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Supplier: RS Components, Ltd.
Description: Specifically formulated for the higher temperature requirements of lead free applications. Syringe applicator provides exact delivery of flux to surface. Long tack time, extended shelf life. No refrigeration required. Noncorrosive, halide and halogen free. Meets IPC requirements for ROL0, No
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Supplier: RS Components, Ltd.
Description: Precision application pens designed for the service and repair engineer to apply small quantities of cleaners, oils and coatings or where application in confined areas is required. Ideal for spot cleaning, repair and service of communication equipment, electrical and electronic control equipment,
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Supplier: RS Components, Ltd.
Description: Chisel tip marker provides exact delivery of flux to surface. Suitable for soldering applications where water soluble flux is required. Applies a neutral pH organic water soluble flux for rapid soldering. Chisel tip marker provides exact delivery of flux to
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Supplier: RS Components, Ltd.
Description: A quick drying, (5 to 10 min at 20° C) mildly activated flux in a 200 ml aerosol for use when removing and replacing surface mount components. The application of spray flux to solder joints will aid reflow when heating to remove components. Can also be used as an anti-tarnish
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Supplier: MacDermid Alpha Electronics Solutions
Description: A halogen-free, high-reliability, mid-solids, alcohol-based, no-clean wave soldering flux for standard & thick board applications. Product Overview ALPHA EF-8800HF is a mid-solids, alcohol-based flux designed for both standard and thicker, high-density PCBs in leaded and lead
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components. Product Overview ALPHA AccuFlux BTC-578 technology features a precision-controlled micro-flux coating on solder preforms. The chemistry is specifically
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: A neutral pH, 15% solids, moderate to high-activity water-soluble flux, non-acidic and can sit in production before washing. Product Overview ALPHA 856 is formulated for defect-free soldering in processes that use water cleaning. It features a buffered activation system with no
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Organic Flux featuring a water soluble formula for use in flux-cored solder wire. Product Overview Kester 331 is the flux cored solder wire version of the popular Kester 2331-ZX Liquid Flux and is more effective than rosin fluxes when soldering
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: TACFlux® 10 is a no-clean flux designed to be used in rework and repair, SMT component attachment, and virtually all applications where flux is required.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: packaging Low residue Halogen-free No-clean Introduction Flip-Chip Flux NC-26S is a halogen-free, no-clean flip-chip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: 42-SS is a water-based inorganic salt formulation developed for soldering stainless steel and other difficultto-solder metals. 42-SS provides fast wetting and effective oxide removal for dependable soldering.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball attach flux is needed, and is suitable for a variety of different deposition methods
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: PASTE TYPE 2 OZ US FLUID CAPACITY STEEL METAL USED ON CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: PASTE TYPE MILKY WHITE PASTE COLOR 2 OZ FLUID CAPACITY 1.1 SPECIFIC GRAVITY GC[T] BRAND USED FOR WATER REMOVABLE, BASE TYPE ROSIN CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: LIQUID TYPE 2 OZ US FLUID CAPACITY CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: 2 OZ US FLUID CAPACITY ALUMINUM METAL USED ON CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: Halide-free, No-clean, SnPbSnPb solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in Pb-free formulation
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: ESAB Welding and Cutting Products
Description: Features White powder flux for removing oxides of aluminum and zinc based alloys. Active to 700°F. Performs to AWS A5.31, Type FB1-A
- Approvals / Conformance: AWS
- Fluxes & Cleaners: Brazing Flux, Soldering Flux / Rosin, Welding Flux
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Supplier: Princess Auto Limited
Description: 4 oz. Soldering Flux Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: SRA #80 SOLVENT-BASED, WATER-SOL
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Handy Flo 800 is a flux/binder system for solder alloys. These low temperature flux-binder systems are intended for soldering applications. Suitable heating methods include torch, induction, resistance, infrared, hot plate or oven, and clean-up is easily accomplished with
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester 120 flux thinner is another quality product from Kester.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Nordson EFD
Description: Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: MG Chemicals 425NS is a No Clean Super Wick with a flux residue that is both non-conductive and non-corrosive. The flux residue remaining on board does not have to be cleaned. 5ft bobbin, desoldering braid. Product Benefits Conforms to MIL-F-14256E RMA flux and J-STD-004
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Esprix Technologies
Description: Type: Automotive Flux - Brazing Aniline Hydrochloride d-Camphoric Acid Cyclohexylamine Hydrochloride Cyclohexylamine Hydrobromide DBD = 2,3–Dibromo–2-Butene - 1,4-Diol Dibromo-Styrene((1,2 -Dibromoethyl
- Fluxes & Cleaners: Soldering Flux / Rosin
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Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes
To fabricate the solder bump, two types of eutectic Sn-58Bi solder paste [Sn-58Bi solder paste (SB; TLF-401-11; Tamura , Japan) containing 9.4% flux and Sn-58Bi epoxy solder paste (SBE; SAM10-401- 27; Tamura) with 14.7% flux…
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Interface reaction between Ag-Pd conductor and Pd-Sn solder
The ceramic board was first dipped into the flux (XA-100, Tamura , Japan) and then vertically inserted into the molten solder bath for 5 s.
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Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder
Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test
Sn-58 wt.%Bi epoxy solder paste (SAM10-401-27, Tamura Co., Japan) containing 14.7% flux with epoxy was employed.
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A study of the microstructure, thermal properties and wetting kinetics of Sn–3Ag–x Zn lead-free solders
All solder specimens were covered with a thin layer of RAM flux (EC-19S-8, Tamura Corp).
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Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders
The solder pellet was positioned on a substrate covered with RMA flux (EC-19S-8, Tamura Corporation, Tokyo, Japan).
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Spreading Kinetics of Liquid Solders over an Intermetallic
Solid Surface. Part 1: Eutectic Lead Solder
A solder specimen was positioned on the substrate covered with RMA flux (EC-19S-8, Tamura Corporation).
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Ventilation Fan Fires: Overheated Windings Lead to Failed Thermal Limit Switch
A second factor that may contribute to the Tamura TCO’s failure to open as designed is that prolonged, increased heat expo- sure can cause the resin flux to harden (oxidize) and become ineffective at break- ing down the oxide layer of the … is that heat encourages oxide growth on the surface of the fusible alloy ( solder ), provid- ing structural…
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A Comparative Study of Reactive Wetting of Lead
and Lead-Free Solders on Cu and (Cu6 Sn5 /Cu3 Sn)/Cu Substrates
The wetting tests were conducted in the presence of a RMA flux (EC-19S-8, Tamura Corp.) using both Cu and Cu6Sn5/Cu3Sn/Cu substrates. .... Each test was conducted four times using Sn-0.7Cu, Sn-3.5Ag, and 63Sn-Pb solders .
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Oxidation and reduction kinetics of eutectic SnPb, InSn and AuSn: a knowledge base for fluxless solder bonding applications
’ S. M. Scheifers and C.J. Raleigh, “Effects of Flux Contamination on Flip Chip Reliability”,Sensors .... Koopman, S. Bobbio, S. Nangalia and J. Bousaba, “Fluxless Soldering in Air and Nitrogen”, 43” ECTC, 1993,. .... T. Nishikawa, M. Ijuin, R. Satoh, Y. Iwata, M. Tamura and M. Shirai, “Fluxless Soldering Process technology”…
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Flux free flip chip attach technology for BGA/CSP packages
Masahiko Furuaoand TsugunOri Masuda CentralResearch Laboratory TAMURA Corporation 1-19-43,Higashi-Oizumi, Nerima-Ku, Tokyo, 178 .... The solder Flip Chip Attach without flux using plasma treatment has been developed in order to eliminate the flux residue cleaning process for manufacturing the BGNCSP packages.