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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive Fast cure at low temperatures Low temperature cure High temperature resistance Water resistant
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Type: Electrical Insulation / Dielectric
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Viscosity: 8,000 to 10,000 cP
- Use Temperature: -55 to 200 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for sealing and potting components that are exposed to high temperatures. It is resistant to chemicals, moisture, and high temperature. 1 gal
- Viscosity: 40,000 cP
- Thermal Conductivity: 0.53 W/m-K
- Dielectric Strength: 419.1000000000009 kV/in
- Features: Electronics, Encapsulating / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for bonding, sealing, and potting electronic components that are exposed to high temperatures. It offers excellent electrical and physical properties; it is
- Viscosity: 40,000 cP
- Thermal Conductivity: 0.53 W/m-K
- Dielectric Strength: 419.1000000000009 kV/in
- Features: Electronics, Encapsulating / Potting
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Supplier: Epoxies Etc...
Description: 20-3066 is a 100% solids epoxy system which exhibits outstanding high temperature resistance. In addition to its' high temperature resistance, 20-3066 also has excellent chemical, solvent, and moisture resistance.
- Use Temperature: -4 to 437 F
- Tensile Strength (Break): 14,000 psi
- Dielectric Strength: 10.000000000000002 kV/in
- Dielectric Constant (Relative Permittivity): 0.4
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high
- Viscosity: 400 cP
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
- Dielectric Strength: 635.0000000000014 kV/in
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system
- Viscosity: 1,600 cP
- Use Temperature: -67 to 266 F
- Coeff. of Thermal Expansion (CTE): 83.33333333333333 µin/in-F
- Tensile Strength (Break): 1,600 psi
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Supplier: Mitsui Chemicals America, Inc.
Description: SOLAR ASCE™ is the brand name of our cross-linking polyolefin (PO) base encapsulating sheet. Mitsui Chemicals was the pioneer in developing a cross-linking type PO encapsulant and have been in high volume manufacturing for several years. The various properties from our unique material
- Type: Film / Flexible Substrate
- Materials: Plastic / Polymer, Polyolefin (PE, HDPE, PP)
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik A329-1 Epoxy Encapsulant one component is used for insulating applications. It is non-conductive, sag resistant, has good thermal stability, and high temperature performance. 1 gal Can.
- Thermal Conductivity: 0.4 W/m-K
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Supplier: Epoxies Etc...
Description: 20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to it’s high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
- Use Temperature: -4 to 446 F
- Thermal Conductivity: 0.54806602 W/m-K
- Tensile Strength (Break): 14,000 psi
- Dielectric Strength: 419.99999999999983 kV/in
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Supplier: CHT USA Inc.
Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep
- Use Temperature: -65.2 to 500 F
- Thermal Conductivity: 0.31 W/m-K
- Dielectric Strength: 353.06000000000074 kV/in
- Viscosity: 9,000 cP
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Supplier: Epoxies Etc...
Description: 20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
- Viscosity: 12,000 cP
- Use Temperature: -94 to 500 F
- Thermal Conductivity: 0.5769116 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 µin/in-F
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Supplier: Chemence Inc.
Description: KS915 is a high strength, high temperature silicone RTV engineered for applications requiring fast development of physical properties and excellent adhesion. KS915 offers the highest temperature resistance of any acetoxy cure silicone currently available. When cured, the
- Viscosity: 500,000 cP
- Features: Building / Construction, Ceramic / Glass, Metal, Plastic
- Form / Function: Die Bonding Adhesive / Compound
- Chemical System: Silicone
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Supplier: Ellsworth Adhesives
Description: ResinLab EP1282 Clear is a two component, room temperature or heat curing, unfilled, flame resistant, epoxy encapsulant that is used for medium castings. It offers good wetting, semi-rigid polymer, high gloss surface, good thermal shock and cycling properties. It is resistant to
- Thermal Conductivity: 0.2 W/m-K
- Elongation: 56 %
- Tensile Strength (Break): 2,400 psi
- Dielectric Strength: 778 kV/in
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Viscosity: 150 to 300 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 31.666666666666664 to 116.66666666666666 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.36
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Supplier: DuPont Electronics & Imaging
Description: HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature performance, advanced material
- Use Temperature: 437 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 µin/in-F
- Tensile Strength (Break): 23,931.0784939375 psi
- Elongation: 170 %
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability
- Use Temperature: 500 F
- Coeff. of Thermal Expansion (CTE): 55.55555555555556 µin/in-F
- Tensile Strength (Break): 4,680 psi
- Elongation: 114.7 %
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Supplier: Master Bond, Inc.
Description: These bonds retain their pertinent physical strength and chemical resistance properties after prolonged exposure to high temperatures. Typical lap shear strength are in the order of 2400-2500psi at ambient temperatures. After heat aging for 1000 hours at 500°F slightly less than
- Viscosity: 250,000 to 500,000 cP
- Use Temperature: -80 to 600 F
- Tensile Strength (Break): 3,000 to 4,000 psi
- Elongation: 2.1 %
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Supplier: OMEGA Engineering, Inc.
Description: assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement can be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What degree of thermal conductivity is needed? What degree
- Use Temperature: 1,549.4 to 2,598.8 F
- Thermal Conductivity: 0.64902555 to 1.7307348 W/m-K
- Coeff. of Thermal Expansion (CTE): 2.5999999999999996 to 12.4 µin/in-F
- Tensile Strength (Break): 250 to 425 psi
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Supplier: Master Bond, Inc.
Description: formulated to cure rapidly at elevated temperatures with a 100 to 30 mix ratio, by weight, to produce high physical strength and chemically resistant products at both ambient and elevated temperatures. Master Bond Polymer System EP45HT can be applied easily by brushing or with a
- Viscosity: 7,000 to 100,000 cP
- Use Temperature: -80 to 500 F
- Tensile Strength (Break): 12,400 psi
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The
- Viscosity: 8,000 to 10,000 cP
- Use Temperature: -60 to 400 F
- Tensile Strength (Break): 4,200 to 8,900 psi
- Elongation: 1.8 to 7.2 %
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Supplier: Allied Electronics, Inc.
Description: Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Maximum operating temperature: 275°C/527°F
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Viscosity: 4,000 to 7,000 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 11.666666666666666 to 71.11111111111111 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.18
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Supplier: Allied Electronics, Inc.
Description: Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Maximum operating temperature: 275°C/527°F
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Supplier: Epoxy Technology
Description: optical properties. Additionally, our products are found in dental and surgical tools, catheters and diagnostic probes. EPO-TEK® epoxies also fabricate the circuitry for bench-top instruments, as well as ensure high performance in radiation detection heavy machinery. Even lifestyle devices,
- Viscosity: 150 to 300 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 35 to 99.44444444444444 µin/in-F
- Index of Refraction: 1.5194
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Supplier: Newark, An Avnet Company
Description: High Temperature Rigid Polyurethane Potting and Encapsulating Compound / 3 kg, 2.55 L Kit
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Supplier: Newark, An Avnet Company
Description: High Temperature, Chemically Resistant, Epoxy Potting and Encapsulating Compound / 2.7 qt Kit
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Supplier: Littelfuse, Inc.
Description: temperature measurement, temperature control and temperature compensation applications. Options: Special lead materials and lengths Special encapsulants or probe housings Non-standard resistance values and tolerances Point matched at specified temperatures Kynar
- Sensor Type: Temperature Sensor
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 1,400 to 2,200 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1 W/m-K
- Coeff. of Thermal Expansion (CTE): 17.22222222222222 to 78.88888888888889 µin/in-F
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Features: Air Setting / Film Drying, Ceramic / Glass, Encapsulating / Potting, Grease / Paste, Metal, Paper / Paperboard, Plastic, Thermal / Heat Conductive
- Type: Electrical Insulation / Dielectric
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL LA3032-78 ) LOCTITE ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to engineering plastics. Typical applications are Ink Jet applications
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Coilcraft CPS
Description: The MS376RAA inductors feature high SRF and excellent Q values. Their ceramic cores make 1% tolerances practical and economical and ensure the utmost in thermal stability, predictability and consistency. This robust version of Coilcraft’s standard 1206CS series features a high
- Inductance Range: 0.018 microH
- Inductance Tolerance: 1 to 5 (+/- %)
- DCR: 0.1 ohms
- Quality Factor (Q): 50
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Featured Products Top
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. Electronic Applications Electronic components and devices must meet high reliability demands in challenging environments, such as extreme temperatures, vibration or exposure to moisture or harsh chemicals. CONAP®, Conathane®, ELAN-Ton®and Bectron®potting materials (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
comments Jimmy Shu, Product Manager Adhesives and Encapsulants at MacDermid Alpha. “The product meets market reliability requirements such as adhesion strength in high temperatures and high humidity making it an excellent solution for camera module, optical and other applications that are very sensitive to high temperature exposure.” (read more)
Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions -
Featuring a high glass transition temperature of 200-210°C, it resists high temperatures up to 550°F. This system has advantageous flow properties combined with a long woking life. I has an element of toughness, and good physical strength properties. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
One component system Combines flexibility and toughness with high temperature resistance Ideal for potting and encapsulation Unused material is easy to reprocess Withstands rigorous thermal cycling and shocks Non halogen filler (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Resilient Encapsulant for PCB and Electronic Assembly Engineered for rapid, reliable protection of complex electronic and microelectronic assemblies, this light-curable encapsulant enhances resistance to moisture, thermal cycling, and abrasion while maintaining (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive. “Supreme 3DM-85 is designed for heat sensitive components that cannot withstand high temperatures (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
volume. A 100 gram batch has a 60-90 minute working life at room temperature, which can be extended by using shallower mixing vessels or mixing smaller size batches. This system is formulated to cure at room temperatures or more rapidly at elevated temperatures. Additional (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
. Thermal Interface Materials During the charging cycle of electric vehicles high temperatures are generated which need to be managed as they have a negative effect on the performance and lifetime of the components. Thermal Interface Materials are the materials (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically. EP29LPAO delivers a thermal conductivity of 9 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
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Optical Transmission Properties of Adhesives
is noteworthy for its low index of refraction and its ability to transmit light very well from 225-2500 nanometers. It is a silicone compound that combines remarkable flexibility, high temperature resistance, superb electrical insulation and outstanding optical clarity. These properties enable it to be used
More Information Top
Indicates content that may require registration and/or purchase.
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Thermal decay characteristic of fiber Bragg gratings written into Sn doped fibers loaded hydrogen and a novel encapsulation method
FIG.7 Spectrogram before and after the high temperature encapsulation ( the purple one is the original spectrogram and the yellow one is the finished spectrogram) .
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Design consideration of high temperature SiC power modules
The concept is based on the use of double metal or DCB leadframes, direct leadframe-to- chip bonding, and high temperature encapsulation materials.
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Development of an extreme temperature range silicon carbide power module for aerospace applications
We selected six commercially available high temperature encapsulation materials and tested them beyond 200°C.
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Piezoresistor Design and Applications
Piezoelectric resonators enable the lowest possible motional impedance [162] but the inclusion of multiple metal layers can degrade their frequency stability and prevent high temperature encapsulation [163, 164].
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CERAMIC ABSTRACTS
High temperature encapsulation of thermoelectric materials, (3) 84f.
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Metal–support interactions on rhodium model catalysts
For higher temperatures encapsulation by titanium oxide species occurred, i.e., the SMSI effect could be demon- strated.
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NCPV FY 1998 Annual Report
STR performed an information search for alternate curative technologies and higher temperature encapsulants .
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Packaging of high-temperature planar power modules interconnected by low-temperature sintering of nanosilver paste
A rigid high temperature encapsulation is added after DC current testing.
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Dielectric and thermal properties of Polyamide-imide (PAI) films
The development of high temperature electronics (SiC, GaN, diamond power devices) for operation in the range from 200 to 300 °C implies the development of suitable high temperature encapsulation materials with good electrical properties in this temperature range [1].
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Solid type cavity fill and under fill materials for new IC packaging applications
Higher temperature encapsulating at 150C is also possible to make the cavity filling with no void and no unfilling.