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Supplier: HAVE, Inc.
Description: Smallest available hard wiring large solder cups. TECHNICAL DATA Electrical Number of contacts: 3 - 7 (except MP: 3-6) Rated voltage: 250 V ac (3 - 6 pole) 125 V ac (7 pole) Contact resistance: < 5 m Insulation resistance - initial: > 2 G - after damp heat test: > 1 G -IEC 68-2-30) Dielectric
- Connector Type: Audio / Video Connector
- Gender: Male / Plug
- Features: XLR Connector
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Supplier: HAVE, Inc.
Description: Smallest available hard wiring large solder cups. TECHNICAL DATA Electrical Number of contacts: 3 - 7 (except MP: 3-6) Rated voltage: 250 V ac (3 - 6 pole) 125 V ac (7 pole) Contact resistance: < 5 m Insulation resistance - initial: > 2 G - after damp heat test: > 1 G -IEC 68-2-30) Dielectric
- Connector Type: Audio / Video Connector
- Gender: Male / Plug
- Features: XLR Connector
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Supplier: HAVE, Inc.
Description: Smallest available hard wiring large solder cups. TECHNICAL DATA Electrical Number of contacts: 3 - 7 (except MP: 3-6) Rated voltage: 250 V ac (3 - 6 pole) 125 V ac (7 pole) Contact resistance: < 5 m Insulation resistance - initial: > 2 G - after damp heat test: > 1 G -IEC 68-2-30) Dielectric
- Connector Type: Audio / Video Connector
- Gender: Male / Plug
- Features: XLR Connector
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Supplier: HAVE, Inc.
Description: Smallest available hard wiring large solder cups. TECHNICAL DATA Electrical Number of contacts: 3 - 7 (except MP: 3-6) Rated voltage: 250 V ac (3 - 6 pole) 125 V ac (7 pole) Contact resistance: < 5 m Insulation resistance - initial: > 2 G - after damp heat test: > 1 G -IEC 68-2-30) Dielectric
- Connector Type: Audio / Video Connector
- Gender: Female / Jack
- Features: XLR Connector
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Supplier: DigiKey
Description: Leaded No-Clean Wire Solder Sn60Pb40 (60/40) 30 AWG, 33 SWG Spool, 17.64 oz (500g)
- Melting Range: 361 to 374 F
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: RS Components, Ltd.
Description: Weller T0051386499 Lead Free Solder
- Diameter / Thickness: 0.01968505 inch
- Melting Range: 429.8 F
- Features: Other, Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
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Supplier: Ellsworth Adhesives
Description: Techspray ProWick Desoldering Braid White is a copper, pre-fluxed wick that is used to remove excess solder from components. 0.9 mm wide, 5 ft long.
- Features: Solid Wire
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Supplier: Ellsworth Adhesives
Description: Techspray No-Clean Desoldering Braid Green is a copper, pre-fluxed wick that is used to remove excess solder from components and leaves no ionic flux residue. 1.9 mm wide, 10 ft long.
- Features: Solid Wire
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Supplier: Ellsworth Adhesives
Description: Techspray ProWick Desoldering Braid Yellow is a copper, pre-fluxed wick that is used to remove excess solder from components. 1.4 mm wide, 5 ft long.
- Features: Solid Wire
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Supplier: Ellsworth Adhesives
Description: Techspray Unfluxed Desoldering Braid is a copper, prefluxed braid that is used to remove excess solder from components. It is ideal for aqueous fluxes, applying your own flux, and has an anti-static spool. 10 ft.
- Features: Solid Wire
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire, strip, paste, powder or
- Melting Range: 536 F
- Conductivity: 48,140,000,000 µS/cm
- Features: Gold Alloy Braze, Other, Solid Wire, Strip / Sheet / Foil
- Product Form: Paste, Powder, Preform
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester 245 lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +363 F. It's manufactured as an activated rosin flux core. Total composition for this lead solder wire is sn63/pb37.
- Features: Other, Solid Wire
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Supplier: Allied Electronics, Inc.
Description: M.G. Chemicals No Clean formula uses synthetically refined resin and an effective activator. Our No Clean formula wets and spreads like normal RA type flux and does not splatter. Features/Benefits: Meets J-STD-004 and QQ-S-571 No Clean Standard Flux Core Percentage at 2.2% Meeting Point 361°F/183°C
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Supplier: Indium Corporation
Description: Most widely used SnPb solder for electronics. Not recommended for soldering to gold thicker than 0.5 microns. Alloy: 63Sn 37Pb Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 183ºC Eutectic Solidus Melting Temperature: 183ºC Eutectic Pb-Free: No
- Diameter / Thickness: 0.3 inch
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Galco Industrial Electronics
Description: SOLDER,60/40RC,20AWG,.032,1 LB
- Features: Solid Wire
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Supplier: ESAB Welding and Cutting Products
Description: Features Cadmium free, low temperature, food grade, solder for high strength on stainless steels, and dissimilar metals. Deposits closely match stainless, and stay bright after prolonged service. Use with All-State Duzall flux or All-state 430 flux.
- Features: Other, Solid Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidification
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C502 Cored Wire ) LOCTITE C 502 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. LOCTITE C 502 is also well suited for soldering applications requiring high melting temperature alloys. It is availalble in several
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more
- Features: Solid Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester 48 activated rosin flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +792 F. It's manufactured as an activated rosin flux core. Total composition for this activated rosin flux core lead-free solder wire is
- Features: Other, Solid Wire
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Supplier: Allied Electronics, Inc.
Description: For the fastest wicking action, rosin flux coated braid is ideal for high volume PCB production/repair environments. Features Pure Copper Braid Fine Braid Construction Enhances Wicking Action Mildest Non-Activated White Rosin Flux Ensures Safe, Clean Operation Meets MIL-F-142560D Type R NASA NNB
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more
- Features: Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb)
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Supplier: Indium Corporation
Description: Solder wire from Indium Corporation is manufactured to demanding quality standards. Our flexible manufacturing process allows us to fulfill orders from evaluation and research quantities to full-scale production volumes.
- Diameter / Thickness: 0.001 to 0.25 inch
- Solder Alloy: Indium (In), Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: Galco Industrial Electronics
Description: SOLDER, 1LB, 63/37, 21AWG, 44 RESIN
- Features: Solid Wire
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Supplier: Allied Electronics, Inc.
Description: KESTER 44 ROSIN CORE SOLDER, ALLOY-40/60, .062'
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester 44 lead solder wire is another quality product from Kester. Melting point is reached at a temperature of +682 F. It's manufactured as an activated rosin flux core. Total composition for this lead solder wire is sn40/pb60.
- Features: Other, Solid Wire
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Supplier: Indium Corporation
Description: Indium Corporation is the leading global supplier of commercial indium, high purity indium, indium fabrications, alloys, and chemicals. Indium metal is extracted from indium-bearing ore and is refined to various grades in high volume utilizing state of the art SPC controlled refining technologies.
- Solder Alloy: Indium (In)
- Product Form: Paste, Preform
- Features: Solid Wire, Strip / Sheet / Foil, Tubular Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp melting/solidification
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
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Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a process in which two or more
- Features: Other, Solid Wire
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Supplier: Galco Industrial Electronics
Description: Solder Wire, 63/37 Tin/Lead, No
- Features: Solid Wire
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C400 Flux Cored Wire ) LOCTITE C 400 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. Multicore C400 wires provide fast soldering on copper, brass and solder coated materials. It is availalble in several
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester 275 no clean flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of +700 F. It's manufactured as a no clean flux core. Total composition for this no clean flux core lead-free solder wire is sn96.5/ag03/cu0.5.
- Features: Other, Solid Wire
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Supplier: Allied Electronics, Inc.
Description: The cleanest No-Clean braid in the industry. The proprietary flux formula is specially designed to avoid catastrophic and latent PCB failures caused by ionic flux residue. Features Cleanest in the Industry Removes Up to Four Times More Solder Residue Halide Free and Non-Conductive Does Not
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore C511 ) LOCTITE C 511 cored solder wire has been specially formulated to compliment no clean wave and reflow soldering processes. It is available in several tin/lead alloys as well as Lead Free. It is available with Sn63, Sn62, Sn60, 96SC (SAC387), 97SC (SAC305) , 99C
- Solder Alloy: Lead Free, Tin-Lead (Sn-Pb)
- Features: Other, Solid Wire
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Supplier: Techsil Limited
Description: specifications. This solder provides a great alternative to leaded solders. It achieves a consistent solder and flux percentage through a state-of-the-art extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency,
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Lead Free
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Microstructure and interfacial reaction of Sn–Zn–x(Al,Ag) near-eutectic solders on Al and Cu substrates
The Sn – Zn – Al solder possessed the best wettability on both Cu and Al substrates among the four solders.
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Present status of Sn–Zn lead-free solders bearing alloying elements
K.L. Lin, T.P. Liu, High-temperature oxidation of a Sn – Zn – Al solder . Oxid. Met.
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Microstructures formed from mixed solders on copper substrate
To investigate possible microstructures resulting from such procedure, samples were prepared using small balls of four different Sn–Ag–Cu (SAC) Pb free solders, as well as Sn – Zn – Al solder , melted together with eutectic Pb–Sn solder paste and also various SAC …
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Development of Sn–Zn lead-free solders bearing alloying elements
While, for Sn – Zn – Al solder , Lin and Hsu [92] proposed the concept of ‘‘inherent barrier solder’’, the solder that provide a barrier function by itself after reflow, and thus, eliminates the need for a barrier layer.
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The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates
On the other hand, it was shown that the thin Cu-Al-Zn interfacial IMC layer formed between Cu and the Sn - Zn - Al solder acts as a diffusion barrier to retard the elemental interdiffusion between Cu and Sn and, thus, the …
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Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact
The Sn - Zn - Al solder system exhibits an eutectic tem- perature of around 199.7∞C.22 Al is expected to im- prove the high temperature oxidation resistance of .
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The adhesion strength of A lead-free solder hot-dipped on copper substrate
Eutectic Sn - Zn - Al solder alloy was used [composition: 91Sn-9(5Al-Zn)] to inves- tigate the effects of dipping parameters such as the temperature, rate and time dipping on the adhesion strength between solder and substrate using dimethylammonium chloride (DMAHCl) flux.
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A potential drop-in replacement for eutectic Sn-Pb solder—The Sn-Zn-Ag-Al-Ga solder
and corrosion behavior22 of Sn - Zn - Al solders have been investigated.
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The Electromigration Investigation on the Newly Developed Pb-free Sn-Zn-Ag-Al-Ga Solder Ball Interconnect
In a series of investigation, it was found that incorporation of eutectic Sn - Zn solder with Al , Ag, and Ga gives rise to an alloy which exhibits superior tensile as well as strain properties (5).