High Temperature Epoxy Adhesives

Description: 10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with excellent electrical insulation properties. BENEFITS: •

• Viscosity: 1,500 to 9,450 cP
• Use Temperature: -85 to 311 F
• Thermal Conductivity: 0.50479765 W/m-K
• Tensile Strength (Break): 3,000 to 4,000 psi

Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI

• Viscosity: 10,000 cP
• Use Temperature: -50 to 130 F
• Tensile Strength (Break): 4,500 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: 10-3445 is a two component epoxy adhesive designed to offer both high shear and peel strength. It does not contain any solvents and offers a fast room temperature cure.

• Viscosity: 12,000 to 20,000 cP
• Features: Epoxy (EP)
• Industry: OEM / Industrial
• Cure / Technology: Room Temperature Curing, Two Component System

Description: 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.

• Viscosity: 5,000 cP
• Use Temperature: -40 to 250 F
• Tensile Strength (Break): 2,500 psi
• Dielectric Strength: 599.9999999999991 kV/in

Description: E-110 is a high performance unfilled single component modified epoxy adhesive which can be cured at125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable

• Use Temperature: 257 to 392 F
• Substrate Compatibility: Dissimilar Substrates, Metal
• Features: Epoxy (EP)
• Cure / Technology: Single Component System, Thermosetting / Crosslinking

Description: Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat curing schedule is useful in bonding applications involving temperature sensitive

• Viscosity: 40,000 to 70,000 cP
• Use Temperature: -100 to 500 F
• Thermal Conductivity: 0.58 to 0.72 W/m-K
• Tensile Strength (Break): 6,000 to 10,000 psi

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,

• Viscosity: 1,800 to 3,600 cP
• Use Temperature: 572 F
• Thermal Conductivity: 12.6 to 26.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F

Description: Adhesive Epoxy, 2 Part Structural, High Temperature

Description: Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.

• Applied Thickness / Gap Fill: 0.004 to 0.006 inch
• Viscosity: 5,000 to 15,000 cP
• Use Temperature: -80 to 350 F
• Coeff. of Thermal Expansion (CTE): 30,555,555.555555556 to 33,333,333.333333332 µin/in-F

Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.

• Viscosity: 50,000 cP
• Use Temperature: -60 to 140 F
• Tensile Strength (Break): 3,000 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: ADHESIVE COMPOUND, EPOXY RESIN HIGH TEMPERATURE APPLICATION

Description: 10-3008 is a filled, high performance structural epoxy adhesive. 10-3008 is a flexible adhesive with outstanding lap shear and peel strength. It is a great choice for bonding substrates of differing coefficients of thermal expansion. 10-3008 is also an excellent

• Viscosity: 96,000 cP
• Tensile Strength (Break): 2,700 to 3,200 psi
• Features: Epoxy (EP), Filled
• Industry: OEM / Industrial

Description: Adhesive Compound, Epoxy Resin High Temperature Application

Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than

• Use Temperature: -452.47 to 250 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
• Features: Anti-static / ESD Control, Die Bonding Adhesive / Compound, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Epoxy (EP), Liquid, Other, Specialty / Other, Unfilled
• Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer

Description: 3M™ Scotch-Weld™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M™ Scotch-Weld™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent

• Viscosity: 6,000 to 1,000,000 cP
• Thermal Conductivity: 0.2007652368 to 0.2924941812 W/m-K
• Tensile Strength (Break): 4,290 psi
• Elongation: 2 to 7 %

Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium

• Use Temperature: -55 to 200 F
• Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 38.888888888888886 µin/in-F
• Tensile Strength (Break): 2,000 psi
• Substrate Compatibility: Ceramic / Glass, Metal, Plastic

Description: The industrial window is wide, the operating time is 120min, and the bonding strength after curing is high. It is a high-viscosity industrial-grade epoxy adhesive with long service life. Once mixed, the two-component epoxy resin cures at room temperature to

• Features: Epoxy (EP)
• Cure / Technology: Room Temperature Curing, Two Component System

Description: PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach oven cure and its superb rheology allows

• Viscosity: 8,500 cP
• Thermal Conductivity: 9.23 W/m-K
• Features: Die Bonding Adhesive / Compound, Electrically Conductive, Epoxy (EP), Filled, Liquid, Thermal / Heat Conductive
• Industry: Electrical Power / HV, Electronics, OEM / Industrial, Semiconductors / IC Packaging

Description: This specification covers a two-component compound, an epoxy resin base and a hardener in the form of a paste.

Description: This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.

Description: Master Bond Polymer Adhesive EP21D is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
• Elongation: 5 %

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Viscosity: 3,000 to 5,000 cP
• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 106.66666666666666 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.34

Description: Parker LORD® 320/322 Epoxy Adhesive is a two component, general purpose epoxy system that is used for primerless bonding to automotive sheet molded compounds, rubber, plastics, polyester thermosets, and prepared metals. It is resistant to sunlight, humidity, extreme

• Viscosity: 300,000 to 2,000,000 cP
• Tensile Strength (Break): 4,440 psi
• Elongation: 3 %
• Features: Epoxy (EP)

Description: Parker LORD® 320/322 Epoxy Adhesive is a two component, general purpose epoxy system that is used for primerless bonding to automotive sheet molded compounds, rubber, plastics, polyester thermosets, and prepared metals. It is resistant to sunlight, humidity, extreme

• Viscosity: 300,000 to 2,000,000 cP
• Tensile Strength (Break): 4,440 psi
• Elongation: 3 %
• Features: Epoxy (EP)

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,

• Viscosity: 25,000 to 45,000 cP
• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,

• Viscosity: 800 to 1,600 cP
• Use Temperature: 482 F
• Thermal Conductivity: 1.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F

Description: It is suitable for a wide range of applications requiring fast curing, good environmental performance and high adhesion. The product cures quickly when exposed to temperatures as low as 100° C and achieves excellent adhesion to plastics, metals and glass. Specially designed for welding

• Features: Epoxy (EP), Specialty / Other
• Cure / Technology: Single Component System

Description: Henkel Loctite EA 9430 is a two component, low viscosity, high strength epoxy adhesive with resistance to chemicals and exceptional high temperature performance. 2 lb Kit.

• Viscosity: 12,000 cP
• Tensile Strength (Break): 5,300 psi
• Elongation: 6 %
• Features: Epoxy (EP)

Description: Henkel Loctite EA 608 is a two component, medium viscosity, high strength, fast setting epoxy adhesive that cures at room temperature. 2.8 oz Kit.

• Viscosity: 20,000 to 450,000 cP
• Dielectric Strength: 1,200 kV/in
• Features: Epoxy (EP)
• Substrate Compatibility: Metal, Plastic

Description: Techsil® EP20860 is a two part, rapid curing epoxy adhesive that cures at room temperature with low shrinkage and forms an ultra-clear bond line. Techsil® EP20860 offers a flexible and impact resistant bond that is resistant to a wide range of chemicals with excellent electrical

• Features: Epoxy (EP)
• Cure / Technology: Thermosetting / Crosslinking

Description: boards. Blue in color, this two-part adhesive develops strong, durable, high impact bonds at room temperature, which improve heat transfer while maintaining electrical insulation. Ther-O-Bond 1600 bonds readily to itself, to metals, silica, steatite, alumina, sapphire and other

Description: Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With good processability and high thermal resistivity,

• Coeff. of Thermal Expansion (CTE): 58.33333333333333 µin/in-F
• Tensile Strength (Break): 1,595.40523292917 psi
• Elongation: 222 %
• Dielectric Strength: 3,124.2000000000066 kV/in

Description: Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Maximum operating temperature: 275°C/527°F

Description: Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Maximum operating temperature: 275°C/527°F

Description: MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to

• Industry: Electronics
• Features: Epoxy (EP), Thermal / Heat Conductive
• Cure / Technology: Thermosetting / Crosslinking