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Supplier: Henkel Corporation - Industrial
Description: fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance. Silicone free Halogen free RoHS compliant Easily peelable without residues Zero outgassing @ 100
- Chemical / Polymer System Type: Polyamide
- Form / Function: Encapsulant / Potting Compound
- Use Temperature: 40 to 212 F
- Viscosity: 4000 cP
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required.
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: , sealing and caulking applications requiring low weight and excellent dielectric properties. LOCTITE STYCAST 4640 can be used with LOCTITE CAT 50 or LOCTITE CAT 50-2 AMB. Two components Lightweight Thermally conductive High temperature resistance Readily pourable Room
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 200 psi
- Use Temperature: 85 to 500 F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE® 3141 Hysol Epoxy Resin, High Temperature is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol hardeners. The system is formulated for high temperature potting and encapsulating applications.
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive Fast cure at low temperatures Low temperature cure High temperature resistance Water resistant
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: OMEGA Engineering, Inc.
Description: , sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement can be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What degree of thermal
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 to 12.4 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: Application Potting, sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement should be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 6.2 to 13 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 31.67 to 117 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 3.36
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for sealing and potting components that are exposed to high temperatures. It is resistant to chemicals, moisture, and high temperature. 1 gal
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 419 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: DuPont Electronics & Imaging
Description: processing. Pyralux® HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature performance,
- Chemical / Polymer System Type: Specialty / Other
- Coeff. of Thermal Expansion (CTE): 36.11 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.2
- Dielectric Strength: 4089 to 6985 kV/in
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2 CN Clear, formerly Emerson and Cuming, is a two component, room temperature curing, silicone encapsulant that is used for potting, replacing, and repairing applications. It offers good visibility, high temperature properties, repairability, and
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 1700 cP
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Supplier: Epoxy Technology
Description: requires their optical properties. Additionally, our products are found in dental and surgical tools, catheters and diagnostic probes.? EPO-TEK® epoxies also fabricate the circuitry for bench-top instruments, as well as ensure high performance in radiation detection heavy machinery
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 35 to 99.44 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Electrical / Electronics Applications: Optoelectronics / Photonics
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for bonding, sealing, and potting electronic components that are exposed to high temperatures. It offers excellent electrical and physical properties; it is
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 419 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: Resin Designs 51606MV Urethane Encapsulant Clear is a two component, room temperature curing polyurethane that is used for encapsulation and potting applications. It is high performance and moisture resistant. 2:1 mix ratio by volume. 50 mL Mixpac.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Elongation: 200 %
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Supplier: CHT USA Inc.
Description: CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 353 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Chemence Inc.
Description: KS915 is a high strength, high temperature silicone RTV engineered for applications requiring fast development of physical properties and excellent adhesion. KS915 offers the highest temperature resistance of any acetoxy cure silicone currently available. When cured, the
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Form / Function: Die Bonding Adhesive / Compound
- Viscosity: Up to 500000 cP
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Supplier: Epoxies Etc...
Description: 20-3066 is a 100% solids epoxy system which exhibits outstanding high temperature resistance. In addition to its' high temperature resistance, 20-3066 also has excellent chemical, solvent, and moisture resistance.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxies Etc...
Description: 20-2100 is a high performance two component flexible urethane system. This easy to use polyurethane is very low in viscosity and ideal for potting or encapsulating delicate electronic components. 20-2100 exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. This system
- Coeff. of Thermal Expansion (CTE): 83.33 µin/in-F
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.1
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Supplier: DigiKey
Description: HIGH TEMPERATURE RIGID POLYURETH
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts.
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
- Use Temperature: -54 to 260 F
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Supplier: Mitsui Chemicals America, Inc.
Description: SOLAR ASCE™ is the brand name of our cross-linking polyolefin (PO) base encapsulating sheet. Mitsui Chemicals was the pioneer in developing a cross-linking type PO encapsulant and have been in high volume manufacturing for several years. The various properties from our unique material
- Materials of Construction: Plastic / Polymer, Polyolefin (PE, HDPE, PP)
- Type: Film / Flexible Substrate
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Supplier: Master Bond, Inc.
Description: compound. These bonds retain their pertinent physical strength and chemical resistance properties after prolonged exposure to high temperatures. Typical lap shear strength are in the order of 2400-2500psi at ambient temperatures. After heat aging for 1000 hours at 500°F slightly
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: protection of LED drivers, its properties also make it suitable for a wide range of applications. It offers excellent high-temperature performance, making it ideal for use in applications where the operating temperature may reach up to 200°C. Its flexibility also allows it to withstand
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: Aremco Products, Inc.
Description: Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide,
- Chemical / Polymer System Type: Silicone, Ceramic / Inorganic Cement
- Composition: Filled
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.2 to 4.5
- Dielectric Strength: 565 kV/in
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Supplier: Hernon Manufacturing, Inc.
Description: Hernon? 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond? 397 will change from amber-yellow to a reddish brown upon cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-3300 is a two part epoxy system formulated to meet the most critical electronic encapsulating requirements. This system has low shrinkage, high tensile and compressive strength.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.11 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL LA3032-78 ) LOCTITE ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to engineering plastics. Typical applications are Ink Jet applications
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: RS Components, Ltd.
Description: High degree of toughness Product Material = PUR Package Type = Pack Package Size = 250 g Special Properties = Encapsulating Compound, Flame Retardant, Thermal Conductivity Cure Time = 24 h Hardness = 85 Shore A Thermal Conductivity = 0.65W/mK Colour = Black Maximum Operating
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.6500 W/m-K
- Use Temperature: -40 to 230 F
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 803 A low viscosity two-component general purpose electrical encapsulant/molding compound that is designed for applications requiring high-impact strength, thermal shock resistance, good corrosion resistance, and good water resistance. INSTAbond® 803 is suitable for service
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Use Temperature: -58 to 248 F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21HT is a two component, room temperature curing epoxy adhesive, sealant and coating featuring a forgiving 1 to 1 mix ratio and high temperature resistance up to 400°F. EP21HT produces high strength, durable bonds that hold up well to thermal
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 28 µin/in-F
- Composition: Two Component System
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts.
- Chemical / Polymer System Type: Silicone
- Industry: Electronics
- Use: Encapsulant / Potting Compound
- Use Temperature: -54 to 260 F
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Featured Products Top
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. Electronic Applications Electronic components and devices must meet high reliability demands in challenging environments, such as extreme temperatures, vibration or exposure to moisture or harsh chemicals. CONAP®, Conathane®, ELAN-Ton®and Bectron®potting materials (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
comments Jimmy Shu, Product Manager Adhesives and Encapsulants at MacDermid Alpha. “The product meets market reliability requirements such as adhesion strength in high temperatures and high humidity making it an excellent solution for camera module, optical and other applications that are very sensitive to high temperature exposure.” (read more)
Browse Encapsulants and Potting Compounds Datasheets for MacDermid Alpha Electronics Solutions -
Featuring a high glass transition temperature of 200-210°C, it resists high temperatures up to 550°F. This system has advantageous flow properties combined with a long woking life. I has an element of toughness, and good physical strength properties. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
One component system Combines flexibility and toughness with high temperature resistance Ideal for potting and encapsulation Unused material is easy to reprocess Withstands rigorous thermal cycling and shocks Non halogen filler (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Resilient Encapsulant for PCB and Electronic Assembly Engineered for rapid, reliable protection of complex electronic and microelectronic assemblies, this light-curable encapsulant enhances resistance to moisture, thermal cycling, and abrasion while maintaining (read more)
Browse Encapsulants and Potting Compounds Datasheets for Dymax -
the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive. “Supreme 3DM-85 is designed for heat sensitive components that cannot withstand high temperatures (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
volume. A 100 gram batch has a 60-90 minute working life at room temperature, which can be extended by using shallower mixing vessels or mixing smaller size batches. This system is formulated to cure at room temperatures or more rapidly at elevated temperatures. Additional (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
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. Thermal Interface Materials During the charging cycle of electric vehicles high temperatures are generated which need to be managed as they have a negative effect on the performance and lifetime of the components. Thermal Interface Materials are the materials (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically. EP29LPAO delivers a thermal conductivity of 9 (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
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Optical Transmission Properties of Adhesives
is noteworthy for its low index of refraction and its ability to transmit light very well from 225-2500 nanometers. It is a silicone compound that combines remarkable flexibility, high temperature resistance, superb electrical insulation and outstanding optical clarity. These properties enable it to be used
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Indicates content that may require registration and/or purchase.
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Thermal decay characteristic of fiber Bragg gratings written into Sn doped fibers loaded hydrogen and a novel encapsulation method
FIG.7 Spectrogram before and after the high temperature encapsulation ( the purple one is the original spectrogram and the yellow one is the finished spectrogram) .
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Design consideration of high temperature SiC power modules
The concept is based on the use of double metal or DCB leadframes, direct leadframe-to- chip bonding, and high temperature encapsulation materials.
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Development of an extreme temperature range silicon carbide power module for aerospace applications
We selected six commercially available high temperature encapsulation materials and tested them beyond 200°C.
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Piezoresistor Design and Applications
Piezoelectric resonators enable the lowest possible motional impedance [162] but the inclusion of multiple metal layers can degrade their frequency stability and prevent high temperature encapsulation [163, 164].
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CERAMIC ABSTRACTS
High temperature encapsulation of thermoelectric materials, (3) 84f.
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Metal–support interactions on rhodium model catalysts
For higher temperatures encapsulation by titanium oxide species occurred, i.e., the SMSI effect could be demon- strated.
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NCPV FY 1998 Annual Report
STR performed an information search for alternate curative technologies and higher temperature encapsulants .
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Packaging of high-temperature planar power modules interconnected by low-temperature sintering of nanosilver paste
A rigid high temperature encapsulation is added after DC current testing.
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Dielectric and thermal properties of Polyamide-imide (PAI) films
The development of high temperature electronics (SiC, GaN, diamond power devices) for operation in the range from 200 to 300 °C implies the development of suitable high temperature encapsulation materials with good electrical properties in this temperature range [1].
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Solid type cavity fill and under fill materials for new IC packaging applications
Higher temperature encapsulating at 150C is also possible to make the cavity filling with no void and no unfilling.