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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to chemicals and high
- Thermal Conductivity: 1.37 W/m-K
- Dielectric Strength: 381.0000000000008 kV/in
- Viscosity: 50,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is
- Thermal Conductivity: 1.34 W/m-K
- Dielectric Strength: 400.00000000000006 kV/in
- Viscosity: 250,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 1495 K Black, formerly Emerson and Cuming, is an epoxy encapsulant that is used for electronic components that require good flowability and thermal conductivity. It offers low viscosity, versatility, high filler, excellent mechanical and electrical properties. 1
- Thermal Conductivity: 1 to 1.1 W/m-K
- Tensile Strength (Break): 6,700 to 8,500 psi
- Dielectric Strength: 398.7800000000008 kV/in
- Viscosity: 10,000 to 21,000 cP
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2850MT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock, high voltage applications, and those that need heat dissipation. It has a low
- Thermal Conductivity: 1.5 to 1.9 W/m-K
- Dielectric Strength: 370.84000000000077 to 393.70000000000084 kV/in
- Viscosity: 7,700 to 58,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Substrate Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose
- Thermal Conductivity: 1.31247389 W/m-K
- Coeff. of Thermal Expansion (CTE): 15.222222222222221 µin/in-F
- Dielectric Strength: 369.99999999999903 kV/in
- Dielectric Constant (Relative Permittivity): 5.41
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Industrial Adhesives - High Tg, Thermally Conductive, Electrically Insulating Epoxy -- EPO-TEK® H74FSupplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 45,000 to 75,000 cP
- Use Temperature: 662 F
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 60 µin/in-F
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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Viscosity: 15,000 cP
- Use Temperature: -94 to 302 F
- Thermal Conductivity: 1.7307348 W/m-K
- Dielectric Strength: 480.0000000000012 kV/in
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Supplier: Chemence Inc.
Description: KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that
- Viscosity: 150,000 cP
- Features: Die Bonding Adhesive / Compound, Grease / Paste
- Industry: Electronics
- Substrate Compatibility: Plastic
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 6,000 to 12,000 cP
- Use Temperature: 662 F
- Thermal Conductivity: 0.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 72.22222222222221 µin/in-F
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature rating,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Cure / Technology: Air Setting / Film Drying, Single Component System
- Features: Electrical Insulation / Dielectric, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it
- Viscosity: 400,000 cP
- Use Temperature: -80 to 400 F
- Thermal Conductivity: 5.7 to 6.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 13,333,333.333333332 to 15,555,555.555555556 µin/in-F
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 40,000 to 70,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 120 µin/in-F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and
- Viscosity: 25,000 cP
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
- Cure / Technology: Two Component System
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the
- Viscosity: 6,000 to 13,000 cP
- Use Temperature: 527 F
- Thermal Conductivity: 0.6 W/m-K
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 to 72.22222222222221 µin/in-F
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Supplier: Epoxies Etc...
Description: The 50-2185FR Potting and Encapsulating Compound has been formulated to provide a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. This system offers excellent heat transfer, low exotherm and excellent electrical properties. 50-2185FR meets the
- Viscosity: 27,000 cP
- Use Temperature: -58 to 248 F
- Thermal Conductivity: 1.22593715 W/m-K
- Tensile Strength (Break): 800 psi
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
- Use Temperature: -76 to 356 F
- Thermal Conductivity: 0.55 W/m-K
- Dielectric Strength: 254.00000000000054 kV/in
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity
- Viscosity: 35,000 to 50,000 cP
- Use Temperature: -65 to 221 F
- Thermal Conductivity: 1.1538 to 1.2981 W/m-K
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.77999999999999 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to withstand aggressive chemicals, and high compressive
- Applied Thickness / Gap Fill: 0.002 to 0.003 inch
- Viscosity: 50,000 to 90,000 cP
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1 to 1.15 W/m-K
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties. It is formulated to cure at room temperature or more
- Viscosity: 20,000 to 30,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 3.603 W/m-K
- Coeff. of Thermal Expansion (CTE): 18 µin/in-F
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Supplier: Protavic America, Inc.
Description: PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include
- Viscosity: 8,000 to 10,000 cP
- Use Temperature: -55 to 200 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 111.11111111111111 µin/in-F
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Description: BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the
- Use Temperature: -76 to 392 F
- Features: Gap Filling Compound, Pad, Thermal / Heat Conductive
- Industry: OEM / Industrial
- Chemical System: Silicone
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock
- Industry: Electronics (PCB / SMT Assembly)
- Chemical System: Epoxy (EP)
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that
- Viscosity: 11,000 to 14,000 cP
- Features: Die Bonding Adhesive / Compound, Gap Filling Sealant / FIP Gasket
- Industry: Electronics
- Type / Form: Grease / Paste
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Viscosity: 400 cP
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
- Dielectric Strength: 635.0000000000014 kV/in
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Supplier: Sauereisen, Inc.
Description: Sauereisen Thermal Potting Cement No. 11 is primarily used where high electrical insulation and thermal conductivity are desired. No. 11 is a chemical-setting cement ideal for potting applications subject to high temperature and thermal shock. Thermal Potting Cement No. 11 is
- Use Temperature: 2,200 F
- Thermal Conductivity: 0.70671671 W/m-K
- Coeff. of Thermal Expansion (CTE): 3.4 µin/in-F
- Tensile Strength (Break): 100 psi
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol FP5001 ) LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints and provides resistance to
- Viscosity: 25,000 to 75,000 cP
- Features: Electronics, Encapsulant / Potting Compound
- Type: Thermal Compound / Thermally Conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications. Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of under-hood applications in the automotive
- Industry: Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
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Supplier: OMEGA Engineering, Inc.
Description: Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS 1. Type of Application Potting, sealing, encapsulating,
- Use Temperature: 1,549.4 to 2,598.8 F
- Thermal Conductivity: 0.64902555 to 1.7307348 W/m-K
- Coeff. of Thermal Expansion (CTE): 2.5999999999999996 to 12.4 µin/in-F
- Tensile Strength (Break): 250 to 425 psi
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Encapsulants and Potting Compounds - Techsil® Non Silicone Heat Transfer Compound 620gm -- TEOT04005Supplier: Techsil Limited
Description: Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any
- Use Temperature: -50 to 130 F
- Features: Electronics
- Type: Thermal Compound / Thermally Conductive
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Supplier: Boyd
Description: Patented encapsulated Annealed Pyrolytic Graphite technology that has three times the conductivity of copper with the mass of aluminum Annealed Pyroloytic Graphite provides a high conduction path Encapsulant sets the CTE and structural properties Encapsulant material is selected
- Features: Other Materials
- Device: Passive Heat Sink
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Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL STYCAST 2850KT/CATALYST 24LV ) LOCTITE STYCAST 2850KT is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E
- Use Temperature: 257 F
- Thermal Conductivity: 0.41826091 W/m-K
- Elongation: 145 %
- Tensile Strength (Break): 1,000 psi
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Epoxies for OptoElectronic Packaging: Applications and Material Properties (.pdf)
The first was to find high thermally conductive silver filled epoxies that can handle high power LEDs, while the second area was to find clear encapsulants that would not yellow with time.
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Adhesives and Sealants
One particularly focused area is photovoltaic (PV) manufacturing and installation, where the company offers a comprehensive line of structural adhesives, elastomers, thermally and/or electrically conductive materials, die-attach adhesives, encapsulants , sealants, molding compounds, and cleaners. These high -tech products comply with relevant standards of the PV industry and are widely used in …
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Subject index
GPS MCM-L modules for high reliab. avionics, hermetic-equiv. packaging. Hagge, J.K., + , T-ADP May 99 145-152 liq. encapsulants , electronic packaging, thermally conductive fillers.
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High-Performance Silicone Materials for High-Brightness LEDs | Features | Mar 2007 | Photonics Spectra
Thermal interface materials have been produced in a variety of physical forms that may be valuable in LED designs, including thermally conductive adhesives, gap fillers, gels and encapsulants , as well as dry, prefabricated pads and even phase-change materials that shift from … A number of trends are driving the development of new materials for high -brightness LEDs.
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Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles
[1] C.P. Wong, R.S. Bollampally, “Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging”, IEEE Transactions on Advanced Packaging, Vol. 22, №1, pp.54-59, February 1999. … Wood, A. Mitchell, J. Thomas, “The role of nano and micro fillers in high thermal conductivity electrical …
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The MERECO brand of high quality specialty chemical products is recognized and sold worldwide. Founded in 1960, Metachem Resins Corporation (MERECO) is a specialized manufacturer of formulated adhesives, electrically conductive resins, encapsulants , epoxies, silicones, thermally conductive resins, urethanes, UV curable systems, and related products for applications in aerospace, defense, electronics, fiber optics, solar cell manufacturing, and …
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MERECO Silver Adhesive Meets Customer Packaging Requirements
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Adhesives, Sealants And Cleaners Help Harness The Power Of The Sun
These high tech products comply with relevant standards of the photovoltaic industry and are widely used in … Henkel products include structural adhesives, elastomers, thermally and/or electrically conductive materials, die attach adhesives, encapsulants , sealants, molding compounds and cleaners.
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Thermal Properties of Solids at Room and Cryogenic Temperatures
Hsieh, C.Y., Chung, S.L.: High thermal conductivity epoxy molding compound filled with a combustion synthesized … Wong, C., Bollampally, R.S.: Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging.