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Supplier: Materion Corporation
Description: Materion Microelectronics & Services’ collection of innovative engineered materials increases manufacturing yields extends target life and offers the lowest overall cost of ownership. Materion Microelectronics & Services employs a wide range of manufacturing options to meet the needs of
- Type: CVD / Chemical Precursor, Sputtering Target
- Features: Specialty / Other
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Supplier: Materion Corporation
Description: Materion Microelectronics & Services is the only sputtering target manufacturer to fully embrace both vacuum casting and powder metallurgy technologies for metallic and non-metallic sputtering materials.
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Supplier: Plansee SE
Description: important to us? Impurities in sputtering targets impair the conductivity of the material. Particles of chromium, manganese, magnesium, silicon, iron and tin are particularly critical. But there's no cause for alarm: Any residual impurities are minimal. They are present only in
- Type: Sputtering Target
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Supplier: Plansee SE
Description: cells. But how to produce molybdenum thin films? In the magnetron sputtering method tiny metal particles are vaporized from the sputtering targets and are then deposited as a thin film on the glass substrate. In this fast, economical coating process, all the materials must meet
- Type: Sputtering Target
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Supplier: Plansee SE
Description: and gaseous impurities in the sputtering target are reproduced almost 1:1 in the sputtered functional layer and result in particle formation during the PVD process (arcing effect). Sputtering targets made from high-purity materials are therefore required for the coating process.
- Type: Sputtering Target
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Supplier: Plansee SE
Description: quality of the obtained image. Totally pure. Impurities in the sputtering targets impair the electrical conductivity of the material. Impurities in the form of titanium, phosphorous, calcium, iron, chromium and selenium are particularly critical. These metals are present in tiny
- Type: Sputtering Target
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Supplier: Umicore Metal Deposition Solutions
Description: Specifications Material Type Metals Material Ta Purity 4N
- Purity: 99.99 %
- Material: Metal
- Features: Specialty / Other
- Type: Sputtering Target
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Supplier: Umicore Metal Deposition Solutions
Description: Specifications Material Type Metals Material Nb Purity 3N
- Purity: 99.9 %
- Material: Metal
- Features: Specialty / Other
- Type: Sputtering Target
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Supplier: Umicore Metal Deposition Solutions
Description: Specifications Material Type non-metals Material Si Purity 6N
- Purity: 99.9999 %
- Material: Silicon
- Features: Specialty / Other
- Type: Sputtering Target
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Supplier: Umicore Metal Deposition Solutions
Description: Specifications Material Type Metals Material Zn Purity 3N
- Purity: 99.9 %
- Material: Metal
- Features: Specialty / Other
- Type: Sputtering Target
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Supplier: Deposition Sciences, Inc.
Description: MicroDyn sputtering process is that more than one sputtering target can be active at once. Co-sputtering two materials (a high index and low index) simultaneously allows the creation of a mixed layer with a controllable intermediate index. This extra degree of freedom
- Functional / Performance: Abrasion Resistant, Antireflective, Chemical Resistant, Dielectric, Heat Resistant / High Temperature, Reflective
- Industry: Aerospace, Automotive, Electronics, Government, Medical / Healthcare, Military Specification, OEM / Industrial
- Materials: Aluminum, Metal, Nickel / Nickel Alloys, Precious Metals, Titanium
- Capabilities: Hard Coating / Treatment, Material Selection / Design Assistance, Physical Vapor Deposition (PVD), Plasma Etching / Cleaning, Research & Development
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Supplier: Indium Corporation
Description: Sputtering Targets can be used in a variety of applications: CIS/CIGS Indium Sputtering Targets are commonly used with CuGa Sputtering Targets to co-deposit copper, indium, and gallium in combination with sulfur/selenium to form the active layer on CIS/ CIGS thin-film solar
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Supplier: Saint-Gobain Coating Solutions
Description: Saint-Gobain Coating Solutions applies its vast knowledge of materials technology to produce a range of high-quality rotatable sputtering targets for architectural glass, automotive glass, smart windows, PV-thin film, Flat Panel Display, web coating, coatings on polymer films. The
- Purity: 99.97 %
- Electrical Resistivity: 7.5 ohm-cm
- Material Density (Theoretical): 9.349994098962004 g/cc
- Thickness: 18 mm
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Supplier: Umicore Materials
Description: Specifications Material Type Metals Material Zn Purity 3N
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Supplier: Umicore Materials
Description: Specifications Material Type Metals Material Ti Purity 3N
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Supplier: Umicore Materials
Description: Specifications Material Type Metals Material Al Purity 5N
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Supplier: Umicore Materials
Description: Specifications Material Type Precious metals Material Ag Purity 4N
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Supplier: Indium Corporation
Description: Benefits Simple Efficient Customizable High throughput Simply Efficient Indium Corporation’s OnSpec CIG alloy sputtering targets, made from copper (Cu), indium (In), and gallium (Ga), are used to produce high-effi ciency CIGS (Cu/In/Ga/di-selenide) solar cells. CIG targets offer tight control
- Width / O.D.: 50.38 to 381.00000000000006 mm
- Length: 304.8 to 1,651.0000000000002 mm
- Thickness: 3.1750000000000003 to 12.700000000000001 mm
- Applications: Electronics / Microelectronics
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Supplier: Accuris
Description: Surface Chemical Analysis - Sputter Depth Profiling - Optimization Using Layered Systems as Reference Materials
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Description: Surface chemical analysis -- Sputter depth profiling -- Optimization using layered systems as reference materials
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Supplier: Accuris
Description: Surface chemical analysis - Sputter depth profiling - Optimization using layered systems as reference materials
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Supplier: Indium Corporation
Description: NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lowering capital expenditures.
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Supplier: Denton Vacuum
Description: The Discovery® series represents Denton Vacuum's offerings in pilot-scale sputtering systems. Utilizing a unique orientation of the sample to the sputtering sources, Discovery® systems can process relatively large samples and achieve remarkable thickness uniformity using small ion beam
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Supplier: CSA Group
Description: ISO 14606:2015 gives guidance on the optimization of sputter-depth profiling parameters using appropriate single-layered and multilayered reference materials in order to achieve optimum depth resolution as a function of instrument settings in Auger electron spectroscopy, X-ray photoelectron
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Supplier: Nikon Metrology
Description: automated vacuum and sputtering. Insert your samples, turn the unit on and select the sputtering time. The chamber will evacuate and sputtering will begin automatically. When the unit is powered down, it vents to atmosphere. Thickness of the coating is influenced by distance
- Maximum Part Diameter / Width: 49.50000000000001 mm
- Type: Batch System (Single Chamber / Multiple Wafers), Laboratory / Benchtop
- Materials Processed: Metal
- Process: Physical Vapor Deposition (PVD)
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Supplier: Gems Sensors & Controls
Description: stability and other performance specifications are achieved by using a sputtered sensing element, which achieves a molecular fusion of a strain gauge material, an insulating material, and the 17-4 PH ss sensing element. Sputtered or thin film technology provides years of worry free
- Working Pressure Range: 10 to 10,000 psi
- Accuracy: 0.1 ±% FS
- Operating Temperature: -22 to 212 F
- Measurement Type: Absolute, Gauge, Sealed
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Description: Hexoloy SG, a variant of silicon carbide containing graphitic carbon, is electrically conductive and can be readily DC magnetron sputtered. Silicon carbide thin film coatings are optically transparent, abrasion and corrosion resistant, temperature stable, and have excellent adhesion on a variety of
- Electrical Resistivity: 1 ohm-cm
- Features: Conductive, Other, Specialty / Other, Transparent
- Applications: Decorative / Shielding, Magnetic Storage, Optical Coatings
- Type: Sputtering Target
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Supplier: Quorum Technologies
Description: features * Metal sputtering or carbon evaporation, or both - can be combined in one space-saving design * Fine grain sputtering for advanced high resolution FE-SEM applications * High vacuum turbo pumping - allows sputtering of a wide range of oxidising and non-oxidising metals
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Supplier: Quorum Technologies
Description: The Q150R is a compact rotary-pumped coating system suitable for SEM sputtering with noble metals - eg gold (Au), gold/palladium (Au/Pd) and platinum (Pt) - and for carbon coating SEM specimens for EDS and WDS. The Q150R is available in three formats: *Q150R S - a compact rotary-pumped
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Supplier: Deposition Sciences, Inc.
Description: PROCESS DESCRIPTION DSI has been producing complex functional thin film coatings on a variety of flexible substrates for over twenty years. Materials include metals, dielectrics, and multilayer optical coatings. DSI’s core enabling technology is an internally-developed batch coating process
- Industry: Aerospace, Automotive, Government, Medical / Healthcare, OEM / Industrial
- Materials: Aluminum, Metal, Precious Metals
- Functional / Performance: Antireflective, Dielectric, Protective, Reflective
- Capabilities: Chemical Vapor Deposition (CVD)
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Supplier: Quorum Technologies
Description: sputtering deposition over a large diameter. Chromium (Cr) targets are fitted as standard. NB: For sputtering non-oxidising metals only, see the Q300R T Triple Target, Large Chamber, Rotary-Pumped Sputter Coater. For sequential sputtering of two different oxidising or
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Supplier: ASTM International
Description: 1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.
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Supplier: ASTM International
Description: This specification covers sputtering targets fabricated from chromium metal for use in thin film applications. The grades of chromium covered in this specification, are based on the total metallic impurity content of the metallic elements, and are classified as 4N, 3N7, 3N5, 3N, and 2N8.
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shapes through processes such as laser cutting, which are suitable for various metallization processes. Key Features and Benefits: Conduct strict quality control from raw materials to finished products to ensure uniform quality; (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
Thick film is the thickness of the conductor layer of the Ceramic PCB. Generally speaking, the thickness should be over 10um(micrometers) at least, ranging between 10- 13um. It is thicker than the sputtering technology used in thin film ceramic PCB, but the (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
standard for thin-film substrates is 99.6% alumina, which is frequently utilized for sputtering, evaporation, and chemical vapor deposition of metals to create circuits. The material is smoother and has fewer surface flaws thanks to the high purity of 99.6% alumina and the smaller grain size (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
produces 5 grades of boron nitride ceramic, BN-1700, BN-2000, BN-2300, BN-2800 and BN-3000. BN-2000 99% purity boron nitride, it’s the most common used hot-pressed BN material. It’s (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Thin-film resistors, on the other hand, are produced by depositing a very thin layer of resistive material, typically through sputtering or evaporation, onto a ceramic substrate. This layer is much thinner than that of thick-film resistors, resulting in components with higher precision, stability, and (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Silicon Carbide - excellent for high temperature applications Different grades of silicon carbide offer high thermal/electrical conductivity well beyond other ceramic materials. Silicon Carbide is industrially (read more)
Browse Ultra-hard Materials Machining Datasheets for Insaco, Inc. -
wafer carrier, is called pocket wafer in English. It is widely used in CVD and vacuum sputtering of semiconductors. We can provide customers with customized wafer carriers of silicon and silicon carbide materials to meet customers' different application needs. It can provide bearing plates (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
between 1×10 -5 cc/sec He to 1×10 -8 cc/sec He. E-Beam / Crystal Sensor Feedthroughs We offer single pin high amperage designs so you can place a large amount of energy into your source material for your Thermal Evaporation process, or you can choose from a variety of multipins for (read more)
Browse Feedthroughs Datasheets for MPF Products, INC. -
These state-of-the-art Semiconductor Electrostatic Chucks (ESCs) deliver exceptional clamping uniformity and stability. Engineered with high-purity ceramic materials (AlN/Al2O3), they provide reliable performance across ultra-high vacuum and high (read more)
Browse Oxide Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
tolerances. Material Specifications Alumina Ceramic (Al2O3 99.5%) - Flexural strength: >= 330 MPa - Vickers hardness: >= 1600 HV - Thermal expansion: 8 ppm/C - Electrical resistivity: > 10^14 ohm.cm Silicon Carbide Ceramic (SiC 99 (read more)
Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd.
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Thin Film Materials Technology: Sputtering of Compound Materials
Thin Film Materials Technology: Sputtering of Compound Materials. Rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, this invaluable resource explains sputter deposition technology in thin film production applications.
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Partial Pressure Control in Reactive Sputtering (.pdf)
Reactive Sputtering is used to produce functional coatings having properties that are suitable for a range of applications such as decorative, wear resistant, optical and magnetic thin films. In Reactive Sputtering a target material (e.g. titanium or aluminium) is sputtered in the presence
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Advances in Precision Positioning Stage Design-Optimized Outgassing and Motion Performance in Ultra-High Vacuum Applications
Many processes in advanced research and industrial manufacturing can only be performed in a vacuum, such as thin-film sputtering and ion milling, and technologies formerly reserved for exotic materials processing are seeing application in new fields.
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Market Trend Of Thin Film Ceramic Substrates
Substrates made of thin-film ceramic are also referred to as semiconductor materials. It is made up of a number of thin layers that have been built up utilizing vacuum coating, deposition, or sputtering methods. Glass sheets with a thickness of less than one millimeter that is two-dimensional (flat
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Advanced Materials Co. Ltd. The move could propel Korea into the polysilicon materials market for use in making silicon wafers and solar cells, according to sources. Pall files suit against Entegris Pall Corp. has filed a patent infringement suit today in the U.S. District Court for the Eastern
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Korea eyes entry into polysilicon South Korean chemicals giant DC Chemical Co. Ltd. has acquired a majority stake in Sodiff Advanced Materials Co. Ltd. The move could propel Korea into the polysilicon materials market for use in making silicon wafers and solar cells, according to sources. Pall
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Reactive Sputter Deposition
At steady state, the sum of the sputtered material (metal atoms and compound molecules) and the reactions with deposited film metal atoms balances so that the substrate surface concentration Θc does not change.
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Sputtering by Particle Bombardment
c) Collection of sputtered material .
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Introduction to Focused Ion Beams
Sputtered material and backsputtered ions may therefore deposit on surfaces that are in close proximity to the active milling site (e.g., the sidewalls of a deep narrow trench).
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Electrical And Optical Properties Of Sputter-Deposited Materials
the sputtered material was actually an oxide, and deposition rates were typical of those for insulators.
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Handbook of Manufacturing Engineering and Technology
sputtered material from substrate .
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EUV Sources for Lithography
There is nothing to prevent relocation of this surface to a greater distance than the 45 mm of this experiment, and/or replacement with a lower- sputter material .
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Springer Handbook of Electronic and Photonic Materials
In glow discharge optical emission spectroscopy (GDOES) a high-pressure glow discharge is used to sputter material from the surface of a sam- ple, and this sputtered material is detected by the optical emissions it produces in the glow discharge.
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Beam Effects, Surface Topography, and Depth Profiling in Surface Analysis
Redeposition (Section 2) of sputtered material occurs and complicates the analysis when it occurs on the surface being analyzed.
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Proceedings of the workshop on sputtering caused by plasma (neutral beam) surface interaction
Present codes give a crude estimate of the actual production of sputtered materials but are potentially useful for surveying the wide variety of materials which have been used or proposed for use in tokamaks.
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Ion sputtering and its biomedical applications. Theoretical concepts and practical consequences. Clinical implications and potential use
Lastly, it is worth noting some derivative effects, such as: redeposition of sput- tered material , changes of surface temperature, etc.