Liquid Silicone Encapsulants

Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature

• Viscosity: 400 cP
• Thermal Conductivity: 0.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
• Dielectric Strength: 635.0000000000014 kV/in

Description: CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the

• Use Temperature: -67 to 399.2 F
• Thermal Conductivity: 0.18 W/m-K
• Elongation: 35 %
• Tensile Strength (Break): 20.30515751000758 psi

Description: WACKER SilGel® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel® 611 A/B is a white colored modification of WACKER SilGel® 612 with higher hardness and reactivity. Special features two-part, 1 : 1

• Viscosity: 1,000 cP
• Features: Electronics, Encapsulating / Potting, Liquid, RTV / Room Temperature Curing
• Chemical System: Rubber Based / Elastomeric, Silicone
• Cure / Technology: Single Component System, Thermosetting / Crosslinking

Description: CONFORMAL COATING - SILICONE, WITH UV INDICATOR, UL RECOGNIZED; 2 OZ LIQUID

Description: LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating LOCTITE® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features

• Viscosity: 2,230 cP
• Chemical System: Silicone
• Cure / Technology: Two Component System

Description: Loctite 5620 clear silicone sealant with a 72 hr cure time. Minimum to maximum operating temperatures are -40 F to +450 F.

• Use Temperature: -40 to 450 F

Description: Potting, encapsulant elastomer Properties Viscosity 3500 Hardness Sha 48 Description a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL™ ESA 7252 QC A & B is supplied as a viscous liquid

• Viscosity: 3,000 to 3,500 cP
• Thermal Conductivity: 0.42 W/m-K
• Coeff. of Thermal Expansion (CTE): 4.444444444444445 µin/in-F
• Tensile Strength (Break): 333.584730521553 psi

Description: 20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from

• Viscosity: 6,000 cP
• Use Temperature: -175 to 401 F
• Thermal Conductivity: 0.207688176 W/m-K
• Coeff. of Thermal Expansion (CTE): 182.99999999999997 µin/in-F

Description: MG Chemicals Silicone Conformal Coating is ideal for high temperature environments. Silicone Conformal coating is a flexible finish product that provides a protective coating for printed circuit boards against moisture, corrosion, and thermal shock. It protects and insulates electrical

Description: Silicone Elastomer for encapsulating applications Properties Viscosity 7500 Hardness Sha 55 Description Bluesil V-1010 is a medium strength, two-component, tin catalyzed, room temperature cure silicone rubber. It is designed as a low viscosity, very flowable material for use as a

• Use Temperature: -65 to 400 F
• Tensile Strength (Break): 400 psi
• Elongation: 105 %
• Form / Function: Conformal / Encapsulating Coating

Description: ELASTOSIL® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features two-part, 1 : 1 mixing ratio low viscosity low hardness low risk of inhibition rapid heat cure primerless adhesion Application encapsulation of electronic components conformal

• Features: Electronics, Liquid
• Chemical System: Rubber Based / Elastomeric, Silicone
• Cure / Technology: Thermosetting / Crosslinking, Two Component System

Description: ELASTOSIL® RT 607 A/B is a pourable, addition curing RTV-2 silicone rubber. Special features two-part, 9 : 1 mixing ratio low viscosity rapid heat cure high hardness excellent heat stability flame retardant Application general purpose Encapsulant

• Viscosity: 200 to 15,000 cP
• Tensile Strength (Break): 435.110518071591 psi
• Elongation: 100 %
• Features: Electronics, Encapsulating / Potting, Liquid, RTV / Room Temperature Curing

Description: SEMICOSIL® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features Rapid cure Excellent electrical properties Excellent adhesion to many substrates Available in clear or red Application SEMICOSIL® 960 CLEAR is a conformal

• Viscosity: 4,000 cP
• Dielectric Strength: 457.20000000000095 kV/in
• Dielectric Constant (Relative Permittivity): 2.7
• Form / Function: Conformal / Encapsulating Coating

Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.

• Viscosity: 32,000 cP
• Use Temperature: -85 to 410 F
• Thermal Conductivity: 1.7307348 W/m-K
• Tensile Strength (Break): 850 psi

Description: Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound Properties Viscosity 6000 Hardness Sha 30 Description BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and

• Form / Function: Conformal / Encapsulating Coating
• Features: Electronics, Encapsulating / Potting, Liquid
• Cure / Technology: Reactive / Moisture Cured, Thermosetting / Crosslinking, Two Component System
• Chemical System: Silicone

Description: MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation.

• Applied Thickness / Gap Fill: 1 inch
• Viscosity: 1,000 cP
• Use Temperature: -67 to 392 F
• Dielectric Strength: 500.00000000000006 kV/in

Description: No Description Provided

• Viscosity: 8,000 to 12,000 cP
• Tensile Strength (Break): 30 to 50 psi
• Elongation: 80 to 120 %
• Features: Ceramic / Glass, Composites, Conformal Coating, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulating / Potting, Liquid, Metal, Non-corrosive Cure, RTV / Room Temperature Curing

Description: reduces the migration of liquid product after application to the substrate.

• Features: Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: No Description Provided

• Viscosity: 70,000 to 120,000 cP
• Tensile Strength (Break): 200 psi
• Elongation: 250 %
• Features: Ceramic / Glass, Composites, Conformal Coating, Electrical Insulation / Dielectric Material, Electrical Power / HV, Electronics, Encapsulating / Potting, Gap Filling Sealant / FIP Gasket, Liquid, Metal, Non-corrosive Cure, RTV / Room Temperature Curing

Description: KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when

• Viscosity: 11,000 to 14,000 cP
• Form / Function: Die Bonding Adhesive / Compound
• Features: Electronics, Gap Filling Sealant / FIP Gasket, Grease / Paste, Metal, Plastic
• Chemical System: Silicone

Description: DETAILS YE5505 is a low viscosity silicone coating from Momentive Performance Materials. It has an easily pourable consistency and excellent adhesion to metals, ceramics and glass without the use of a primer. Product Benefits Low viscosity Oxime cure; little risk of corrosion Excellent

• Form / Function: Conformal / Encapsulating Coating
• Features: Electronics
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Techsil® RTV27844 is a clear liquid, which cures at room temperature to a high strength silicone rubber with the addition of a curing agent. Once cured, RTV27844 has a hardness of 44 shore A, with 120% elongation, and a 1,406 refractive index. RTV27844 is supplied as a complete kit in

• Features: Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Techsil® RTV27844 is a clear liquid, which cures at room temperature to a high strength silicone rubber with the addition of a curing agent. Once cured, RTV27844 has a hardness of 44 shore A, with 120% elongation, and a 1,406 refractive index. RTV27844 is supplied with a curing agent

• Features: Encapsulating / Potting
• Chemical System: Rubber Based / Elastomeric, Silicone

Description: Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9

• Viscosity: 35,000 to 50,000 cP
• Use Temperature: -65 to 221 F
• Thermal Conductivity: 1.1538 to 1.2981 W/m-K
• Coeff. of Thermal Expansion (CTE): 61.11 to 77.77999999999999 µin/in-F

Description: Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and

• Use Temperature: -65 to 400 F
• Tensile Strength (Break): 100 to 150 psi
• Elongation: 150 to 180 %
• Dielectric Strength: 450.00000000000006 kV/in

Description: well as many rubbers and plastics. Tack free time can range from 10-20 minutes. This compound withstands liquid sterilants, gamma radiation and EtO very well. Its service temperature range is -75°F to +400°F.

• Use Temperature: -75 to 400 F
• Tensile Strength (Break): 1,300 to 1,600 psi
• Elongation: 400 to 600 %
• Dielectric Constant (Relative Permittivity): 2.75

Description: Dow SYLGARD™ 184 Clear is a two component, flowable, room temperature and heat cure silicone curing agent with good dielectric properties and flame resistance. Curing agent only. It is to be used with Dow SYLGARD™ 184 Base to form a flexible, encapsulant that is used to protect

• Applications: Adhesives / Sealants, Elastomers / Rubbers, Plastics / Composites
• Function: Curing Agent ( Hardener / Curative)
• Form & Features: Liquid / Solution

Description: Chemical Zinc Oxide⁄Non Hazardous, Non Silicone Heat Transfer Compound Lubricant Type Ideal for aggressive chemical environments. Urethane conformal coating is a durable finish product that provides a protective coating for printed circuit boards against moisture, corrosion and thermal shock.

Description: Chemical Zinc Oxide⁄Non Hazardous, Non Silicone Heat Transfer Compound Lubricant Type Ideal for aggressive chemical environments. Urethane conformal coating is a durable finish product that provides a protective coating for printed circuit boards against moisture, corrosion and thermal shock.

Description: Product Availability Minimum Order Quantity : 60 Potting Resin Product Availability : China, ASIA, ANZPAC, AMERICAS, EMEA Product Type Features Component Design : Liquid Material System : Fluid Silicone Potting Resin Product Type : Casting Material Potting Resin Technology : Insulating

• Features: Encapsulant / Potting Compound, Specialty / Other
• Chemical System: Silicone

Description: moisture resistance. Two-part systems consist of a powder and liquid binder system. Materials set at room temperature in several hours, then cured at ~250 °F in 2-4 hours. Sil-Bond™, a silicone-ceramic potting compound for optimal moisture resistance, is now offered along with EZ-Cast™

• Use Temperature: 900 F
• Chemical System: Ceramic / Inorganic Cement, Silicone
• Features: Electronics, Encapsulating / Potting, Grease / Paste
• Composition: Filled

Description: RTV-2 for protective potting, coating and encapsulation Properties Viscosity 150000 Hardness Sha 60 Description RTV Elastomer - Two components addition cure for encapsulation/protection of electronical systems and production of moulding parts Good heat stability in confined environments Excellent

• Use Temperature: -94 to 572 F
• Thermal Conductivity: 0.31 W/m-K
• Coeff. of Thermal Expansion (CTE): 5 µin/in-F
• Tensile Strength (Break): 507.628937750189 to 870.221036143182 psi

Description: Hi-temp, prevents dusting of fibrous insulation materials

• Viscosity: 600 to 1,200 cP
• Use Temperature: 1,100 F
• Industry: Automotive, OEM / Industrial
• Features: Ceramic / Glass, Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting Compound, Filled / Reinforced, Gap Filling Sealant / FIP Gasket, Liquid, Other

Description: Whether adhesive bonding, sealing, filling or insulating: Due to their simple, robust design principle, piston dispensers are the systems of choice for many different dispensing tasks. They also cover a wide range of materials: In addition to very liquid adhesives, sealants and

• Dispense Rate: 0.12007820574422538 L/min
• Shot Size: 0.060000000000000005 to 32 cc
• Metering Accuracy: 0.5 %
• Application: Adhesive / Silicone

Description: LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures.

• Use Temperature: -76 to 356 F
• Thermal Conductivity: 0.55 W/m-K
• Dielectric Strength: 254.00000000000054 kV/in
• Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial