IC Packaging Materials

Description: Materion Microelectronics & Services offers an extensive array of contact alloys, cast and fabricated to meet the exacting standards of micro electronics and industrial applications. In-house alloying and an analytical lab ensure contact alloys with superior material characteristics and

• Shape / Form: Application Specific / Custom
• Material: Copper (Cu), Magnesium / Magnesium Alloy (UNS M), Palladium / Palladium Alloys, Silver / Silver Alloy (Ag)
• Type: Electrical Contact
• Applications: Electronics (IC Packaging / Interconnect)

Description: Multilayer ceramic electronic packages can be produced with a wide choice of materials, each designed to meet specific application needs. The choices include: Ceramics Metallizations Brazed Components Platings Ceramic Materials AdTech offers a choice of ceramic materials:

• Type: BGA, LCCC, MCM
• Material: Ceramic
• Backend Processing: Dicing, Hermetic Sealing, Soldering / Pasting
• Features: North America, Other, Southern US Only, United States Only

Description: zone & edge chipping: <30μm Laser focal spot size: 20μm Cutting speed: 3000mm/s Cutting, scribing, and drilling of camera modules, fingerprint identification modules, PCBs, SD cards, FPCs, BGA and QFN packages, FR4, and other polymer-based materials. Applicable workpieces: Suitable for

• Type: Complete / Turnkey System
• Laser Operation: Laser Cutting
• Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System
• Workpiece Material: Metal / Conductive Materials, Semiconductors / Electronics

Description: faceplates, bezels, and surface mount boxes - Used with ICC RG6 F-Type ICPCSF patch cords - Housing: - Material: ABS, UL 94V-0 - Available in White - Nickel Plated F-Type Connector: - Material: Bronze with Nickel Plating - Holding Force > 80 Grams - F-Type Connector Threads: 3/8-32

• Material: Nickel

Description: high-density semiconductors. SPVF With the SPVF (Samsung Photo Via Film) material, the quality of the product is guaranteed. Laser via-less process High productivity of via process (similar to Litho process) Fine Line/Space Competitive cost of process and material Properties of SPVF

• Mounting: SMT

Description: inserts, surface mount boxes, and blank patch panels - Compatible with all IC108 furniture faceplates, bezels, and surface mount boxes - Used with ICC RG6 F-Type ICPCSF patch cords - Housing: - Material: ABS, UL 94V-0 - Color: XX: WH-WHITE - Gold Plated F-Type Connector: - Material:

Description: solid wire - Termination cap: Material: PC, UL 94V-0 - Colors: IV – Ivory and WH - White - Sold in a Package of 25 Modules and 25 Caps Package Contains: - (25) 6P6C HD RJ-11 Voice Modules - (25) Wire Caps

Description: dangers of overheating.

 When you’re finalizing the design of your electronic device, your custom converting expert can be a helpful partner in selecting the right materials for thermal interface and EMI shielding.

 ABLE’s stock of raw materials along with our technical expertise

• Features: EMI / RFI Shielding Material, Specialty / Other, Thermal Compound / Interface (Thermally Conductive)
• Industry: Electronics, Semiconductors / IC Packaging
• Form / Shape: Film / Sheet, Liquid
• Use: Gap Filling Compound

Description: ICC offers Configurable Surface Mount Boxes in bulk pack. The new 25-Piece packaging designed is an ideal solution for contractors and environmentally friendly to speed large installations and reduces jobsite waste. These flush keystone faceplates are available in 1 and 2 port and compatible

Description: Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be

• Thermal Conductivity: 15 to 28.1 W/m-K
• Form / Shape: Film / Sheet
• Industry: Semiconductors / IC Packaging
• Features: Specialty / Other, Thermally Conductive

Description: Circuit / Semiconductor Materials LG Chem achieved growth mainly based on high value products. LG Chem boasts competitiveness in the materials used for PCB and semiconductors such as CCL, 2CCL, and DAF. LG Chem started mass-producing 2CCL beginning 2005, and it has been widely used in

• Materials: Copper Foil / Cladding, Metal Foil / Cladding
• Features: Specialty / Other

Description: Indium Corporation’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices Thermal conductance for high power devices – with densities in excess of 1000 watts End-of-life performance at the thermal interface – to avoid failures common with

• Form / Shape: Film / Sheet
• Industry: Semiconductors / IC Packaging
• Features: Specialty / Other, Thermally Conductive

Description: pressure than mercury. Excellent Thermal and Electrical Conductivity Alloy systems that are liquid at room temperature have a high degree of thermal conductivity far superior to ordinary nonmetallic liquids. This results in the use of these materials for specific heat conducting and/or

• Form / Shape: Liquid
• Industry: Semiconductors / IC Packaging
• Features: Specialty / Other, Thermally Conductive

Description: systems that source bulk material from interior and exterior plant locations, transport it between process equipment and storage vessels, weigh it, blend it, feed it to packaging lines, extruders, molding machines and storage vessels, and load it into railcars and trailers. Choose from

• Industries Served: Agriculture, Chemical, Food / Beverage, Mining, Paper, Pharmaceutical
• Features: Conveyors, Other
• Automated Assembly Equipment: Custom Equipment Design, Powder / Bulk Handling
• Services: Equipment Design, Factory Automation

Description: materials, we strongly recommend stringent testing before selecting a material for your application. For further information, please refer to the product TDS or contact our Technical Support Team, who are always available to provide solutions. Excellent Non-Creep Characteristics Very

• Use Temperature: 266 F
• Thermal Conductivity: 0.9 W/m-K
• Industry: Electronics, Semiconductors / IC Packaging
• Form / Shape: Grease / Paste

Description: Element experts measure up For projects that require accurate dimensional measurements, Element Materials Technology dimensional scientists measure up in every way: capabilities, expertise, timeliness, and presentation of your results. Our professional inspection team uses cutting-edge

• Applications / Industry: Aerospace / Avionics, Appliances, Automotive, Battery / Energy Products, Building & Construction, Combustion Equipment, Consumer Products, HVAC, Plumbing and Lighting, Health Care / Medical, Industrial / Machinery, Instrument & Sensors / Laboratory, Materials, Microelectronics / Electronics, Motors
• Services Offered: Alignment, Dimensional Gaging / Metrology, Engineering / Design Verification (DVT), Form / Geometry (Straightness, Roundness, etc.), NDT / Inspection, Visual / Video Inspection
• Forms Tested / Certified: Capital Equipment, Components / Parts, Facilities / Capital Structures, Products, Samples or Materials
• Capabilities: Certification, Component / Product Comparison, Failure Analysis / Troubleshooting, Field Evaluation / On-site Inspection, First Article / Contract QA, In-process / In-line Testing, Test Development, Test Fixtures / Equipment, Testing / Simulation

Description: AS27 is an advanced insulation material composed of nanoscale porous silica, carbon, and other materials, with an extremely low thermal conductivity of 0.009 W/m·K, making it one of the lowest-known thermal conductivity solid materials. AS27 is renowned for its ultra-low

• Use Temperature: -76 to 392 F
• Thermal Conductivity: 0.009 W/m-K
• Features: Aerospace, Automotive, Electrical Insulation / Dielectric Material, Gap Filling Sealant / FIP Gasket, Laminating Adhesive / Composite Resin, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other, Photonics / Optoelectronics, Specialty / Other, Textiles / Fabrics, Thermal Insulation
• Industry: Electrical Power / HV, Electronics, Semiconductors / IC Packaging

Description: Manufacturer: AMIS Category: Tapes, Adhesives, Materials - Tape Dispensers Part Status: Obsolete Connector Type: Receptacle Number of Positions: 5 Pitch: 0.200" (5.08mm) Number of Rows: 2 Mounting Type: Fixed Features: series Field Programmable Gate Array (FPGA) IC 100 184320 6000

• Machine Type: Tape Dispensers

Description: The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux.

• Form / Shape: Film / Sheet
• Industry: Semiconductors / IC Packaging
• Features: Specialty / Other, Thermally Conductive

Description: life 4-point edge male contacts provide accurate mating Socket locating posts provide accurate socket location to board Bottom contact allows for via in center of PCB pad Available in pitch sizes from 0.20mm GENERAL SPECIFICATIONS SOCKET BODY MATERIAL: Torlon PAI HARDWARE: Stainless Steel

• Contact Resistance: 40 milliohms
• Contacts Pitch: 0.2 to 0.8 mm
• Socket Type: BGA, DIP, Test / Prototyping Socket
• Features: Clamshell Socket, Other, Solderless

Description: IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This

Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique

• Viscosity: 625 cP
• Use Temperature: -85 to 347 F
• Dielectric Constant (Relative Permittivity): 4.3
• Water Absorption: 1.5 %

Description: RF EMI POWDER ECCOSTOCK QT CAN Product overview: 33016002 from Laird - Performance Materials is an Interface Transceiver IC for serial communication, bus conversion, signal driving, receiver stages, and industrial networking. It is useful for engineers and buyers comparing datasheets,

• T_J: -65 C
• Features: Other, RoHS Compliant
• Device Type: Transceiver

Description: Manufacturer: TE Connectivity AMP Connectors Category: Connectors, Interconnects -Sockets for ICs, Transistors -IC Sockets Series: Diplomate DL Package: Tube Product Status: Obsolete Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating:

• Number of Contacts: 8
• Contacts Pitch: 2.54 mm
• Product Type: IC Headers
• Features: Other

Description: INSULATING KIT; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Body Material:Nylon ;RoHS Compliant: Yes Product overview: MK3313 from Multicomp is a Power

Description: Rating: UL94 V-0 Contact Finish Thickness - Post: 100.0µin (2.54µm) Housing Material: Thermoplastic Number of Positions or Pins (Grid): 20 (4 x 5) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Material - Post: Phosphor Bronze

• Number of Contacts: 20
• Contacts Pitch: 1.27 mm
• Product Type: IC Headers
• Features: Other

Description: INTERMEDIATE TYPE NYLON MATERIAL NATURAL COLOR 14.5 INCH 0.142 INCH UL, CSA APPROVAL 100 PER BAG STANDARD PACKAGE 40 LB TENSILE STRENGTH 1/16 TO 4 INCH BUNDLE DIAMETER NYLON CLIP MATERIAL POWR-TIE[TM] BRAND THICKNESS 0.055 INCH

• Length: 14.5 inch

Description: Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective

Description: Manufacturer: Laird-Signal Integrity Products Win Source Part Number: 1044428-IC1206B821R-10 Packaging: Reel - TR Current Rating: 150mA Inductance: 820nH Height - Seated (Max): 0.055" (1.40mm) Mounting: SMD (SMT) Tolerance: ±10% Material - Core: Ferrite Q @ Freq: 25 @ 25MHz Frequency -

• Inductance Range: 0.8200000000000001 microH
• DCR: 0.9 ohms
• Rated DC Current: 150 milliamps
• Operating Temperature: -40 to 125 C

Description: protection and external overtemperature protection) Benefits Best THD and PF enable system level optimization Combo IC of PFC + LLC/LCC shortens design to market One IC for global design, reduced variants of products, meaning scale of economy and simplified inventory management

• Type: Constant Current, Constant Voltage
• Form Factor: Integrated Circuit (IC)
• Features: RoHS Compliant

Description: IC SOCKET, DIP, 28 POSITION, 2.54MM; Accessory Type:IC Socket; For Use With:28 Lead DIP Type Package; Features:Socket for 28 Lead DIP Type Package; Product Range:-; Connector Type:DIP Socket; Contact Material:Phosphor Bronze RoHS Compliant: Yes