Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Foams and Foam Materials - Closed-cell Polyurethane Dielectric Foam Material -- LAST-A-FOAM® RF-2206Supplier: General Plastics Manufacturing Co.
Description: LAST-A-FOAM® RF-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of Machin able, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring
- Bulk Density: 6 lbs/ft³
- Tensile Strength: 130 psi
- Thermal Conductivity: 0.24000000000000002 BTU-in/hr-ft²-F
- Form / Shape: Board / Block / Bun, Stock Shape (Bar, Sheet, etc.)
-
Supplier: Kayaku Advanced Materials, Inc.
Description: dielectric layers with reduced mechanical stress. Key Features i-Line/broadband sensitivity 1:1 aspect ratio imaging Solvent development Low temperature cure < 200°C Excellent thermal & chemical stability No warpage due to low shrinkage and tensile modulus. High
- Applications: Electronics / Microelectronics
- Thick Film Type: Resistor
-
Supplier: NIKKO Company
Description: Features Easy to achieve high number of layers Fine Line, small diameter via capabilities Various layer thicknesses available Capable of offering a Cavity structure Capable of creating surface resistors with trimming options Low resistance conductor material available for internal and
- Material Type: Alumina / Aluminum Oxide
- Features: Dielectric Ceramics / Materials, Other
-
-
Supplier: ASTM International
Description: elongation, dielectric strength, dielectric constant, volume resistivity, outgassing characteristics, total mass loss, volatile condensable material, and storage life.
-
Supplier: ASTM International
Description: elongation, dielectric strength, dielectric constant, volume resistivity, outgassing characteristics, total mass loss, volatile condensable material, and storage life.
-
Supplier: ASTM International
Description: elongation, dielectric strength, dielectric constant, volume resistivity, outgassing characteristics, total mass loss, volatile condensable material, and storage life.
-
Supplier: Total Plastics, Inc.
Description: E96516 as a self-extinguishing material. Dielectric Sheet has low moisture absorption and good dielectric strength. It also has good dimensional stability and is easy to fabricate. Consider Dielectric sheet when using glass polyester for indoor applications.
- Form / Shape: Film / Sheet
- Features: UL Approved
-
Supplier: Techsil Limited
Description: DETAILS RTV577 is a low temperature silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric
- Use Temperature: -115 to 204 F
- Features: Encapsulating / Potting, Rubber Based / Elastomeric
- Chemical System: Silicone
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200
- Viscosity: 690 cP
- Dielectric Strength: 533 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting
- Industry: Electronics, Semiconductors / IC Packaging
-
Supplier: Master Bond, Inc.
Description: in a low thermal resistance.
- Use Temperature: -100 to 300 F
- Tensile Strength (Break): 5,000 to 6,000 psi
- Dielectric Strength: 400.00000000000006 kV/in
- Dielectric Constant (Relative Permittivity): 4.7
-
Supplier: Wacker Chemical Corp.
Description: curing time by selection among different catalysts (no lot binding between base and catalyst) fast curing at room temperature with Catalyst PT-F long pot life at room temperature with Catalyst PT extremely fast curing with Catalyst UV low hardness excellent tackiness Application
- Viscosity: 1,000 cP
- Dielectric Strength: 584.2000000000012 kV/in
- Dielectric Constant (Relative Permittivity): 2.7
- Index of Refraction: 1.404
-
Supplier: Master Bond, Inc.
Description: MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock.
- Use Temperature: -175 to 500 F
- Tensile Strength (Break): 800 to 1,000 psi
- Elongation: 110 to 140 %
- Dielectric Strength: 45 kV/in
-
Description: and Macor Components. Typical Features Can be machined using standard metalworking equipment. Low thermal conductivity Excellent electric insulator for high voltages Continuous working temperature of 800 C and peak temperature of 1000 C Zero porosity Won't cause outgassing in
- Max Use Temperature: 1,000 C
- Thermal Conductivity: 1.68 W/m-K
- Dielectric Strength: 40,000,000 V/m
- Density: 2.5999983590696485 g/cc
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a
- Viscosity: 750 cP
- Dielectric Strength: 457.20000000000095 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting
- Chemical System: Silicone
-
Supplier: Master Bond, Inc.
Description: Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100°F to +500°F with a glass transition
- Applied Thickness / Gap Fill: 0.004 to 0.006 inch
- Viscosity: 140,000 to 280,000 cP
- Use Temperature: -100 to 500 F
- Tensile Strength (Break): 6,000 to 7,000 psi
-
Supplier: Shiu Li Technology Co., Ltd
Description: AS17 is an advanced insulation material composed of a fiber composite made from porous silica, aluminum nitride, and other materials, with an extremely low thermal conductivity of 0.028 W/m·K. AS17 is notable for its ability to prevent thermal runaway, its ultra-low
- Use Temperature: -76 to 2,372 F
- Thermal Conductivity: 0.028 W/m-K
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Laminating Adhesive / Composite Resin, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Photonics / Optoelectronics, Semiconductors / IC Packaging, Tooling / Mold Material
- Features: Electrical Insulation / Dielectric Material, Film / Sheet, Gap Filling Sealant / FIP Gasket, Other, Pad, Specialty / Other, Thermal Insulation / Heat Insulating
-
Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-6635 Dielectric Gel Clear is a one component, heat curing, low temperature gel that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, low viscosity, durable, and self healing. 18.1 kg Pail.
- Viscosity: 700 to 1,100 cP
- Dielectric Strength: 520 kV/in
- Features: Electrical Insulation / Dielectric Material, Electronics, Encapsulating / Potting
- Chemical System: Silicone
-
Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit.
- Viscosity: 465 cP
- Dielectric Strength: 425.00000000000006 kV/in
- Features: Electrical Insulation / Dielectric Material, Encapsulating / Potting
- Industry: Electronics
-
Supplier: SAE International
Description: dielectric capacitor films. Polyetherimides can be melt extruded into thin films providing a low cost, environmentally friendly dielectric material. Discussions of the results of melt extrusion, metallization, and winding into electrostatic polyetherimide film capacitors
-
Supplier: Newport MKS
Description: The 10Q20BB.1 is an Ultra-broadband Dielectric Mirror with a 25.4 mm diameter, 6.35 mm thickness, and absolute Reflectivity > 99% at an AOI of 0-50°, from 350-700 nm. Newport’s Ultra-broadband mirrors are IBS coated with layers of dielectric materials to use for high reflection
- Wavelength Range: 350 to 700 nm
- Diameter/Width: 25.400000000000002 mm
- Thickness: 6.3500000000000005 mm
- Surface Flatness: λ/10
-
Supplier: Newport MKS
Description: The 10Q20BB.3 is an Ultra-broadband Dielectric Mirror with a 25.4 mm diameter, 6.35 mm thickness, and absolute Reflectivity > 99% at an AOI of 0-50°, from 350-1100 nm. Newport’s Ultra-broadband mirrors are IBS coated with layers of dielectric materials to use for high reflection
- Wavelength Range: 350 to 1,100 nm
- Diameter/Width: 25.400000000000002 mm
- Thickness: 6.3500000000000005 mm
- Surface Flatness: λ/10
-
Supplier: Specialty Seal Group
Description: Ceramic-to-Metal End Seals Give Top Performance in Harsh Industrial Environments High-Temperature Feedthru Terminals Designs: Feedthrus or Pin Seals are custom made to specifications that determined by the electrical, temperature, and environmental condition requirements. The parts
- Features: Electrical
-
Supplier: Newport MKS
Description: The 10Q20BB.2 is an Ultra-broadband Dielectric Mirror with a 25.4 mm diameter, 6.35 mm thickness, and absolute Reflectivity > 99% at an AOI of 0-50°, from 610-1130 nm. Newport’s Ultra-broadband mirrors are IBS coated with layers of dielectric materials to use for high reflection
- Wavelength Range: 610 to 1,130 nm
- Diameter/Width: 25.400000000000002 mm
- Thickness: 6.3500000000000005 mm
- Surface Flatness: λ/10
-
Supplier: Birk Manufacturing, Inc.
Description: Birk Manufacturing has increased its product offering by introducing a new line of thin-film high temperature (HT) flexible heaters. These high-performance heating elements are capable of operating at temperatures up to 300°C. Their lightweight, low mass design allows for very
- Maximum Operating (Sheath) Temperature: 572 F
- Features: Other
- Sleeve (Sheath) Material: Polyimide
-
Description: shock resistance Low dielectric constant and loss tangent Excellent machinability Chemically inert Corrosion resistant Not wet by most molten metals Extremely high working temperature Applications High-temperature furnace setter plates Molten glass and metal crucibles
- Material Type: Boron Nitride
- Shape / Form: Tube / Sheath - Immersion (Closed End)
-
Supplier: Newport MKS
Description: colorless silica glass combines a low content of inclusions with high refractive index homogeneity, a very low thermal expansion coefficient, and excellent transmittance in the wavelength regime from UV to NIR. As a result, these mirrors will perform better with temperature
- Wavelength Range: 350 to 1,100 nm
- Diameter/Width: 12.700000000000001 mm
- Thickness: 3.1 mm
- Surface Flatness: λ/10
-
Supplier: Master Bond, Inc.
Description: EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours,
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 27.779999999999998 to 30.560000000000002 µin/in-F
- Tensile Strength (Break): 7,000 to 8,000 psi
- Dielectric Strength: 400.00000000000006 to 450.00000000000006 kV/in
-
Supplier: DuPont Electronics & Imaging
Description: HT can be used as a coverfilm, offering good coverage over circuits, or as a bonding material for multilayer flex applications. This material system is ideal for multilayer flex and rigid flex applications which require high operating temperature performance, advanced
- Use Temperature: 437 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 µin/in-F
- Tensile Strength (Break): 23,931.0784939375 psi
- Elongation: 170 %
-
Supplier: Lydall Performance Materials
Description: Because it is processed from washed fiber, LyTherm® 970-L paper is clean, has low shot content, and offers low thermal conductivity. It’s highly uniform structure assures homogeneous thermal conductivity throughout, and its high tensile strength makes it ideal as a gasket, seal, or
- Overall Thickness: 0.125 inch
- Overall Width / OD: 12 to 72 inch
- Use Temperature: 2,300 F
- Fabric Strength: 11.464037624 to 13.22773572 lbs/in
-
Supplier: Lydall Performance Materials
Description: Because it is processed from washed fiber, LyTherm® 970-L paper is clean, has low shot content, and offers low thermal conductivity. It’s highly uniform structure assures homogeneous thermal conductivity throughout, and its high tensile strength makes it ideal as a gasket, seal, or
- Overall Thickness: 0.03125 inch
- Overall Width / OD: 12 to 72 inch
- Use Temperature: 2,300 F
- Fabric Strength: 4.850169764 to 5.291094288 lbs/in
-
Supplier: Lydall Performance Materials
Description: Because it is processed from washed fiber, LyTherm® 970-L paper is clean, has low shot content, and offers low thermal conductivity. It’s highly uniform structure assures homogeneous thermal conductivity throughout, and its high tensile strength makes it ideal as a gasket, seal, or
- Overall Thickness: 0.0625 inch
- Overall Width / OD: 12 to 72 inch
- Use Temperature: 2,300 F
- Fabric Strength: 5.952481074 to 7.054792384 lbs/in
-
Supplier: Lydall Performance Materials
Description: concentrated alkalies. Features/Advantages: Easy to cut, wrap or form Temperature stability Low thermal conductivity Low heat storage Resilient and Flexible Light Weight Thermal shock resistant Good dielectric strength High fired tensile strength Good flame resistance
- Overall Thickness: 0.03125 inch
- Overall Width / OD: 12 to 24 inch
- Use Temperature: 2,600 F
- Fabric Strength: 0.95239697184 lbs/in
-
Supplier: Molex Signal Tech Industrial Ltd.
Description: Our Low Loss Semi-Rigid products are designed with solid Aluminum outer jackets for the ability to route cables "on-site" while maintaining the abilities to withstand high levels of radiation doses. The dielectric materials in this product are very low loss and phase
- Application: RF
-
Description: electronic components. ◆ Excellent flame resistance, achieving a UL94 V-0 rating. ◆ Outstanding electrical insulation properties, with dielectric strength up to 8 kV/mm. ◆ No cracking or dripping, ensuring good stability in both high and low-temperature environments. ◆ Can be
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 3.5 W/m-K
- Dielectric Strength: 0.00012700000000000027 kV/in
- Dielectric Constant (Relative Permittivity): 5.5
-
Supplier: SAE International
Description: This paper describes the development of a lead free, high temperature ceramic capacitor material having the base composition of (Na 0.5 Bi 0.5 ) TiO 3 . The goal is to modify this structure to create a material that has the relative permittivity of barium titanate with extended
Find Suppliers by Category Top
Featured Products Top
-
SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
SARCON® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
handling Excellent heat resistance Toughened system Passes NASA low outgassing Master Bond Supreme 11AOHTLP is a two component epoxy resin system for high performance bonding, sealing and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
increasingly complex, engineers seek materials that can accomplish more. Dielectric foam meets this demand. Aerospace companies encounter various design challenges. High altitudes create extreme temperature changes. Parts must endure without losing strength or signal clarity. RF systems operate (read more)
Browse Electrical Insulation and Dielectric Materials Datasheets for General Plastics Manufacturing Co. -
-2200 is an advanced dielectric material for use in radomes, antennas and other radio frequency (RF) communication systems. This series of machinable, closed cell polyurethane foams provide an RF-transparent, low-loss protective layer for applications requiring optimal performance where (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
Low Loss Dielectric Materials Cuming Microwave manufactures a full line of low loss dielectric materials. Our materials range in dielectric constant from 1 (read more)
Browse Foams and Foam Materials Datasheets for Dexmet® Corporation, a part of PPG’s engineered materials division -
Silicon Valley area to quickly evaluate and test Fujipoly products to see how they will perform for their specific application. Fujipoly’s CERC is fully equipped to test thermal resistance, electrical resistance/isolation, compression force, hardness, viscosity, tensile strength, reliability testing at high & low temperatures and heat shock. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Fujipoly® America Corp. -
temperatures, making them suitable for demanding thermal environments. Low Thermal Expansion: The combination of metal and ceramic reinforcement gives MMCs a low coefficient of thermal expansion, ensuring dimensional stability even under temperature variations. (read more)
Browse Ultra-hard Materials Machining Datasheets for Top Seiko Co., Ltd. -
do not absorb water, thus preventing changes in dielectric performance. Our dielectric materials display non-dispersive and low-loss properties, where dielectric performance stays (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications. As a single component system, EP3UF is easy to handle with an “unlimited” working life at room temperature and fast cures at temperatures as low as (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
Conduct Research Top
-
Dielectric Materials for Use in Radomes
Mfg. Co. presents an overview of dielectric materials, as well as a comparison of polyurethane foam with other commonly used dielectrics. In addition, dielectric properties of three series of rigid polyurethane foam at low, medium and high densities are examined in frequencies ranging from 1 - 10 GHz
-
MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
chamber geometries by. imposing a dielectrophoresis (DEP) force on the beads. In cDEP the electrodes are not in. direct contact with the fluid sample but are instead capacitively coupled to the mixing. chamber through thin dielectric barriers, which eliminates many of the problems. encountered
-
Beryllia Ceramic BeO Metallization
The thermal conductivity of BeO ceramics is very high, which is comparable to that of some metal materials; it also has the advantages of high-temperature resistance, high-pressure resistance, high strength, and low dielectric loss, which meets the requirements of power devices for insulation
-
3D Scanners Take Volume Measurement to a New Level
for hazardous locations. Not affected by material characteristics or low dielectric constants. CONS. Elevated background noise can impact performance of acoustics technology. Setup requires care in mounting the sensor in the proper location and accurately mapping the vessel dimensions. Time required
More Information Top
Indicates content that may require registration and/or purchase.
-
Abstract listings
14:40 - 15:00 Low Temperature Dielectric Material for Embedded Micro Wafer Level Packaging .
-
Assessments of Low-Temperature Aging Test Method for the Dielectric Materials Immersed in Liquid Nitrogen
In order to investigate degradation phenomena of cryogenic dielectric materials, generally used low temperature dielectric materials including Nomax, Kapton, Kraft sheet were prepared for the tests [3]–[7].
-
Comparative Evaluation Between DC and AC Breakdown Characteristic of Dielectric Insulating Materials in Liquid Nitrogen
Commonly used low temperature dielectric materials , including Kapton (polyimide), Kraft and Nomex (polyamide) sheets, have been prepared.
-
Will future RFIC be flexible? (Invited)
After the devices are isolated with reactive ion etching, gate stack is formed with low temperature dielectric materials (such as evaporated SiO[8]) and metal gate.
-
Embedded wafer level packages with laterally placed and vertically stacked thin dies
Several materials like mold compounds with different coefficients of thermal expansion (CTE) and filler contents, molding tapes, dicing die attach films, low temperature dielectric materials have been evaluated and the associated processes are optimized.
-
Low temperature variable inductor using Porous Anodic Alumina
PAA is a novel low cost and low temperature dielectric material that can be easily tuned and integrated with RFIC or MEMS process.
-
Cable Materials
Lower temperature dielectric materials soften at relatively low tempera- tures and inevitably the center conductor migrates off-center, toward the shield, in the direction of gravity or the inside of a bend in the cable.
-
Printed thin film transistor: materials and applications
PRINTED CONDUCTORS AND LOW TEMPERATURE DIELECTRIC MATERIALS .
-
Case study on the US superconducting power transmission program
Besides establishing the AC loss behavior of the superconductor chosen, the other components of an AC SPTL R&D program include the development of satisfactory low temperature dielectric materials , conductor design and develapment, the development of conductor joining processes, provision for thermal…
-
Technical sessions
14:40 - 15:00 Low Temperature Dielectric Material for Embedded Micro Wafer Level Packaging .