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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating LOCTITE® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Viscosity: 2230 cP
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: CHT USA Inc.
Description: CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the
- Cure Type / Technology: Two Component System, Specialty / Other
- Dielectric Strength: 315 kV/in
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Elongation: 35 %
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone sealant, self-leveling liquid
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
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Supplier: Techsil Limited
Description: LOCTITE® 595 is for superior bonding and sealing properties to most surfaces (although not recommended for use on concrete). This product resists aging weathering and thermal cycling without having adverse reactions such as hardening, shrinking or cracking. The thixotropic nature of LOCTITE® 595
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: Techsil® RTV27844 is a clear liquid, which cures at room temperature to a high strength silicone rubber with the addition of a curing agent. Once cured, RTV27844 has a hardness of 44 shore A, with 120% elongation, and a 1,406 refractive index. RTV27844 is supplied with a curing agent
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Encapsulants and Potting Compounds - Techsil® RTV27844 Clear Silicone Rubber 10:1 250ml -- TESI19112Supplier: Techsil Limited
Description: Techsil® RTV27844 is a clear liquid, which cures at room temperature to a high strength silicone rubber with the addition of a curing agent. Once cured, RTV27844 has a hardness of 44 shore A, with 120% elongation, and a 1,406 refractive index. RTV27844 is supplied as a complete kit in
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: Techsil® RTV27844 is a clear liquid, which cures at room temperature to a high strength silicone rubber with the addition of a curing agent. Once cured, RTV27844 has a hardness of 44 shore A, with 120% elongation, and a 1,406 refractive index. RTV27844 is supplied with a curing agent
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Bluestar Silicones USA Corp.
Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 4.44 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity. Special features
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Form: Liquid
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Supplier: Chemence Inc.
Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Gap Filling Compound, Die Bonding Adhesive / Compound
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Supplier: Wacker Chemical Corp.
Description: WACKER SILGEL® 613 is a pourable, addition-curing, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 10 : 1 mixing ratio very low viscosity rapid curing at room temperature with
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Optical Grade / Material
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Elongation: Over 100 %
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Supplier: Wacker Chemical Corp.
Description: WACKER SilGel® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features two-part, 1 : 1 mixing ratio low viscosity rapid heat cure very low hardness (silicone
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Flame Retardant (e.g. UL 94 Rated), Optical Grade / Material
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Supplier: Novagard Solutions
Description: Non-corrosive, single component silicone coating & encapsulating compound
- Chemical / Polymer System Type: Silicone
- Composition: Single Component System, Unfilled
- Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Features: Electrical Insulation / Dielectric Material
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Supplier: Wacker Chemical Corp.
Description: GENIOSIL® WP2 is a mixture of a special polyether-basedsilan e-terminated polymer and diisononyl cyclohexane-1,2-dica rboxylate as viscosity adjuster. GENIOSIL® WP2 is suitable as a binder in low viscous, moisture curing formulations. It is a clear liquid with a slight but
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 800 cP
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Supplier: Master Bond, Inc.
Description: as well as many rubbers and plastics. Tack free time can range from 10-20 minutes. This compound withstands liquid sterilants, gamma radiation and EtO very well. Its service temperature range is -75°F to +400°F.
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Aremco Products, Inc.
Description: used to improve moisture resistance. Two-part systems consist of a powder and liquid binder system. Materials set at room temperature in several hours, then cured at ~250 °F in 2-4 hours. Sil-Bond™, a silicone-ceramic potting compound for optimal moisture resistance, is now offered
- Chemical / Polymer System Type: Silicone, Ceramic / Inorganic Cement
- Composition: Filled
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...
Description: 20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 183 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: Epoxies Etc...
Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.5
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Supplier: Master Bond, Inc.
Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): Over 2.7
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Supplier: Bluestar Silicones USA Corp.
Description: Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound Properties Viscosity 6000 Hardness Sha 30 Description BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: Reactive / Moisture Cured, Thermosetting / Crosslinking
- Form: Liquid
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Supplier: TE Connectivity
Description: Component Design : Liquid Material System : Fluid Silicone Potting Resin Product Type : Casting Material Potting Resin Technology : Insulating Compound Self-Repairing : Yes
- Chemical / Polymer System Type: Silicone, Specialty / Other
- Form / Function: Encapsulant / Potting Compound
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Supplier: RS Components, Ltd.
Description: A two component, low viscosity silicone encapsulant specially designed to protect the electrical characteristics of electronic circuits. Transparent product cures in place to form a cushioning self-healing gel like mass. The cured gel retains the stress relief and self-healing
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Use Temperature: -40 to 356 F
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Supplier: Master Bond, Inc.
Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 61.11 to 77.78 µin/in-F
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System, Unfilled
- Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 2.4
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Supplier: RS Components, Ltd.
Description: Silcoset 101 is a pourable brick-red liquid which - with the addition of â??Silcosetâ?? curing agent - cures at room temperature to form a resilient, high temperature-resistan t, silicone rubber. It possesses excellent weathering resistance, is resistant to
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.3700 W/m-K
- Use Temperature: -76 to 482 F
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 184 Clear is a two component, flowable, room temperature and heat cure silicone curing agent with good dielectric properties and flame resistance. Curing agent only. It is to be used with Dow SYLGARD™ 184 Base to form a flexible, encapsulant that is used to protect
- Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
- Form: Liquid / Solution
- Function: Curing Agent ( Hardener / Curative)
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Supplier: Aremco Products, Inc.
Description: Hi-temp, prevents dusting of fibrous insulation materials
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrical Insulation / Dielectric Material
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Supplier: Aremco Products, Inc.
Description: Exceptional electrical, moisture & chemical resistance
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrical Insulation / Dielectric Material
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Dielectric Strength: 254 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Scheugenpflug, Inc.
Description: Whether adhesive bonding, sealing, filling or insulating: Due to their simple, robust design principle, piston dispensers are the systems of choice for many different dispensing tasks. They also cover a wide range of materials: In addition to very liquid adhesives, sealants and
- Application: Adhesive / Silicone, Other
- Dispense Rate: 0.1201 L/min
- Dispensing Type: Bead, Fill ("Potting")
- Metering Accuracy: 0.5000 %
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Supplier: Chemence Inc.
Description: KSC2040 is a thermally conductive silicone RTV adhesive rubber developed for heat sink applications. KSC2040 is a 1-part silicone that when applied to the substrate enables adhesion to parts and heat transfer of the bonded assembly within minutes. When cured, the elastomer resists
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Die Bonding Adhesive / Compound
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Supplier: Chemence Inc.
Description: KS130 is a fast curing silicone RTV adhesive rubber developed for the bonding of "difficult to bond" plastics like Tygon™.KS130 is a one part silicone that when applied to the substrate enables handling of the bonded assembly within an hour. When cured, the elastomer resists
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Form / Function: Die Bonding Adhesive / Compound
- Industry Applications: OEM / Industrial
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Supplier: Chemence Inc.
Description: KS715 is a fast curing, high strength, silicone RTV adhesive rubber product engineered for applications requiring fast development of physical properties and excellent adhesion. When cured, the elastomer resists weathering, ozone, moisture, UV and high temperatures. KS715 works well in manual
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Form / Function: Die Bonding Adhesive / Compound
- Industry Applications: OEM / Industrial
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: Novagard Solutions
Description: Non-corrosive, single component alkoxy cure silicone sealant/adhesive
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System
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Supplier: Protavic America, Inc.
Description: PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 111 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible
- Chemical / Polymer System Type: Silicone
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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-blowing silicone foam which creates a closed-cell structure. It is formulated as a liquid system with a 1:1 mix ratio by volume and low viscosity, enabling easy dispensing either by cartridge or automated mixing machine. This silicone foam’s fast gel time will help increase (read more)
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high temperature exposure and exhibits excellent adhesion strength on Stainless Steel (SUS), Nickel, PCBs and Liquid Crystal Polymer (LCP). “ALPHA HiTech AD13-9910B ultra-low temperature adhesive is able to fast cure at very low temperatures, with excellent dispensing performance,” (read more)
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complex parts Self-bonding grades Flame retardant, UL listed silicones With the latest innovation of SilSo Clear 21002 , CHT has developed a highly transparent liquid silicone rubber (LSR) designed for injection moulding of optical parts suitable for (read more)
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various components within a single device. Selection of a suitable, flowable silicone will eliminate all the air gaps in and around components, thereby providing an effective path for the transmission of any unwanted heat. In addition to heat dissipation, silicone encapsulants also provide protection (read more)
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Development of flame retardant PV module encapsulants: Volume 1. Final report
A non-inclusive listing is detailed below: Drv Encapsulants EVA-based Ionomer-based Fluoropolymer PolyvinylButyral Fabrication of a PV Module Wet Encapsulants Proprietary Liquid Encapsulants Silicone Polyurethane .
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HAST evaluation of organic liquid IC encapsulants using Sandia's assembly test chips
Accelerated aging (HAST) experiments have been conducted with special purpose corrosion test chips(ATCs) in both bare die form and with various liquid encapsulants ; epoxy, silicone and silicone elastomer, or silicone gel.
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Federal Register > Monday, February 12, 2007 > [72 FR 6518] Foreign-Trade Zone 121 - Albany, New York, Application for Subzone, MPM Silicones, LLC, (Silicone-B...
… for the manufacturing and warehousing of methyl chloride, organo functional silanes, silicone fluids, plastics additives, anti-fog coating and primers, pressure sensitive adhesives, abrasion resistant coatings, adhesive sealants, architectural coatings, urethane foam additives, encapsulants , uncured silicone rubber, liquid injection molding components, paper …
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Exhibitor listing
… offer a unique combination of thermal, electrical, and mechanical properties that make them excellent candidates for use in a range of thermal management materials, including gap fillers and underfills, potting and molding compounds, silicone and other compliant pads, liquid encapsulants , and compounded .
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http://dspace.mit.edu/bitstream/handle/1721.1/85789/871543633-MIT.pdf?sequence=2
Dow Corning* silicone encapsulants are supplied as two-part liquid .
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http://dspace.mit.edu/bitstream/handle/1721.1/85787/871542017-MIT.pdf?sequence=2
Dow Coming silicone encapsulants are supplied as two-part liquid component kits.
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http://dspace.mit.edu/bitstream/handle/1721.1/85793/871552123-MIT.pdf?sequence=2
Dow Coming* silicone encapsulants are supplied as two-part liquid component kits.
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NEW LoSTRESS(tm) Liquid Encapsulant Reduces Stress And Warping On Thin Circuit Board Substrates
Polysciences' LoSTRESS liquid encapsulant is a superior alternative to higher modulus epoxy and traditional silicone encapsulants .
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http://www.polysciences.com/SiteData/docs/201415PROD/fdc6998e52f8c3b4/2014-15%20PRODUCT%20CATALOG.pdf
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Polymers In Solar Modules
The silicone encapsulants are UV stable, durable, increase light transmission (and therefore efficiency), and the liquid process is less labour intensive and more cost-effective.