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Supplier: Nordson EFD
Description: Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Princess Auto Limited
Description: 4 oz. Soldering Flux Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: RA ROSIN FLUX PASTE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: MULTICORE LM100 no clean flux solder paste is designed for use with low temperature Pb-free solder alloys. LM100 is formulated to provide excellent dispensability, printability and solderability through various reflow profiles.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Princess Auto Limited
Description: Aluminum Solder Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: SRA NO CLEAN PASTE FLUX IN 2 OZ
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Princess Auto Limited
Description: Silver Bearing Solder Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: PASTE TYPE MILKY WHITE PASTE COLOR 2 OZ FLUID CAPACITY 1.1 SPECIFIC GRAVITY GC[T] BRAND USED FOR WATER REMOVABLE, BASE TYPE ROSIN CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Pb and Pb-free applications Introduction WS-364 Interconnect Flux is a high viscosity paste-type flux designed for use in BGA bumping and board level attachment. It can also be used wherever a water-soluble flux with excellent cleanability is desired.
- Fluxes & Cleaners: Soldering Flux / Rosin
- Halogen / Halide Free: Yes
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Supplier: Indium Corporation
Description: Suitable for Sn/Pb, Pb-Free, and high lead-containing applications Designed for Flip-Chip applications Introduction WS-366 Interconnect Flux is a high viscosity paste-type flux designed for use in BGA bumping and board level attachment. It can also be used wherever a
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: PASTE TYPE 2 OZ US FLUID CAPACITY STEEL METAL USED ON CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Indalloy Flux #1 is a non-acid*, non toxic*, Pb-free, amber colored paste flux for use on copper, brass, galvanized iron, lead, zinc, tin, silver, nickel, mild steel, terne plate and malleable iron. Its strong detergent action cleans as it solders. Due to its possible corrosive
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: is a low viscosity semiconductor-grade wafer bumping (bump fusion) flux. It has a wide process window, ranging from 125°C to 350°C. Electroplated and reflowed solder paste form bright, spherical bumps when using this flux. Wafer Flux SC 5R can be applied by spraying and
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
- Halogen / Halide Free: Yes
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: . Typical formulations are up to 85% metal by weight. Brazing and soldering pastes incorporate filler metal, flux, and a binder in a one-step application process. Because pastes are readily applied, they lend themselves well to both manual and automated production operations. We
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: designed to reduce voiding at the thermal/ground interface of bottom terminated component (BTC) packages, such as QFN, QFP, and D-Pak. By incorporating ALPHA AccuFlux BTC-578 flux-coated preforms and solder paste with an optimized stencil design, minimal to non-detectable
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: Multicore WS300 is a water wash flux system specially formulated with fine-powder lead-free alloys. High performance, water washable solder paste. Residues are easily removed with DI water without the need for a saponifier. Good open time with excellent print definition and soldering.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore WS300 TACKY FLUX ) LOCTITE WS 300 RWF BU is a water wash flux system specially formulated with fine-powder lead-free alloys. High performance, water washable solder paste. Residues are easily removed with DI water without the need for a saponifier. Good open
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: (Known as MULTICORE HF108RWF ) LOCTITE MULTICORE HF 108RWF is a halogen-free flux gel for rework processes in conjunction with HF 108 solder paste and can be used wherever halogen-free processing of printed circuit boards is eqiredl It is recommended for consumer and communications
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Ellsworth Adhesives
Description: MicroCare UltraClean™ VOC-Free Flux Remover is a high-purity, halogen-free, fast-drying, non-chlorinated cleaning fluid ideal for "no-clean" fluxes, rosin fluxes and difficult to clean, lead-free solder pastes. Low odor, ultra-low GWP, ozone-safe, plastic-safe, and
- Type: Defluxer / Flux Remover
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Supplier: Ellsworth Adhesives
Description: MicroCare UltraClean™ VOC-Free Flux Remover is a high-purity, halogen-free, fast-drying, non-chlorinated cleaning fluid ideal for "no-clean" fluxes, rosin fluxes and difficult to clean, lead-free solder pastes. Low odor, ultra-low GWP, ozone-safe, plastic-safe, and
- Type: Defluxer / Flux Remover
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Supplier: Ellsworth Adhesives
Description: MicroCare SuprClean™ Heavy Duty Flux Remover is designed for removing rosin fluxes, lead-free solders and pastes, and most acrylic and conformal coatings. Dries instantly with no residue, nonflammable, ESD-safe, low odor, and no rinsing required. Compatible with the
- Type: Defluxer / Flux Remover
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Supplier: Ellsworth Adhesives
Description: MicroCare SuprClean™ Heavy Duty Flux Remover is designed for removing rosin fluxes, lead-free solders and pastes, and most acrylic and conformal coatings. Dries instantly with no residue, nonflammable, ESD-safe, low odor, and no rinsing required. Compatible with the
- Type: Defluxer / Flux Remover
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 309, Rosin based Cored Solder Wire Flux LOCTITE® 309 solid flux is based on a blend of novel activators and resins. It has a mild characteristic odor and leaves a clear pale residue. The alloys used for LOCTITE flux cored solder wires conform to the purity
- Form / Shape: Paste
- Welding Process / Form: Other
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip,
- Alloy: Other
- Conductivity: 4.81E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
- Melting Range: 536 F
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Supplier: RS Components, Ltd.
Description: Contains no lead and a special flux to address the concerns of PCB assemblers who wish to use Rosin-free solders. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Fast soldering on brass and copper. Compatible with 96SC CR32 and 96S RM89 solder pastes Wire
- Diameter / Thickness: 0.0394 inch
- Form / Shape: Solid Wire
- Melting Range: 423 F
- Soldering Filler Alloys: Tin-Silver (Sn-Ag)
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Supplier: RS Components, Ltd.
Description: Contains no lead and a special flux to address the concerns of PCB assemblers who wish to use Rosin-free solders. 5 Cores of Ecosol® 105 Rosin (Colophony) free flux. Fast soldering on brass and copper. Compatible with 96SC CR32 and 96S RM89 solder pastes Wire
- Diameter / Thickness: 0.0276 inch
- Form / Shape: Solid Wire
- Melting Range: 423 F
- Soldering Filler Alloys: Tin-Silver (Sn-Ag)
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Supplier: ASTM International
Description: -tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes.
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Supplier: RS Components, Ltd.
Description: Specifically formulated for the higher temperature requirements of lead free applications. Syringe applicator provides exact delivery of flux to surface. Long tack time, extended shelf life. No refrigeration required. Noncorrosive, halide and halogen free. Meets IPC requirements for ROL0, No
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Supplier: ESAB Welding and Cutting Products
Description: Features White powder flux for removing oxides of aluminum and zinc based alloys. Active to 700°F. Performs to AWS A5.31, Type FB1-A
- Approvals / Conformance: AWS
- Fluxes & Cleaners: Brazing Flux, Soldering Flux / Rosin, Welding Flux
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester 120 flux thinner is another quality product from Kester.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: MG Chemicals 425NS is a No Clean Super Wick with a flux residue that is both non-conductive and non-corrosive. The flux residue remaining on board does not have to be cleaned. 5ft bobbin, desoldering braid. Product Benefits Conforms to MIL-F-14256E RMA flux and J-STD-004
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Esprix Technologies
Description: Type: Automotive Flux - Brazing Aniline Hydrochloride d-Camphoric Acid Cyclohexylamine Hydrochloride Cyclohexylamine Hydrobromide DBD = 2,3–Dibromo–2-Butene - 1,4-Diol Dibromo-Styrene((1,2 -Dibromoethyl
- Fluxes & Cleaners: Soldering Flux / Rosin
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Soldering a copper tube to a brass flow valve [IH]
The joint is to be made using 60/40 Tin Lead Solder and Kestor Rosin paste flux .
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Improvement of microstructure and mechanical properties of Sn-58Bi alloy with La2O3
The composite solder paste was prepared as follows: the La2O3 and Flux55 rosin flux paste was stirred in the Al2O3 crucible, then the Sn-58Bi alloy powder were gradually added into the mixture stirred until the La2O3 were well-distributed in the …
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Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints during isothermal aging process
… Sn–3.0Ag–0.5Cu–xTiO2 (x = 0, 0.02, 0.05, 0.1, 0.3 and 0.6 wt%) composite solders were pre- pared by mixing different weight percentages of TiO2 nanoparticles into the near eutectic Sn–3.0Ag–0.5Cu solder paste with rosin flux .
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Adsorptive Stripping Voltammetric Detection of Daunomycin at a Bismuth Bulk Electrode
Granulated bismuth (from Fluka) was mixed with a small amount of rosin soldering paste flux (for electrical and electronic applications) (Cat.
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http://dspace.mit.edu/bitstream/handle/1721.1/59102/62214996-MIT.pdf?sequence=2
icult with rosin or paste flux , but very simple with .
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http://repositories.lib.utexas.edu/bitstream/handle/2152/3281/ridingd43672.pdf?sequence=2
Soldering Iron 6 RadioShack Non-Spill Paste Rosin Soldering Flux ® 7 .
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Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect
The reflow pro- cess was conducted at 110 °C for 15 min to evaporate rosin flux in paste and at 170 °C for 5 min to reflow eutectic 42Sn58Bi paste.
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Development of Quality Control (QC) Tools for Solder Pastes used for Flip Chip Assembly based on Oscillatory Tests
Since the generic solder paste flux contains rosin /resin, solvent, activator, thickeners, rheological agents and other additives (Johnson and Kevra, 1989).