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Supplier: DigiKey
Description: Leaded Bar Solder Sn96Ag4 (96/4) Bar, 1 lb (454g)
- Melting Range: 430 F
- Features: Other
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Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties; good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Features: Strip / Sheet / Foil
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Diameter / Thickness: 0.3 inch
- Features: Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste, powder or
- Melting Range: 430 F
- Conductivity: 81,200,000,000 µS/cm
- Approvals / Conformance: ASTM / UNS
- Product Form: Paste, Powder, Preform
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Supplier: Newark, An Avnet Company
Description: SOLDER BAR, SN/AG/CU, 220°C, 1.67LB; Solder Alloy:96.5, 3, 0.5 Sn, Ag, Cu; Melting Temperature:217°C; Density:-; Weight - Metric:757.499g; Weight - Imperial:1.67lb; Product Range:-; Weight:757.499g RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: SOLDER PASTE, SN, AG, CU; Flux Type:No Clean; Solder Alloy:96.5, 0.5 Sn, Ag, Cu; Melting Temperature:-; Weight - Metric:-; Weight - Imperial:-; Product Range:-; SVHC:No SVHC (15-Jan-2019) RoHS Compliant: Yes
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Supplier: Indium Corporation
Description: Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are triangular in shape (1.4 lbs./bar) packed 18 bars/box 25 lbs./box Minimum order quantity is: 25 lbs.
- Features: Other
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Accuris
Description: SOLDER 97.5PB - 1.5AG - 1SN
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Supplier: Newark, An Avnet Company
Description: SOLDER PASTE, SN/AG/CU, 8G ROHS COMPLIANT: YES
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Supplier: Newark, An Avnet Company
Description: SOLDER PASTE, SN, BI, AG, 138DEG C, 15G; Solder Alloy:42, 57.6, 0.4 Sn, Bi, Ag; Melting Temperature:138 C; Weight - Metric:15g; Weight - Imperial:0.529oz; Product Range:-; SVHC:No SVHC (17-Dec-2015); Weight:15g RoHS Compliant: Yes
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Supplier: Accuris
Description: Solder 97.5Pb - 1.5Ag - 1Sn
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Supplier: Accuris
Description: SOLDER PASTE, 62 SN, 36 PB, 2 AG
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Supplier: Accuris
Description: SOLDER, BAR, 62 SN/36 PB/ 2 AG
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Solder - Solder; Lead Free; No Clean; 21 gauge wire; .032 diameter; 35 gram spool; Sn/Ag -- 70125623Supplier: Allied Electronics, Inc.
Description: Solder; Lead Free; No Clean; 21 gauge wire; .032 diameter; 35 gram spool; Sn/Ag
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Supplier: Allied Electronics, Inc.
Description: Solder;Lead Free;No Clean; 21 gauge wire;.032 dia;1 lb spool;Sn/Ag
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Supplier: SAE International
Description: This specification covers wire, strip, bars, pigs, or as ordered. Alloy: 1.5 Sn Solder UNS Number: L50131
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Supplier: Allied Electronics, Inc.
Description: Solder; Lead Free; No Clean; 21 gauge wire; .032 diameter; 1/4 lb spool; Sn/Ag
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Supplier: Allied Electronics, Inc.
Description: Solder; Lead Free; No Clean; 21 gauge wire; .032 diameter; 1/2 lb spool; Sn/Ag
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Supplier: ODG (Origin Data Global)
Description: SOLDER BAR SN42/BI57/AG1 8OZ 227
- Features: Other
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead-free solder bar is another quality product from Kester. Total composition for this lead-free solder bar is sn96.5/ag03/cu0.5.
- Features: Other
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead-free solder bar is another quality product from Kester. Total composition for this lead-free solder bar is sn95/ag05.
- Features: Other
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester Ultrapure lead-free solder bar is another quality product from Kester. Total composition for this lead-free solder bar is sn96.5/ag3.5.
- Features: Other
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester solder without flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a solder without flux core. Total composition for this solder without flux core lead-free
- Features: Other, Solid Wire
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Supplier: RS Components, Ltd.
Description: SOLDER SN62 PB AG2 10/10
- Diameter / Thickness: 0.0393701 inch
- Features: Other, Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
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Supplier: RS Components, Ltd.
Description: Sn42Bi57Ag1 Low Temperature Solder Paste
- Process Capability: Soldering Equipment
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Supplier: HAVE, Inc.
Description: Smallest available hard wiring large solder cups. TECHNICAL DATA Electrical Number of contacts: 3 - 7 (except MP: 3-6) Rated voltage: 250 V ac (3 - 6 pole) 125 V ac (7 pole) Contact resistance: < 5 m Insulation resistance - initial: > 2 G - after damp heat test: > 1 G -IEC 68-2-30) Dielectric
- Connector Type: Audio / Video Connector
- Gender: Male / Plug
- Features: XLR Connector
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Supplier: HAVE, Inc.
Description: Smallest available hard wiring large solder cups. TECHNICAL DATA Electrical Number of contacts: 3 - 7 (except MP: 3-6) Rated voltage: 250 V ac (3 - 6 pole) 125 V ac (7 pole) Contact resistance: < 5 m Insulation resistance - initial: > 2 G - after damp heat test: > 1 G -IEC 68-2-30) Dielectric
- Connector Type: Audio / Video Connector
- Gender: Male / Plug
- Features: XLR Connector
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Supplier: HAVE, Inc.
Description: mallest available hard wiring large solder cups. TECHNICAL DATA Electrical Number of contacts: 3 - 7 (except MP: 3-6) Rated voltage: 250 V ac (3 - 6 pole) 125 V ac (7 pole) Contact resistance: < 5 m Insulation resistance - initial: > 2 G - after damp heat test: > 1 G -IEC 68-2-30) Dielectric
- Connector Type: Audio / Video Connector
- Gender: Female / Jack
- Features: XLR Connector
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Supplier: HAVE, Inc.
Description: Smallest available hard wiring large solder cups. TECHNICAL DATA Electrical Number of contacts: 3 - 7 (except MP: 3-6) Rated voltage: 250 V ac (3 - 6 pole) 125 V ac (7 pole) Contact resistance: < 5 m Insulation resistance - initial: > 2 G - after damp heat test: > 1 G -IEC 68-2-30) Dielectric
- Connector Type: Audio / Video Connector
- Gender: Female / Jack
- Features: XLR Connector
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidification
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidification
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Technic, Inc.
Description: Technistan Ag is a patent-pending high speed plating process that deposits a semi-bright to full bright tin-silver alloy in the range of 90-99% tin. Technistan Ag deposits have an extremely stable alloy composition across a wide range of plating process variables. Even parts with
- Chemical / Composition: Tin Plating
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE LF 620, Solder paste, Halide-free, No clean, Low voiding, Pb-free soldering LOCTITE® LF 620 is a halide-free, no clean, low voiding Pb-free solder paste, which has excellent humidity resistance and a broad process window both for printing and reflow . It shows low hot slump to
- Product Form: Paste
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Supplier: MacDermid Alpha Electronics Solutions
Description: The alloy also yields very low voiding in BGA solder joints, even when a traditional SAC alloy sphere is used. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C. Eliminates the
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Supplier: MacDermid Alpha Electronics Solutions
Description: High lead solder preforms with 4N alloy purity for die attach. Product Overview ALPHA High Lead Die Attach Preforms are constructed with 99.99% (4N) purity PbSn, PbSnAg, and PbSb alloys. To minimize oxidation during storage and shipping, these products are packaged in glass jars flooded with
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; different surface finishes for contact pads (HASL, PbFree HASL, immersion coatings (ImAu, ImAg, ImSn), HardGold, OSP, and others). Get Bulk Rigid PCB at Best Cost We work with any volume of orders – we supply prototypes, test batches and large series of printed (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd.
Conduct Research Top
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Solder Reflow Recommendation
of tin and lead provided excellent bonding strength as well as enough elasticity to withstand the thermal stresses in the product's operating environment. As electronic manufacturers move away from this longtime standard PbSn alloy toward Pb-free solder alloys such as tin-silvercopper (Sn-Ag-Cu
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Indicates content that may require registration and/or purchase.
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Effect of Al and Zn alloying elements on Sn-3.8Ag-0.7Cu and Sn-3.6Ag solder reaction with Cu and Ni(P) substrate
21 [8] Jee, Y.K., Xia, Y.H., Yu, J., Kang, H.W., Lee, T.Y., "Effect of Al Addition in Sn Ag Solder on the Interfacial Reactions with Cu and ENIG Metallizations," In IEEE 58th Electron.
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Printed circuit assembly with no lead solder assembly process
Due to the cost of the Sn Ag solder and some preliminary solder test results, the SnCu solder became the solder of choice.
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Future devices and modules for power electronic applications
Pb Sn Ag solder (eutect.
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The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical
Shock Loading
secondary and tertiary phases.70,72–75 Furthermore, all of the listed characteristics increase with increased strain rate.73 The steady-state creep rate of low- Ag solder ( Sn -1Ag-0.5Cu) was compared with that of a higher-Ag composition (Sn-4Ag …
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Effects of prestrain, rate of prestrain, and temperature on the stress-relaxation behavior of eutectic Sn-3.5Ag solder joints
Stress-relaxation studies on eutectic Sn- Ag solder ( Sn -3.5Ag in wt.%) joints were carried out at various temperatures after imposing different amounts and rates of simple shear strain.
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Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints
Low- Ag solder Sn –0.3Ag–0.7Cu and high-Ag concentration solder Sn–3Ag–0.5Cu were also investigated.
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Lead-free Solders: Materials Reliability for Electronics
… High Vacancy Concentration on Strength 10.4.5 Effect of High Vacancy Concentration on Stress-Relaxation Rate 10.5 Conclusions Acknowledgments References 11 Effect of Temperature-Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn - Ag Solder Joints Andre Lee, Deep …
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Lead-Free Electronic Solders
Figures 1 and 2 provide microstructures of eutectic Sn - Ag solder joints containing Cu6Sn5, Ni3Sn4, and Fe-Sn reinforcement particles in the as- joined condition and after long-term aging [38, 39].
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Lead-Free Solder Interconnect Reliability
Evaluation of Lead-Free Eutectic Sn - Ag Solder for Automotive Electronics Packaging Appli- cations, Proceedings of the International .
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http://calhoun.nps.edu/public/bitstream/handle/10945/1777/05Dec_How.pdf?sequence=1
Therefore, in this work, finite element modeling using ANSYSTM is employed to obtain the elastic, plastic and creep properties of these Sn - Ag solder joints from impression testing, which uses a flat-tip cylindrical indenter, so that correlations may be drawn with …