Resin Dispensing Equipment

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  • Tech Tip 16 - Understanding & Preventing Epoxy Resin Bleed
    Epoxy resin separation ("resin bleed or bleed out") is a phenomenon that can take place when working with filled, adhesive systems dispensed onto various surfaces/substrates. It is often described as a clear, colorless or amber organic stain, surrounding the die attach epoxy; appearing as a shadow
  • Protect Life-Saving Pharmaceuticals with Fluorinated Resin Coatings for Glass Packaging
    the vaccine to the public, it is first produced in bulk, then transferred to a filling line where it is dispensed into the vials. The vials are then inspected, labeled, packaged, stored and shipped.
  • Pressure Control for Adhesive Materials
    Robot dispensing of adhesive materials such as epoxies and resins pose pressure control problems that cannot be solved using conventional pressure transducers. The high viscosity of the dispensed material clogs up the conventional transducer pressure port and plumbing. The requirement
  • Conformal Coating - Sealing PCBs
    "Sealing" in dispensing and potting technology describes a process in which sensitive electronics surfaces are coated with a very thin layer of casting resin or protective varnish. It serves to protect against environmental influences and corrosion, resulting in a longer service life
  • Protecting the Precise Contours of PCBs
    "Sealing" in dispensing and potting technology describes a process in which sensitive electronics surfaces are coated with a very thin layer of casting resin or protective varnish. It serves to protect against environmental influences and corrosion, resulting in a longer service life
  • T-Minus 30 Minutes and Casting
    One way to eliminate rejects is to document the equipment, supplies and procedures necessary for each project ahead of time; prior to hand-mixing and pouring or meter-mix dispensing your material. A pre-casting checklist will help eliminate the need to scramble at the last minute, while your resin
  • Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
    , glob-tops, coatings, and bonding. Potting is a process where epoxy is poured on top of a circuit board and allowed to cure. This process "encapsulates" the components of the board, protecting them from unwanted damage. Glob-top is a process where epoxy is selectively dispensed onto a vulnerable

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