Products & Services
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Supplier: Epoxies Etc...
Description: 20-3064 is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 80 Shore D. 20-3064 provides excellent thermal shock resistance and outstanding adhesion. 20-3064
- Viscosity: 40,000 cP
- Use Temperature: -94 to 212 F
- Thermal Conductivity: 0.4326837 W/m-K
- Coeff. of Thermal Expansion (CTE): 38.888888888888886 µin/in-F
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Supplier: RS Components, Ltd.
Description: MG Black flexible epoxy 832FX 450ml
- Features: Encapsulating / Potting Compound, Specialty / Other
- Chemical System: Epoxy (EP)
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Supplier: Epoxies Etc...
Description: 20-3241 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for encapsulation where low embedment stress to sensitive electronic components is required.
- Use Temperature: -58 to 212 F
- Thermal Conductivity: 0.41826091 W/m-K
- Coeff. of Thermal Expansion (CTE): 27.77777777777778 µin/in-F
- Dielectric Strength: 559.9999999999989 kV/in
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Supplier: Accuris
Description: POTTING COMPOUND, EPOXY, FLEXIBLE DUROMETER 75-85
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for molding
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 2350, Urethane, High Speed Sealing, Potting and Encapsulating LOCTITE® STYCAST US 2350 is a flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is low viscosity so it flows well and
- Viscosity: 2,400 cP
- Use Temperature: 149 to 257 F
- Thermal Conductivity: 0.51 W/m-K
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview UR5604 is a general-purpose two-part polyurethane potting compound designed for potting and encapsulation. This versatile resin offers high-performance protection against environmental factors, making it suitable for a wide range of electronic applications. It
- Use Temperature: -40 to 266 F
- Thermal Conductivity: 0.78 W/m-K
- Dielectric Strength: 457.20000000000095 kV/in
- Water Absorption: 1 %
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Supplier: Newark, An Avnet Company
Description: Epoxy Potting Compound, Flexible (Ratio 1:1) (MTO = 1) / 93.2 lb Kit
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Supplier: Epoxies Etc...
Description: 10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.
- Viscosity: 800 to 2,000 cP
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
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Supplier: Epoxies Etc...
Description: The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling
- Viscosity: 1,200 to 1,950 cP
- Use Temperature: -58 to 248 F
- Tensile Strength (Break): 150 psi
- Elongation: 50 %
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Supplier: Accuris
Description: Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure
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Encapsulants and Potting Compounds - Filter-bond™ Elastomeric Casting and Potting Compound -- E-3568Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval.
- Viscosity: 950 cP
- Features: Encapsulating / Potting Compound, Flexible / Dampening, Medical / Food (Sanitary / FDA)
- Chemical System: Polyurethane (PU, PUR), Rubber Based / Elastomeric
- Cure / Technology: Two Component System
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Supplier: SAE International
Description: Technical Standard
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Supplier: SAE International
Description: Technical Standard
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Supplier: Accuris
Description: PLASTIC POLYURETHANE, FLEXIBLE POTTING AND MOLDING COMPOUND
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Supplier: SAE International
Description: This specification covers a flexibilized epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
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Supplier: Henkel Corporation - Electronics
Description: (Known as LOCTITE US5533 flame retardant potting compound ) LOCTITE STYCAST US 5533 PTB is a two-component, flexible, flame retardant potting compound. It is formulated with low odor designed to be more work-environment friendly. It meets UL94 flammability ratings
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1612-1 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on potted
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 5620 Silicone Potting Compound Clear is a two component material that turns to a flexible elastomer after curing at room or elevated temperatures. It is used for potting and protection components from vibrations, moisture, mechanical and thermal shock. 400
- Viscosity: 200 to 450 cP
- Thermal Conductivity: 0.16 W/m-K
- Dielectric Strength: 537 kV/in
- Features: Encapsulating / Potting
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Supplier: SAE International
Description: This specification covers a flexibilized epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
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Supplier: Wacker Chemical Corp.
Description: WACKER SILGEL® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 10 : 1 mixing ratio very low viscosity rapid curing at room temperature with ELASTOSIL® CAT PT-F very low hardness (silicone gel)
- Viscosity: 150 cP
- Index of Refraction: 1.404
- Industry: Automotive, OEM / Industrial
- Features: Electrical Power / HV, Electronics, Encapsulating / Potting, Flexible / Dampening, Liquid, RTV / Room Temperature Curing
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Flexible Thermally Conductive Flame Retardant Encapsulating and Potting Compound, Meets UL 94V-0 Kit
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Supplier: Henkel Corporation - Industrial
Description: Acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate. LOCTITE® 3703 is a bone white to beige, translucent, acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to
- Viscosity: 35,000 cP
- Chemical System: Acrylic / Polyacrylate
- Form / Function: Gap Filling Compound
- Cure / Technology: Single Component System, UV / Radiation Cured (also EB, Light)
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Flexible Thermally Conductive Flame Retardant Encapsulating and Potting Compound, Meets UL 94V-0 (MTO = 4) Kit
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 5092 Nuva-Sil is a one component UV light and moisture curable silicone. It is self leveling, has medium strength and is highly flexible. 300 mL Cartridge.
- Viscosity: 4,000 to 7,500 cP
- Tensile Strength (Break): 87 psi
- Elongation: 75 %
- Dielectric Strength: 558.8000000000012 kV/in
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Supplier: Newark, An Avnet Company
Description: Black Flexible Polyurethane Potting and Encapsulating Compound / 2.84 kg, 2.55 L Kit
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Nuva-Sil 5091 is a one component, low viscosity, UV light and moisture curable silicone sealant. It is self leveling, has medium strength and is highly flexible. 300 mL Cartridge.
- Viscosity: 5,500 cP
- Tensile Strength (Break): 145 psi
- Elongation: 100 %
- Dielectric Strength: 457.20000000000095 kV/in
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Supplier: TE Connectivity
Description: Order Quantity : 1 Potting Resin Product Availability : China, EMEA, ASIA, AMERICAS, ANZPAC Product Type Features Material System : Two-Component Hydrocarbon Resin Potting Resin Product Type : Potting Material Potting Resin Technology : Resin Self-Repairing : No Usage
- Features: Encapsulant / Potting Compound, Specialty / Other
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30-D10 is a uniquely versatile two component, abrasion resistant elastomer featuring superior strength, toughness and chemical resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such
- Viscosity: 100,000 cP
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 50 µin/in-F
- Tensile Strength (Break): 1,450 psi
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Supplier: Hapco, Inc.
Description: Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness’s from 20 A to 80 A .
- Use Temperature: 176 F
- Thermal Conductivity: 0.21634185 W/m-K
- Elongation: 1,200 %
- Tensile Strength (Break): 300 psi
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Supplier: Master Bond, Inc.
Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 800 to 1,200 cP
- Use Temperature: -452.47 to 250 F
- Coeff. of Thermal Expansion (CTE): 38,888,888.88888889 to 44,444,444.44444444 µin/in-F
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Supplier: Hapco, Inc.
Description: Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available.
- Use Temperature: 158 F
- Thermal Conductivity: 0.21634185 W/m-K
- Tensile Strength (Break): 125 psi
- Elongation: 25 %
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Supplier: Techsil Limited
Description: TC-5120 from BJB is a room temperature, 20 Shore A, addition/platinum curing silicone rubber designed for part making or mould making. Can be easily pigmented, encapsulating products, making flexible moulds and creating parts and skins. Product Specifications 20 Shore A 40 Minute Work Time 24
- Features: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: combination of superb physical properties and convenient processing enable EP30HV to be used not only for bonding and coating, but also for potting and encapsulation, especially of electronic or optical assemblies. Master Bond Polymer System EP30HV produces high strength, rigid bonds which
- Viscosity: 4,000 cP
- Use Temperature: -60 to 300 F
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Dielectric Strength: 440 kV/in
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Supplier: DigiKey
Description: BLACK FLEXIBLE URETHANE POTTING
- Features: Encapsulating / Potting
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Featured Products Top
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becomes tack?free in seconds Improved protection and yield in glob top and electronic encapsulation of bare die, wire bonds, and integrated circuits Reduced stress on sensitive components for designs on rigid and flexible PCB platforms, including flex and glass More complete (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
chip-on-board, chip-on-flex, chip-on-glass, and wire bonding assemblies, this material provides excellent flexibility, enhanced durability, and superior resistance on PCBs. 9014 encapsulant provides moisture and corrosion protection of critical components found in electronic applications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
versatile physical properties, contributing to design flexibility, process efficiency, and long-term performance. CHT offers an extensive portfolio of silicone technology that addresses different challenges and meet s design requirements for today’s electronic applications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
One component system Combines flexibility and toughness with high temperature resistance Ideal for potting and encapsulation Unused material is easy to reprocess Withstands rigorous thermal cycling and shocks Non halogen filler (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
flexibility and adhesion to substrates such as PCBs, ceramics, lead frames, flex circuits, and silicon. Its low modulus and low glass-transition temperature help absorb mechanical stress, reducing strain on delicate wire bonds and fine interconnects. Dual-Cure Processing Flexibility (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
durable and feature important and versatile physical properties, contributing to design flexibility, process efficiency, and long-term performance. CHT offers an extensive portfolio of silicone technology that addresses different challenges and meets design requirements for today’s (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
Browse Industrial Enclosures Datasheets for New Yorker Electronics Co., Inc. -
Flood Coating on a PCB The Flood-Coating technology with ELANTAS CONASHIELD™ CS 313 combines the low material usage of a conventional protective coating with the encapsulation of a potting process. It thereby (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
be formulated to only cure with the use of heat in order to achieve a very long pot life. Silicone gels are used in numerous electronic applications when a soft and highly flexible encapsulation or potting is required. CHT’s silicone gels protect delicate components and assemblies (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
Meet ELANTAS at CoilTech North America and explore our complete portfolio of Impregnating Resins, Flexible Laminates, Wire Enamels, Mica Tapes and Potting & Casting compounds. Register for free and connect with our team! (read more)
Browse Insulating Varnishes and Impregnating Resins Datasheets for ELANTAS North America LLC
Conduct Research Top
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Polyurethane Potting Compound for Electronics from China Polyurethane Potting Compound Manufacturers
Polyurethane encapsulating and potting compounds have many advantages, especially when a quick cure is needed at low temperatures. This solution is better compared to epoxy systems. With polyurethanes, there is better crack resistance and flexibility. There is also better adhesion to some
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Silicone Potting Compound - The Waterproofing Silicone Gel Option For Electronics
Silicone is a popular potting compound, especially in applications where flexibility is needed together with component protection. The material has many other properties, making it a popular choice amongst electronic fabricators. It is a material available in many forms, including gel. You can use
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
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Polyurethane: "Customized Plastic"
PU Potting Compounds: Vacuum Processing Provides Optimum Results - Polyurethanes have an extremely wide and flexibly modifiable range of properties. This makes them a popular and frequently used group of materials in industrial production. PU potting compounds can be processed easily and feature
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Importance of Hardness Testing
how a material is holding up to various experiments and accelerated aging tests. For example, 85°C + 85% humidity testing is often used to determine the expected operating life for devices stored in damp heat. Master Bond performed this testing on many adhesives and potting compounds by subjecting
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Optical Transmission Properties of Adhesives
is noteworthy for its low index of refraction and its ability to transmit light very well from 225-2500 nanometers. It is a silicone compound that combines remarkable flexibility, high temperature resistance, superb electrical insulation and outstanding optical clarity. These properties enable it to be used
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
More Information Top
Indicates content that may require registration and/or purchase.
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Flexible Compounds for Clear Optical Device Assembly
Master Bond has a wide range of optically clear, flexible potting compounds .
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A Formulary of Adhesives and Sealants
These two-part flexible potting compounds can be either poured in place or dispensed by automatic equipment.
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The Chemical Formulary, Volume 17
These two-part flexible potting compounds can be either poured in place or dispensed by automatic equipment.
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CR4 - Thread: Need Small Non-Ferrous Weights
I would mix shot and flexible potting compound , like RTV silicone.
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AIAA Journal > Composite Material Mechanics: Structural Mechanics
Weingarten165 investigated experimentally the vibrations of sym- metrically laminated (three-layer) isotropic-material shells with ends embedded in a flexible potting compound .
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Journal of Spacecraft and Rockets > Dynamics of composite, sandwich, and stiffened shell-type structures
Weingarten128 carried out experimental vibrational analyses of symmetrically laminated, three-layer isotropic-material shells in which the ends were imbedded in a flexible potting compound .
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https://dspace.lib.cranfield.ac.uk/bitstream/1826/4182/1/Tyler_Thesis_1992.pdf
It was therefore considered necessaryto use a much more flexible potting compound on the new array.
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Custom-formulated Gels: Protecting Electronic Components More Economically | Kunststoffe.de
As a flexible potting compound , silicones have protected electronic components reliably for years.
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Journal of Spacecraft and Rockets > Optimal Scheduling of a Satellite Control Network Using Zero-One Linear Programing
The immediate problem was solved by replacing the hard epoxy end-seals with a flexible polyurethane potting compound that was compatible with the capacitor material and tempera- tures.