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Supplier: Techsil Limited
Description: excellent vibration dampening properties and offers superb mechanical shock protection. This product has been specially designed for electronic potting applications, such a hybrid IC insulation, potting of power modules and sensors when fast cure at room temperature is required.
- Chemical / Polymer System Type: Silicone
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Henkel Corporation - Industrial
Description: To help manufacturers comply with UL-674 requirements for explosion-proof electric motors, Henkel Corporation has introduced LOCTITE® E-40EXP Hysol, a two-component, room-temperature-cur ing epoxy potting compound designed to pass UL testing and maintain more than 85% of its
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.25 W/m-K
- Viscosity: 24000 cP
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Supplier: Techsil Limited
Description: manual works. Once cured, TB 2210 excels with excellent electric properties and good chemical resistance. This grade is perfect for fastening and sealing electric and electronic component parts such as relays, sensors, coils, microchips, switches and terminals.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Form / Function: Encapsulant / Potting Compound
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Epoxy Technology
Description: in: Fiber Optics and Photonics LED/ LCD/Lighting/ Display Lasers Camera and Video Sensors Solar
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 30 to 97.22 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.26
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Supplier: Epoxy Technology
Description: in: Fiber Optics and Photonics LED/ LCD/Lighting/ Display Lasers Camera and Video Sensors Solar
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 33.89 to 100 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.34
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Supplier: Epoxy Technology
Description: in: Fiber Optics and Photonics LED/ LCD/Lighting/ Display Lasers Camera and Video Sensors Solar
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 31.11 to 107 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.39
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Supplier: Epoxy Technology
Description: in: Fiber Optics and Photonics LED/ LCD/Lighting/ Display Lasers Camera and Video Sensors Solar
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.67 to 94.44 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 11.35
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Supplier: RS Components, Ltd.
Description: A white, flame retardant, epoxy resin system designed to conduct heat away from hot spots. Unlike similar materials this product has relatively low viscosity and gives little risk of abrasion from the fillers. Typical applications include potting temperature sensors, high output
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 1.26 W/m-K
- Use Temperature: -40 to 266 F
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 567 Primerless Silicone Encapsulant Black is a two component, heat curing elastomer that is used as a protective coating, encapsulating, and potting electrical applications such as LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 533 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol EO7038 ) LOCTITE EO7038 is a one-component epoxy potting system, formulated to protect sensors used in harsh environments, such as automotive applications.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16.67 µin/in-F
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 93-500 Space Grade Encapsulant and 93-500 Thixotropic Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/pottin g electronic components, and bonding solar cells to
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 480 kV/in
- Elongation: 170 %
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/pottin g electronic components, and bonding solar cells to
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 460 kV/in
- Elongation: 125 %
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Supplier: Henkel Corporation - Electronics
Description: generating electronic devices such as bridge rectifiers, power supplies, thermistors, transformers, thermal probes and sensors. Other applications include pour-in-place thermal pads and heat sinks.
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Dow SYLGARD™ 182 Silicone Elastomer Clear is a two component, heat curing encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides flexibility, low stress, easy to repair, long
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Dielectric Strength: 475 kV/in
- Electrical / Electronics Applications: Electrical Power / HV (Coils, Motors)
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE 3118 is a white image sensor adhesive.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Ultra high-performance polyurethane offering exceptional protection in various environments with excellent electrical properties. Product Overview UR5118 is a highly water-resistant, RF polyurethane resin developed as an ultra-high-performan ce encapsulation and potting
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: Aerospace, Automotive
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol EO1058 ) LOCTITE STYCAST EO 10587 is a single component epoxy system that cures at 125°C. Hysol EO1058 provides excellent environmental and thermal protection to encapsulated parts. This product is especially suited for use in protecting sensors used in harsh environments such
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.33 µin/in-F
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Techsil Limited
Description: cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more. Also available in Amber.
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Supplier: Techsil Limited
Description: cycle times. The most popular applications for the Overtec molding system are electronic component encapsulation, connector potting, grommet injection, automotive electronics, PCB overholding, molded connectors and sensors, and many more.
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive Fast cure at low temperatures Low temperature cure High temperature resistance Water resistant
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 15 µin/in-F
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: and impact absorbing potting compound. Also, the Premium+ Series line now includes a choice of AC/DC and DC-only, 12, 18 and 30 mm sensors with unmatched noise immunity of greater than 20V/meter.
- DC Load: 3-Wire NPN, 3-Wire PNP
- Load: AC Load, DC Load
- Operating Distance: 0.0800 to 0.6000 inch
- Operating Temperature: -13 to 158 F
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Supplier: Eaton Corporation - Sensors
Description: Auto-configure output allows for automatic NPN or PNP on DC sensors Rugged stainless steel housing with shock absorbent potting compound Resistant to extreme temperatures (-40C) and high pressure washdown High electrical noise immunity of 20 V/m Typical Applications Automotive
- Body: Cylindrical
- DC Load: 2-Wire
- Load: DC Load
- Operating Distance: 0.4724 to 0.5906 inch
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Supplier: Eaton Corporation - Sensors
Description: without user intervention Small diameter, 2-wire AC/DC models feature a selector switch inside the housing, enabling output contacts to be used as either N.O. or N.C. Robust design featuring vibration and impact-absorbing potting compound Ideal for extreme temperatures or high pressure
- Load: AC Load
- Operating Distance: 0.0 to 3.94 inch
- Operating Temperature: -13 to 158 F
- Power Requirements: AC Powered
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Supplier: Graphene Laboratories, Inc.
Description: substrate. A heating oven is required for curing. Uses for G6E-FXNS™ epoxy include flexible circuits, medical sensor assembly and repair, etc. FEATURES: · Flexible (after curing) · Silver-Carbon Filled (Non-Magnetic) · Very Good Electrical
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Graphene Laboratories, Inc.
Description: circuits, medical sensor assembly and repair and many other similar applications. FEATURES: · Flexible (after curing) · Carbon Filled (Non-Metallic & Non-Magnetic) · Electrically Conductive · Resistant to Temperature Variations
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Bluestar Silicones USA Corp.
Description: Elastomer - RTV 1 - Acetic curing - Translucent Flowable, Mechanical properties and thermal resistance Chemical Resistance Properties Viscosity 140000 Hardness Sha 26 Description Potting and insulation of electronic sensors Bonding of various materials General maintenance in industry
- Chemical / Polymer System Type: Silicone
- Compound Type: Liquid
- Dielectric Constant: 2.7
- Dielectric Strength: 483 kV/in
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Supplier: Eaton Corporation - Sensors
Description: space is limited. Product Features Manufactured to take physical and environmental abuse Designed with stainless steel barrel and impact-absorbing new potting compound for robust, high temperature, high pressure washdown, as well as intense shock and vibration
- Body: Cylindrical
- Load: AC Load
- Operating Distance: 0.0 to 0.5906 inch
- Operating Temperature: -13 to 158 F
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Supplier: Eaton Corporation - Sensors
Description: space is limited. Product Features Manufactured to take physical and environmental abuse Designed with stainless steel barrel and impact-absorbing new potting compound for robust, high temperature, high pressure washdown, as well as intense shock and vibration
- Body: Cylindrical
- DC Load: 3-Wire PNP
- Load: DC Load
- Operating Distance: 0.0 to 0.0394 inch
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Supplier: RS Components, Ltd.
Description: The E57 premium+ range of sensors from Eaton have improved sensing performance, product durability and selection. The premium+ range has a rugged stainless body, shock-resistant front caps and impact absorbing potting compound ensuring the highest quality performance. Compact,
- Body: Cylindrical
- Operating Distance: 0.3937 inch
- Output: Switched / Alarm
- Switch Type: Normally Open
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Supplier: Stellar Technology
Description: The Series GT27XX pressure transducers and pressure transmitters are designed to meet the requirements of demanding test and measurement environments. The GT27XX sensors provide improved 0.15% accuracy and high level outputs. Standard analog outputs, plus RS232, RS485, and
- Additional Pressure Reading: Absolute, Gauge, Compound
- Device Category: Transducer
- Features: Temperature Compensation
- Operating Temperature: -65 to 250 F
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Supplier: OMEGA Engineering, Inc.
Description: These liquid level switches are sealed with potting compound. The only path for liquid to the electrical switch would be through the wires. If the wires are terminated in an appropriate manner (e.g. NEMA-6 connectors), the level switch will meet or exceed a NEMA-6 rating, making them
- Device Classification: Sensor-Only
- Level Measurement Type: Point Level / Multi-Point Levels
- Maximum Operating Pressure: 225 psi
- Media Type: Liquid
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Supplier: RS Components, Ltd.
Description: The E57 premium+ range of sensors from Eaton have improved sensing performance, product durability and selection. The premium+ range has a rugged stainless body, shock-resistant front caps and impact absorbing potting compound ensuring the highest quality performance. Compact,
- Body: Cylindrical
- Operating Distance: 0.3937 inch
- Output: Switched / Alarm
- Switch Type: Normally Open
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Supplier: SCHURTER Inc
Description: Description Complements USF 1206 with lower current ratings Impermeable to potting compound Unique Selling Proposition Lowest voltage drop Very fast, precise opening Applications Smart meters Battery protection Sensors Mobile devices Semiconductor protection
- Approvals / Standards: UL Approval, IEC (UMF) Approval
- Current Rating: 0.2500 amps
- Features: Fast Acting
- Material: Other
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A Robust Sensor for Monitoring the Operational Status of Agricultural Ventilation Fans
The mechanical fastening is accomplished through the 6-32 machine screw that passes through the sensor potting compound .
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Inductively coupled corrosion potential sensor for steel reinforced concrete with time domain gating interrogation
Figure 7: Encapsulated corrosion sensor by potting compound .
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Field Operational Testing of a Digital Brake Stroke Sensor
As expected, none of the individual BSS on the 4 trucks would communicate with either the gateway or an externally connected diagnostic computer, indicating that the potting compound around the sensor electronics had been compromised.
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Electrochemical corrosion rate probes for high temperature energy applications
A second and more likely possibility is that, at the test temperature, the ceramic potting compound surrounding the sensor electrodes was sufficiently electrically conductive to act as the electrolyte for the electrochemical measurement of corrosion rate.
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Corrosion probes for fireside monitoring in coal-fired boilers
A second and more likely possibility is that, at the test temperature, the potting compound surrounding the sensor electrodes was sufficiently electrically conductive to act as the electrolyte for the electrochemical measurement of corrosion rate.
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Understanding the operation and use of high temperature electrochemical corrosion rate probes
Probe construction – Two factors related to the design of the probe are: a good seal between the potting compound and the sensor electrodes and a high-resistivity potting compound at elevated temperatures.
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Proceedings of the 18th Annual Conference on Fossil Energy Materials.
A second and more likely possibility is that, at the test temperature, the potting compound surrounding the sensor electrodes was sufficiently electrically conductive to act as the electrolyte for the electrochemical measurement of corrosion rate.
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Shock tunnel measurements of surface pressures in shock induced separated flow field using MEMS sensor array
An array of these single fabricated sensors are created using suitable bonding material and the packaged sensor is filled with potting compound to fill the gap between the sensors and package.
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Fiber Optic Hydrophones Based On Variable Ratio Couplers
Once the potting compound is cured, the sensor is rugged enough to be roughly handled.
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CR4 - Thread: Temperature Sensing Probe
If the gel is a solid then it is more likely a silicon based potting compound to mechanically hold the sensor in place and protect it to some degree.