Products & Services
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1345372-ADPA7005CHIP Category: RF and Wireless - RF Amplifiers Package: Tray Standard Package: 25 Test Frequency: 20GHz ~ 34GHz Frequency: 20GHz ~ 44GHz Gain: 14.5dB Noise Figure: 6dB Current - Supply: 1.2A P1dB: 31dBm RF
- Applications: Terrestrial RF/Microwave Systems
- Frequency Range: 20000 to 44000 MHz
- Maximum Gain: 14.5 dB
- Minimum Gain: 14.5 dB
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1345421-ADPA7007CHIP Category: RF and Wireless - RF Amplifiers Series: ADPA Package: Tray Standard Package: 25 Test Frequency: 36GHz ~ 44GHz Frequency: 18GHz ~ 44GHz Gain: 21dB Noise Figure: 6.5dB Current - Supply: 1.4A P1d
- Applications: Terrestrial RF/Microwave Systems
- Frequency Range: 18000 to 44000 MHz
- Maximum Gain: 21 dB
- Minimum Gain: 21 dB
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1345514-ADPA7004CHIP -SX Category: RF and Wireless - RF Amplifiers Series: ADPA Package: Case Standard Package: 2 Test Frequency: 45GHz ~ 75GHz Frequency: 40GHz ~ 80GHz Gain: 16dB Current - Supply: 550mA P1dB: 22dBm RF Type
- Applications: Terrestrial RF/Microwave Systems
- Frequency Range: 40000 to 80000 MHz
- Maximum Gain: 16 dB
- Minimum Gain: 16 dB
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1350879-HMC1040CHIPS -SX Category: RF and Wireless - RF Amplifiers Package: Tray Standard Package: 1 Test Frequency: 40GHz ~ 44GHz Frequency: 20GHz ~ 44GHz Gain: 21dB Noise Figure: 2.5dB Current - Supply: 65mA P1dB: 14dBm RF
- Applications: Terrestrial RF/Microwave Systems
- Frequency Range: 20000 to 44000 MHz
- Maximum Gain: 21 dB
- Minimum Gain: 21 dB
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Supplier: New Jersey Semi-Conductor Products, Inc.
Description: RF Amp Chip Single GP 400MHz 5.5V 3-Pin TO-39
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Supplier: Pulse Electronics Corporation
Description: Our range of various chip inductor products contain the very latest in wire-wound technology and Ceramic or Ferrite Core, thus providing the ultimate in performance demanded by today's Wireless products. The Inductors provide high Q and SRFs in an industry standard size and footprint
- Inductance Range: 0.0033 microH
- Inductance Tolerance: 5 (+/- %)
- RoHS Compliant: Yes
- SRF: 6200 MHz
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Supplier: Frontier Electronics Corp.
Description: Frontier's series of chip couplers are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. Frequency range: 2400MHz ~ 2700MHz LTCC (Low Temperature Co-fired Ceramic)
- Coupling: 9 to 11 dB
- Frequency Range: 2400 to 2700 MHz
- Insertion Loss: 0.7400 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: Frontier Electronics Corp.
Description: Frontier's series of chip baluns are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. EIA 0603 ~ 0805 case sizes 50O/50O 50O/100O 50O/200O Frequency range: 869MHz ~ 5800MHz LTCC (Low Temperature Co-fired Ceramic)
- Insertion Loss: 1 to 1.2 dB
- Operating Frequency Range: 8.69E8 to 5.80E9 Hz
- Other Transformer Types / Applications: Balun Transformer
- Package Type: Surface Mount Technology (SMT)
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Supplier: Frontier Electronics Corp.
Description: Frontier's series of chip diplexers are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. Frequency range: 824MHz ~ 5900MHz LTCC (Low Temperature Co-fired Ceramic)
- Device Type: Diplexer
- Insertion Loss: 0.5500 to 3.5 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: AVX Corporation
Description: RF/Microwave Inductors Inductors designed for operating in the RF/Microwave frequency range. Technologies include MLO™, Thin Film, Air Core, Wire Wound Ceramic and Multilayer Ceramic. Thin Film Inductors Accu-L®
- Type: Chip Inductor
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Supplier: MACOM
Description: MACOM's chip capacitors are used extensively in commercial and aerospace and defense applications. Our capacitors are designed for long-term reliability and repeatable performance in a variety of hybrid microwave circuit applications operating up through the Ku-band frequency. MACOM’s
- Applications: Aerospace, High Frequency, RF / Microwave Capacitors
- Capacitance Range: 1.00E-5 to 1.50E-4 microF
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Supplier: Accuris
Description: COIL, RF, CHIP, FIXED, HIGH FREQUENCY
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Supplier: Accuris
Description: COIL, RF, CHIP, FIXED, CERAMIC, SURFACE MOUNT
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Supplier: APITech
Description: Powerfilm™ chip attenuators from API Inmet come in two varieties: "Temperature Stable" (standard) and "Temperature Variable" attenuators. The standard attenuators reduce the RF power uniformly at all temperatures while the temperature-variable chips are designed to reduce
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Supplier: Skyworks Solutions, Inc.
Description: Skyworks MIS Chip Capacitors are available in a wide range of sizes and capacitance values. They are frequently used in applications requiring DC blocking, and RF bypassing, or as a fixed capacitance tuning element in filters, oscillators, and matching networks. The devices have a
- Applications: RF / Microwave Capacitors
- Capacitance Range: 4.70E-5 microF
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Supplier: Skyworks Solutions, Inc.
Description: Skyworks MIS Chip Capacitors are available in a wide range of sizes and capacitance values. They are frequently used in applications requiring DC blocking, and RF bypassing, or as a fixed capacitance tuning element in filters, oscillators, and matching networks. The devices have a
- Applications: RF / Microwave Capacitors
- Capacitance Range: 3.33E-4 microF
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Supplier: Skyworks Solutions, Inc.
Description: Skyworks MIS Chip Capacitors are available in a wide range of sizes and capacitance values. They are frequently used in applications requiring DC blocking, and RF bypassing, or as a fixed capacitance tuning element in filters, oscillators, and matching networks. The devices have a
- Applications: RF / Microwave Capacitors
- Capacitance Range: 1.50E-5 microF
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Supplier: Skyworks Solutions, Inc.
Description: Skyworks MIS Chip Capacitors are available in a wide range of sizes and capacitance values. They are frequently used in applications requiring DC blocking, and RF bypassing, or as a fixed capacitance tuning element in filters, oscillators, and matching networks. The devices have a
- Applications: RF / Microwave Capacitors
- Capacitance Range: 6.80E-5 microF
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Supplier: Yageo USA
Description: Chip attenuators with lead-free terminations made by thick film process Attenuation value from 1 dB to 20 dB Tolerance from ±0.2 dB to ±2 dB Applications Mobile phones, Receivers, Battery charger, Palmtop computers
- Configuration: Single Resistor
- Power Rating: 0.0400 watts
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Supplier: Frontier Electronics Corp.
Description: Frontier's series of chip low pass filters are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. Frequency range: 824MHz ~ 5900MHz EIA case sizes 0402 ~ 0805 (1005~2012M) LTCC (Low Temperature Co-fired Ceramic)
- Frequency (Fc): 824 to 3800 MHz
- Insertion Loss: 0.4200 to 0.9000 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: LCSC Electronics Technology (HK) Limited
Description: - RF Chips ROHS
- Features: RoHS Compliant
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Supplier: LCSC Electronics Technology (HK) Limited
Description: - RF Chips ROHS
- Features: RoHS Compliant
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Supplier: LCSC Electronics Technology (HK) Limited
Description: - RF Chips ROHS
- Features: RoHS Compliant
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Supplier: LCSC Electronics Technology (HK) Limited
Description: - RF Chips ROHS
- Features: RoHS Compliant
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Supplier: QUALCOMM, Incorporated
Description: Wave-2 802.11ac SoC for Routers, Gateways and Access Points The IPQ4018 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines
- Data Rate: 1.73E6 kbps
- IC Package Type: QFN
- Interface: I2C, SPI, UART, USB
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: QUALCOMM, Incorporated
Description: Wave-2 802.11ac SoC for Routers, Gateways and Access Points The IPQ4028 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines
- Data Rate: 1.73E6 kbps
- IC Package Type: QFN
- Interface: I2C, SPI, UART, USB
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Supplier: QUALCOMM, Incorporated
Description: Wave-2 802.11ac SoC for Routers, Gateways and Access Points The IPQ4019 was the industry’s first single-chip Wi-Fi system-on-chip (SoC) to bring Wave-2 802.11ac features to a variety of home and enterprise networking products. The highly-integrated, single-chip design combines
- Data Rate: 1.73E6 kbps
- IC Package Type: BGA
- Interface: I2C, PCI Express, PCM, SPI, UART, USB
- Technology: Wi-Fi / WiMAX / Wi-Mesh
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Description: RF/IF and RFID - RF Amplifiers
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Description: RF BOOSTERPACK RF EVM ADAPTER
- Device Type: Other
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Supplier: Semtech Corp.
Description: With their extremely low-power requirements and highly integrated foundation, our UHF transmitter circuits give you a low-cost and flexible solution for your RF transmitter design. Our RF devices are versatile, multi-channel ISM band RF transmitter IC chips (optimized for
- Data Rate: 600 kbps
- Device Type: Transmitter
- IC Package Type: SOIC, Other
- Operating Frequency: 310 to 928 MHz
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Supplier: AVX Corporation
Description: Capacitors RF/Microwave SMD capacitors designed and manufactured for optimal performance in RF and microwave frequencies, high RF power, and optical applications. Technologies include: industry leading tight tolerance Accu-P® capacitors, ultra-broadband capacitors, single layer
- Applications: Aerospace, Automotive, RF / Microwave Capacitors
- Technology: Multilayer, Monolithic / Single Layer
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Supplier: Richardson RFPD
Description: Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.
- Type: Chip Inductor, Standard Inductor, Coil, Choke
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Supplier: ODG (Origin Data Global)
Description: IC RF AMP 10MHZ-10GHZ DIE
- IC Package Type: Other
- Supply Voltage: Other
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Description: RF TXRX MODULE BT CHIP SMD
- Form Factor / Package: Other
- Operating Frequency: 2400 MHz
- Operating Temperature: -40 to 85 C
- Output Power: 4 dBm
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Supplier: ODG (Origin Data Global)
Description: RF TRANS NPN 20V BIPOLAR CHIP
- Output Power: 3 watts
- Package Type: Other
- Polarity: NPN, Other
- TJ: 200 C
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Featured Products Top
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Vishay launches the CHA series of AEC-Q200 qualified thin film chip resistors, delivering high-frequency performance up to 70GHz in a compact 02016 case size. These resistors serve automotive, aerospace, telecom, and military applications with resistance values from 10Ω to 500Ω. They (read more)
Browse Resistors Datasheets for New Yorker Electronics Co., Inc. -
-reliability fixed chip attenuators optimised to combine high frequency and power in a small package. As the global demand for faster data transmission and broadband connectivity contiues to grow, engineers face increasing challenges around space, power, and performance. The new HR TSX WB2 (read more)
Browse Chip Resistors Datasheets for Molex Signal Tech Industrial Ltd. -
In modern RF and microwave systems, engineers face challenges like signal integrity, fast switching speeds, and space-constrained designs. The MA4AGSW2 addresses these needs with exceptional performance in a bare-die format (read more)
Browse RF Switches Datasheets for Win Source Electronics -
The MM1-1886HCSP2 is a highly linear passive GaAs double balanced MMIC mixer suitable for both up and down-conversion applications. It features an excellent 9 dB conversion loss, high 40 dB LO to RF isolation and +20 dBm IIP3 across broad 18 to 86 GHz RF/LO and DC to 27 GHz IF bandwidths. The MM (read more)
Browse RF Mixers Datasheets for Marki Microwave LLC -
Digital processing chips are everywhere—from smartphones and appliances to MRI systems and industrial equipment. The rise of the Internet of Things has only increased the use of Wi-Fi, Bluetooth, and other high-frequency communications. With this growth comes a greater risk of (read more)
Browse Antennas Datasheets for A.H. Systems Inc. -
The ADRV9002 is a highly integrated, RF transceiver that has dual-channel transmitters, dual-channel receivers, integrated synthesizers, and digital signal processing functions. The IC delivers a versatile combination of high performance and low power consumption required by (read more)
Browse RF Transceivers Datasheets for Richardson RFPD -
Over the last four decades, the number of devices that need to maintain mission-critical satellite communications (satcom) has rapidly grown. At the same time, the information transmitted on these devices has become increasingly more complex. As a result, the RF circuit building blocks that make (read more)
Browse RF Filters and Microwave Filters Datasheets for Knowles Precision Devices -
available RF Power Amplifier product portfolio for wireless infrastructure that spans multiple levels of integration, including; discrete transistors, multistage IC’s, and multi-chip modules (MCM), as well as leveraging GaN and Silicon LDMOS from the latest cutting edge NXP fabs (read more)
Browse RF Amplifiers Datasheets for Richardson RFPD -
due to their outstanding thermal conductivity and protective properties. Enhancement of Thermal Conductivity Efficiency Thermal potting compounds are primarily used to fill the gap between the chip and the heat sink in RF modules. These compounds create a (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd.
Conduct Research Top
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Production Testing of RF and System-On-a-Chip Devices for Wireless Communications
Production Testing of RF and System-On-a-Chip Devices for Wireless Communications. Addressing the need for a merger of RF and mixed-signal test approaches head-on, this text offers an overview of RF and SOC product testing for wireless communications, and introduces creative methods for more
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Everything RF: Qorvo's UWB Solutions Interoperable with Apple's U1 Chip
Qorvo, a leading provider of innovative RF solutions that connect the world announced the interoperability of its DW3000 family of products with the Apple U1 chip used in iPhone and Apple Watch models and the new Nearby Interaction protocol specification draft unveiled at the 2021 Worldwide
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Test and Diagnosis of Analogue, Mixed-Signal and RF Integrated Circuits: The System on Chip Approach
Test and Diagnosis of Analogue, Mixed-Signal and RF Integrated Circuits: The System on Chip Approach. Providing a comprehensive discussion of automatic testing, diagnosis and tuning of analogue, mixed-signal and RF integrated circuits and systems, this book reports systematically on state
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Soldering a copper chip to a silver dipped brass RF attenuator [PFS]
Induction heating provides repeatable consistent results in all three areas soldered at the same time, not. individually. Faster process time, increased production and even distribution of heating...
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Bits and Chips: Wi-Fi Thermal Challenges for RF Front-End Designers
There are two main design challenges when it comes to thermal management in the Wi-Fi front-end. The first is the increased demand for smaller, sleeker routers, access points and wireless speakers that must be aesthetically pleasing.
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AN721: Impedance Matching Networks Applied to RF Power Transistors, Courtesy of Motorola
be considered as a corollary of the matching circuit. Matching is necessary for the best possible energy transfer from stage to stage. In RF-power transistors the input impedance is of low value, decreasing as the power increases, or as the chip size becomes larger. This impedance must be matched
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Planet Analog: The Latest About RF Front-ends in 5G, Wi-Fi 6E and IoT
While system-on-chips (SoCs) mostly do the heavy lifting in wireless networks, the last inches of the broadband signal path to the antennas are still crucial. Spanning those gaps falls to the RF front-end (RFFE), also known as RFE or FEM for front-end module.
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How to Simplify the Design of an RF Remote Control Using a Highly-Integrated Transmitter SoC (.pdf)
System-on-chip (SoC) transmitter solutions 434 MHz Remote Control PCBgreatly simplify the process of designing a remote control and reduce system bill of materials (BOM) cost by eliminating the need for numerous discrete components. This white paper addresses the 3 most common challenges
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ESD: RF Technology and Circuits
ESD-induced failure mechanisms are a function of the technology type, device, circuit topology, and RF chip architecture.
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Development of Coherent Detector Technologies for Sub-Millimetre Wave Astronomy Observations
In the first method, we only combined a subsection of the RF chip that includes the RF quadrature hybrid, the DC/IF blocks and the tuner circuits, without the finline taper and the microstrip transition, since we know that their performance is good…
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A Raw processor interface to an 802.11b/g RF front end
The RF chip has two different types of control interface.
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Page 18. Semiconductor parts with 323 in root number
TREM RF Chip Wire Wound Inductors .
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Circuits and Systems for Wireless Communications
By way ofexample, the design of the BRIGHT family of RF chip sets for GSM is described.
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Digital Radio Systems on a Chip
Typical transceiver chip sets consist of an RF chip , an IF chip, and one or two synthesizer chips.
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High-Speed Serial fully digital interface
between WLAN RF and BB chips (June 2005)
Therefore comes the need for an interface between the RF chip and the rest of the design, commonly known as the “baseband” (BB) part (see Fig. 1).
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Built-In Self Test of RF Subsystems
On the RF chip , the receiver path is introduced in the previous section.