Sn Ag Solder

Description: This alloy has excellent thermal fatigue properties; good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes

• Alloy: Tin-Silver (Sn-Ag)

Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste,

• Alloy: Tin-Silver (Sn-Ag)
• Approvals / Conformance: ASTM / UNS
• Conductivity: 8.12E10 µS/cm
• Form / Shape: Paste, Powder, Preform, Wire

Description: A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 140ºC Solidus Melting Temperature: 139ºC Pb-Free: Yes

• Alloy: Tin-Silver (Sn-Ag)
• Lead Free: Yes

Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes

• Alloy: Tin-Silver (Sn-Ag)
• Form / Shape: Wire

Description: Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes

• Alloy: Tin-Silver (Sn-Ag)
• Form / Shape: Wire

Description: SOLDER BAR SN96.5/AG3.5 1LB (454

• Form / Shape: Other
• Melting Range: 430 F

Description: Leaded Bar Solder Sn96Ag4 (96/4) Bar, 1 lb (454g)

• Form / Shape: Other
• Melting Range: 430 F

Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidificati on

• Alloy: Tin-Silver (Sn-Ag)
• Form / Shape: Wire

Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidificati on

• Alloy: Tin-Silver (Sn-Ag)
• Form / Shape: Wire

Description: Leaded Bar Solder Sn62Pb36Ag2 (62/36/2) Bar, 1 lb (454g)

• Form / Shape: Other
• Melting Range: 354 F

Description: "SN99/AG1 .031"" SOLDER WIRE 1OZ S"

• Form / Shape: Wire
• Melting Range: 428 to 446 F

Description: The Kester Ultrapure lead-free solder bar is another quality product from Kester. Total composition for this lead-free solder bar is sn96.3/ag3.7.

• Approvals / Conformance: Other

Description: The Kester Ultrapure lead solder bar is another quality product from Kester. Total composition for this lead solder bar is sn10/pb88/ag02.

• Approvals / Conformance: Other

Description: The Kester Ultrapure lead-free solder bar is another quality product from Kester. Total composition for this lead-free solder bar is sn96.5/ag3.5.

• Approvals / Conformance: Other

Description: The Kester Ultrapure lead solder bar is another quality product from Kester. Total composition for this lead solder bar is sn62/pb36/ag02.

• Approvals / Conformance: Other

Description: SOLDER BAR SN42/BI57/AG1 8OZ 227

• Equipment Type: Other

Description: WSW SAC L0 solders have been developed to meet the electronics industryâ??s increasingly stringent quality requirements. WSW SAC L0 lead-free solder wire with Sn3.0Ag0.5Cu alloy. L0 - Halogen-free flux. For a long life of the soldering tips. Fast and homogeneous

• Alloy: Tin-Silver (Sn-Ag)
• Form / Shape: Wire
• Melting Range: 423 to 430 F

Description: surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. 4 hours between print abandon time even on small CSP apertures. Very low hot slump. Colorless residues for easy post-reflow inspection Suitable for fine pitch, high speed printing up to 150mm/s (6"/s) Halide

• Form / Shape: Paste

Description: SOLDER, BAR, 62 SN/36 PB/ 2 AG

Description: High lead solder preforms with 4N alloy purity for die attach. Product Overview ALPHA High Lead Die Attach Preforms are constructed with 99.99% (4N) purity PbSn, PbSnAg, and PbSb alloys. To minimize oxidation during storage and shipping, these products are packaged in glass jars

Description: This specification covers wire, strip, bars, pigs, or as ordered. Alloy: 1.5 Sn Solder UNS Number: L50131

Description: wide range of reflow profiles in air and N2 reflow ovens and across a wide range of surface finishes including Ni/Au, immersion Sn, Immersion Ag and OSP Cu. Proflow compatible. Available with both AGS (20-45?m, equivalent to IPC type 3) and DAP (20-38?m, equivalent to IPC type 4)

Description: Enables low temperature SMT assembly technology to minimize rework in multiple reflow applications. Product Overview ALPHA CVP-520 is designed for near-eutectic low-temperature alloys such as SnBi0.4Ag, enabling peak reflow profiles between 155°C and 190°C. The flux

Description: .6 30% GR (glass reinforced) Contacts: - female (3 pole): CuSn6 - female (4-7pole) & male: CuZn39Pb3 Contact surface: gal 2 â•¡m Ag or gal 0.2 â•¡m Au hard alloy over 2 â•¡m Ni Latch lock & spring: CK 67 steel, treated Environmental Temperature range: -30â-' C to + 80â-' C

• Connector Type: XLR Connector
• Gender: Male / Plug

Description: .6 30% GR (glass reinforced) Contacts: - female (3 pole): CuSn6 - female (4-7pole) & male: CuZn39Pb3 Contact surface: gal 2 â•¡m Ag or gal 0.2 â•¡m Au hard alloy over 2 â•¡m Ni Latch lock & spring: CK 67 steel, treated Environmental Temperature range: -30â-' C to + 80â-' C

• Connector Type: Audio / Video Connector
• Gender: Male / Plug

Description: Tin and silver alloy in packaging suitable for wave soldering machines and tinning crucibles. Bar dimensions: 380 x 15 x 8 mm. Product Form = Granules Melting Point = +221°C Percent Silver = 4% Percent Tin = 96% Product Weight = 500g

• Form / Shape: Powder
• Melting Range: 430 F
• Soldering Filler Alloys: Tin-Silver (Sn-Ag)

Description: geometry will have a consistent alloy in all areas of the part. This is very important, as the melting temperature of the alloy can range from 221° C at the tin-silver eutectic – 96.5% Sn/3.5% Ag to over 300° C for the silver rich 90/10 deposit. Therefore, the alloy will determine the

• Chemical / Process: Tin Plating

Description: Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic

Description: IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded

Description: lifecycles. IP67 sealed Contact Configuration = SP Terminal Type = Solder, Tab Switch Operation = Momentary Actuator Colour = Black Actuator Type = Cap Contact Current Rating = 50 mA @ 24 V dc IP Rating = IP67 Operating Force = 3.5 N Operating Temperature Range = -40 - +160°C Contact Material

• Maximum Current: 0.0500 amps
• Maximum DC Voltage: 24 volts
• Switching Mechanism: Other
• Terminal Type: Solder Terminals, Other

Description: Relay terminal block, with soldered-in miniature power relay, contacts (AgSnO): medium to large loads, 1 PDT, input voltage 24 V DC, for assembly on NS 35/7.5, terminal width 6.2 mm

• Input Current Range: 0.0090 amps
• Operating Temperature: 68 to 122 F

Description: Relay module, with soldered-in remanence miniature switching relay, with positive switching diode wiring, contacts (AgSnO): small to large loads, 1 PDT, 24 V DC input voltage

• DC Coil Voltage: 24 volts
• Maximum AC Switching Power: 1500 VA
• Operating Temperature: 104 to 122 F
• Pole Specifications: Single Pole (SP)

Description: Ag/Ni/Au, Pg/Ag, Solder Coated, Sn/Pb, 100% Sn. Features and Benefits Voltage ratings: 50, 100V Sizes: 0805, 1805, 1808, 1812, 1825, 2225 Capacitance Range: 10pF to 0.47uF Typical Applications Military Defense Aerospace

• Capacitance Range: 2.20E-4 microF
• Capacitance Tolerance: 10 (+/- %)
• DC Rated Voltage Range (WVDC): 100 volts
• Electrostatic Capacitors: Ceramic

Description: including Ag/Ni/Au, Pg/Ag, Solder Coated, Sn/Pb, 100% Sn. Features and Benefits Voltage ratings: 50, 100V Sizes: 0805, 1805, 1808, 1812, 1825, 2225 Capacitance Range: 10pF to 0.47uF Typical Applications Military Defense Aerospace

• Capacitance Range: 0.1000 microF
• Capacitance Tolerance: 10 (+/- %)
• DC Rated Voltage Range (WVDC): 50 volts
• Electrostatic Capacitors: Ceramic

Description: length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg(3.5%)Cu(1%) solder bumps for Wafer Level Chip Scale Package (WLCSP) applications.

• Actuator Type: Other
• Frequency Range: 1000 to 4000 MHz
• Insertion Loss: 0.5000 dB
• Isolation (Port to Port): 24 dB