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Encapsulants and Potting Compounds - Filter-bond? Elastomeric Casting and Potting Compound -- E-3505Supplier: Hapco, Inc.
Description: FDA approval. Filter-bond™ E-3264 E-3264 is an extremely tough, flexible potting and sealing compound. E-3264 has a long working life. It is also available in a 5 minute gel time(3264-5). Both are excellent in aqueous environments, and are Hydrophobic
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Henkel Corporation - Industrial
Description: Acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate. LOCTITE® 3703 is a bone white to beige, translucent, acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to
- Chemical / Polymer System Type: Acrylic / Polyacrylate
- Cure Type / Technology: UV / Radiation Cured (also EB, Light), Single Component System
- Form / Function: Gap Filling Compound, Specialty / Other
- Viscosity: Up to 35000 cP
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Supplier: Henkel Corporation - Industrial
Description: Alkoxy silicone liquid for potting that will cure at room temperature or at elevated temperatures. LOCTITE® SI 5620 is a clear, 2-part, alkoxy silicone liquid for potting that will cure at room temperature or at elevated temperatures. After mixing, the material cures quickly to form a
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Thermal Conductivity: 0.7600 W/m-K
- Use Temperature: 40 to 450 F
- Viscosity: 200 cP
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: . It cures to form a durable, flexible rubber sealant. Typical applications include gasketing/sealing of enclosures that require a rapid-curing, post-applied sealant that facilitates immediate on-part inspection. One component - requires no mixing Medium viscosity - thixotropic Forms a
- Cure Type / Technology: Single Component System
- Viscosity: Up to 125000 cP
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Supplier: Epoxies Etc...
Description: The 20-2135 is a two component, low durometer, potting, casting and encapsulating compound. This system is unfilled and low in viscosity allowing for fast self-leveling. The 20-2135 will quickly encapsulate components and electronic devices. The 20-2135 has outstanding thermal cycling
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.5
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Supplier: Epoxies Etc...
Description: 20-3241 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for encapsulation where low embedment stress to sensitive electronic components is required.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 27.78 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxies Etc...
Description: 20-3064 is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 80 Shore D. 20-3064 provides excellent thermal shock resistance and outstanding adhesion. 20-3064 FR
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 38.89 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing. Room temperature flow
- Coeff. of Thermal Expansion (CTE): 33.89 µin/in-F
- Viscosity: 354 cP
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Supplier: Epoxies Etc...
Description: 20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006 provides low stress on surface mount and other
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1612-1 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1610 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on potted
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Flame Retardant / UL 94V-0 Rated: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: ACCRAbond, Inc.
Description: CONAPOXY® FR-1810 is a flexible two-component, low exotherm, flame retardant, long pot life epoxy potting and casting system with excellent handling properties. CONAPOXY FR-1810 is filled with a non-abrasive filler to reduce wear on machine metering/dispensing equipment. FR-1810
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Flame Retardant / UL 94V-0 Rated: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: High-performance polyurethane potting and encapsulation compound suitable for a wide range of applications. Product Overview UR5604 is a general-purpose two-part polyurethane potting compound designed for potting and encapsulation. This versatile resin offers high
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Flame Retardant / UL 94V-0 Rated: Yes
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Supplier: TE Connectivity
Description: Body Features Color : Opaque Flexibility : Elastic Industry Standards UL Rating : No Operation/Applicatio n Application
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: TE Connectivity
Description: Body Features Color : Transparent Flexibility : Soft-Elastic Industry Standards UL Rating : No Operation/Applicatio n Application
- Chemical / Polymer System Type: Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 2.4 to 2.6
- Dielectric Strength: 358 kV/in
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Supplier: Henkel Corporation - Electronics
Description: (Known as LOCTITE US5533 flame retardant potting compound ) LOCTITE STYCAST US 5533 PTB is a two-component, flexible, flame retardant potting compound. It is formulated with low odor designed to be more work-environment friendly. It meets UL94 flammability ratings
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 2.9 to 3.1
- Dielectric Strength: 350 kV/in
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Supplier: Hapco, Inc.
Description: Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available.
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 2.6 to 2.7
- Dielectric Strength: 350 kV/in
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 5620 Silicone Potting Compound Clear is a two component material that turns to a flexible elastomer after curing at room or elevated temperatures. It is used for potting and protection components from vibrations, moisture, mechanical and thermal shock. 400
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 537 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: DigiKey
Description: BLACK FLEXIBLE URETHANE POTTING
- Form / Function: Encapsulant / Potting Compound
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Supplier: SAE International
Description: Technical Standard
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Supplier: SAE International
Description: Technical Standard
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Nuva-Sil 5091 is a one component, low viscosity, UV light and moisture curable silicone sealant. It is self leveling, has medium strength and is highly flexible. 300 mL Cartridge.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 457 kV/in
- Elongation: 100 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite 5092 Nuva-Sil is a one component UV light and moisture curable silicone. It is self leveling, has medium strength and is highly flexible. 300 mL Cartridge.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Dielectric Strength: 559 kV/in
- Elongation: 75 %
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Supplier: Accuris
Description: POTTING COMPOUND, EPOXY, FLEXIBLE DUROMETER 75-85
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Supplier: Accuris
Description: PLASTIC POLYURETHANE, FLEXIBLE POTTING AND MOLDING COMPOUND
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Supplier: Techsil Limited
Description: TC-5120 from BJB is a room temperature, 20 Shore A, addition/platinum curing silicone rubber designed for part making or mould making. Can be easily pigmented, encapsulating products, making flexible moulds and creating parts and skins. Product Specifications 20 Shore A 40 Minute Work Time 24
- Form / Function: Encapsulant / Potting Compound
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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover epoxy resin formulations based on diglycidyl ether of bisphenol A with an epoxide equivalent of 175 - 195. When properly mixed and cured, these resins produce a rigid or flexible product.
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Supplier: SAE International
Description: This specification and its supplementary detail specifications cover epoxy resin formulations based on diglycidyl ether of bisphenol A with an epoxide equivalent of 175-195. When properly mixed and cured, these resisns produce a rigid or flexible product.
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: such as strength, chemical resistance, and adhesive qualities, with those of the polyurethanes including toughness, abrasion resistance and flexibility. In addition, EP30D10 has been used successfully in a number of different cryogenic applications. Master Bond Polymer System EP30D-10 is
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 50 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Techsil Limited
Description: matched kits which are designed for use at a convenient 10:1 ratio by weight. This kit comprises of 454gm A and 45gm B. RTV27844 is a low viscosity, easily pourable liquid with the capability of remaining flexible at low temperatures and have been used for the protection of electronic
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Techsil® RTV27844 Clear Silicone Rubber 10:1 250ml -- TESI19112Supplier: Techsil Limited
Description: handy 10:1 side by side cartridge. Users will require a suitable gun to aid dispension. RTV27844 is a low viscosity, easily pourable liquid with the capability of remaining flexible at low temperatures and have been used for the protection of electronic components and assemblies against shock
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: matched kits which are designed for use at a convenient 10:1 ratio by weight. This kit comprises of 907gm A and 91gm B. RTV27844 is a low viscosity, easily pourable liquid with the capability of remaining flexible at low temperatures and have been used for the protection of electronic
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 37.22 to 112 µin/in-F
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Master Bond, Inc.
Description: Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting.
- Applied Thickness / Gap Fill: 0.0030 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 3.89E7 to 4.44E7 µin/in-F
- Composition: Unfilled
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
- Electrical / Electronics Applications: Optoelectronics / Photonics, Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound, Glob Top / Daub
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Supplier: Accuris
Description: Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure
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Supplier: RS Components, Ltd.
Description: MG Black flexible epoxy 832FX 450ml - Adhesives & Glues - Potting Compounds
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.2600 W/m-K
- Use Temperature: -40 to 284 F
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Supplier: RS Components, Ltd.
Description: MG Black flexible epoxy 832FX 1.7L - Adhesives & Glues - Potting Compounds
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.2600 W/m-K
- Use Temperature: -40 to 284 F
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® FR coverlay (bondply) composites are constructed of DuPont™ Kapton® polyimide film, coated on one side (both sides) with a proprietary B-staged acrylic adhesive. They are used to encapsulate etched details in flexible and rigid-flex multilayer constructions
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
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becomes tack?free in seconds Improved protection and yield in glob top and electronic encapsulation of bare die, wire bonds, and integrated circuits Reduced stress on sensitive components for designs on rigid and flexible PCB platforms, including flex and glass More complete (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
Its flexibility allows for stress minimization especially when bonding substrates with different coefficients of thermal expansion. It also utilizes a fluorescent dye for detection purposes, which enables easy visual inspection. LED405FL3 is a one part system that (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
chip-on-board, chip-on-flex, chip-on-glass, and wire bonding assemblies, this material provides excellent flexibility, enhanced durability, and superior resistance on PCBs. 9014 encapsulant provides moisture and corrosion protection of critical components found in electronic applications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
One component system Combines flexibility and toughness with high temperature resistance Ideal for potting and encapsulation Unused material is easy to reprocess Withstands rigorous thermal cycling and shocks Non halogen filler (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
versatile physical properties, contributing to design flexibility, process efficiency, and long-term performance. CHT offers an extensive portfolio of silicone technology that addresses different challenges and meet s design requirements for today’s electronic applications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
flexibility and adhesion to substrates such as PCBs, ceramics, lead frames, flex circuits, and silicon. Its low modulus and low glass-transition temperature help absorb mechanical stress, reducing strain on delicate wire bonds and fine interconnects. Dual-Cure Processing Flexibility (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
durable and feature important and versatile physical properties, contributing to design flexibility, process efficiency, and long-term performance. CHT offers an extensive portfolio of silicone technology that addresses different challenges and meets design requirements for today’s (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc. -
MG Chemicals 832FXC is a clear, flexible epoxy potting compound designed to minimize physical stress on delicate components. Ideal for low-temperature, arctic, or temperature-cycling environments, it maintains flexibility and stability through rapid thermal changes. Its transparency allows easy (read more)
Browse Industrial Enclosures Datasheets for New Yorker Electronics Co., Inc. -
Flood Coating on a PCB The Flood-Coating technology with ELANTAS CONASHIELD™ CS 313 combines the low material usage of a conventional protective coating with the encapsulation of a potting process. It thereby (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
be formulated to only cure with the use of heat in order to achieve a very long pot life. Silicone gels are used in numerous electronic applications when a soft and highly flexible encapsulation or potting is required. CHT’s silicone gels protect delicate components and assemblies (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc.
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Polyurethane Potting Compound for Electronics from China Polyurethane Potting Compound Manufacturers
Polyurethane encapsulating and potting compounds have many advantages, especially when a quick cure is needed at low temperatures. This solution is better compared to epoxy systems. With polyurethanes, there is better crack resistance and flexibility. There is also better adhesion to some
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Silicone Potting Compound - The Waterproofing Silicone Gel Option For Electronics
Silicone is a popular potting compound, especially in applications where flexibility is needed together with component protection. The material has many other properties, making it a popular choice amongst electronic fabricators. It is a material available in many forms, including gel. You can use
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New Urethane Technology for Potting & Encapsulation in Electronics
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds available to designers are unable to give adequate protection over a wide temperature range
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Polyurethane: "Customized Plastic"
PU Potting Compounds: Vacuum Processing Provides Optimum Results - Polyurethanes have an extremely wide and flexibly modifiable range of properties. This makes them a popular and frequently used group of materials in industrial production. PU potting compounds can be processed easily and feature
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Importance of Hardness Testing
how a material is holding up to various experiments and accelerated aging tests. For example, 85°C + 85% humidity testing is often used to determine the expected operating life for devices stored in damp heat. Master Bond performed this testing on many adhesives and potting compounds by subjecting
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Optical Transmission Properties of Adhesives
is noteworthy for its low index of refraction and its ability to transmit light very well from 225-2500 nanometers. It is a silicone compound that combines remarkable flexibility, high temperature resistance, superb electrical insulation and outstanding optical clarity. These properties enable it to be used
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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Flexible Compounds for Clear Optical Device Assembly
Master Bond has a wide range of optically clear, flexible potting compounds .
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A Formulary of Adhesives and Sealants
These two-part flexible potting compounds can be either poured in place or dispensed by automatic equipment.
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The Chemical Formulary, Volume 17
These two-part flexible potting compounds can be either poured in place or dispensed by automatic equipment.
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CR4 - Thread: Need Small Non-Ferrous Weights
I would mix shot and flexible potting compound , like RTV silicone.
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AIAA Journal > Composite Material Mechanics: Structural Mechanics
Weingarten165 investigated experimentally the vibrations of sym- metrically laminated (three-layer) isotropic-material shells with ends embedded in a flexible potting compound .
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Journal of Spacecraft and Rockets > Dynamics of composite, sandwich, and stiffened shell-type structures
Weingarten128 carried out experimental vibrational analyses of symmetrically laminated, three-layer isotropic-material shells in which the ends were imbedded in a flexible potting compound .
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https://dspace.lib.cranfield.ac.uk/bitstream/1826/4182/1/Tyler_Thesis_1992.pdf
It was therefore considered necessaryto use a much more flexible potting compound on the new array.
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Custom-formulated Gels: Protecting Electronic Components More Economically | Kunststoffe.de
As a flexible potting compound , silicones have protected electronic components reliably for years.
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Journal of Spacecraft and Rockets > Optimal Scheduling of a Satellite Control Network Using Zero-One Linear Programing
The immediate problem was solved by replacing the hard epoxy end-seals with a flexible polyurethane potting compound that was compatible with the capacitor material and tempera- tures.