Products & Services
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Supplier: Materion Corporation
Description: Materion Microelectronics & Services’ collection of innovative engineered materials increases manufacturing yields extends target life and offers the lowest overall cost of ownership. Materion Microelectronics & Services employs a wide range of manufacturing options to meet the needs of
- Materials Processed: Specialty / Other
- Type: CVD / Chemical Precursor, Sputtering Target
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Supplier: Deposition Sciences, Inc.
Description: to be coated are held on a cylindrical rotating drum concentric within the chamber. Unlike other optical coating methods, sputtering does not require heating the coated parts. This allows the technique to be used on a wide range of substrate materials, as well as on assemblies that may
- Functional / Performance: Abrasion Resistant, Antireflective, Chemical Resistant, Dielectric, Heat Resistant / High Temperature, Reflective
- Hard Coating / Treatment: Yes
- Industry: Aerospace, Automotive, Electronics, Government, Medical / Healthcare, Military Specification, OEM / Industrial, Other
- Material / Substrate Capabilities: Aluminum, Metal, Nickel / Nickel Alloys, Precious Metals, Titanium, Specialty / Other
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Supplier: Materion Corporation
Description: Materion Microelectronics & Services is the only sputtering target manufacturer to fully embrace both vacuum casting and powder metallurgy technologies for metallic and non-metallic sputtering materials.
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Supplier: Saint-Gobain Coating Solutions
Description: Saint-Gobain Coating Solutions applies its vast knowledge of materials technology to produce a range of high-quality rotatable sputtering targets for architectural glass, automotive glass, smart windows, PV-thin film, Flat Panel Display, web coating, coatings on polymer films. The
- Applications: Other
- Electrical Resistivity: 7.5 ohm-cm
- Material Density (Theoretical): 9.35 g/cc
- Materials Processed: Barrier / Refractory Metal (W, Mo, Ti,, Molybdenum, Oxides, Silicon, Silicide (MoSi2), Tungsten, Specialty / Other
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Supplier: Plansee SE
Description: best. Why is that so important to us? Impurities in sputtering targets impair the conductivity of the material. Particles of chromium, manganese, magnesium, silicon, iron and tin are particularly critical. But there's no cause for alarm: Any residual impurities are minimal. They are
- Type: Sputtering Target
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Supplier: Plansee SE
Description: . High material purity. Metallic and gaseous impurities in the sputtering target are reproduced almost 1:1 in the sputtered functional layer and result in particle formation during the PVD process (arcing effect). Sputtering targets made from high-purity materials
- Type: Sputtering Target
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Supplier: Plansee SE
Description: materials must meet the highest quality criteria. You can rely on our molybdenum sputtering targets. There's none cleaner. No targets are cleaner than ours. The most important benefits: your films possess an outstanding level of electrical conductivity and minimized particle
- Type: Sputtering Target
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Supplier: Plansee SE
Description: therefore determines the quality of the obtained image. Totally pure. Impurities in the sputtering targets impair the electrical conductivity of the material. Impurities in the form of titanium, phosphorous, calcium, iron, chromium and selenium are particularly critical. These metals
- Type: Sputtering Target
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Supplier: Umicore Metal Deposition Solutions
Description: Specifications Material Type Metals Material Ta Purity 4N
- Materials Processed: Metal, Specialty / Other
- Purity: 99.99 %
- Type: Sputtering Target
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Supplier: Umicore Metal Deposition Solutions
Description: Specifications Material Type non-metals Material Si Purity 6N
- Materials Processed: Silicon, Specialty / Other
- Purity: 100 %
- Type: Sputtering Target
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Supplier: Umicore Metal Deposition Solutions
Description: Specifications Material Type non-metals Material Ge Purity 5N
- Materials Processed: Germanium, Specialty / Other
- Purity: 100 %
- Type: Sputtering Target
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Supplier: Umicore Metal Deposition Solutions
Description: Specifications Material Type Metals Material Ta Purity 3N
- Materials Processed: Metal, Specialty / Other
- Purity: 99.9 %
- Type: Sputtering Target
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Supplier: Nikon Metrology
Description: Thin film conductive coatings are effective in eliminating charging with non-conductive materials or enhancing secondary electron emission. JEOL’s Smart Coater is a fully automated sputter coater that applies a fine grained gold or platinum (option) coating on samples for imaging in a
- Applications & Materials Processed: Research / Surface Analysis
- Coating System Type: Batch System (Single Chamber / Multiple Wafers), Laboratory / Benchtop
- Materials Processed (Deposit or Substrate): Metal
- Maximum Part Diameter / Width: 49.5 mm
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Supplier: Gems Sensors & Controls
Description: with turndown capabilities. Exceptional levels of stability and other performance specifications are achieved by using a sputtered sensing element, which achieves a molecular fusion of a strain gauge material, an insulating material, and the 17-4 PH ss sensing element.
- Accuracy: 0.1000 ±% FS
- Electrical Output: Analog Current
- Features: Intrinsically Safe, Temperature Compensation, Submersible
- Media: Liquid
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Supplier: Indium Corporation
Description: Indium Corporation’s Indium (In) Sputtering Targets offer tight control of the final thin-film composition. This is due to our unique manufacturing process that results in a fine grain monolithic material. Impurity levels are controlled before and during the manufacturing process
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Supplier: Indium Corporation
Description: Benefits Simple Efficient Customizable High throughput Simply Efficient Indium Corporation’s OnSpec CIG alloy sputtering targets, made from copper (Cu), indium (In), and gallium (Ga), are used to produce high-effi ciency CIGS (Cu
- Applications: Electronics / Microelectronics
- Length: 305 to 1651 mm
- Materials Processed: Specialty / Other
- Thickness: 3.18 to 12.7 mm
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Description: Surface chemical analysis -- Sputter depth profiling -- Optimization using layered systems as reference materials
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Supplier: Denton Vacuum
Description: The Discovery® series represents Denton Vacuum's offerings in pilot-scale sputtering systems. Utilizing a unique orientation of the sample to the sputtering sources, Discovery® systems can process relatively large samples and achieve remarkable thickness uniformity using small ion
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Supplier: Deposition Sciences, Inc.
Description: PROCESS DESCRIPTION DSI has been producing complex functional thin film coatings on a variety of flexible substrates for over twenty years. Materials include metals, dielectrics, and multilayer optical coatings. DSI’s core enabling technology is an internally
- Additional Services / Processes: Material Selection / Design Assistance
- Coating Process: Thin Film Coating
- Finishing / Surface Treatment: Mirror Finishing
- Functional / Performance: Antireflective, Dielectric, Protective, Reflective
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Supplier: Indium Corporation
Description: NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lowering capital expenditures.
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Supplier: Denton Vacuum
Description: The Phoenix 400 inline series represents one of Denton Vacuum's offerings for research, pilot-scale as well as continuous production sputtering systems. Utilizing a unique transport system for the substrate carriers, a Phoenix 400 in line system can process multiple substrates and achieve
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Description: Hexoloy SG, a variant of silicon carbide containing graphitic carbon, is electrically conductive and can be readily DC magnetron sputtered. Silicon carbide thin film coatings are optically transparent, abrasion and corrosion resistant, temperature stable, and have excellent adhesion on a
- Applications: Decorative / Shielding, Magnetic Storage, Optical Coatings, Other
- Applications & Features: Conductive, Transparent
- Electrical Resistivity: 1 ohm-cm
- Materials Processed: Specialty / Other
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Supplier: Accuris
Description: Surface chemical analysis - Sputter depth profiling - Optimization using layered systems as reference materials
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Supplier: CSA Group
Description: ISO 14606:2015 gives guidance on the optimization of sputter-depth profiling parameters using appropriate single-layered and multilayered reference materials in order to achieve optimum depth resolution as a function of instrument settings in Auger electron spectroscopy, X-ray
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Supplier: Quorum Technologies
Description: The Q150R is a compact rotary-pumped coating system suitable for SEM sputtering with noble metals - eg gold (Au), gold/palladium (Au/Pd) and platinum (Pt) - and for carbon coating SEM specimens for EDS and WDS. The Q150R is available in three formats: *Q150R S - a compact rotary
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Supplier: ASTM International
Description: This specification covers sputtering targets fabricated from chromium metal for use in thin film applications. The grades of chromium covered in this specification, are based on the total metallic impurity content of the metallic elements, and are classified as 4N, 3N7, 3N5, 3N, and 2N8
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Description: We have core strength in vacuum deposition via sputtering ad thermal evaporation. Our materials are used for numerous applications, including passive thermal control for satellites and launch vehicles, thermal insulation for F1 racing cars and fire suits, and robust materials
- Features: Flame Retardant (e.g. UL 94 Rated), Laminating / Composites, Thermal / Heat Insulating
- Industry: Aerospace, Automotive, Electronics, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial
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Supplier: Materion Corporation
Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive Compound, Leveling / Filling Compound
- Industry: Electronics
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Supplier: Rhenium Alloys, Inc.
Description: Rhenium Alloys is uniquely able to convert ammonium perrhenate - or virtually any form of rhenium-bearing material - into pellets. Pellets (Rhenium Melting Stock) ... offered in two purity grades, 99.99% and 99.9% pure on a metals basis. Can be tailored to meet any specification
- Applications: Electronics / Microelectronics
- Bulk Solid (Powder, Granule, Lumps, etc.): Yes
- Materials Processed: Barrier / Refractory Metal (W, Mo, Ti,
- Type: Evaporation Material, Sputtering Target
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Description: Analytical Instrument Accessories - Low metallic impurities (<5 ppm total metallic ash) make Pyrolytic Graphite ideal material for manufacturing atomic absorption spectrograph planchettes, crucibles for plasma vaporization, and sputter-coating scanning electron microscope samples
- Capabilities: Chemical Testing Services
- Industry Applications: Aerospace / Aviation, Chemical / Material Processing, Cleanroom, Military, Semiconductors / Electronics, Specialty / Other
- Materials: Ceramics / Glass, Chemicals, Composites, Nanomaterials
- Regional Preference: North America, United States Only, Northeast US Only
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Supplier: LG Chemical of America Inc.
Description: Touch Materials Key material for touch panels To make an ITO (Indium Tin Oxide) film, indium and tin are sputtered and deposited on a base film(PET or COP etc). ITO film is a key material for a touch panel. Product Classification Category
- Enhancement / Function: Electrically Conductive
- Features: ITO
- Film Material: PET / Polyester
- Thickness: 9.06E-4 to 0.0071 inches
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Supplier: Materion Corporation
Description: Silvertech PT-1™ is a two-component, Silver-filled conductive epoxy proven to work exceptionally well for the specific needs of the sputtering target industry. Designed to replace metallic solder bonding where high operating temperatures are a concern, or where metallic solder may be
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive
- Industry: Electronics
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Description: Qnnect, formerly Hermetic Solutions Group manufactures precious metal evaporation pellets and sputter targets for the thin film coating industry. These products are used to coat dies, components, glass and other electronic materials.
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Supplier: Henkel Corporation - Electronics
Description: Effectiveness (SE). Furthermore, this technology is simple allowing easy production scalability and design flexibility with minimal cost of ownership using spray-coating compared to other costly methods such as PVD/sputtering. Advantages of Spraying with Henkel Material Key
- Coating Type: Electrically Conductive, EMI / RFI Shielding Material
- Cure Type / Technology: Single Component System
- Industry Applications: Electronics (PCB / SMT Assembly)
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Supplier: San Jose Delta Associates, Inc.
Description: : metalized parts can be soldered together and brazing has proven an effective method of joining the material to various metals; epoxy produces a strong joint, and a sealing glass creates a vacuum tight seal. Even a straight-forward mechanical joint is possible. It can be thick film metalized
- Applications: Refractory / High Temperature Materials
- Coeff. of Thermal Expansion (CTE): 93 µm/m-C
- Density: 2.52 g/cc
- Dielectric Constant (Relative Permittivity): 5.67 to 6.03 #
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shapes through processes such as laser cutting, which are suitable for various metallization processes. Key Features and Benefits: Conduct strict quality control from raw materials to finished products to ensure uniform quality; (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD. -
Thick film is the thickness of the conductor layer of the Ceramic PCB. Generally speaking, the thickness should be over 10um(micrometers) at least, ranging between 10- 13um. It is thicker than the sputtering technology used in thin film ceramic PCB, but the (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
standard for thin-film substrates is 99.6% alumina, which is frequently utilized for sputtering, evaporation, and chemical vapor deposition of metals to create circuits. The material is smoother and has fewer surface flaws thanks to the high purity of 99.6% alumina and the smaller grain size (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
produces 5 grades of boron nitride ceramic, BN-1700, BN-2000, BN-2300, BN-2800 and BN-3000. BN-2000 99% purity boron nitride, it’s the most common used hot-pressed BN material. It’s (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Thin-film resistors, on the other hand, are produced by depositing a very thin layer of resistive material, typically through sputtering or evaporation, onto a ceramic substrate. This layer is much thinner than that of thick-film resistors, resulting in components with higher precision, stability, and (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Silicon Carbide - excellent for high temperature applications Different grades of silicon carbide offer high thermal/electrical conductivity well beyond other ceramic materials. Silicon Carbide is industrially (read more)
Browse Ultra-hard Materials Machining Datasheets for Insaco, Inc. -
wafer carrier, is called pocket wafer in English. It is widely used in CVD and vacuum sputtering of semiconductors. We can provide customers with customized wafer carriers of silicon and silicon carbide materials to meet customers' different application needs. It can provide bearing plates (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
between 1×10 -5 cc/sec He to 1×10 -8 cc/sec He. E-Beam / Crystal Sensor Feedthroughs We offer single pin high amperage designs so you can place a large amount of energy into your source material for your Thermal Evaporation process, or you can choose from a variety of multipins for (read more)
Browse Feedthroughs Datasheets for MPF Products, INC. -
These state-of-the-art Semiconductor Electrostatic Chucks (ESCs) deliver exceptional clamping uniformity and stability. Engineered with high-purity ceramic materials (AlN/Al2O3), they provide reliable performance across ultra-high vacuum and high (read more)
Browse Oxide Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
surface of an optic, or improve wear resistance. Coatings are created with a variety of materials (including oxides, metals, nitride, and rare earth materials) deposited on the optical surface in our in-house coating facility, using specialized methods (electron beam, sputtering, etc.) and state (read more)
Browse Optical Manufacturing Services Datasheets for Zygo Corporation
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Thin Film Materials Technology: Sputtering of Compound Materials
Thin Film Materials Technology: Sputtering of Compound Materials. Rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, this invaluable resource explains sputter deposition technology in thin film production applications.
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Partial Pressure Control in Reactive Sputtering (.pdf)
Reactive Sputtering is used to produce functional coatings having properties that are suitable for a range of applications such as decorative, wear resistant, optical and magnetic thin films. In Reactive Sputtering a target material (e.g. titanium or aluminium) is sputtered in the presence
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Advances in Precision Positioning Stage Design-Optimized Outgassing and Motion Performance in Ultra-High Vacuum Applications
Many processes in advanced research and industrial manufacturing can only be performed in a vacuum, such as thin-film sputtering and ion milling, and technologies formerly reserved for exotic materials processing are seeing application in new fields.
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Market Trend Of Thin Film Ceramic Substrates
Substrates made of thin-film ceramic are also referred to as semiconductor materials. It is made up of a number of thin layers that have been built up utilizing vacuum coating, deposition, or sputtering methods. Glass sheets with a thickness of less than one millimeter that is two-dimensional (flat
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Advanced Materials Co. Ltd. The move could propel Korea into the polysilicon materials market for use in making silicon wafers and solar cells, according to sources. Pall files suit against Entegris Pall Corp. has filed a patent infringement suit today in the U.S. District Court for the Eastern
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Korea eyes entry into polysilicon South Korean chemicals giant DC Chemical Co. Ltd. has acquired a majority stake in Sodiff Advanced Materials Co. Ltd. The move could propel Korea into the polysilicon materials market for use in making silicon wafers and solar cells, according to sources. Pall
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Reactive Sputter Deposition
At steady state, the sum of the sputtered material (metal atoms and compound molecules) and the reactions with deposited film metal atoms balances so that the substrate surface concentration Θc does not change.
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Sputtering by Particle Bombardment
c) Collection of sputtered material .
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Introduction to Focused Ion Beams
Sputtered material and backsputtered ions may therefore deposit on surfaces that are in close proximity to the active milling site (e.g., the sidewalls of a deep narrow trench).
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Electrical And Optical Properties Of Sputter-Deposited Materials
the sputtered material was actually an oxide, and deposition rates were typical of those for insulators.
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Handbook of Manufacturing Engineering and Technology
sputtered material from substrate .
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EUV Sources for Lithography
There is nothing to prevent relocation of this surface to a greater distance than the 45 mm of this experiment, and/or replacement with a lower- sputter material .
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Springer Handbook of Electronic and Photonic Materials
In glow discharge optical emission spectroscopy (GDOES) a high-pressure glow discharge is used to sputter material from the surface of a sam- ple, and this sputtered material is detected by the optical emissions it produces in the glow discharge.
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Beam Effects, Surface Topography, and Depth Profiling in Surface Analysis
Redeposition (Section 2) of sputtered material occurs and complicates the analysis when it occurs on the surface being analyzed.
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Proceedings of the workshop on sputtering caused by plasma (neutral beam) surface interaction
Present codes give a crude estimate of the actual production of sputtered materials but are potentially useful for surveying the wide variety of materials which have been used or proposed for use in tokamaks.
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Ion sputtering and its biomedical applications. Theoretical concepts and practical consequences. Clinical implications and potential use
Lastly, it is worth noting some derivative effects, such as: redeposition of sput- tered material , changes of surface temperature, etc.