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Supplier: FX PCB Co., Ltd.
Description: Ceramic PCB Datasheet: Item - Unit - Value - Test Standard Color / Gray 3.2 Density g/cm³ = 3.33 GB/T 2413 Thermal Conductivity 20?, W/(m • K) = 170 GB/T 5598 Dielectric Constant 1MHz 8~10 GB/T 5594.4 Dielectric
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0098 to 0.0150 inches
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Supplier: FX PCB Co., Ltd.
Description: ,ENEPIG,Immersio n Silver Material AIN, AI203 Ceramic PCB Materials Properties: Item Unit Value Test Standard Color / Gray 3.2 Density g/cm³ = 3.33 GB/T 2413 Thermal Conductivity 20?, W/(m · K) = 170 GB
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0150 to 0.1181 inches
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Description: providing shock absorption. ? High electrical insulation, with dielectric strength up to 8 kV/mm. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Curing time adjustable based on temperature. ? Two-component structure for easy storage. ? Can
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Description: for delicate and sensitive electronic components. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Outstanding electrical insulation properties, with dielectric strength up to 8 kV/mm. ? No cracking or dripping, ensuring good stability in both high and low
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 5.5
- Dielectric Strength: 1.27E-4 kV/in
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Description: for delicate and sensitive electronic components. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Outstanding electrical insulation properties, with dielectric strength up to 8 kV/mm. ? No cracking or dripping, ensuring good stability in both high and low
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 7
- Dielectric Strength: 1.27E-4 kV/in
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Description: providing shock absorption. ? High electrical insulation, with dielectric strength up to 8 kV/mm. ? Excellent flame resistance, achieving a UL94 V-0 rating. ? Curing time adjustable based on temperature. ? Two-component structure for easy storage. ? Can
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Dielectric Constant (Relative Permittivity): 4
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: CoorsTek
Description: heat dissipation with thermal conductivity of 170 W/m K Non-toxic alternative to BeO Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors High dielectric strength
- Features: Dielectric / Insulating
- Materials of Construction: Specialty / Other
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It’s suitable for high power transistors,
- Applied Thickness / Gap Fill: 0.0059 inch
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one-to-one (1:1) mix ratio by weight or volume. It has an unusual blend
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrically Conductive, Electrical Insulation / Dielectric
- Coeff. of Thermal Expansion (CTE): 33.33 to 36.11 µin/in-F
- Composition: Unfilled
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Supplier: TE Connectivity
Description: Current Class (AMP) : 20 - 30 Terminal Type : PCB-THR Dimensions Height Class (Mechanical) (MM) : 10 - 11 Length Class (Mechanical) (MM) : 20 - 25 Product Height
- Coil Nominal DC Power: 0.5670 watts
- Coil Resistance: 254 ohms
- DC Coil Voltage: 12 volts
- Mounting: PC Board, Other
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Supplier: TE Connectivity
Description: Current Class (AMP) : 20 - 30 Terminal Type : PCB-THT Dimensions Height Class (Mechanical) (MM) : 10 - 11 Length Class (Mechanical) (MM) : 20 - 25 Product Height
- Coil Nominal DC Power: 0.5670 watts
- Coil Resistance: 254 ohms
- DC Coil Voltage: 12 volts
- Mounting: PC Board, Other
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Supplier: TE Connectivity
Description: Current Class (AMP) : 20 - 30 Terminal Type : PCB-THR Dimensions Height Class (Mechanical) (MM) : 10 - 11 Length Class (Mechanical) (MM) : 20 - 25 Product Height
- Coil Nominal DC Power: 0.5520 watts
- Coil Resistance: 181 ohms
- DC Coil Voltage: 10 volts
- Mounting: PC Board, Other
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Supplier: Master Bond, Inc.
Description: EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Optima Technology Associates, Inc.
Description: -Free HASL, ENIG, Ag & Sn RoHS Finishes Thickness from 0.020 to 0.125 inches Cu Cladding from 18 to 70 microns FR4, FR2, CEM1, High Dielectric Laminates Universal BBT with Simultaneous Double-Sided SMD 8 Mil Holes, 4 Mil Traces / Isolation ISO Certified, UL Approved Rigid, Flex, or
- Location: North America, United States Only, Northeast US Only, South / Central America Only
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
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Supplier: Lumentum Operations, LLC
Description: process control due to superior energy stability enabled by unique intracavity harmonic generation Customization available upon request Applications Wafer scribing Full-cut wafer dicing Low-k dielectric grooving Micromachining of silicon, sapphire, ceramic, and metal Micro-via drilling
- Beam Area: 0.3000 mm²
- Laser Output: Q-Switched, Pulsed
- Laser Power: 12000 to 40000 milliwatts
- Laser Type: Laser Diode Modules
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Supplier: Lumentum Operations, LLC
Description: Wafer scribing Full-cut wafer dicing Low-k dielectric grooving Micromachining of silicon, sapphire, ceramic, and metal Micro-via drilling PCB and flexboard cutting
- Beam Area: 0.2600 mm²
- Laser Output: Pulsed
- Laser Power: 2900 to 11000 milliwatts
- Laser Type: Laser Diode Modules
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Supplier: Adhesive Applications
Description: PolySil™ SP590 offers optimum performance in electrical and thermal insulation. The continuous service temperature range is -100°F to 500°F (-73°C to 260°C) with short term, intermittent service to 600°F (315°C). Provides clean removal in high
- Adhesive: Silicone
- Backing: Polyimide (e.g., Kapton®)
- Peel Strength / Adhesion: 1.62 lbs/in
- Performance Features: Dielectric / Insulating, Abrasion / Scratch Resistant, Removable, Thermally Insulating / Insulative
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Supplier: Datatronics™
Description: Feature Designed for Switching Mode Power Supply Applications High Dielectric Strength Capability 3750VRMS Frequency Range 20 kHz - 200 kHz Fully molded construction with center thru hole for Primary Lead The PT27312 is VDE approved
- DCR: 0.7000 to 11 ohms
- Isolation / Hipot Level: 3.75 kilovolts
- Mounting / Form Factor: PC / PCB Mount
- Operating Frequency Range: 50000 to 200000 Hz
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one-to-one (1:1) mix ratio by weight or volume. It has an unusual blend
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrically Conductive, Electrical Insulation / Dielectric
- Coeff. of Thermal Expansion (CTE): 33.33 to 36.11 µin/in-F
- Composition: Unfilled
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving one-to-one mix ratio by weight or volume. As an adhesive, it forms very
- Chemical / Polymer System Type: Epoxy (EP)
- Coating Type: Electrical Insulation / Dielectric
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Techsil Limited
Description: : 120% Dielectric Strength: 21.2kv/ mm (540 v/mil) Operating Temperature: -115°C to +260°C Thermal Conductivity:0.31 W/mK
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Momentive RTV560 Red Electronic Silicone +DBT 12lb -- MOSI02088Supplier: Techsil Limited
Description: : 120% Dielectric Strength: 21.2kv/ mm (540 v/mil) Operating Temperature: -115°C to +260°C Thermal Conductivity:0.31 W/mK
- Chemical / Polymer System Type: Silicone
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Fujipoly® America Corp.
Description: SARCON® PG130A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely
- Applied Thickness / Gap Fill: 0.0118 to 0.0787 inch
- Dielectric Strength: 330 kV/in
- Features: Electrical Insulation / Dielectric
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Richardson RFPD
Description: The MLO® Low Pass Filters are low profile passive devices with best in class performance based on AVX’s patented multilayer organic high density interconnect technology. The MLO® low pass filters utilize high dielectric constant and low loss materials to realize high Q
- Bandwidth: 0.0 to 6.16E6 kHz
- Filter Type: Low Pass
- Insertion Loss: 0.9000 dB
- Package Type: Surface Mount Technology (SMT), Other
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Supplier: Datatronics™
Description: Feature Designed for SMPS applications. International Safety construction. High dielectric strength capability 3750VRMS Frequency range 25kHz
- Mounting / Form Factor: PC / PCB Mount
- Operating Frequency Range: 25000 Hz
- Package Type: Through Hole Technology (THT)
- Standards / Compliance: RoHS Compliant
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Supplier: Henkel Corporation - Electronics
Description: ensure dielectric integrity. Your benefits High thermal conductivity: 1.8W/m-K Eliminates need for mechanical fasteners Low viscosity for ease of screening or stenciling Maintains structural bond in severe-environment applications Heat
- Compound Type: Electrically Conductive, Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: RS Components, Ltd.
Description: Application = PCBs Colour = Colourless Dielectric Strength = 45kV/mm Maximum Operating Temperature = +100°C Minimum Operating Temperature = -50°C
- Dielectric Strength: 4.50E7 V/m
- Form: Aerosol, Liquid
- Industry: Electronics
- Operating / Use Temperature: -58 to 212 F
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Supplier: Standex-Meder Electronics
Description: The single in-line SIL RF series high frequency reed relay is capable of switching signals from DC to 1.5GHz. This instrumentation grade RF reed relay is supplied in a rugged thermoset overmolded package. Utilizes minimum PCB area at only 50% compared to our DIP and DIL series.
- Break Time (Release Time): 0.1000 milliseconds
- Coil Resistance: 500 to 1000 ohms
- DC Coil Voltage: 5 to 12 volts
- Make Time (Operate Time): 0.6000 milliseconds
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Supplier: Henkel Corporation - Electronics
Description: Bergquist introduces a new high thermal performance dielectric into its comprehensive Thermal Clad metal core PCB (MCPCB’s) line. HPL is a dielectric specifically formulated for high power lighting LED applications with demanding thermal performance
- Industry: Electronics
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Supplier: RS Components, Ltd.
Description: Provides a true non-flammable precision electronics cleaner and degreaser for use in areas where electrical shutdown is impractical or impossible. Free from CFC and HCFCs. Non-flammable, no flame extension. High dielectric strength, 17kV. Fast evaporation. Safe on plastics
- Industry Applications: Other
- Type: Aerosol / Contact Cleaner, Cleaner / Cleaning Agent, Degreaser
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Supplier: RS Components, Ltd.
Description: High capacity, high dielectric strength, multi-pole relays ideal for 3-phase motor control applications and resistive loads. No contact chattering for momentary voltage drops up to 50% of rated voltage. Withstands more than 4kV between contacts that are of different
- Input (Pick-up) Voltage Range: 24 volts
- Input Voltage Type: DC
- Load Voltage: 30 to 220 volts
- Mounting: PC Board
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Supplier: Henkel Corporation - Electronics
Description: technology of Thermal Clad resides in the dielectric. This datasheet highlights the performance characteristics of Thermal Clad HT 3 mils (High Temperature) a dielectric resistant to degradation from high temperature exposure and features high dielectric
- Industry: Electronics
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Supplier: Henkel Corporation - Electronics
Description: counterpart. This dielectric is proven in applications such as LED, Power Conversion, Heat-Rails, Solid State Relays and Motor Drives. Your benefits Very low thermal resistance of 0.11°Cin²/W (0.71°Ccm²/W) High thermal conductivity of 4.1 W/m-K
- Industry: Electronics
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Supplier: HAVE, Inc.
Description: 2 pole chassis connector. D-size flange. Does not intermate with the 4-pole cable connector. TECHNICAL DATA Electrical Rated current/contact: 30 A rms continous, 40 A rms 1 min. Dielectric strength: 4kV peak Rated voltage: 250 V ac Contact resistance: = 3 m (= 10 m for
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Supplier: HAVE, Inc.
Description: 8 pole chassis connector with black chrome metal flange. Compatible with Cannon `EP-Series`. Air tight. TECHNICAL DATA Electrical Rated current/contact: 30 A rms continous, 40 A rms 1 min. Dielectric strength: 4kV peak Rated voltage: 250 V ac Contact resistance: = 3 m
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Supplier: HAVE, Inc.
Description: 4 pole chassis connector, round flange for speaker cabinets. Compatible with Cannon `EP-Series`. Air tight. TECHNICAL DATA Electrical Rated current/contact: 30 A rms continous, 40 A rms1 min. Dielectric strength: 4kV peak Rated voltage: 250 V ac Contact resistance: = 3 m
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Supplier: RS Components, Ltd.
Description: . Not affected by UV light. Resistant to PCB cleaning solvents. Medium strength cure allows component removal for rework. Hardness (shore) 85. Dielectric constant 3.5 @ 1 kHz Type = Thermal Conductive Adhesive Product Material = Epoxy Package Type = Syringe Package Size = 10 ml
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 0.2500 to 0.3000 W/m-K
- Use Temperature: -40 to 266 F
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Supplier: ValueTronics International, Inc.
Description: and current programming and relay drivers. Limitless Power The ADM extends the normal power range of a programmable DC channel to 10 kW or more by using the flexibility of the AT 8000A controller to program high power external power supplies. One IEEE Address
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High dielectric constant SU8 composite photoresist for embedded capacitors
Embedded capacitors require the use of high dielec- tric constant ( high - k ) materials because of the limited space inside the PCB substrate.
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A study on bandwidth enhancement of 900/1800 dual band LTCC chip antenna by using equivalent circuit analysis
Thus, compared with printed circuit board ( PCB ) technology, LTCC technology can pro- vide 3D multilayer structure and high K dielectric that are both powerful tools to miniaturize RF passive components [6].
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Physical and dielectric properties of BaTiO3–fluoride–glass systems for nitrogen-fireable embedded capacitors
As an embedded capacitor in Cu- printed circuit board ( PCB ) substrates, specifically, thick film dielectrics with a high dielectric constant k >1,000 have a great potential in fabricating high-density packages [3–7].
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Tailored Dielectric Properties of High-k Polymer Composites via Nanoparticle Surface Modification for Embedded Passives Applications
Novel materials for embedded passive applications are in great and urgent demands, for which high dielectric constant ( k ), low dielectric loss and process compatibility with the PCBs are the most important prerequisites.
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Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package
The embedded capacitor uses the high - k thin dielectric film to achieve large capacitance and as it is buried inside the PCB or the package as an additional layer, it eliminates discrete capacitor pad inductance as well as the internal inductance …
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IMS2011: Day 2 Technology Report
This printed circuit board ( PCB ) material has high thermal conductivity of 1.44 W/m- K , z-axis dielectric constant of 3.5., and low loss tangent of 0.0013 at 10 GHz.
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Live From IMS2011: Rogers Boosts Thermal Conductivity In New High-Frequency Laminates
This printed circuit board ( PCB ) material has high thermal conductivity of 1.44 W/m- K , z-axis dielectric constant of 3.5., and low loss tangent of 0.0013 at 10 GHz.
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Circuit Laminate Keeps The Heat Out | Content content from Microwaves & RF
It has a thermal conductivity of 1.44 W/(m- K ) at +80Ca value considerably higher than that of other PCB laminates with similar relative dielectric constant (Dk) values (see figure).
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Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression
Because PCPL consists of two kinds of dielectric materials, it is not feasible to periodically embed the high - K rods inside the package or PCB substrate under the laminated fabrication technique.
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Controlling simultaneous switching noise with built-in decoupling capacitors
The on PCB decap consists of the layer between the L3 power layer and the L4 ground layer as shown in figure 11, if a high - k dielectric material can be used [SI [9].