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  • M538: Surface Mounting Instructions - Footprint Guidelines
    and will also allow for just enough excess surface area for adequate solder filleting. The following recommended footprints are suggested guidelines only and may require ground plane modifications for electrical and/or thermal considerations. When an increase in ground plane size is necessary, solder mask
  • SMT Adhesive Dispensing (.pdf)
    The adhesive dispensing process, can be defined as the process of transferring adhesive onto the PCB solder mask in a position suitable for holding the later placed components until the PCB is wave soldered. In some cases, this process is also used to hold heavy components in the second pass
  • HumiSeal (R) 1B31S (.pdf)
    1B31S is a modified version of 1B31 with improved adhesion to solder masks. 1B31S is a fast air drying, single component, acrylic coating providing excellent moisture and environmental protection for printed circuit assemblies. The final film demonstrates excellent flexibility and is easily
  • Guide To Different Types of PCB Assembly Processes
    Printed circuit boards are found in just about anything electronic, from industrial manufacturing equipment to vehicles, to children's toys. Made from fiberglass, metal components, epoxy, and a green solder mask, PCBs are essential to a plethora of applications. And while many people know a PCB
  • S2083: Surface Mounting Instructions for PQFN Packages
    . With the correct pad geometry, the package will self-align when subjected to a solder reflow process and will also allow for just enough excess surface area for adequate solder filleting. The solder mask should be applied over bare copper (SMOBC) to avoid solder reflow under the solder mask
  • The Effect of Thermal Pad Patterning on QFN Voiding
    Voiding under QFNs is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips. Venting accessibility is defined as the perimeter length per unit area of the metal pad. Regardless