IC Packaging Materials

Description: Materion Microelectronics & Services offers an extensive array of contact alloys, cast and fabricated to meet the exacting standards of micro electronics and industrial applications. In-house alloying and an analytical lab ensure contact alloys with superior material characteristics and

• Applications / Industry: Electronics (IC Packaging / Interconnect)
• Form / Shape: Application Specific / Custom
• Material: Copper (Cu), Magnesium / Magnesium Alloy (UNS M), Palladium / Palladium Alloys, Silver / Silver Alloy (Ag)
• Type: Electrical Contact

Description: .20mm GENERAL SPECIFICATIONS SOCKET BODY MATERIAL: Torlon PAI HARDWARE: Stainless Steel SPRING-LOADED CONTACTS: Au-plated BeCu CONTACT RESISTANCE: <40mO ACCEPTS SOLDER BALL SIZES: 0.15mm-0.93mm ESTIMATED CONTACT LIFE

• Features: Solderless, Clamshell Socket
• Military Standards: Other
• Product Type: IC Probing / Analysis Adapters

Description: through multiple solder reflow operations. Materials Selection Multilayer ceramic electronic packages can be produced with a wide choice of materials, each designed to meet specific application needs. The choices include: Ceramics Metallizations Brazed

• Backend Processing: Soldering / Pasting, Hermetic Sealing, Dicing, Other
• IC Package Type: BGA, MCM, LCCC, Other
• Location: North America, United States Only, Southern US Only
• Package Material: Ceramic, Other

Description: wire, the path distance of electric signals is short, and input and output can be formed in large quantities, allowing the product to handle high-density semiconductors. SPVF With the SPVF (Samsung Photo Via Film) material, the quality of the product is guaranteed.

• Mounting: SMT

Description: automated systems that source bulk material from interior and exterior plant locations, transport it between process equipment and storage vessels, weigh it, blend it, feed it to packaging lines, extruders, molding machines and storage vessels, and load it into railcars and trailers.

• Additional Capabilities: Powder / Bulk Handling, Custom Equipment Design
• Capabilities: Conveyors, Other
• Industries Served: Agriculture, Food / Beverage
• Services: Equipment Design, Factory Automation

Description: Indium Corporation’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices Thermal conductance for high power devices – with densities in excess of 1000 watts End-of-life performance at the thermal

• Chemical / Polymer System Type: Specialty / Other
• Industry: Semiconductors / IC Packaging

Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electroni c casting and encapsulating applications that require a unique

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Dielectric Constant (Relative Permittivity): 4.3
• Features: Thermal Insulation / Heat Insulating
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging

Description: with all IC108 furniture faceplates, bezels, and surface mount boxes - Used with ICC RG6 F-Type ICPCSF patch cords - Housing: - Material: ABS, UL 94V-0 - Available in White - Nickel Plated F-Type Connector: - Material: Bronze with Nickel Plating - Holding Force > 80 Grams

• Material: Nickel

Description: IC107 faceplates, inserts, surface mount boxes, and blank patch panels - Compatible with all IC108 furniture faceplates, bezels, and surface mount boxes - Used with ICC RG6 F-Type ICPCSF patch cords - Housing: - Material: ABS, UL 94V-0 - Color: XX: WH-WHITE - Gold Plated F

Description: ICC offers Configurable Surface Mount Boxes in bulk pack. The new 25-Piece packaging designed is an ideal solution for contractors and environmentally friendly to speed large installations and reduces jobsite waste. These flush keystone faceplates are available in 1 and 2 port and compatible

Description: ICC offers Configurable Surface Mount Boxes in bulk pack. The new 25-Piece packaging designed is an ideal solution for contractors and environmentally friendly to speed large installations and reduces jobsite waste. These flush keystone faceplates are available in 1 and 2 port and compatible

Description: Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular,

• Chemical / Polymer System Type: Specialty / Other
• Industry: Semiconductors / IC Packaging
• Thermal Conductivity: 15 to 28.1 W/m-K

Description: vapor pressure than mercury. Excellent Thermal and Electrical Conductivity Alloy systems that are liquid at room temperature have a high degree of thermal conductivity far superior to ordinary nonmetallic liquids. This results in the use of these materials for specific heat conducting

• Chemical / Polymer System Type: Specialty / Other
• Industry: Semiconductors / IC Packaging

Description: Fujipoly® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon® materials in order to find the perfect

• Industry: Electronics, Semiconductors / IC Packaging

Description: Manufacturer: AMIS Category: Tapes, Adhesives, Materials - Tape Dispensers Part Status: Obsolete Connector Type: Receptacle Number of Positions: 5 Pitch: 0.200" (5.08mm) Number of Rows: 2 Mounting Type: Fixed Features: series Field Programmable Gate Array (FPGA) IC 100 184320 6000

• Machine Type: Tape Dispensers

Description: Circuit / Semiconductor Materials LG Chem achieved growth mainly based on high value products. LG Chem boasts competitiveness in the materials used for PCB and semiconductors such as CCL, 2CCL, and DAF. LG Chem started mass-producing 2CCL beginning 2005, and it has been widely used in

• Materials of Construction: Copper Foil / Cladding, Metal Foil / Cladding, Specialty / Other

Description: Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components. Product Overview HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of electrical and electronic

• Chemical / Polymer System Type: Silicone
• Industry: Electronics, Semiconductors / IC Packaging
• Material Type: Grease / Paste
• Thermal Conductivity: 0.9000 W/m-K

Description: The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux.

• Cure Type / Technology: Specialty / Other
• Industry: Semiconductors / IC Packaging
• Material Type: Specialty / Other

Description: AS27 is an advanced insulation material composed of nanoscale porous silica, carbon, and other materials, with an extremely low thermal conductivity of 0.009 W/m·K, making it one of the lowest-known thermal conductivity solid materials. AS27 is renowned for its ultra-low

• Features: Electrical Insulation / Dielectric Material, Thermal Insulation / Heat Insulating
• Form: Film / Sheet, Pad, Specialty / Other
• Industry: Optoelectronics / Photonics, Semiconductors / IC Packaging, Electronics, Electrical Power / HV
• Thermal Conductivity: 0.0090 W/m-K

Description: AS17 is an advanced insulation material composed of a fiber composite made from porous silica, aluminum nitride, and other materials, with an extremely low thermal conductivity of 0.028 W/m·K. AS17 is notable for its ability to prevent thermal runaway, its ultra-low density, and its

• Features: Electrical Insulation / Dielectric Material, Thermal Insulation / Heat Insulating
• Form: Film / Sheet, Pad, Specialty / Other
• Industry: Optoelectronics / Photonics, Semiconductors / IC Packaging, Electronics, Electrical Power / HV
• Thermal Conductivity: 0.0280 W/m-K

Description: . Heat-affected zone & edge chipping: <30µm Laser focal spot size: 20µm Cutting speed: 3000mm/s Cutting, scribing, and drilling of camera modules, fingerprint identification modules, PCBs, SD cards, FPCs, BGA and QFN packages, FR4, and other polymer-based materials. Applicable

• Automation / Control: Windows / PC Control
• Materials Processed: Metal / Conductive Materials, Semiconductors / Electronics, Soft / Fibrous (Textiles, Foams, Paper)
• Process / Operation: Laser Cutting
• Pulsed / Q-switched: Yes

Description: Element experts measure up For projects that require accurate dimensional measurements, Element Materials Technology dimensional scientists measure up in every way: capabilities, expertise, timeliness, and presentation of your results. Our professional inspection team uses cutting

• Capabilities: Certification, Component / Product Comparison, Failure Analysis / Troubleshooting, Field Evaluation / On-site Inspection, First Article / Contract QA, In-process / In-line Testing, Reverse Engineering / Digitization, Test Development, Test Fixtures / Equipment, Testing / Simulation, Specialty /
• Forms Tested / Certified: Capital Equipment, Components / Parts, Facilities / Capital Structures, Products, Samples or Materials
• Industry: Appliances, Aerospace / Avionics, Automotive, Battery / Energy Products, Building & Construction, Combustion Equipment, Consumer Products, Health Care / Medical, HVAC, Plumbing and Lighting, Industrial / Machinery, Instrument & Sensors / Laboratory, Materials, Motors and Control Systems,
• Services Offered: Alignment, Dimensional Gaging / Metrology, Engineering / Design Verification (DVT), Form / Geometry (Straightness, Roundness, etc.), NDT / Inspection, Visual / Video Inspection, Specialty / Other

Description: FEATURES A cost-effective means of upgrading to MSOP 0.5mm package SOIC without changing your PCB layout. Available on 0.300 [7.62] centers GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS

• Output (Bottom) Side Package: DIP
• Product Type: Package Adapters / Converters
• Top (Input) Side Package: Other

Description: FEATURES A cost-effective means of upgrading to PLCC package without changing your PCB layout GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M

• Output (Bottom) Side Package: DIP
• Product Type: Package Adapters / Converters
• Top (Input) Side Package: PLCC

Description: FEATURES Convert surface-mount PQFP packages to an Amp interstitial PGA footprint Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs Pins are mechanically fastened and soldered to board using Aries patented process

• Output (Bottom) Side Package: PGA
• Product Type: Package Adapters / Converters
• Top (Input) Side Package: Other

Description: Tabletop Vacuum Sealer V-300 incorporates a vacuum mechanism into the great features of FS-315. Use of the V-300-10D is recommended for thick gas barrier packaging materials for thick film bags, gusset bags and bags for industrial parts such as IC parts. With self-contained

• Automation: Manual
• Closing Method: Heat Seal
• Goods: Consumer Packaging
• Industry: Industrial / General Use, Chemical / Petrochemical, Electronics / Semiconductor, Food / Beverage, Garment

Description: Highly Conformable, Non-Flammable, Isolation and High Heat Conducting Gel materials.•Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities.•The basic Gap Filler Pad series can be further enhanced for special

• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 5.76 to 7.27
• Dielectric Strength: 305 kV/in
• Features: UL Approved

Description: SARCON ® Silicone Putty is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of components.

• Applied Thickness / Gap Fill: 0.0394 to 0.0787 inch
• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 7.77 to 8.58
• Features: UL Approved

Description: Sarcon® PG25A Series is a highly conformable and high thermal conducting gel material in a versatile sheet form that easily fits and adheres to most all shapes and sizes of components, including protrusions and recessed areas.

• Applied Thickness / Gap Fill: 0.0394 to 0.1969 inch
• Chemical / Polymer System Type: Silicone
• Dielectric Constant (Relative Permittivity): 6.25 to 7.21
• Dielectric Strength: 254 kV/in

Description: Integrated two-stage PFC + LLC/LCC resonant half-bridge controller for LED drivers in DSO-19 package ICL5102HV control IC for LED drivers offers a unique one-package solution for lighting applications up to 350W, supporting LLC/LCC topology. It is particularly designed to

• Features: RoHS Compliant
• Form Factor: Integrated Circuit (IC)
• Type: Constant Current, Constant Voltage

Description: INTERMEDIATE TYPE NYLON MATERIAL NATURAL COLOR 5.7 INCH 0.14 INCH UL, CSA APPROVAL 100 PER BAG STANDARD PACKAGE 40 LB TENSILE STRENGTH 1/16 TO 1-7/16 INCH BUNDLE DIAMETER NYLON CLIP MATERIAL POWR-TIE[TM] BRAND THICKNESS 0.049 INCH

• Length: 5.7 inch

Description: INTERMEDIATE TYPE NYLON MATERIAL NATURAL COLOR 8.8 INCH 0.14 INCH UL, CSA APPROVAL 100 PER BAG STANDARD PACKAGE 40 LB TENSILE STRENGTH 1/16 TO 2-3/8 INCH BUNDLE DIAMETER NYLON CLIP MATERIAL POWR-TIE[TM] BRAND THICKNESS 0.049 INCH

• Length: 8.8 inch

Description: INTERMEDIATE TYPE NYLON MATERIAL NATURAL COLOR 11.5 INCH 0.142 INCH UL, CSA APPROVAL 100 PER BAG STANDARD PACKAGE 40 LB TENSILE STRENGTH 1/16 TO 3-3/8 INCH BUNDLE DIAMETER NYLON CLIP MATERIAL POWR-TIE[TM] BRAND THICKNESS 0.055 INCH

• Length: 11.5 inch

Description: INTERMEDIATE TYPE NYLON MATERIAL NATURAL COLOR 14.5 INCH 0.142 INCH UL, CSA APPROVAL 100 PER BAG STANDARD PACKAGE 40 LB TENSILE STRENGTH 1/16 TO 4 INCH BUNDLE DIAMETER NYLON CLIP MATERIAL POWR-TIE[TM] BRAND THICKNESS 0.055 INCH

• Length: 14.5 inch

Description: IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This

Description: These Adaptics IC-Socket Package Adapters are supplied in a Panel format to enable processing in an automatic production environment with either 80 or 36 or 40 circuits per panel with SMT pads to through hole pins. Pitch = 10.16mm End 1 = 8 Pin SOIC End 2 = 8 Pin DIP End 1 Number

• Product Type: Package Adapters / Converters

Description: QFP adaptors which convert a broad range of QFP ICs into a PGA footprint. The adaptors are supplied in 2 pieces, the adaptor and its mating PGA socket. QFP Adaptor Body material is Epoxy Fibreglass FR4, Contact material is Brass, Tin over Nickel plating. PGA Socket Body material

• Product Type: Package Adapters / Converters