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Supplier: Henkel Corporation - Industrial
Description: Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high thermal
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant LOCTITE® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive Good elongation strength
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 580 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Tensile Strength (Break): 7250 psi
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Viscosity: 25000 cP
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 400 kV/in
- Thermal Conductivity: 1.34 W/m-K
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Supplier: OMEGA Engineering, Inc.
Description: products. OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 1.2 W/m-K
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ TC-6020 Thermally Conductive Encapsulant Part A White is a two-part silicone elastomer. It offers adhesion to aluminum, high thermal conductivity, and excellent dielectric properties. It is for use in the manufacture of electrical and PCB products and
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 612 kV/in
- Elongation: 20.6 %
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Conductive Compounds - High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74FSupplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 18.33 to 60 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: 50-3182 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.72 µin/in-F
- Composition: Filled
- Compound Type: Thermally Conductive
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound, Die Bonding Adhesive / Compound
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock
- Chemical / Polymer System Type: Epoxy (EP)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Master Bond, Inc.
Description: Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation with a free flowing viscosity.
- Applied Thickness / Gap Fill: 0.0030 to 0.0050 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to withstand aggressive chemicals, and high compressive
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Dielectric Strength: 254 kV/in
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties. 50-2185FR
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low outgassing approval. It will cure at room temperature or
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability,
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 1.33E7 to 1.56E7 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.1 to 4.4
- Dielectric Strength: 400 kV/in
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Supplier: MacDermid Alpha Electronics Solutions
Description: +180°C, this compound is also suited for a variety of other electronics applications. While its primary feature is chemical resistance, ER2223 also exhibits good resistance to thermal cycling, making it ideal for use in environments such as engine compartments. Its low viscosity allows for
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints and provides resistance
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 25000 to 75000 cP
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Supplier: RS Components, Ltd.
Description: Two part polyurethane resin potting and encapsulating compound supplied in handy 250g â??duo-sachetâ?? pack for easy mixing and pouring with no mess. Quick setting, flame retardant and thermally conductive encapsulant designed for general purpose use. The cured
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.6500 W/m-K
- Use Temperature: -40 to 230 F
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Supplier: Boyd
Description: Patented encapsulated Annealed Pyrolytic Graphite technology that has three times the conductivity of copper with the mass of aluminum Annealed Pyroloytic Graphite provides a high conduction path Encapsulant sets the CTE and structural properties Encapsulant
- Device: Passive Heat Sink
- Material: Other Materials
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Thermal conductivity behavior of SiC–Nylon 6,6 and hBN–Nylon 6,6 composites
Therefore, incorpora- tion of high-thermal-conductivity fillers in polymers to develop high -performance thermally conducting encapsulants or thermal interface materials has been widely investigated [5–7].
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
The first was to find high thermally conductive silver filled epoxies that can handle high power LEDs, while the second area was to find clear encapsulants that would not yellow with time.
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Adhesives and Sealants
One particularly focused area is photovoltaic (PV) manufacturing and installation, where the company offers a comprehensive line of structural adhesives, elastomers, thermally and/or electrically conductive materials, die-attach adhesives, encapsulants , sealants, molding compounds, and cleaners. These high -tech products comply with relevant standards of the PV industry and are widely used in …
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Subject index
GPS MCM-L modules for high reliab. avionics, hermetic-equiv. packaging. Hagge, J.K., + , T-ADP May 99 145-152 liq. encapsulants , electronic packaging, thermally conductive fillers.
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High-Performance Silicone Materials for High-Brightness LEDs | Features | Mar 2007 | Photonics Spectra
Thermal interface materials have been produced in a variety of physical forms that may be valuable in LED designs, including thermally conductive adhesives, gap fillers, gels and encapsulants , as well as dry, prefabricated pads and even phase-change materials that shift from … A number of trends are driving the development of new materials for high -brightness LEDs.
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Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles
[1] C.P. Wong, R.S. Bollampally, “Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging”, IEEE Transactions on Advanced Packaging, Vol. 22, №1, pp.54-59, February 1999. … Wood, A. Mitchell, J. Thomas, “The role of nano and micro fillers in high thermal conductivity electrical …
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Mereco Silver Adhesive Cures In Only 45 Seconds
The MERECO brand of high quality specialty chemical products is recognized and sold worldwide. Founded in 1960, Metachem Resins Corporation (MERECO) is a specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies, silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing, and …
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MERECO Silver Adhesive Meets Customer Packaging Requirements
The MERECO brand of high quality specialty chemical products is recognized and sold worldwide. Founded in 1960, Metachem Resins Corporation (MERECO) is a highly specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies, silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing …
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Adhesives, Sealants And Cleaners Help Harness The Power Of The Sun
These high tech products comply with relevant standards of the photovoltaic industry and are widely used in … Henkel products include structural adhesives, elastomers, thermally and/or electrically conductive materials, die attach adhesives, encapsulants , sealants, molding compounds and cleaners.
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Thermal Properties of Solids at Room and Cryogenic Temperatures
Hsieh, C.Y., Chung, S.L.: High thermal conductivity epoxy molding compound filled with a combustion synthesized … Wong, C., Bollampally, R.S.: Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging.