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Description: , and Macor Components. Typical Features Can be machined using standard metalworking equipment. Low thermal conductivity Excellent electric insulator for high voltages Continuous working temperature of 800 C and peak temperature of 1000 C
- Density: 2.6 g/cc
- Dielectric Strength: 4.00E7 V/m
- Max Use Temperature: 1000 C
- Shape / Form: Plate / Board (e.g., Fiberboard)
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Supplier: Total Plastics, Inc.
Description: Dielectric Sheet is a cellular based laminate impregnated with thermosetting resins. Manufactured under high pressure and temperature into dense, uniform sheets having good electrical and mechanical properties. This material conforms to Nema XX thickness and flatness standard
- Material Type / Grade: UL Approved
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Supplier: NIKKO Company
Description: Features Easy to achieve high number of layers Fine Line, small diameter via capabilities Various layer thicknesses available Capable of offering a Cavity structure Capable of creating surface resistors with trimming options Low resistance conductor material available for internal and
- Applications: Other
- Material Type: Alumina / Aluminum Oxide
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Foams and Foam Materials - Closed-cell Polyurethane Dielectric Foam Material -- LAST-A-FOAM® RF-2206Supplier: General Plastics Manufacturing Co.
Description: LAST-A-FOAM® RF-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of Machin able, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring
- Application: Other
- Bulk Density: 6 lbs/ft³
- Foam Type: Closed Cellular, Rigid
- Form / Shape: Stock Shape (Bar, Sheet, etc.), Board / Block / Bun
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features Low ion content Low volatile content Low viscosity Good mechanical damping properties Application SEMICOSIL® 925 is a
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 2.5
- Dielectric Strength: 559 kV/in
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Single Component System
- Dielectric Strength: 533 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Accuratus Corporation
Description: glass is a very low thermal expansion material, and so is extremely thermal shock resistant. The material is also chemically inert up to moderate temperatures except to hydrofluoric acid, which dissolves silica. It will devitrify above about 1100°C in the presence of
- Material Type: Fused Silica, Silica / Silicate Materials
- Shape / Form: Fabricated / Custom Shape
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Supplier: 3X Ceramic Parts Company Limited
Description: >108MPa Compression Strength >508 MPa Thock Fracturness >2.56KJ/ m2 Elastic Modulus 65GPa Dielectric loss 1~ 4×10-3 Room temperature Dielectric Constant 6~7 " Thock Strength >40KV/mm
- Material Type: Glass Ceramic, Silica / Silicate Materials
- Thermal Conductivity: 1.71 W/m-K
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Electrical and Electronic Resins - Dielectric Silicone Gel For Sealing Electronics -- SEMICOSIL® 912Supplier: Wacker Chemical Corp.
Description: low viscosity modular system allows flexible adjustment of pot life and curing time by selection among different catalysts (no lot binding between base and catalyst) fast curing at room temperature with Catalyst PT-F long pot life at room temperature with Catalyst PT
- Chemical / Polymer System Type: Silicone
- Composition: Two Component System
- Cure Type / Technology: UV / Radiation Cured (also EB, Light)
- Dielectric Constant (Relative Permittivity): 2.7
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 457 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 35 kg Kit.
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 457 kV/in
- Elongation: 300 %
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Supplier: Master Bond, Inc.
Description: MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock.
- Chemical / Polymer System Type: Silicone
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System, Specialty / Other
- Dielectric Constant (Relative Permittivity): 2.6
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
- Dielectric Strength: 6.24E7 V/m
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
- Dielectric Strength: 6.24E7 V/m
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
- Dielectric Strength: 6.24E7 V/m
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Supplier: San Jose Delta Associates, Inc.
Description: Macor is a relatively easy material to machine using ordinary carbide drills, end mills, taps, etc. and doesn’t require post machining firing. Macor-Machinable Glass Ceramic is also unique in that it can withstand 1000°C, has low thermal conductivity and is a good electrical insulator
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Other
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
- Dielectric Strength: 6.24E7 V/m
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Supplier: Master Bond, Inc.
Description: Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and can be applied in sections as thin as 5-15 microns, resulting
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.7
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Supplier: ASTM International
Description: This specification covers a two-part flowable space grade silicone rubber room temperature vulcanizing (RTV) adhesive or compound. This specification provides material requirements and testing procedures to differentiate between the physical, mechanical, electrical, and adhesive
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Supplier: ASTM International
Description: This specification covers a two-part flowable space grade silicone rubber room temperature vulcanizing (RTV) adhesive or compound. This specification provides material requirements and testing procedures to differentiate between the physical, mechanical, electrical, and adhesive
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Supplier: ASTM International
Description: This specification covers a two-part flowable space grade silicone rubber room temperature vulcanizing (RTV) adhesive or compound. This specification provides material requirements and testing procedures to differentiate between the physical, mechanical, electrical, and adhesive
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Supplier: Aremco Products, Inc.
Description: Aremco offers a broad range of machinable and fully-dense ceramic materials for applications in which high temperature insulation, thermal shock resistance and high dielectric strength are required. Aremcolox? and Super-Heat ceramics include compositions based on alumina,
- Applications: Chemical / Materials Processing, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperature Materials
- Density: 2.77 g/cc
- Dielectric Constant (Relative Permittivity): 6.8 #
- Glass Type: Glass Ceramic
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. Part A, 18.1 kg Pail.
- Compound Type: Encapsulating / Potting
- Cure Type / Technology: Two Component System
- Dielectric Strength: 425 kV/in
- Features: Electrical Insulation / Dielectric Material
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Supplier: Shiu Li Technology Co., Ltd
Description: AS17 is an advanced insulation material composed of a fiber composite made from porous silica, aluminum nitride, and other materials, with an extremely low thermal conductivity of 0.028 W/m·K. AS17 is notable for its ability to prevent thermal runaway, its ultra-low
- Features: Electrical Insulation / Dielectric Material, Thermal Insulation / Heat Insulating
- Form: Film / Sheet, Pad, Specialty / Other
- Industry: Optoelectronics / Photonics, Semiconductors / IC Packaging, Electronics, Electrical Power / HV
- Thermal Conductivity: 0.0280 W/m-K
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Supplier: 3X Ceramic Parts Company Limited
Description: bonded material with hexagonal crystal structure.AlN has excellent thermal, mechanical and electrical properties, such as high thermal conductivity, low dielectric constant, high electrical resistivity, low density and a thermal expansion coefficient that matches well
- Coeff. of Thermal Expansion (CTE): 3 to 4.5 µm/m-C
- Dielectric Constant (Relative Permittivity): 9.66 to 10.6 #
- Loss Tangent (tan δ ): 3.00E-4 #
- Material Type: Aluminum Nitride
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Supplier: 3X Ceramic Parts Company Limited
Description: Silicone Nitride Ceramic Wafer Material Description : Silicon nitride ceramic material has high hardness, low density, wear resistance and high temperature resistance. The rolling body is made of silicon nitride ceramic, while the other components are paired with bearing
- Coeff. of Thermal Expansion (CTE): 3.3 µm/m-C
- Dielectric Constant (Relative Permittivity): 8 #
- Material Type: Silicon Nitride
- Thermal Conductivity: 15 to 20 W/m-K
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Supplier: 3X Ceramic Parts Company Limited
Description: Silicone Nitride Material Description : Silicon nitride ceramic material has high hardness, low density, wear resistance and high temperature resistance. The rolling body is made of silicon nitride ceramic, while the other components are paired with bearing steel to form
- Coeff. of Thermal Expansion (CTE): 3.3 µm/m-C
- Dielectric Constant (Relative Permittivity): 8 #
- Material Type: Silicon Nitride
- Thermal Conductivity: 15 to 20 W/m-K
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Supplier: Newport MKS
Description: The 10Q20BB.2 is an Ultra-broadband Dielectric Mirror with a 25.4 mm diameter, 6.35 mm thickness, and absolute Reflectivity > 99% at an AOI of 0-50°, from 610-1130 nm. Newport’s Ultra-broadband mirrors are IBS coated with layers of dielectric materials to use for high reflection
- Diameter/Width: 25.4 mm
- Mirror Coatings: Dielectric, Other Mirror Coating
- Mirror Materials: Fused Silica, Other Mirror Material
- Mirror Shape: Round, Other
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Supplier: Newport MKS
Description: The 10Q20BB.3 is an Ultra-broadband Dielectric Mirror with a 25.4 mm diameter, 6.35 mm thickness, and absolute Reflectivity > 99% at an AOI of 0-50°, from 350-1100 nm. Newport’s Ultra-broadband mirrors are IBS coated with layers of dielectric materials to use for high reflection
- Diameter/Width: 25.4 mm
- Mirror Coatings: Dielectric, Other Mirror Coating
- Mirror Materials: Fused Silica, Other Mirror Material
- Mirror Shape: Round, Other
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Supplier: Newport MKS
Description: The 10Q20BB.1 is an Ultra-broadband Dielectric Mirror with a 25.4 mm diameter, 6.35 mm thickness, and absolute Reflectivity > 99% at an AOI of 0-50°, from 350-700 nm. Newport’s Ultra-broadband mirrors are IBS coated with layers of dielectric materials to use for high reflection
- Diameter/Width: 25.4 mm
- Mirror Coatings: Dielectric, Other Mirror Coating
- Mirror Materials: Fused Silica, Other Mirror Material
- Mirror Shape: Round, Other
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Supplier: Newport MKS
Description: a low content of inclusions with high refractive index homogeneity, a very low thermal expansion coefficient, and excellent transmittance in the wavelength regime from UV to NIR. As a result, these mirrors will perform better with temperature fluctuations and is ideal for
- Diameter/Width: 50.8 mm
- Mirror Coatings: Dielectric, Other Mirror Coating
- Mirror Materials: Fused Silica, Other Mirror Material
- Mirror Shape: Round, Other
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Supplier: Master Bond, Inc.
Description: Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100°F to +500°F with a glass transition
- Applied Thickness / Gap Fill: 0.0040 to 0.0060 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Specialty Seal Group
Description: Mechanical Strength Pressures over 10,000 PSI High Temperature Usage Low Dielectric Loss Mass Spectrometer Leak Tested High Chemical Stability
- Feedthrough Type: Electrical
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Supplier: Accuratus Corporation
Description: Boron nitride is a white solid material in the as produced hot pressed form. It is a low porosity solid. It is easily machined into complex shapes using standard carbide tooling. The material is anisotropic in its electrical and mechanical properties due to the platy hexagonal
- Material Type: Boron Nitride
- Shape / Form: Fabricated / Custom Shape
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATITE®650 is an alloy of silicon nitride and aluminum oxide. This superior refractory material has the combined properties of silicon nitride (high strength, hardness, fracture toughness, and low thermal expansion) and aluminum oxide (corrosion resistance, chemically inert, high
- Applications: Other
- Bore Diameter (I.D.): 0.2559 to 0.6299 inch
- Coeff. of Thermal Expansion (CTE): 3 µm/m-C
- Length: 5.91 to 23.62 inch
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Supplier: Lydall Performance Materials
Description: upon drying. Features/Advantages: Easy to cut wrap or form Temperature stability Low thermal conductivity Low heat storage Resilient Light Weight Thermal shock resistant High heat reflectance Good dielectric strength
- Applications: Fire Proofing / Thermal Protection, Other
- Electrical Resistivity: 55 Ohm-cm
- Overall Thickness: 0.0625 to 0.3750 inch
- Overall Width / OD: 12 to 24 inch
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Supplier: Lydall Performance Materials
Description: or form Temperature stability Low thermal conductivity Low heat storage Resilient Light Weight Thermal shock resistant High heat reflectance Good dielectric strength Excellent corrosion resistance Applications: Parting plane in
- Applications: Fire Proofing / Thermal Protection, Other
- Electrical Resistivity: 50 Ohm-cm
- Fabric Strength: 4.85 to 5.29 lbs/in
- Overall Thickness: 0.0312 inch
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Supplier: Lydall Performance Materials
Description: or form Temperature stability Low thermal conductivity Low heat storage Resilient Light Weight Thermal shock resistant High heat reflectance Good dielectric strength Excellent corrosion resistance Applications: Parting plane in
- Applications: Fire Proofing / Thermal Protection, Other
- Electrical Resistivity: 50 Ohm-cm
- Fabric Strength: 11.46 to 13.23 lbs/in
- Overall Thickness: 0.1250 inch
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Supplier: Lydall Performance Materials
Description: or form Temperature stability Low thermal conductivity Low heat storage Resilient Light Weight Thermal shock resistant High heat reflectance Good dielectric strength Excellent corrosion resistance Applications: Parting plane in
- Applications: Fire Proofing / Thermal Protection, Other
- Electrical Resistivity: 50 Ohm-cm
- Fabric Strength: 5.95 to 7.05 lbs/in
- Overall Thickness: 0.0625 inch
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Supplier: Master Bond, Inc.
Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond lines as thin as
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: thermal cure at low temperature. Temporarily curing the material allows for any necessary adjustments to the final device configuration. Dual cure system Low viscosity Fast cure at low temperature Non-conductive Good adhesion to a variety of substrates
- Features: Electrical Insulation / Dielectric Material
- Substrate / Material Compatibility: Ceramic / Glass
- Viscosity: 22000 cP
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Description: Low thermal expansion Good thermal shock resistance Low dielectric constant and loss tangent Excellent machinability Chemically inert Corrosion resistant Not wet by most molten metals Extremely high working temperature
- Material Type: Boron Nitride
- Shape / Form: Tube / Sheath - Immersion (Closed End)
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Supplier: Techsil Limited
Description: DETAILS RTV577 is a low temperature silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric
- Compound Type: Encapsulating / Potting
- Use Temperature: -115 to 204 F
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Supplier: Aremco Products, Inc.
Description: Aremco offers a broad range of machinable and fully-dense ceramic materials for applications in which high temperature insulation, thermal shock resistance and high dielectric strength are required. Aremcolox™ and Super-Heat™ ceramics include compositions based on aluminum
- Applications: Chemical / Materials Processing, Foundry / Metal Processing, Refractory / High Temperature Materials
- Material Type: Zirconia, Specialty Ceramic
- Performance Features: Machinable
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Supplier: Accuratus Corporation
Description: Accuratus maintains an inventory of standard extruded and cast aluminum oxide, mullite and sialon shapes for fast delivery requirements. These are low cost, quality rods and tubes that can be quickly cut to precision lengths. (See Mullite Sizes, Aluminum Oxide Sizes and Sialon Sizes
- Applications: Abrasive / Erosive Wear Protection, Armor / Ballistic Protection, Dielectric / Electrical Insulation, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperature Materials
- Coeff. of Thermal Expansion (CTE): 8.1 to 8.4 µm/m-C
- Compressive / Crushing Strength: 304577 to 377096 psi
- Density: 3.69 to 3.89 g/cc
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Supplier: Birk Manufacturing, Inc.
Description: Birk Manufacturing has increased its product offering by introducing a new line of thin-film high temperature (HT) flexible heaters. These high-performance heating elements are capable of operating at temperatures up to 300°C. Their lightweight, low mass design allows for very
- Heater Type: Other
- Maximum Operating (Sheath) Temperature: 572 F
- Sleeve (Sheath) Material: Polyimide
Find Suppliers by Category Top
Featured Products Top
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SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
handling Excellent heat resistance Toughened system Passes NASA low outgassing Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
increasingly complex, engineers seek materials that can accomplish more. Dielectric foam meets this demand. Aerospace companies encounter various design challenges. High altitudes create extreme temperature changes. Parts must endure without losing strength or signal clarity. RF systems operate (read more)
Browse Electrical Insulation and Dielectric Materials Datasheets for General Plastics Manufacturing Co. -
-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of machinable, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring optimal performance where (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
Low Loss Dielectric Materials Cuming Microwave manufactures a full line of low loss dielectric materials. Our materials range in dielectric constant from 1 (read more)
Browse Foams and Foam Materials Datasheets for Dexmet® Corporation, a part of PPG’s engineered materials division -
Silicon Valley area to quickly evaluate and test Fujipoly products to see how they will perform for their specific application. Fujipoly’s CERC is fully equipped to test thermal resistance, electrical resistance/isolation, compression force, hardness, viscosity, tensile strength, reliability testing at high & low temperatures and heat shock. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
temperatures, making them suitable for demanding thermal environments. Low Thermal Expansion: The combination of metal and ceramic reinforcement gives MMCs a low coefficient of thermal expansion, ensuring dimensional stability even under temperature variations. (read more)
Browse Ultra-hard Materials Machining Datasheets for Top Seiko Co., Ltd. -
do not absorb water, thus preventing changes in dielectric performance. Our dielectric materials display non-dispersive and low-loss properties, where dielectric performance stays (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications. As a single component system, EP3UF is easy to handle with an “unlimited” working life at room temperature and fast cures at temperatures as low as (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
Conduct Research Top
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Dielectric Materials for Use in Radomes
Mfg. Co. presents an overview of dielectric materials, as well as a comparison of polyurethane foam with other commonly used dielectrics. In addition, dielectric properties of three series of rigid polyurethane foam at low, medium and high densities are examined in frequencies ranging from 1 - 10 GHz
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
chamber geometries by. imposing a dielectrophoresis (DEP) force on the beads. In cDEP the electrodes are not in. direct contact with the fluid sample but are instead capacitively coupled to the mixing. chamber through thin dielectric barriers, which eliminates many of the problems. encountered
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Beryllia Ceramic BeO Metallization
The thermal conductivity of BeO ceramics is very high, which is comparable to that of some metal materials; it also has the advantages of high-temperature resistance, high-pressure resistance, high strength, and low dielectric loss, which meets the requirements of power devices for insulation
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3D Scanners Take Volume Measurement to a New Level
for hazardous locations. Not affected by material characteristics or low dielectric constants. CONS. Elevated background noise can impact performance of acoustics technology. Setup requires care in mounting the sensor in the proper location and accurately mapping the vessel dimensions. Time required
More Information Top
Indicates content that may require registration and/or purchase.
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Abstract listings
14:40 - 15:00 Low Temperature Dielectric Material for Embedded Micro Wafer Level Packaging .
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Assessments of Low-Temperature Aging Test Method for the Dielectric Materials Immersed in Liquid Nitrogen
In order to investigate degradation phenomena of cryogenic dielectric materials, generally used low temperature dielectric materials including Nomax, Kapton, Kraft sheet were prepared for the tests [3]–[7].
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Comparative Evaluation Between DC and AC Breakdown Characteristic of Dielectric Insulating Materials in Liquid Nitrogen
Commonly used low temperature dielectric materials , including Kapton (polyimide), Kraft and Nomex (polyamide) sheets, have been prepared.
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Will future RFIC be flexible? (Invited)
After the devices are isolated with reactive ion etching, gate stack is formed with low temperature dielectric materials (such as evaporated SiO[8]) and metal gate.
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Embedded wafer level packages with laterally placed and vertically stacked thin dies
Several materials like mold compounds with different coefficients of thermal expansion (CTE) and filler contents, molding tapes, dicing die attach films, low temperature dielectric materials have been evaluated and the associated processes are optimized.
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Low temperature variable inductor using Porous Anodic Alumina
PAA is a novel low cost and low temperature dielectric material that can be easily tuned and integrated with RFIC or MEMS process.
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Cable Materials
Lower temperature dielectric materials soften at relatively low tempera- tures and inevitably the center conductor migrates off-center, toward the shield, in the direction of gravity or the inside of a bend in the cable.
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Printed thin film transistor: materials and applications
PRINTED CONDUCTORS AND LOW TEMPERATURE DIELECTRIC MATERIALS .
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Case study on the US superconducting power transmission program
Besides establishing the AC loss behavior of the superconductor chosen, the other components of an AC SPTL R&D program include the development of satisfactory low temperature dielectric materials , conductor design and develapment, the development of conductor joining processes, provision for thermal…
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Technical sessions
14:40 - 15:00 Low Temperature Dielectric Material for Embedded Micro Wafer Level Packaging .