Ceramic substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional
More Information Top
Indicates content that may require registration and/or purchase.
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Solder Joint Technology
Wetting Reaction of Pb-Free Eutectic Solders on Thick Cu UBM...........................................................................
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Lead-Free Electronic Solders
For exam- ple, McCormack and coworkers [40, 41] modified the Sn–3.5Ag binary eutectic solder with 0.5–2.0 wt.% Zn additions, and noted substantial refinement of the microstructure; in particular, they observed a decrease in the incidence of b-Sn …
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Lead-free Solders: Materials Reliability for Electronics
Tsai, J.Y., Chang, C.W., Ho, C.E. et al. (2006) Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates.
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Lead-free Electronics
After soldering the same components with tin-lead eutectic solder , the lead-free materials were used with a reflow temperature of 245"C, which again was well below the 260°C expected peak.
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Principles of Soldering
The authors have com- pared the spreading characteristics, as a function of excess temperature above the melting point (“superheat”), of all combinations of the elements bismuth, indium, lead, silver, and tin when used as eutectic solders on “ideal” substrates [Humpston and Jacobson …
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A Guide to Lead-free Solders
As-cast Microstructures of Solder Alloys..........................................73 3.4.1 SnPb Euctectic..........................................................................74 3.4.2 SnAg Eutectic Solder ...............................................................74 3.4.3 SnAgCu Ternary Solders.........................................................75 3.5 .
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Lead-Free Solder Interconnect Reliability
and Q.J. Yang, A New Constitutive Creep Constitutive Model for Eutectic Solder Al- .
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Advanced Flip Chip Packaging
It has also been utilized to form a hybrid joint, uniting high lead with eutectic solder for joining die onto organic substrates.
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Reliability of Pb-Free Solder Joints in Comparison to Sn-Pb Eutectic Solder Joints .
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Lead-Free Soldering
This approach is eminently logical: the new standard Pb-free alloy replaces Sn-Pb eutectic solder in a wide variety of board designs and microelectronics applications.