Products & Services
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Supplier: Matexcel
Description: Conductive silver paste is a quick-drying silver paste. It is refined from ultra-fine silver powder and low-temperature curing thermoplastic resin, suitable for screen printing. It can be widely used in FFC and flexible printed circuits, and can be used on PET and
- Density: 1.7999988639712952 g/cc
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Supplier: Princess Auto Limited
Description: Silver Bearing Solder Paste
- Joining Process / Product Form: Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ABLESTIK SSP-2000 printable low temperature silver sintering paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating
- Type: Electrically Conductive
- Industry: Electronics (PCB / SMT Assembly)
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Supplier: Accuris
Description: Tin-Silver Solder Metal Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA Argomax 5040 Paste is a silver sintering paste developed for die placement on wet paste prior to drying, followed by low-pressure sintering die attachment on copper-finished surfaces. It is formulated for printing or dot dispensing on Cu surfaces
- Joining Process / Product Form: Paste
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Supplier: Henkel Corporation - Electronics
Description: LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as high
- Type: Electrically Conductive
- Industry: Electronics (PCB / SMT Assembly)
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA Argomax 2048 Paste is a dispensable silver sintering paste developed for pressure sintering of large packages or components on gold- and silver-finished substrates, such as Direct Bonded Copper (DBC), aluminum, and copper coolers. Inverters
- Joining Process / Product Form: Paste
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Seal 2084 silver adhesive/sealant is compatible with aluminum, glass, metal and wood materials with a 24 hr cure time. Provides a 5 min fixture time. Delivers great performance with peel strength of 25 piw.
- Viscosity: 30,000 cP
- Type / Form: Grease / Paste
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Seal 2084 silver adhesive/sealant is compatible with aluminum, glass, metal and wood materials with a 24 hr cure time. Provides a 5 hr fixture time. Delivers great performance with peel strength of 25 piw.
- Viscosity: 30,000 cP
- Type / Form: Grease / Paste
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Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Seal 2084 silver adhesive/sealant is compatible with aluminum, glass, metal and wood materials with a 24 hr cure time. Provides a 5 min fixture time. Delivers great performance with peel strength of 25 piw.
- Viscosity: 30,000 cP
- Type / Form: Grease / Paste
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Supplier: R. S. Hughes Company, Inc.
Description: Momentive silver RTV109 adhesive/sealant with a 72 hr cure time. Provides a 20 min fixture time. Delivers great performance with a shear strength of 200 psi, tensile strength of 400 psi and peel strength of 40 pli. Maximum operating temperature is +400 F.
- Use Temperature: 400 F
- Type / Form: Grease / Paste
- Cure / Technology: Room Temp. Cure / Vulcanizing
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Supplier: Monocrystal, Inc.
Description: AGH – series Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 –
- Type: Electrically Conductive
- Industry: Electronics (PCB / SMT Assembly)
- Features: Grease / Paste
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Supplier: Newark, An Avnet Company
Description: Silver Bearing Solder Paste - 7.1g Syringe; Flux Type:-; Solder Alloy:-; Melting Temperature:-; Weight - Metric:-; Weight - Imperial:-; Product Range:
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Supplier: Indium Corporation
Description: NC-SMQ® 80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or silver, and improved ductility to compensate for coefficient of
- Solder Alloy: Indium (In)
- Features: Other
- Product Form: Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: Board (IPC) Class III voiding on Ball Grid Array (BGA) components, and less than 10% average voiding on Bottom Terminated Components (BTC). This paste is engineered for ultra-low voiding performance with high-reliability alloys such as Innolot® and traditional Tin-Silver-Copper (SAC)
- Solder Alloy: Lead Free
- Product Form: Paste, Powder
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Supplier: Accuris
Description: SOLDER PASTE(62 TIN/36 LEAD/2 SILVER, RMA FLUX, NO-CLEAN, STENCIL PRINTABLE
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Supplier: Accuris
Description: SOLDER PASTE (62 TIN/36 LEAD/2 SILVER, RMA FLUX, NO-CLEAN, STENCIL PRINTABLE)
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Supplier: MacDermid Alpha Electronics Solutions
Description: A silver sinter paste for large packages, designed for high-tack component placement on wet paste for marginal surfaces. Product Overview Argomax 2141® Paste is an integrated solution and an extension to the highly successful Argomax range. This product is a dispensable
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Supplier: Metalor Technologies USA Corporation
Description: Metalor develops high performance paste systems and environmentally friendly materials. Among our new products, we offer lead-free pastes based on silver and aluminium.
- Type: Electrically Conductive
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Supplier: Accuris
Description: Aerospace series - Silver base alloy AG-B14001 (AgCu42Ni2) - Filler metal for brazing - Powder or paste
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Supplier: Morgan Advanced Materials
Description: The Wesgo Metals business of Morgan Technical Ceramics manufactures and supplies high-purity, low vapour pressure brazing alloys in various forms. Precious and non-precious alloys are available in atomized powder, discs, evaporation slugs, extrudable paste, FlexibrazeTM, preforms, ribbon,
- Melting Range: 1,580 to 1,673 F
- Joining Process / Product Form: Paste, Solid Wire, Strip / Sheet / Foil
- Braze Alloy: Silver Alloy Braze
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Supplier: Morgan Advanced Materials
Description: The Wesgo Metals business of Morgan Technical Ceramics manufactures and supplies high-purity, low vapour pressure brazing alloys in various forms. Precious and non-precious alloys are available in atomized powder, discs, evaporation slugs, extrudable paste, FlexibrazeTM, preforms, ribbon,
- Melting Range: 1,760 F
- Joining Process / Product Form: Paste, Powder, Solid Wire, Strip / Sheet / Foil
- Braze Alloy: Silver Alloy Braze
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Supplier: Morgan Advanced Materials
Description: The Wesgo Metals business of Morgan Technical Ceramics manufactures and supplies high-purity, low vapour pressure brazing alloys in various forms. Precious and non-precious alloys are available in atomized powder, discs, evaporation slugs, extrudable paste, FlexibrazeTM, preforms, ribbon,
- Melting Range: 1,436 to 1,526 F
- Joining Process / Product Form: Paste, Powder, Solid Wire, Strip / Sheet / Foil
- Braze Alloy: Silver Alloy Braze
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Supplier: Morgan Advanced Materials
Description: The Wesgo Metals business of Morgan Technical Ceramics manufactures and supplies high-purity, low vapour pressure brazing alloys in various forms. Precious and non-precious alloys are available in atomized powder, discs, evaporation slugs, extrudable paste, FlexibrazeTM, preforms, ribbon,
- Melting Range: 1,204 to 1,454 F
- Joining Process / Product Form: Paste, Powder, Solid Wire, Strip / Sheet / Foil
- Braze Alloy: Silver Alloy Braze
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: and copper based alloys. The Easy Flo alloy group has varying percentages of Silver, Copper, Zinc and Cadmium. Easy-Flo alloys are available in strip, wire, powder, paste, preforms as well as clad tri-metal products. NOTE: These alloys contain cadmium and cadmium fumes are toxic. As a
- Tensile Strength (UTS): 55,000 to 130,000 psi
- Melting Range: 1,175 F
- Conductivity: 138,620,000,000 µS/cm
- Approvals / Conformance: ASME, AWS
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Supplier: SAE International
Description: This specification covers a silver-brazing flux in the form of a paste.
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Alloys vary in silver content from 18% to 2% and the percentage of silver and phosphorous does change the melt and flow characteristics of the filler metal. Sil-Fos alloys are available in wire & rod, powder & paste, preformed rings and shapes. Some Sil-Fos alloys are available
- Melting Range: 1,190 F
- Conductivity: 34,220,000,000 µS/cm
- Braze Alloy: Copper Alloy Braze, Silver Alloy Braze
- Features: Other
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Features: Die Bonding Adhesive / Compound, Electrically Conductive, Powder, Specialty / Other
- Industry: Electronics
- Chemical System: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: SAE International
Description: This specification covers a silver brazing compound in paste form containing not more than 35% water by weight.
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: applications. The Braze family of alloys is available in strip, wire, powder, paste, preforms as well as clad tri-metal products and flux-cored wire.
- Tensile Strength (UTS): 25,000 to 45,000 psi
- Elongation: 8 to 18 %
- Melting Range: 1,575 F
- Conductivity: 141,520,000,000 µS/cm
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Supplier: SAE International
Description: This specification covers a silver-brazing flux in paste form.
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Supplier: Epoxies Etc...
Description: 40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its' wide operating
- Use Temperature: -58 to 338 F
- Thermal Conductivity: 14.42279 W/m-K
- Coeff. of Thermal Expansion (CTE): 13.88888888888889 µin/in-F
- Tensile Strength (Break): 9,450 psi
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Supplier: Ellsworth Adhesives
Description: AI Technology Prima-Solder ME8456 Epoxy Paste Adhesive is a thermally conductive, electrically, reworkable, pure silver filled epoxy paste adhesive. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with
- Viscosity: 130,000 cP
- Thermal Conductivity: 7.9 W/m-K
- Chemical System: Epoxy (EP)
- Cure / Technology: Single Component System
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Featured Products Top
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(Waterbury, CT USA) April 28, 2026 - MacDermid Alpha Electronics Solutions will debut ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON (read more)
Browse Silicone Adhesives and Sealants Datasheets for MacDermid Alpha Electronics Solutions -
thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or manual syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material. (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
use in detection of small componentry or silver paste placement. Two styles are available—wafer and cylindrical. The wafer sensor is the size of a thick coin and ideal for situations when overall length is a problem. The cylindrical sensors are available in smooth and threaded (read more)
Browse Capacitive Proximity Sensors Datasheets for Locon Sensor Systems, Inc. -
LTCC Low Temperature Co-fired Ceramics are multilayer ceramic substrates for satellite, space station, rocket and space transfer vehicles. KOA LTCC uses Silver based paste(Ag) with low conductor resistance as multilayer conductor patterns in ceramics substrate by co-firing process (read more)
Browse Electroceramics Datasheets for KOA Speer Electronics, Inc. -
MacDermid Alpha Electronics Solutions Expands Singapore Production Facility to Meet Growing Global Demand for Argomax® Silver Sintering Paste This strategic initiative marks a significant milestone in the company’s growth. At the heart of the (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
reliability. ALPHA® OM-100 is a silver-free, high-performance solder paste designed to deliver the required thermomechanical reliability (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has a thermal conductivity of 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(m·K)]. EP3HTS is dimensionally stable and bonds well to metals (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
award celebrates a collaboration of more than two decades, during which MacDermid Alpha has supplied advanced solder alloys, pastes, adhesives, and cleaners to support Syrma SGS’s expansion into one of India’s most technologically advanced manufacturers. In 2025, MacDermid Alpha (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions
Conduct Research Top
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Energy & Eco-Sustainability using Pressure-less Silver Sintering for RF Power Electronics
A virtually void free die attach was successfully achieved using a fixed but critical volume of Ag sinter paste by a process of pressure-less sintering on a multi-axis cartesian style bonder, retrofitted with a high-speed jetting dispenser. While this process potentially offered an ideal
More Information Top
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Effect of spherical silver powders with different sizes in back electrode paste on the conversion efficiency of silicon solar cells
Then the properties of three back-side silver pastes made of spherical silver powders with three different sizes (D90 \ 1.0, 1.5 and 2.0 lm) were investigated when these back-side silver pastes were printed and further formed to …
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Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep
Initial failure of nano-silver sintered lap shear joints often occurred at interfacial nano- silver paste layers.
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Advanced Technologies in Manufacturing, Engineering and Materials
The Cascaded Effects in the Frequency Selective Surfaces Sculpted from Carbon Fabric Reinforced Epoxy Composite Panels Coated with Conductive Silver Paste C.L. Li, D.Z. Jiang, J.C. Zeng, S.L. Xing and S. Ju .
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Electrical Conductivity of Thick Films Made from Silver Methylcarbamate Paste
Key words: Thick film, silver paste , electrical conductivity, sintering process, initial silver content .
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Uncertainty analysis in contact resistivity measurements of crystalline silicon solar cells
The achievement of obtaining low contact resistivity between silver electrodes and the emitter layer of a crystalline silicon solar cell has been a constant issue for the silver paste developers in crystalline silicon solar cell industries.
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Nanoparticles-aided silver front contact paste for crystalline silicon solar cells
Thick silver films were prepared by screen-printing using the front contact silver paste containing the as-prepared silver nanoparticles.