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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Filled
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve
- Coeff. of Thermal Expansion (CTE): 9.44 to 36.11 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
- Dielectric Strength: Over 381 kV/in
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Supplier: Protavic America, Inc.
Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Filled
- Industry: Automotive, Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging
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Description: It is a two-component epoxy resin structural adhesive. At room temperature (25°C), the operating time is 20 minutes, the curing position is 90 minutes, and the curing is complete in 24 hours. After being fully cured, it has the characteristics of high shear, high
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Description: The industrial window is wide, the operating time is 120min, and the bonding strength after curing is high. It is a high-viscosity industrial-grade epoxy adhesive with long service life. Once mixed, the two-component epoxy resin cures at room temperature to
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require
- Coeff. of Thermal Expansion (CTE): 18.89 to 71.67 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.59
- Features: Electrical Insulating / Dielectric, Thermal / Heat Insulating
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Supplier: Epoxy Technology
Description: used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices.
- Coeff. of Thermal Expansion (CTE): 21.11 to 52.22 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Photonics / Optoelectronics, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: 10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Strength: 600 kV/in
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting
- Industry: Electronics, OEM / Industrial, Other
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Supplier: DuPont Electronics & Imaging
Description: , Pyralux® GPL adhesive is ideal for high volume processing and has been tested in low-layer counts FPC manufacturing. Key Features and Benefits: Excellent low loss performance Drop-in solution - similar lamination temperature as conventional epoxy adhesive Wide
- Coeff. of Thermal Expansion (CTE): 58.33 µin/in-F
- Dielectric Constant (Relative Permittivity): 2.8
- Dielectric Strength: 3124 kV/in
- Elongation: 222 %
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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium
- Coeff. of Thermal Expansion (CTE): 36.11 to 38.89 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Description: It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and
- Cure Type / Technology: Two Component System
- Industry: Electronics
- Use Temperature: -40 to 302 F
- Viscosity: 9000 to 12000 cP
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Supplier: Epoxies Etc...
Description: 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.11
- Dielectric Strength: 550 kV/in
- Dissimilar Substrates: Yes
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Description: It is suitable for a wide range of applications requiring fast curing, good environmental performance and high adhesion. The product cures quickly when exposed to temperatures as low as 100° C and achieves excellent adhesion to plastics, metals and glass. Specially designed for welding
- Cure Type / Technology: Single Component System, Specialty / Other
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Supplier: Epoxies Etc...
Description: 10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with excellent electrical insulation properties. BENEFITS: •
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Strength: 400 kV/in
- Features: Electrical Insulating / Dielectric
- Industry: OEM / Industrial
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Supplier: Master Bond, Inc.
Description: Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems.
- Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
- Coeff. of Thermal Expansion (CTE): 3.06E7 to 3.33E7 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.9
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera
- Coeff. of Thermal Expansion (CTE): 33.89 to 106 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Index of Refraction: 1.57
- Industry: Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera
- Coeff. of Thermal Expansion (CTE): 28.33 to 98.89 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Index of Refraction: 1.57
- Industry: Medical / Food (Sanitary / FDA), Optical Grade / Material, Photonics / Optoelectronics
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Supplier: Koford Engineering, LLC
Description: E-114 is a low cure temperature, non sag high performance filled single component epoxy adhesive whichcan be cured at 100°C or 120°C to provide good shear strength in combination with good temperatureresistanc e. Especially suitable for assembley applications such as
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Industry: Electronics
- Substrate / Material Compatibility: Metal
- Use Temperature: 284 to 392 F
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Supplier: Koford Engineering, LLC
Description: E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Metal
- Use Temperature: 257 to 392 F
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Supplier: Koford Engineering, LLC
Description: E-110 is a high performance unfilled single component modified epoxy adhesive which can be cured at125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Metal
- Use Temperature: 257 to 392 F
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Supplier: Epoxies Etc...
Description: 10-3445 is a two component epoxy adhesive designed to offer both high shear and peel strength. It does not contain any solvents and offers a fast room temperature cure.
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Industry: OEM / Industrial
- Viscosity: 12000 to 20000 cP
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Supplier: Koford Engineering, LLC
Description: E-107 is a high performance silica filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Especiall y suitable for bonding magnets and other applications where
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Metal, Other
- Use Temperature: 356 to 392 F
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive 1838 is a rigid, two-part epoxy. 4:5 mix ratio, 60 minute work life and handling strength in 8 hours. 3M™ Scotch-Weld™ Epoxy Adhesive 1838 adhesive cures at room temperature with high shear strength and excellent
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 6.06 to 6.1
- Dielectric Strength: 585 to 600 kV/in
- Elongation: 2 to 7 %
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can be obtained with this exceptionally thermally stable and chemically resistant
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.8
- Dielectric Strength: 400 to 450 kV/in
- Dissimilar Substrates: Yes
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Weld 2214 gray one-part epoxy adhesive is compatible with metal materials with a 40 min @ 250F cure time. Delivers great performance with a shear strength of 4500 psi, tensile strength of 10000 psi and peel strength of 5 piw. Minimum to maximum operating temperatures
- Features: Leveling / Filling Compound
- Use Temperature: -67 to 250 F
- Viscosity: 1.00E6 cP
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Weld 2214 gray one-part epoxy adhesive is compatible with metal materials with a 40 min @ 250F cure time. Delivers great performance with a shear strength of 4500 psi, tensile strength of 10000 psi and peel strength of 5 piw. Minimum to maximum operating temperatures
- Features: Leveling / Filling Compound
- Use Temperature: -67 to 250 F
- Viscosity: 1.00E6 cP
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Supplier: Techsil Limited
Description: Techsil® EP20860 is a two part, rapid curing epoxy adhesive that cures at room temperature with low shrinkage and forms an ultra-clear bond line. Techsil® EP20860 offers a flexible and impact resistant bond that is resistant to a wide range of chemicals with excellent electrical
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Techsil Limited
Description: MG Chemicals 832HT is a high temperature epoxy designed for encapsulating and potting electronics in high temperature environments. It is also an ideal encapsulant for very chemically aggressive environments and applications where extreme physical strength is
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Electrical Insulating / Dielectric, EMI / RFI Shielding Material, Anti-static / ESD Control
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Other
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. This low heat curing schedule is useful in bonding applications involving temperature sensitive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 3.5 to 4.1
- Dissimilar Substrates: Yes
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Laminating / Composites, Leveling / Filling Compound, Non-corrosive Cure, Thermal / Heat Insulating
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Supplier: SAE International
Description: This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.
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Description: 3M™ Scotch-Weld™ Epoxy Adhesive EC 2615 and EC 2615 LW (Long Worklife) are two component epoxy adhesives which cure at room temperature or with heat to form a tough, impact-resistance bond. They have excellent adhesion to many metal and plastic substrates.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Metal, Plastic
- Viscosity: 8000 to 800000 cP
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Description: Two component epoxy adhesive that cures at room temperature or with heat to form a tough, impact-resistant bond. High shear strength. High peel strength. Outstanding environmental resistance. 20 minute worklife. Excellent adhesion to many metal and plastic
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Industry: Aerospace, OEM / Industrial
- Substrate / Material Compatibility: Metal, Plastic
- Viscosity: 8000 to 800000 cP
Find Suppliers by Category Top
Featured Products Top
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Master Bond EP13LTE is a one part epoxy system for structural bonding applications that features high temperature resistance, dimensional stability and NASA low outgassing approval. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
high temperature electrical potting compounds and powdered epoxies for electrical insulating and electric conductivity as well as UV curable adhesives for temporary metal maskants and insulating coatings. (read more)
Browse Epoxy Adhesives Datasheets for Beacon Adhesives, Inc. -
Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. It is a thermally stable formulation with a high glass transition temperature of 410°F (210°C). It retains its bond (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. It is easy to handle with a long open time of 12-24 hours at 75°F for a 100 gram batch. It has a non (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 10HT continues to set the standard for high-performance bonding in extreme environments. In published research studies, this toughened, one-component epoxy has been utilized for structural bonding in supersonic aircraft assemblies, high-temperature electronics packaging, and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Supreme 17HTND-2 is thermally stable epoxy for bonding and sealing. It is a one part system, featuring a high glass transition temperature (Tg) of 410°F (210°C). It also meets NASA low outgassing specifications per ASTM E595 testing. It has reliable electrical insulation properties and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
EP21TCHT-1 Two component epoxy compound for high performance bonding and sealing challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
-5 minutes for a mixed 50 gram batch. The exact fixture time in an application context can vary from a few minutes to several hours, depending on multiple factors including, but not limited to the size of the components, the substrates being bonded, curing temperature and the amount of adhesive applied (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
high-temperature epoxy that was first used in the Mercury manned spaceflight program. These Epoxylite® Hi Temp epoxy systems have since found many other high reliability applications (read more)
Browse Epoxy Adhesives Datasheets for ELANTAS North America LLC
Conduct Research Top
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High-Temperature Epoxy Adhesive for Metal: A Comprehensive Guide
Epoxy adhesive is popular for bonding metal surfaces due to its strength, durability, and chemical resistance. High-temperature epoxy adhesive for metal is specially formulated to withstand extreme temperatures and harsh environments. In this blog post, we will discuss the properties, applications
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Which is Stronger, Epoxy or Resin?
components. Epoxy is typically used in the aerospace and automotive industries, as it is resistant to high temperatures and has a low expansion coefficient. Epoxy is also used in the electronics industry, as it can be used to create insulating coatings for printed circuit boards. This material
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Industrial Adhesive Solution for High Peel Strength
The DM-6012 series products developed by DeepMaterial have a wide industrial window, an operating time of 120 minutes, and high bonding strength after curing. This is a high viscosity, long life, industrial grade epoxy adhesive. After mixing, the two-part epoxy cures at room temperature to form
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What is the strongest metal adhesive?
adhesives are the most common type of metal adhesive. They are quick-drying and have good shear strength. Epoxy adhesives are waterproof and have high heat resistance. Urethane adhesives have high impact resistance and good UV stability. Metal adhesives are designed to withstand high temperatures
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Industrial Adhesive Applications
DeepMaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer,supply industrial appliance structural bonding epoxy adhesive glue,low refractive index epoxy resin adhesive glue,high refractive index optical adhesive glue,best glue for magnet
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Optical Transmission Properties of Adhesives
silicate system widely used for coating applications requiring excessively high temperature resistance, since it is serviceable up to 1,500°F. Optical Transmission test results of Master Bond adhesives. Optical Transmission Test Results for EP30-2LB, MasterSil 151, MB600. In Graph 2, we show results
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The Importance of Quality Control in Electronic Assembly Adhesive Selection
Epoxies are commonly used in electronic assembly due to their high strength and resistance to chemicals and temperature. They are ideal for bonding metals, ceramics, and plastics. Acrylics are known for their fast curing time and excellent adhesion to a variety of substrates, including metals
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Optical Bonding Materials
Because most types of glass have a refractive index of 1.5, most adhesives used for optical bonding have a similar refractive index. Depending on the application, silicone, epoxy, acrylated urethane or PSA may offer the optimized mechanical and thermal properties. Silicones are commonly used
More Information Top
Indicates content that may require registration and/or purchase.
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Handbook of Adhesives and Sealants, Second Edition > EFFECTS OF THE ENVIRONMENT
Barie, W. P., and N. W. Franke, “ High Temperature Epoxy Adhesives Based on BTDA,” Adhesives Age, October 1971, pp. 36–39.
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Influence of the temperature on the fracture energy of a methacrylate adhesive for mining applications
Effects of temperature and loading rate on the mechanical properties of a high temperature epoxy adhesive .
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Hybrid Adhesive Joints
Preliminary results confirm that mixed-adhesive joints with a silicone and a high temperature epoxy adhesive provide an improved joint strength at room and high temperature in relation to a joint with silicone alone.
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Adhesion 99
ABSTRACT: The work reported here concerns the use aluminium and polytetrafluoroethylene (PTFE) as fillers in a two part' epoxy high temperature adhesive .
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Effect of Low Temperature on Tensile Strength and Mode I Fracture Energy of a Room Temperature Vulcanizing Silicone Adhesive
[31] Banea, M. D., da Silva, L. F. M., and Campilho, R. D. S. G., “Effect of Temperature on Tensile Strength and Mode I Fracture Toughness of a High Temperature Epoxy Adhesive ,” J. Adhes.
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Adhesives
Barie, W. P., Jr., et al., " High Temperature Epoxy Adhesives Based on BTDA," Adhesives Age, 14, 10 (1971)' 36-9 .
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Energy-efficient incandescent lamp. Final report
Both lamp designs are based on bonding the three or two lamp parts together vacuum tight by means of a high temperature epoxy adhesive that was found impermeable to diffusion of water and oxygen.
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Feasibility investigation and design study of optical well logging methods for high temperature geothermal wells. Semiannual technical progress report, 30 Sept...
Other materials of interest include a high temperature epoxy adhesive , and a very high-temperature ceramic adhesive.