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Supplier: RS Components, Ltd.
Description: Specifically formulated for the higher temperature requirements of lead free applications. Syringe applicator provides exact delivery of flux to surface. Long tack time, extended shelf life. No refrigeration required. Noncorrosive, halide and halogen free. Meets IPC requirements for ROL0, No
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Supplier: RS Components, Ltd.
Description: Precision application pens designed for the service and repair engineer to apply small quantities of cleaners, oils and coatings or where application in confined areas is required. Ideal for spot cleaning, repair and service of communication equipment, electrical and electronic control equipment,
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Supplier: RS Components, Ltd.
Description: Chisel tip marker provides exact delivery of flux to surface. Suitable for soldering applications where water soluble flux is required. Applies a neutral pH organic water soluble flux for rapid soldering. Chisel tip marker provides exact delivery of flux to
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Supplier: RS Components, Ltd.
Description: A quick drying, (5 to 10 min at 20° C) mildly activated flux in a 200 ml aerosol for use when removing and replacing surface mount components. The application of spray flux to solder joints will aid reflow when heating to remove components. Can also be used as an anti-tarnish
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Supplier: MacDermid Alpha Electronics Solutions
Description: A halogen-free, high-reliability, mid-solids, alcohol-based, no-clean wave soldering flux for standard & thick board applications. Product Overview ALPHA EF-8800HF is a mid-solids, alcohol-based flux designed for both standard and thicker, high-density PCBs in leaded and lead
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: designed to reduce voiding at the thermal/ground interface of bottom terminated component (BTC) packages, such as QFN, QFP, and D-Pak. By incorporating ALPHA AccuFlux BTC-578 flux-coated preforms and solder paste with an optimized stencil design, minimal to non-detectable
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: A neutral pH, 15% solids, moderate to high-activity water-soluble flux, non-acidic and can sit in production before washing. Product Overview ALPHA 856 is formulated for defect-free soldering in processes that use water cleaning. It features a buffered activation system with no
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: MacDermid Alpha Electronics Solutions
Description: Organic Flux featuring a water soluble formula for use in flux-cored solder wire. Product Overview Kester 331 is the flux cored solder wire version of the popular Kester 2331-ZX Liquid Flux and is more effective than rosin fluxes when soldering
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: TACFlux® 10 is a no-clean flux designed to be used in rework and repair, SMT component attachment, and virtually all applications where flux is required.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: packaging Low residue Halogen-free No-clean Introduction Flip-Chip Flux NC-26S is a halogen-free, no-clean flip-chip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: 42-SS is a water-based inorganic salt formulation developed for soldering stainless steel and other difficultto-solder metals. 42-SS provides fast wetting and effective oxide removal for dependable soldering.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Indium Corporation
Description: applications requiring soldering to surface finishes with tenacious oxides, such as nickel. It can also be used wherever a no-clean ball attach flux is needed, and is suitable for a variety of different deposition methods
- Approvals / Conformance: Other
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: PASTE TYPE 2 OZ US FLUID CAPACITY STEEL METAL USED ON CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: PASTE TYPE MILKY WHITE PASTE COLOR 2 OZ FLUID CAPACITY 1.1 SPECIFIC GRAVITY GC[T] BRAND USED FOR WATER REMOVABLE, BASE TYPE ROSIN CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: LIQUID TYPE 2 OZ US FLUID CAPACITY CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Waldom Electronics
Description: 2 OZ US FLUID CAPACITY ALUMINUM METAL USED ON CONTAINER TYPE BOTTLE
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Henkel Corporation - Electronics
Description: Halide-free, No-clean, SnPbSnPb solder paste with excellent resistance to solder balling and suitable for fine pitch, stencil printing applications.Also available in Pb-free formulation
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: ESAB Welding and Cutting Products
Description: Features White powder flux for removing oxides of aluminum and zinc based alloys. Active to 700°F. Performs to AWS A5.31, Type FB1-A
- Approvals / Conformance: AWS
- Fluxes & Cleaners: Brazing Flux, Soldering Flux / Rosin, Welding Flux
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Supplier: Princess Auto Limited
Description: 4 oz. Soldering Flux Paste
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Chemical Strategies, Inc.
Description: Chemical Strategies offers over 3,000 products by Chempax. If you are unable to locate a chemical you need, our sales department can custom source any needed materials for you directly.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: DigiKey
Description: SRA #80 SOLVENT-BASED, WATER-SOL
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: . Typical formulations are up to 85% metal by weight. Brazing and soldering pastes incorporate filler metal, flux, and a binder in a one-step application process. Because pastes are readily applied, they lend themselves well to both manual and automated production
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: R. S. Hughes Company, Inc.
Description: The Kester 120 flux thinner is another quality product from Kester.
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Nordson EFD
Description: Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Techsil Limited
Description: MG Chemicals 425NS is a No Clean Super Wick with a flux residue that is both non-conductive and non-corrosive. The flux residue remaining on board does not have to be cleaned. 5ft bobbin, desoldering braid. Product Benefits Conforms to MIL-F-14256E RMA flux and J-STD-004
- Fluxes & Cleaners: Soldering Flux / Rosin
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Supplier: Esprix Technologies
Description: Type: Automotive Flux - Brazing Aniline Hydrochloride d-Camphoric Acid Cyclohexylamine Hydrochloride Cyclohexylamine Hydrobromide DBD = 2,3–Dibromo–2-Butene - 1,4-Diol Dibromo-Styrene((1,2 -Dibromoethyl
- Fluxes & Cleaners: Soldering Flux / Rosin
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ALPHA OM-362, next-generation ultra-low voiding solder paste This lead-free, zero-halogen, no-clean paste can deliver less than 10 (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions
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Indicates content that may require registration and/or purchase.
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Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes
To fabricate the solder bump, two types of eutectic Sn-58Bi solder paste [Sn-58Bi solder paste (SB; TLF-401-11; Tamura , Japan) containing 9.4% flux and Sn-58Bi epoxy solder paste (SBE; SAM10-401- 27; Tamura) with 14.7% flux…
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Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder
Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test
Sn-58 wt.%Bi epoxy solder paste (SAM10-401-27, Tamura Co., Japan) containing 14.7% flux with epoxy was employed.
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A study of the microstructure, thermal properties and wetting kinetics of Sn–3Ag–x Zn lead-free solders
…experiment, the surface of Cu substrate was polished by using 1 lm diamond paste and then was .... Real- time in situ observations of the wetting and spreading of the Sn–3Ag–xZn solder over the Cu .... All solder specimens were covered with a thin layer of RAM flux (EC-19S-8, Tamura Corp).
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Interface reaction between Ag-Pd conductor and Pd-Sn solder
The ceramic board was first dipped into the flux (XA-100, Tamura , Japan) and then vertically inserted into the molten solder bath for 5 s. .... Co, Rigaku, Japan) patterns for Ag and Pd powder used to make the paste , and for the…
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Flux free flip chip attach technology for BGA/CSP packages
Masahiko Furuaoand TsugunOri Masuda CentralResearch Laboratory TAMURA Corporation 1-19-43,Higashi-Oizumi, Nerima-Ku, Tokyo, 178 .... The solder Flip Chip Attach without flux using plasma treatment has been developed in order to eliminate the flux residue cleaning process for manufacturing the BGNCSP packages. .... connection using a Au stud bump and anisotropic conductive film (ACF)[lO] or anisotropic conductive paste (ACP).
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Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials > GLOBAL STATUS OF LEAD-FREE SOLDERING
Sn91/Zn9 (eutectic 199°C) is fairly reactive, since Zn causes oxidation and corrosion, and reacts with flux to form a hardened paste . .... • SnZnBiX (Hitachi Harima, Tamura ). .... The cost of solder bar is dictated by the raw materials cost (see Table 11.2).
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A Guide to Lead-free Solders
With the advent of SnAgCu or other Pb-free replacements, changes in flux vehi- cles and increasing solder temperatures may require more aggressive cleaning processes. .... Alpha Metals, (2004), OM-300 Series Solder Paste , Product Manual. .... 11 Choi, W. J., Lee, T. Y., Tu, K. N., Tamura , N., Celestre, R.S., MacDowell, A…
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Materials for Advanced Packaging
…7Ag2.8Bi1.0Cu0.5 (214–2158C, Nihon Genma) Sn93.6Ag2.9Bi3.0Cu0.5 (205–2168C, Tamura Kaken) Sn92.8Ag3 .... Although attractive in its low melting temperature, its high surface tension (0.768 N/m for Zn) and high reactivity toward flux and oxygen prohibit its use for electronic soldering . .... 5.3 Lead-Free Solder Pastes .
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A simple and reproducible method towards fabricating defect-free and reliable solder joints
The splitting is also found to be effective in expunging inclusion, flux resildue from solder joints. .... various solder joints with different dimension which are fabricated by no-clean and water-soluble solder pastes . .... [111 Toru Nishikawa, Masahito Ijuin, Ryohei Satoh, Yasuhiro Iwata, Mitsunori Tamura and Mitsugu Shirai, “Fluxless Soldering Process…
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Proceedings Of 1993 Japan International Electronic Manufacturing Technology Symposium
Coatings & No-clean Flux .............................................................................................................. .... WB1-2 Adaptive Solder Paste Composites Smart Solder Pastes .............. .... Nagaoka, T. Makabe, F. Yoshimura, Y.Kobayashi, T. Tamura , Y. Suzuki& F. Suzuki*(NJX Corporation,Nec Engineering…