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Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-curing epoxy potting compound designed to pass UL testing and maintain more than 85% of its compression
- Viscosity: 24,000 cP
- Thermal Conductivity: 1.25 W/m-K
- Chemical System: Epoxy (EP)
- Features: Leveling / Filling Compound
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Supplier: Techsil Limited
Description: vibration dampening properties and offers superb mechanical shock protection. This product has been specially designed for electronic potting applications, such a hybrid IC insulation, potting of power modules and sensors when fast cure at room temperature is required. Techsil®
- Features: Encapsulating / Potting
- Chemical System: Rubber Based / Elastomeric, Silicone
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Supplier: OMEGA Engineering, Inc.
Description: impact absorbing potting compound. Also, the Premium+ Series line now includes a choice of AC/DC and DC-only, 12, 18 and 30 mm sensors with unmatched noise immunity of greater than 20V/meter.
- Operating Distance: 0.08 to 0.6 inch
- Operating Temperature: -13 to 158 F
- Output Load: 3-Wire NPN, 3-Wire PNP, AC Load, DC Load
- Power Requirements: AC Powered, DC Powered
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Supplier: Techsil Limited
Description: manual works. Once cured, TB 2210 excels with excellent electric properties and good chemical resistance. This grade is perfect for fastening and sealing electric and electronic component parts such as relays, sensors, coils, microchips, switches and terminals.
- Features: Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol EO7038 ) LOCTITE EO7038 is a one-component epoxy potting system, formulated to protect sensors used in harsh environments, such as automotive applications.
- Coeff. of Thermal Expansion (CTE): 16.666666666666668 µin/in-F
- Viscosity: 40,000 cP
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: devices such as bridge rectifiers, power supplies, thermistors, transformers, thermal probes and sensors. Other applications include pour-in-place thermal pads and heat sinks.
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Allied Electronics, Inc.
Description: Includes Stainless Steel Body and Vibration Absorbing Potting Compound Operates Accurately Across a Wide Temperature Range of –40 to +70°C to Be Applied In Most Applications Around the World Extremely Long Sensing Range Allows You to Back the Sensor Away From Target to Avoid
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5952 White, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion resistant,
- Viscosity: 18,000 to 40,000 cP
- Thermal Conductivity: 0.85 W/m-K
- Tensile Strength (Break): 500 psi
- Elongation: 50 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity,
- Viscosity: 35,000 to 55,000 cP
- Thermal Conductivity: 1.15 W/m-K
- Tensile Strength (Break): 400 psi
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity,
- Viscosity: 15,000 to 35,000 cP
- Thermal Conductivity: 1.15 W/m-K
- Tensile Strength (Break): 400 psi
- Elongation: 17 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5952 Red, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion resistant,
- Viscosity: 40,000 to 65,000 cP
- Thermal Conductivity: 0.85 W/m-K
- Tensile Strength (Break): 500 psi
- Elongation: 50 %
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Supplier: Allied Electronics, Inc.
Description: Includes Stainless Steel Body and Vibration Absorbing Potting Compound Operates Accurately Across a Wide Temperature Range of –40 to +70°C to Be Applied In Most Applications Around the World Extremely Long Sensing Range Allows You to Back the Sensor Away From Target to Avoid
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Supplier: Allied Electronics, Inc.
Description: Includes Stainless Steel Body and Vibration Absorbing Potting Compound Operates Accurately Across a Wide Temperature Range of –40 to +70°C to Be Applied In Most Applications Around the World Extremely Long Sensing Range Allows You to Back the Sensor Away From Target to Avoid
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Supplier: Allied Electronics, Inc.
Description: Includes Stainless Steel Body and Vibration Absorbing Potting Compound Operates Accurately Across a Wide Temperature Range of –40 to +70°C to Be Applied In Most Applications Around the World Extremely Long Sensing Range Allows You to Back the Sensor Away From Target to Avoid
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE 3118 is a white image sensor adhesive.
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 µin/in-F
- Viscosity: 15,000 cP
- Industry: Electronics (PCB / SMT Assembly)
- Features: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol EO1058 ) LOCTITE STYCAST EO 10587 is a single component epoxy system that cures at 125°C. Hysol EO1058 provides excellent environmental and thermal protection to encapsulated parts. This product is especially suited for use in protecting sensors used in harsh environments such
- Coeff. of Thermal Expansion (CTE): 13.333333333333332 µin/in-F
- Elongation: 1.96 %
- Viscosity: 50,000 cP
- Industry: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more.
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Supplier: Techsil Limited
Description: cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more. Also available in Amber.
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive Fast cure at low temperatures Low temperature cure High temperature resistance Water resistant
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Type: Electrical Insulation / Dielectric
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: Ultra high-performance polyurethane offering exceptional protection in various environments with excellent electrical properties. Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performance encapsulation and potting compound,
- Industry: Aerospace, Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulating / Potting, Marine
- Chemical System: Polyurethane (PU, PUR)
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Supplier: SCHURTER Inc
Description: Description Complements USF 1206 with lower current ratings Impermeable to potting compound Unique Selling Proposition Lowest voltage drop Very fast, precise opening Applications Smart meters Battery protection Sensors Mobile devices Semiconductor protection
- Voltage Rating: 125 volts
- Current Rating: 0.25 amps
- Rated Breaking Capacity: 100 amps
- Operating Temperature: -55 C
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Features: Air Setting / Film Drying, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
- Type: Electrical Insulation / Dielectric
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Features: Air Setting / Film Drying, Ceramic / Glass, Encapsulating / Potting, Grease / Paste, Metal, Paper / Paperboard, Plastic, Thermal / Heat Conductive
- Type: Electrical Insulation / Dielectric
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Supplier: Bluestar Silicones USA Corp.
Description: Elastomer - RTV 1 - Acetic curing - Translucent Flowable, Mechanical properties and thermal resistance Chemical Resistance Properties Viscosity 140000 Hardness Sha 26 Description Potting and insulation of electronic sensors Bonding of various materials General maintenance in industry
- Use Temperature: -76 to 392 F
- Thermal Conductivity: 0.15 to 0.2 W/m-K
- Tensile Strength (Break): 188.547891164356 psi
- Elongation: 260 %
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Supplier: Eaton Corporation - Sensors
Description: The new ChipMaster sensor from Eaton's electrical business is an application-specific sensing solution designed to better tolerate metal chips near the sensor face. Where typical inductive proximity sensors immediately false trigger in such an environment, the ChipMaster has the
- Operating Distance: 0.4724412 to 0.5905515 inch
- Operating Temperature: -40 to 158 F
- Output Load: 2-Wire, DC Load
- Body Shape: Cylindrical, Threaded Barrel
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Supplier: Epoxy Technology
Description: LCD/Lighting/ Display Lasers Camera and Video Sensors Solar
- Viscosity: 150 to 300 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 31.666666666666664 to 116.66666666666666 µin/in-F
- Dielectric Constant (Relative Permittivity): 3.36
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Supplier: Epoxy Technology
Description: LCD/Lighting/ Display Lasers Camera and Video Sensors Solar
- Viscosity: 350 to 650 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 94.44444444444444 µin/in-F
- Dielectric Constant (Relative Permittivity): 11.35
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Supplier: Epoxy Technology
Description: LCD/Lighting/ Display Lasers Camera and Video Sensors Solar
- Viscosity: 80 to 100 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 30 to 97.22222222222221 µin/in-F
- Dielectric Constant (Relative Permittivity): 4.26
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Supplier: Dymax
Description: as the aerospace and defense industries. 9483-Z is ideal for coating automotive sensors, control modules, and miscellaneous automotive components. Recommended substrates include ABS, lead frame, PCB, flex, and ceramic. Dymax dual-cure materials have no non-reactive solvents. Their ability to
- Coeff. of Thermal Expansion (CTE): 43,333,333.333333336 to 9,444,444.444444444 µin/in-F
- Elongation: 19 %
- Tensile Strength (Break): 1,500 psi
- Viscosity: 750 cP
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Supplier: Epoxy Technology
Description: Radiation detection and Sensors
- Viscosity: 20,000 to 30,000 cP
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 22.77777777777778 to 94.44444444444444 µin/in-F
- Index of Refraction: 1.5665 to 1.5842
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Supplier: Stellar Technology
Description: The Series GT27XX pressure transducers and pressure transmitters are designed to meet the requirements of demanding test and measurement environments. The GT27XX sensors provide improved 0.15% accuracy and high level outputs. Standard analog outputs, plus RS232, RS485, and CANbus digital
- Working Pressure Range: 0 to 3,000 psi
- Operating Temperature: -65 to 250 F
- Measurement Type: Absolute, Compound, Gauge, Vacuum
- Signal Output: Analog Voltage, RS232 / RS485
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Supplier: SCHURTER Inc
Description: Description 26 rated currents from 160 mA to 50 A Square design: 5.3 x 16 Impermeable to potting compound used to achieve hermetic seal for use in intrinsically safe applications according to ATEx and IECEx requirements. Unique Selling Proposition High breaking capacity up to 1500 A
- Voltage Rating: 277 volts
- Current Rating: 50 amps
- Rated Breaking Capacity: 1,500 amps
- Operating Temperature: -55 C
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A Robust Sensor for Monitoring the Operational Status of Agricultural Ventilation Fans
The mechanical fastening is accomplished through the 6-32 machine screw that passes through the sensor potting compound .
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Inductively coupled corrosion potential sensor for steel reinforced concrete with time domain gating interrogation
Figure 7: Encapsulated corrosion sensor by potting compound .
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Field Operational Testing of a Digital Brake Stroke Sensor
As expected, none of the individual BSS on the 4 trucks would communicate with either the gateway or an externally connected diagnostic computer, indicating that the potting compound around the sensor electronics had been compromised.
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Electrochemical corrosion rate probes for high temperature energy applications
A second and more likely possibility is that, at the test temperature, the ceramic potting compound surrounding the sensor electrodes was sufficiently electrically conductive to act as the electrolyte for the electrochemical measurement of corrosion rate.
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Corrosion probes for fireside monitoring in coal-fired boilers
A second and more likely possibility is that, at the test temperature, the potting compound surrounding the sensor electrodes was sufficiently electrically conductive to act as the electrolyte for the electrochemical measurement of corrosion rate.
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Understanding the operation and use of high temperature electrochemical corrosion rate probes
Probe construction – Two factors related to the design of the probe are: a good seal between the potting compound and the sensor electrodes and a high-resistivity potting compound at elevated temperatures.
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Proceedings of the 18th Annual Conference on Fossil Energy Materials.
A second and more likely possibility is that, at the test temperature, the potting compound surrounding the sensor electrodes was sufficiently electrically conductive to act as the electrolyte for the electrochemical measurement of corrosion rate.
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Shock tunnel measurements of surface pressures in shock induced separated flow field using MEMS sensor array
An array of these single fabricated sensors are created using suitable bonding material and the packaged sensor is filled with potting compound to fill the gap between the sensors and package.
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Fiber Optic Hydrophones Based On Variable Ratio Couplers
Once the potting compound is cured, the sensor is rugged enough to be roughly handled.
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CR4 - Thread: Temperature Sensing Probe
If the gel is a solid then it is more likely a silicon based potting compound to mechanically hold the sensor in place and protect it to some degree.