Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Princess Auto Limited
Description: Silver Bearing Solder Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
- Form / Shape: Paste
-
Supplier: Monocrystal, Inc.
Description: AGH – series Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Form: Grease / Paste
- Industry: Electronics
-
Supplier: Accuris
Description: Tin-Silver Solder Metal Paste
-
-
Supplier: Matexcel
Description: Conductive silver paste is a quick-drying silver paste. It is refined from ultra-fine silver powder and low-temperature curing thermoplastic resin, suitable for screen printing. It can be widely used in FFC and flexible printed circuits, and can be used on PET and
- Density: 1.8 g/cc
-
Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Seal 2084 silver adhesive/sealant is compatible with aluminum, glass, metal and wood materials with a 24 hr cure time. Provides a 5 hr fixture time. Delivers great performance with peel strength of 25 piw.
- Features: Grease / Paste
- Viscosity: 30000 cP
-
Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Seal 2084 silver adhesive/sealant is compatible with aluminum, glass, metal and wood materials with a 24 hr cure time. Provides a 5 min fixture time. Delivers great performance with peel strength of 25 piw.
- Features: Grease / Paste
- Viscosity: 30000 cP
-
Supplier: R. S. Hughes Company, Inc.
Description: 3M Scotch-Seal 2084 silver adhesive/sealant is compatible with aluminum, glass, metal and wood materials with a 24 hr cure time. Provides a 5 min fixture time. Delivers great performance with peel strength of 25 piw.
- Features: Grease / Paste
- Viscosity: 30000 cP
-
Supplier: Indium Corporation
Description: NC-SMQ® 80 is a halide-free, no-clean solder paste formulated for use with indium-based alloys. Indium-containing alloys offer the benefits of reduced leaching/scavenging of metallizations of precious metals like gold or silver, and improved ductility to compensate for coefficient of
- Alloy: Indium (In)
- Approvals / Conformance: Other
- Form / Shape: Paste
-
Supplier: MacDermid Alpha Electronics Solutions
Description: A silver sinter paste, providing high thermal and electrical conductivity. Product Overview The ALPHA® Argomax® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste
- Industry: Electronics, Semiconductors / IC Packaging, Automotive
- Material Type: Die Bonding Adhesive / Compound, Grease / Paste
-
Supplier: Henkel Corporation - Electronics
Description: LOCTITE ABLESTIK SSP-2000 printable low temperature silver sintering paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating
- Compound Type: Electrically Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Dispensable paste for pressure sintering large components on gold/silver substrates, including DBC, aluminum, copper. Product Overview ALPHA Argomax 2048 Paste is a dispensable silver sintering paste developed for pressure sintering of large packages or components
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Sinter silver paste for die attachment on copper, designed for wet paste placement and low-pressure sintering. Product Overview ALPHA Argomax 5040 Paste is a silver sintering paste developed for die placement on wet paste prior to drying, followed by
-
Supplier: MacDermid Alpha Electronics Solutions
Description: A silver sinter paste for large packages, designed for high-tack component placement on wet paste for marginal surfaces. Product Overview Argomax 2141® Paste is an integrated solution and an extension to the highly successful Argomax range. This product is a dispensable
-
Supplier: Henkel Corporation - Electronics
Description: LOCTITE ABLESTIK SSP 2020 is a sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. It is formulated to provide high heat transfer generated from power devices. It maintains high adhesion at operating temperatures as high
- Features: Electrically Conductive Compound (Adhesive, Grease)
- Industry: Electronics
-
Supplier: Metalor Technologies USA Corporation
Description: institutes, Metalor develops high performance paste systems and environmentally friendly materials. Among our new products, we offer lead-free pastes based on silver and aluminium.
- Compound Type: Electrically Conductive
-
Supplier: Morgan Advanced Materials
Description: , sheet, washers, and wire. The extensive range of high purity, low vapor pressure Precious Brazing Filler Metals is derived from Gold, Silver, Platinum and Palladium based materials and exceeds the most stringent requirements imposed by the Power Tube, Aerospace, Semiconductor, Medical,
- Brazing Filler Alloys: Silver Alloy Braze
- Form / Shape: Paste, Powder, Strip / Sheet / Foil, Solid Wire
- Melting Range: 1760 F
-
Supplier: Morgan Advanced Materials
Description: replaces metallizing, firing and electroplating, offering savings in time and cost. ABA®’s are available in Gold, Silver, Titanium and Copper based materials and offer highly reliable hermetic seals between ceramic and metal for both oxide and non-oxide ceramics. Available alloy forms include
- Brazing Filler Alloys: Silver Alloy Braze
- Form / Shape: Paste, Strip / Sheet / Foil, Solid Wire
- Melting Range: 1580 to 1673 F
-
Supplier: R. S. Hughes Company, Inc.
Description: Momentive silver RTV109 adhesive/sealant with a 72 hr cure time. Provides a 20 min fixture time. Delivers great performance with a shear strength of 200 psi, tensile strength of 400 psi and peel strength of 40 pli. Maximum operating temperature is +400 F.
- Cure Type / Technology: Room Temp. Cure / Vulcanizing
- Features: Grease / Paste
- Use Temperature: 400 F
-
Supplier: Lucas Milhaupt Global Brazing Solutions
Description: These alloys are vacuum grade filler metals that have their compositions specifically controlled to fabricate joints exposed to high vacuum on electron devices. These alloys must be brazed in high purity atmosphere or vacuum. Premabraze alloys consist of only certified "pure" materials, this metal
- Approvals / Conformance: ASTM / UNS
- Brazing Filler Alloys: Silver Alloy Braze
- Conductivity: 6.09E11 µS/cm
- Form / Shape: Paste, Powder, Preform, Strip / Sheet / Foil, Solid Wire
-
Supplier: Morgan Advanced Materials
Description: , sheet, washers, and wire. The extensive range of high purity, low vapor pressure Precious Brazing Filler Metals is derived from Gold, Silver, Platinum and Palladium based materials and exceeds the most stringent requirements imposed by the Power Tube, Aerospace, Semiconductor, Medical,
- Brazing Filler Alloys: Silver Alloy Braze
- Form / Shape: Paste, Powder, Strip / Sheet / Foil, Solid Wire
- Melting Range: 1204 to 1454 F
-
Supplier: Morgan Advanced Materials
Description: , sheet, washers, and wire. The extensive range of high purity, low vapor pressure Precious Brazing Filler Metals is derived from Gold, Silver, Platinum and Palladium based materials and exceeds the most stringent requirements imposed by the Power Tube, Aerospace, Semiconductor, Medical,
- Brazing Filler Alloys: Silver Alloy Braze
- Form / Shape: Paste, Powder, Strip / Sheet / Foil, Solid Wire
- Melting Range: 1436 to 1526 F
-
Supplier: Lucas Milhaupt Global Brazing Solutions
Description: /steel and copper based alloys. The Easy Flo alloy group has varying percentages of Silver, Copper, Zinc and Cadmium. Easy-Flo alloys are available in strip, wire, powder, paste, preforms as well as clad tri-metal products. NOTE: These alloys contain cadmium and cadmium fumes are
- Approvals / Conformance: ASME, AWS, Other
- Brazing Filler Alloys: Silver Alloy Braze
- Conductivity: 1.39E11 µS/cm
- Form / Shape: Paste, Powder, Preform, Strip / Sheet / Foil, Solid Wire
-
Supplier: Lucas Milhaupt Global Brazing Solutions
Description: -Fos Alloys vary in silver content from 18% to 2% and the percentage of silver and phosphorous does change the melt and flow characteristics of the filler metal. Sil-Fos alloys are available in wire & rod, powder & paste, preformed rings and shapes. Some Sil-Fos alloys are
- Approvals / Conformance: ASME, AWS
- Brazing Filler Alloys: Copper Alloy Braze, Silver Alloy Braze, Other
- Conductivity: 4.58E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Solid Wire
-
Supplier: Lucas Milhaupt Global Brazing Solutions
Description: specialty applications. The Braze family of alloys is available in strip, wire, powder, paste, preforms as well as clad tri-metal products and flux-cored wire.
- Approvals / Conformance: AWS
- Brazing Filler Alloys: Silver Alloy Braze
- Conductivity: 1.04E11 µS/cm
- Form / Shape: Paste, Powder, Preform, Strip / Sheet / Foil, Solid Wire
-
Supplier: Accuris
Description: SOLDER PASTE (62 TIN/36 LEAD/2 SILVER, RMA FLUX, NO-CLEAN, STENCIL PRINTABLE)
-
Supplier: Accuris
Description: SOLDER PASTE(62 TIN/36 LEAD/2 SILVER, RMA FLUX, NO-CLEAN, STENCIL PRINTABLE
-
Supplier: Accuris
Description: Aerospace series - Silver base alloy AG-B14001 (AgCu42Ni2) - Filler metal for brazing - Powder or paste
-
Supplier: SAE International
Description: This specification covers a silver-brazing flux in the form of a paste.
-
Supplier: SAE International
Description: This specification covers a silver-brazing flux in paste form which contains not more than 35% water by weight.
-
Supplier: SAE International
Description: This specification covers a silver brazing compound in paste form containing not more than 35% water by weight.
-
Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive
- Industry: Electronics
-
Supplier: SAE International
Description: This specification covers a silver-brazing flux in paste form.
-
Supplier: Epoxy Technology
Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 87.78 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
-
Supplier: Epoxies Etc...
Description: 40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its' wide operating
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 µin/in-F
- Composition: Two Component System, Filled
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
-
Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 21.67 to 124 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
-
Supplier: RS Components, Ltd.
Description: Typical uses are screen printing of PCBs (for surface mounting of chip and leadless components), fired-on ceramics, and gold/silver-plated surfaces. Methods of heating are hot air, vapour phase, infrared, hot plates and even conventional electric irons. Standard particle size available.
- Form / Shape: Paste
-
Supplier: Graphene Laboratories, Inc.
Description: · Flexible Electronics, Wiring & Harnesses · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
-
Supplier: Epoxy Technology
Description: mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 26.67 to 83.33 µin/in-F
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
-
Supplier: Graphene Laboratories, Inc.
Description: · Display Packaging / Bonding · Electronics Manufacture / Repair · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
-
Supplier: Graphene Laboratories, Inc.
Description: · Medical Devices / Sensors · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic silver paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 50 (Part B) by weight
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
-
Supplier: RS Components, Ltd.
Description: No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux Type =
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Paste
- Melting Range: 423 to 426 F
-
Supplier: RS Components, Ltd.
Description: No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux Type =
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Paste
- Melting Range: 423 to 426 F
-
Supplier: RS Components, Ltd.
Description: No-Clean solder paste suitable for stencil printing for reflow processes. Fine pitch capability (400 µm). High activity. Minimal residue, neutral and colourless. Chlorine-free. Product Form = Paste Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux Type =
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Paste
- Melting Range: 423 to 426 F
-
Supplier: Graphene Laboratories, Inc.
Description: dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight. POT LIFE: 4 hours CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Two Component System, Filled
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Specialty / Other
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of two part silver conductive epoxy systems, the EP77M-F has a one-to-one mix
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Filled
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Industry: Electronics, Electrical Power / HV, Semiconductors / IC Packaging, Aerospace, Automotive, OEM / Industrial
Find Suppliers by Category Top
Featured Products Top
-
(Waterbury, CT USA) April 28, 2026 - MacDermid Alpha Electronics Solutions will debut ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON (read more)
Browse Silicone Adhesives and Sealants Datasheets for MacDermid Alpha Electronics Solutions -
thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or manual syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material. (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
use in detection of small componentry or silver paste placement. Two styles are available—wafer and cylindrical. The wafer sensor is the size of a thick coin and ideal for situations when overall length is a problem. The cylindrical sensors are available in smooth and threaded (read more)
Browse Capacitive Proximity Sensors Datasheets for Locon Sensor Systems, Inc. -
LTCC Low Temperature Co-fired Ceramics are multilayer ceramic substrates for satellite, space station, rocket and space transfer vehicles. KOA LTCC uses Silver based paste(Ag) with low conductor resistance as multilayer conductor patterns in ceramics substrate by co-firing process (read more)
Browse Electroceramics Datasheets for KOA Speer Electronics, Inc. -
MacDermid Alpha Electronics Solutions Expands Singapore Production Facility to Meet Growing Global Demand for Argomax® Silver Sintering Paste This strategic initiative marks a significant milestone in the company’s growth. At the heart of the (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
reliability. ALPHA® OM-100 is a silver-free, high-performance solder paste designed to deliver the required thermomechanical reliability (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
customized services. LTCC ceramic package shell LTCC (Low Temperature Co-fired Ceramic) is a multilayer ceramic substrate, the main components of which are alumina and glass, and high conductivity metals such as gold, silver, and copper are used as conductor pastes (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has a thermal conductivity of 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(m·K)]. EP3HTS is dimensionally stable and bonds well to metals (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
award celebrates a collaboration of more than two decades, during which MacDermid Alpha has supplied advanced solder alloys, pastes, adhesives, and cleaners to support Syrma SGS’s expansion into one of India’s most technologically advanced manufacturers. In 2025, MacDermid Alpha (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
the surface of talc porcelain or a small amount of iron or manganese is added to the powder to improve its bonding performance. It is sintered in hydrogen and nitrogen atmosphere and then welded with metal. Aluminum-manganese method is commonly used. Active metal method: The paste made of (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited
Conduct Research Top
-
Energy & Eco-Sustainability using Pressure-less Silver Sintering for RF Power Electronics
A virtually void free die attach was successfully achieved using a fixed but critical volume of Ag sinter paste by a process of pressure-less sintering on a multi-axis cartesian style bonder, retrofitted with a high-speed jetting dispenser. While this process potentially offered an ideal
More Information Top
Indicates content that may require registration and/or purchase.
-
Effect of spherical silver powders with different sizes in back electrode paste on the conversion efficiency of silicon solar cells
Then the properties of three back-side silver pastes made of spherical silver powders with three different sizes (D90 \ 1.0, 1.5 and 2.0 lm) were investigated when these back-side silver pastes were printed and further formed to …
-
Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep
Initial failure of nano-silver sintered lap shear joints often occurred at interfacial nano- silver paste layers.
-
Advanced Technologies in Manufacturing, Engineering and Materials
The Cascaded Effects in the Frequency Selective Surfaces Sculpted from Carbon Fabric Reinforced Epoxy Composite Panels Coated with Conductive Silver Paste C.L. Li, D.Z. Jiang, J.C. Zeng, S.L. Xing and S. Ju .
-
Electrical Conductivity of Thick Films Made from Silver Methylcarbamate Paste
Key words: Thick film, silver paste , electrical conductivity, sintering process, initial silver content .
-
Uncertainty analysis in contact resistivity measurements of crystalline silicon solar cells
The achievement of obtaining low contact resistivity between silver electrodes and the emitter layer of a crystalline silicon solar cell has been a constant issue for the silver paste developers in crystalline silicon solar cell industries.
-
Nanoparticles-aided silver front contact paste for crystalline silicon solar cells
Thick silver films were prepared by screen-printing using the front contact silver paste containing the as-prepared silver nanoparticles.