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Supplier: HAVE, Inc.
Description: .6 30% GR (glass reinforced) Contacts: - female (3 pole): CuSn6 - female (4-7pole) & male: CuZn39Pb3 Contact surface: gal 2 â•¡m Ag or gal 0.2 â•¡m Au hard alloy over 2 â•¡m Ni Latch lock & spring: CK 67 steel, treated Environmental Temperature range: -30â-' C to + 80â-' C
- Connector Type: XLR Connector
- Gender: Female / Jack
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Supplier: HAVE, Inc.
Description: .6 30% GR (glass reinforced) Contacts: - female (3 pole): CuSn6 - female (4-7pole) & male: CuZn39Pb3 Contact surface: gal 2 â•¡m Ag or gal 0.2 â•¡m Au hard alloy over 2 â•¡m Ni Latch lock & spring: CK 67 steel, treated Environmental Temperature range: -30â-' C to + 80â-' C
- Connector Type: XLR Connector
- Gender: Male / Plug
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Supplier: HAVE, Inc.
Description: .6 30% GR (glass reinforced) Contacts: - female (3 pole): CuSn6 - female (4-7pole) & male: CuZn39Pb3 Contact surface: gal 2 â•¡m Ag or gal 0.2 â•¡m Au hard alloy over 2 â•¡m Ni Latch lock & spring: CK 67 steel, treated Environmental Temperature range: -30â-' C to + 80â-' C
- Connector Type: XLR Connector
- Gender: Male / Plug
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Supplier: HAVE, Inc.
Description: % GR (glass reinforced) Contacts: - female (3 pole): CuSn6 - female (4-7pole) & male: CuZn39Pb3 Contact surface: gal 2 â•¡m Ag or gal 0.2 â•¡m Au hard alloy over 2 â•¡m Ni Latch lock & spring: CK 67 steel, treated Environmental Temperature range: -30â-' C to + 80â-' C Flammability: UL
- Connector Type: XLR Connector
- Gender: Female / Jack
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Supplier: Ellsworth Adhesives
Description: Techspray Unfluxed Desoldering Braid is a copper, prefluxed braid that is used to remove excess solder from components. It is ideal for aqueous fluxes, applying your own flux, and has an anti-static spool. 10 ft.
- Form / Shape: Wire
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Supplier: Ellsworth Adhesives
Description: Techspray No-Clean Desoldering Braid Green is a copper, pre-fluxed wick that is used to remove excess solder from components and leaves no ionic flux residue. 1.9 mm wide, 10 ft long.
- Form / Shape: Wire
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Supplier: Ellsworth Adhesives
Description: Techspray ProWick Desoldering Braid Blue is a copper, pre-fluxed wick that is used to remove excess solder from components. 2.5 mm wide, 5 ft long.
- Form / Shape: Wire
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Supplier: Ellsworth Adhesives
Description: Techspray ProWick Desoldering Braid Blue is a copper, pre-fluxed wick that is used to remove excess solder from components. 2.5 mm wide, 100 ft long.
- Form / Shape: Wire
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Supplier: RS Components, Ltd.
Description: Soldering wire made from lead-free Sn99Cu0.7NiGe alloy on plastic reels. Flux core based on modified resin and organic activators. EL version with 3.5% flux, halogen-free, for general soldering. RA activated with 2.5% halogen content for repairing even oxidised soldering
- Form / Shape: Wire
- Melting Range: 441 F
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Supplier: RS Components, Ltd.
Description: Sn60 Pb40 alloy for use at high temperatures. Bar dimensions: 380 x 15 x 8 mm. High resistance to oxidation. For use in baths and crucibles. Percent Lead = 40% Product Form = Wire Melting Point = +183 - +190°C Percent Tin = 60%
- Alloy: Tin-Lead (Sn-Pb)
- Form / Shape: Wire
- Melting Range: 361 to 374 F
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Supplier: RS Components, Ltd.
Description: Lead free solder designed for hand soldering applications. 3% halide-activated non-corrosive rosin flux Wire Diameter = 1.22mm Product Form = Wire Melting Point = +227 - +240°C Percent Tin = 99% Flux Type = Rosin Product Weight = 500g Flux Content Percent = 3% Percent Copper = 0.45 -
- Form / Shape: Wire
- Melting Range: 441 to 464 F
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Supplier: RS Components, Ltd.
Description: No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. Wire Diameter = 0.35mm Product Form = Wire Melting Point = +217°C Percent Silver
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 F
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Supplier: Indium Corporation
Description: Very popular lead-free solder alloy. Alloy: 96.5Sn 3.0Ag 0.5Cu Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 220ºC Solidus Melting Temperature: 217ºC Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: ESAB Welding and Cutting Products
Description: Features Cadmium free, low temperature, food grade, solder for high strength on stainless steels, and dissimilar metals. Deposits closely match stainless, and stay bright after prolonged service. Use with All-State Duzall flux or All-state 430 flux.
- Alloy: Other
- Form / Shape: Wire
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C502 Cored Wire ) LOCTITE C 502 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. LOCTITE C 502 is also well suited for soldering applications requiring high melting temperature alloys. It is
- Alloy: Tin-Lead (Sn-Pb), Other
- Approvals / Conformance: Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: DigiKey
Description: Leaded Rosin Activated (RA) Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 24 AWG, 25 SWG Spool, 1 lb (454 g)
- Form / Shape: Wire
- Melting Range: 565 to 574 F
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two
- Alloy: Other
- Form / Shape: Wire
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste,
- Alloy: Tin-Lead (Sn-Pb)
- Approvals / Conformance: ASTM / UNS
- Conductivity: 5.86E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester 245 no clean flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +423 F. It's manufactured as a no clean flux core. Total composition for this no clean flux core lead-free solder wire is sn96.3/ag3.7.
- Approvals / Conformance: Other
- Form / Shape: Wire
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Supplier: Galco Industrial Electronics
Description: SOLDER,60/40RC,20AWG ,.032,1 LB
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidificati on
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Microstructure and interfacial reaction of Sn–Zn–x(Al,Ag) near-eutectic solders on Al and Cu substrates
The Sn – Zn – Al solder possessed the best wettability on both Cu and Al substrates among the four solders.
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Present status of Sn–Zn lead-free solders bearing alloying elements
K.L. Lin, T.P. Liu, High-temperature oxidation of a Sn – Zn – Al solder . Oxid. Met.
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Microstructures formed from mixed solders on copper substrate
To investigate possible microstructures resulting from such procedure, samples were prepared using small balls of four different Sn–Ag–Cu (SAC) Pb free solders, as well as Sn – Zn – Al solder , melted together with eutectic Pb–Sn solder paste and also various SAC …
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Development of Sn–Zn lead-free solders bearing alloying elements
While, for Sn – Zn – Al solder , Lin and Hsu [92] proposed the concept of ‘‘inherent barrier solder’’, the solder that provide a barrier function by itself after reflow, and thus, eliminates the need for a barrier layer.
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The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates
On the other hand, it was shown that the thin Cu-Al-Zn interfacial IMC layer formed between Cu and the Sn - Zn - Al solder acts as a diffusion barrier to retard the elemental interdiffusion between Cu and Sn and, thus, the …
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Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact
The Sn - Zn - Al solder system exhibits an eutectic tem- perature of around 199.7∞C.22 Al is expected to im- prove the high temperature oxidation resistance of .
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The adhesion strength of A lead-free solder hot-dipped on copper substrate
Eutectic Sn - Zn - Al solder alloy was used [composition: 91Sn-9(5Al-Zn)] to inves- tigate the effects of dipping parameters such as the temperature, rate and time dipping on the adhesion strength between solder and substrate using dimethylammonium chloride (DMAHCl) flux.
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A potential drop-in replacement for eutectic Sn-Pb solder—The Sn-Zn-Ag-Al-Ga solder
and corrosion behavior22 of Sn - Zn - Al solders have been investigated.
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The Electromigration Investigation on the Newly Developed Pb-free Sn-Zn-Ag-Al-Ga Solder Ball Interconnect
In a series of investigation, it was found that incorporation of eutectic Sn - Zn solder with Al , Ag, and Ga gives rise to an alloy which exhibits superior tensile as well as strain properties (5).