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Supplier: DigiKey
Description: TSF-8808 30G SYR
- Type: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: delivers excellent peel force, resulting in long-term reliability of the solder joints. Fast Wetting with Minimal or No Heating Prior to Wire Ribbon Dipping Fast wetting with minimal or no heating before wire ribbon dipping, ensuring higher process efficiency. Reduced Placement Slippage for
- Type: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: for pH adjustment before disposal. Defect-Free Soldering with Low Bridging and Solder Balling ORH1 per J-STD-004
- Type: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview Kester TSF-6592HF is a no-clean paste flux designed as a lead-free solution for a range of interconnect applications, including flip chip attach, sphere or ball attach, and rework or repair of Chip Scale Packaging's (CSPs), Ball Grid Arrays (BGAs), and Surface Mount Devices (SMDs).
- Features: Lead Free, Paste
- Type: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview Kester 285 consists of high-quality, purified rosin combined with a synergistic blend of activating agents. This flux was formerly classified as Type RMA per QQ-S-571. Its fluxing ability surpasses that of typical mildly activated rosin fluxes and is comparable to fully
- Features: Flux Cored Wire
- Type: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Chemtronics Flux-Off 892B flux remover is sold 12 cans per case and is another quality product from Chemtronics. Use caution when purchasing products in this category as some may be flammable. This particular flux remover is not flammable.
- Type: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: Non-Conductive, Non-Tacky Residues Compatible with Lead-Free and Leaded Solder Systems Thixotropic Paste
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Type: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: MG Chemicals 426NS is a No Clean Super Wick with a flux residue that is both non-conductive and non-corrosive. The flux residue remaining on board does not have to be cleaned. 5ft bobbin, desoldering braid. Product Benefits Conforms to MIL-F-14256E RMA flux and J-STD-004 High purity, oxide-free
- Type: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The
- Features: Paste
- Type: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: (Known as Multicore X32-10I No Clean Flux ) LOCTITE X32-10i No Clean Flux is a low solids synthetic resin flux meets global demand for ultra low residue medium activity flux.
- Type: Soldering Flux / Rosin
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Supplier: Nordson EFD
Description: Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides a
- Features: Paste
- Type: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: LIQUID TYPE 16 OZ US FLUID CAPACITY CONTAINER TYPE BOTTLE
- Type: Soldering Flux / Rosin
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with a hot water rinse.
- Melting Range: 300 to 525 F
- Features: Paste
- Type: Soldering Flux / Rosin
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Supplier: ESAB Welding and Cutting Products
Description: Features White powder flux for removing oxides of aluminum and zinc based alloys. Active to 700°F. Performs to AWS A5.31, Type FB1-A
- Tensile Strength (UTS): 28,000 psi
- Approvals / Conformance: AWS
- Type: Brazing Flux, Soldering Flux / Rosin, Welding Flux
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Supplier: Esprix Technologies
Description: Type: Automotive Flux - Brazing Aniline Hydrochloride d-Camphoric Acid Cyclohexylamine Hydrochloride Cyclohexylamine Hydrobromide DBD = 2,3–Dibromo–2-Butene - 1,4-Diol Dibromo-Styrene((1,2-Dibromoethyl)Benzene) Diethylamine Hydrochloride (DEA-HCL) Diethylamine Hydrobromide Dimethylamine
- Type: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Chemtronics Circuitworks CW9000 concentrate flux remover is another quality product from Chemtronics. Use caution when purchasing products in this category as some may be flammable. This particular flux remover is flammable.
- Type: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: Wave Solder Flux 1025 is a high activity, versatile, water-soluble wave soldering fl ux formulated to maximize yields and reduce defects on surface-mount and mixed-technology assemblies. It has a broad processing range and provides excellent wetting.
- Type: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: Halogen-free, No-clean, Pb-freeHigh tack, low voiding solder paste designed for medium to large boards. Robust reflow process window with exceptional solderability across a wide range of challenging surfaces finishes including immersion Ag and OSP copper.
- Features: Lead Free, Other, Paste
- Type: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: Liquid Physical State, Ethereal Odor, Heavy Duty Flux Remover Use when an aggressive flux remover is required. Penetrates to quickly remove all non-ionic and ionic soils found in post-solder applications. Variable valve allows user to control rate of flow. Fast Evaporation Aggressive Cleaner
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Supplier: Princess Auto Limited
Description: Aluminum Solder Paste
- Features: Paste
- Type: Soldering Flux / Rosin
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Type: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Chemtronics Flux-Off 835B concentrate flux remover is another quality product from Chemtronics. Use caution when purchasing products in this category as some may be flammable. This particular flux remover is flammable.
- Type: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: 80 Battery Flux is specially formulated for cast-on-strap manufacturing of batteries. This flux offers a wide process window at various temperatures and an extended life. 80 Battery Flux does not contain any chlorides, heavy metals, or organic acids that could affect the long-term life of the
- Approvals / Conformance: ISO / EN
- Type: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: A flux for metals as effective as acid or chloride types but non-corrosive. Solders even hard-to-solder metals such as aluminum, zinc-based alloys, steel, etc. Ideal for soldering bus and ground wires to aluminum and steel chassis, to hermetically seal lids to metal cases, for
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Supplier: Henkel Corporation - Electronics
Description: Halide-free, No-clean, Pb-freePb-free solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in SnPb formulation
- Features: Lead Free, Other, Paste
- Type: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: MG Chemicals 835-P Rosin Flux Pen contains a type RA rosin-activated flux, composed of pure white-water gum rosin, a unique solvent system and very effective activators. The superior fluxing remains consistent throughout the entire aeration process and provides fast wetting action. It complies with
- Type: Soldering Flux / Rosin
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Type: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Techspray 1631 concentrate flux remover is sold 12 per case and is another quality product from Techspray. Use caution when purchasing products in this category as some may be flammable. This particular flux remover is not flammable.
- Type: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: depths down to 10 microns or less. WS-641 has an activator system powerful enough to promote solder wetting even on mildly oxidized copper and ENEPIG. Its cleanability in deionized (DI) water and halogen-free nature makes it environmentally-friendly, as well.
- Type: Halogen / Halide Free, Soldering Flux / Rosin
- Features: Other
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Supplier: Henkel Corporation - Electronics
Description: (Known as MULTICORE MF388 No Clean Flux ) LOCTITE MF 388 is a sustained activity in high preheats for dual wave and lead-free processes. High PTH fill, low residues. High reliability. Solvent-based no clean flux may be thinned with IPA.
- Type: Soldering Flux / Rosin
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Type: Soldering Flux / Rosin
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Supplier: Allied Electronics, Inc.
Description: The pen for applying flux with precision and control. Chisel Tip Marker Provides Exact Delivery of Flux to Surface Easily Removed with Appropriate Flux Remover Pen or Flux-Off® Flux Remover Flux Meets ANSI/IPC S-STD-004 Type ROLO
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Supplier: Princess Auto Limited
Description: 4 oz. Soldering Flux Paste
- Features: Paste
- Type: Soldering Flux / Rosin
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Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes
To fabricate the solder bump, two types of eutectic Sn-58Bi solder paste [Sn-58Bi solder paste (SB; TLF-401-11; Tamura , Japan) containing 9.4% flux and Sn-58Bi epoxy solder paste (SBE; SAM10-401- 27; Tamura) with 14.7% flux…
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Interface reaction between Ag-Pd conductor and Pd-Sn solder
The ceramic board was first dipped into the flux (XA-100, Tamura , Japan) and then vertically inserted into the molten solder bath for 5 s.
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Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder
Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test
Sn-58 wt.%Bi epoxy solder paste (SAM10-401-27, Tamura Co., Japan) containing 14.7% flux with epoxy was employed.
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A study of the microstructure, thermal properties and wetting kinetics of Sn–3Ag–x Zn lead-free solders
All solder specimens were covered with a thin layer of RAM flux (EC-19S-8, Tamura Corp).
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Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders
The solder pellet was positioned on a substrate covered with RMA flux (EC-19S-8, Tamura Corporation, Tokyo, Japan).
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Spreading Kinetics of Liquid Solders over an Intermetallic
Solid Surface. Part 1: Eutectic Lead Solder
A solder specimen was positioned on the substrate covered with RMA flux (EC-19S-8, Tamura Corporation).
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Ventilation Fan Fires: Overheated Windings Lead to Failed Thermal Limit Switch
A second factor that may contribute to the Tamura TCO’s failure to open as designed is that prolonged, increased heat expo- sure can cause the resin flux to harden (oxidize) and become ineffective at break- ing down the oxide layer of the … is that heat encourages oxide growth on the surface of the fusible alloy ( solder ), provid- ing structural…
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A Comparative Study of Reactive Wetting of Lead
and Lead-Free Solders on Cu and (Cu6 Sn5 /Cu3 Sn)/Cu Substrates
The wetting tests were conducted in the presence of a RMA flux (EC-19S-8, Tamura Corp.) using both Cu and Cu6Sn5/Cu3Sn/Cu substrates. .... Each test was conducted four times using Sn-0.7Cu, Sn-3.5Ag, and 63Sn-Pb solders .
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Oxidation and reduction kinetics of eutectic SnPb, InSn and AuSn: a knowledge base for fluxless solder bonding applications
’ S. M. Scheifers and C.J. Raleigh, “Effects of Flux Contamination on Flip Chip Reliability”,Sensors .... Koopman, S. Bobbio, S. Nangalia and J. Bousaba, “Fluxless Soldering in Air and Nitrogen”, 43” ECTC, 1993,. .... T. Nishikawa, M. Ijuin, R. Satoh, Y. Iwata, M. Tamura and M. Shirai, “Fluxless Soldering Process technology”…
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Flux free flip chip attach technology for BGA/CSP packages
Masahiko Furuaoand TsugunOri Masuda CentralResearch Laboratory TAMURA Corporation 1-19-43,Higashi-Oizumi, Nerima-Ku, Tokyo, 178 .... The solder Flip Chip Attach without flux using plasma treatment has been developed in order to eliminate the flux residue cleaning process for manufacturing the BGNCSP packages.