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Supplier: Allied Electronics, Inc.
Description: Thermalbond™ is a thermally conductive, high strength epoxy adhesive. Green in color, it provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics. Thermalbond™ also has a coefficient of thermal expansion compatible with aluminum, copper and
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Supplier: Techsil Limited
Description: thermal. 8329TCS epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required
- Industry: Electronics
- Features: Epoxy (EP), Thermal / Heat Conductive
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound.
- Viscosity: 10,000 to 15,000 cP
- Use Temperature: -60 to 275 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 17 µin/in-F
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Supplier: Techsil Limited
Description: thermal. 8329TCM epoxy has many uses, its excellent conductivity improves thermal management for modern high powered devices which in turn increases their long term reliability. Ideal for thermal management applications where superior bonding strength is required
- Industry: Electronics
- Features: Epoxy (EP), Thermal / Heat Conductive
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Allied Electronics, Inc.
Description: Thermalbond™ is a thermally conductive, high strength epoxy adhesive. Green in color, it provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics. Thermalbond™ also has a coefficient of thermal expansion compatible with aluminum, copper and
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: -67 to 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Supplier: Master Bond, Inc.
Description: Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond
- Viscosity: 60,000 to 120,000 cP
- Use Temperature: -100 to 350 F
- Thermal Conductivity: 0.72 to 0.87 W/m-K
- Tensile Strength (Break): 7,000 to 9,000 psi
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Supplier: Koford Engineering, LLC
Description: E-111 is a high performance aluminum filled single component modified epoxy adhesive which can be curedat 125°C or 140°C to provide exceptional shear strength in combination with high peel strength, impactresistance, and good temperature resistance. Especially suitable for applications
- Use Temperature: 257 to 392 F
- Substrate Compatibility: Dissimilar Substrates, Metal
- Features: Epoxy (EP)
- Cure / Technology: Single Component System, Thermosetting / Crosslinking
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Supplier: Newark, An Avnet Company
Description: EPOXY ADHESIVE ROHS COMPLIANT: YES
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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Use Temperature: -55 to 120 F
- Thermal Conductivity: 0.5 to 1 W/m-K
- Tensile Strength (Break): 2,000 psi
- Dielectric Constant (Relative Permittivity): 4 to 5
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Supplier: Epoxies Etc...
Description: 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the
- Viscosity: 15,000 cP
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
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Supplier: Master Bond, Inc.
Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond
- Use Temperature: -100 to 300 F
- Thermal Conductivity: 2.88 to 3.6 W/m-K
- Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
- Tensile Strength (Break): 6,000 to 7,000 psi
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Supplier: Ellsworth Adhesives
Description: 3M Thermally Conductive Epoxy Adhesive TC-2810 Cream is a two component, boron nitride filled adhesive that offers low outgassing, good thermal conductivity, and low chloride ion content. 50 mL Duo-Pak Cartridge.
- Viscosity: 40,000 to 80,000 cP
- Thermal Conductivity: 0.8 to 1.4 W/m-K
- Dielectric Strength: 750 kV/in
- Features: Epoxy (EP), Thermal / Heat Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at
- Use Temperature: -452.47 to 250 F
- Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, OEM / Industrial, Semiconductors / IC Packaging, Tooling / Mold Material
- Features: Anti-static / ESD Control, Die Bonding Adhesive / Compound, EMI / RFI Shielding Material, Electrical Insulating / Dielectric, Electrically Conductive, Epoxy (EP), Liquid, Other, Specialty / Other, Unfilled
- Substrate Compatibility: Ceramic / Glass, Composites, Metal, Plastic, Porous Surfaces, Rubber / Elastomer
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Supplier: Ellsworth Adhesives
Description: 3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications, and good surface wet out. 50 mL Duo-Pak Cartridge.
- Viscosity: 60,000 cP
- Thermal Conductivity: 0.72 W/m-K
- Features: Epoxy (EP), Thermal / Heat Conductive
- Cure / Technology: Two Component System
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Supplier: Epoxies Etc...
Description: 10-3092 is a two-component, high strength epoxy adhesive system. This adhesive is formulated with fiberglass for added impact, compression and thermal shock resistance. 10-3092 is a reliable bonding agent with excellent electrical insulation properties. BENEFITS: •
- Viscosity: 1,500 to 9,450 cP
- Use Temperature: -85 to 311 F
- Thermal Conductivity: 0.50479765 W/m-K
- Tensile Strength (Break): 3,000 to 4,000 psi
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Supplier: Newark, An Avnet Company
Description: 3M THERMALLY CONDUCTIVE EPOXY ADHESIVE TC2810, 50MLDUOPAK
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Supplier: Epoxies Etc...
Description: formulation. 10-3003 NS yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high performance epoxy adhesive exhibits outstanding physical, thermal, and electrical insulation properties.
- Viscosity: 4,500 to 6,500 cP
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 10,500 psi
- Dielectric Strength: 550.0000000000008 kV/in
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Supplier: Epoxies Etc...
Description: 10-3008 is a filled, high performance structural epoxy adhesive. 10-3008 is a flexible adhesive with outstanding lap shear and peel strength. It is a great choice for bonding substrates of differing coefficients of thermal expansion. 10-3008 is also an excellent
- Viscosity: 96,000 cP
- Tensile Strength (Break): 2,700 to 3,200 psi
- Features: Epoxy (EP), Filled
- Industry: OEM / Industrial
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Supplier: Newark, An Avnet Company
Description: Thermally Conductive 1-Part Epoxy Adhesive (Keep Refrigerated) Syringe
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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium
- Use Temperature: -55 to 200 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 38.888888888888886 µin/in-F
- Tensile Strength (Break): 2,000 psi
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production
- Viscosity: 2,000 cP
- Thermal Conductivity: 2.5 to 3 W/m-K
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 55.55555555555556 µin/in-F
- Substrate Compatibility: Ceramic / Glass, Metal
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Use Temperature: 572 F
- Thermal Conductivity: 1 W/m-K
- Coeff. of Thermal Expansion (CTE): 11.11111111111111 to 62.22222222222222 µin/in-F
- Dielectric Constant: 5.19
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Supplier: Protavic America, Inc.
Description: Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.
- Viscosity: 8,000 cP
- Use Temperature: -55 to 175 F
- Thermal Conductivity: 1.49 to 2.2 W/m-K
- Tensile Strength (Break): 4,200 psi
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Supplier: Newark, An Avnet Company
Description: Thermally Conductive 1-Part Epoxy Adhesive - MTO 140 (Keep Refrigerated) Syringe
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Supplier: Win Source Electronics
Description: Category: Fans, Thermal Management>Thermal>Adhesives, Epoxies, Greases, Pastes Mfr: TE Connectivity Aerospace, Defense and Marine Packaging: Bulk Part Status: Obsolete Resistance (Ohms): 5 Tolerance: ±20% Power (Watts): 30 W Composition: Wirewound Features: Bootstrap Circuit,
- Resistance Range: 5 ohms
- Tolerance: 20 +/- %
- Temperature Coefficient (TCR): 1,200 ±ppm/°C
- Power Rating: 30.000000000000004 watts
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Viscosity: 25,000 to 45,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 2.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND 281 BLK one component epoxy adhesive is formualted for use in applications requiring excellent thermal conductivity. It has high thermal conductivity, good chemical resistance and is electrically insulating. It is designed to not flow or sag even on
- Industry: Electronics
- Features: Thermally Conductive
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Description: The industrial window is wide, the operating time is 120min, and the bonding strength after curing is high. It is a high-viscosity industrial-grade epoxy adhesive with long service life. Once mixed, the two-component epoxy resin cures at room temperature to form a tough,
- Features: Epoxy (EP)
- Cure / Technology: Room Temperature Curing, Two Component System
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Supplier: Allied Electronics, Inc.
Description: Ther-O-Bond 1600 produces a stable, durable, high-impact bond, with good heat transfer characteristics. It is a thixotropic (smooth paste) thermally conductive epoxy system used for staking thermistors, diodes, resistors, integrated circuits and other heat sensitive components to printed
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Supplier: DigiKey
Description: Thermal Applicator, Epoxy 50 ml Cartridges
- Use Temperature: -58 to 266 F
- Features: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: ResinLab SEC1233 Silver is a two component, room temperature curing, epoxy adhesive paste that is used for bonding electronic components. It is silver filled, thixotropic, 100% solids, protects against the environment, and has good electrical and thermal conductivity. 4 g
- Viscosity: 29,500 to 582,000 cP
- Thermal Conductivity: 4.65 W/m-K
- Tensile Strength (Break): 450 psi
- Elongation: 20 to 30 %
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST EE 4186 Epoxy Adhesive Resin Tan is a two component cure epoxy system resistant to thermal and mechanical shock. It is flexible and used in the assembly of transformers and rotating parts where high temperatures are expected. 1 gal Can.
- Viscosity: 150,000 cP
- Tensile Strength (Break): 9,950 psi
- Features: Epoxy (EP)
- Cure / Technology: Two Component System
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Supplier: DuPont Electronics & Imaging
Description: Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With good processability and high thermal resistivity, Pyralux® GPL
- Coeff. of Thermal Expansion (CTE): 58.33333333333333 µin/in-F
- Tensile Strength (Break): 1,595.40523292917 psi
- Elongation: 222 %
- Dielectric Strength: 3,124.2000000000066 kV/in
Find Suppliers by Category Top
Featured Products Top
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Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
EP40ND is a superb adhesive and bonds well to a variety of substrates including metals, ceramics, composites and plastics. It is most noteworthy for its affinity to bonding engineered plastics such as polycarbonates and acrylics. EP40ND is also capable of withstanding rigorous thermal cycling and shock. EP40ND is a reliable electrical insulator. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
values. Also, it stands up briskly to thermal cycling as well as impact and shock. The service temperature range is -60°F to +200°F. Most notably, EP3SP5FL softens markedly above 200°F and this characteristic can allow the epoxy to be more readily reworkable than most other epoxy type systems. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients Master Bond Supreme 70CN is a two part epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This moderate viscosity unfilled epoxy is black in color and (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Supreme 11AOHTLP Product Information Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Key Features Convenient (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
EP42HT-2LTE Master Bond EP42HT-2LTE is an innovative, two component epoxy system with an ultra low coefficient of thermal expansion. It can be used as an adhesive, sealant, coating and, in some cases, as a casting system. EP42HT-2LTE (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc.
Conduct Research Top
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Is Epoxy Stronger than Adhesive?
Epoxy is a term that covers a wide range of thermosetting polymer materials used in a wide range of industries today. They are adhesives, coatings, primers, sealants, and encapsulants with superior mechanical, electrical, and thermal properties. Epoxy products are typically two-part systems
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Best Top 10 Two Component Epoxy Adhesives Manufacturers And Companies In China
Two-part epoxies offer great versatility in performance and application. The two component epoxy adhesive formulations offer a wide range of properties, including chemical, optical, electrical, thermal, and mechanical resistance.
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Is Epoxy Stronger than Glue?
. In addition, epoxides can be easily cured or reacted with different curing agents to form rigid, durable thermoset polymers. Cured epoxy polymers are used in various applications, including adhesives, coatings, composites, and electrical laminates.
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The Benefits And Applications Of Underfill Epoxy Encapsulants In Electronics
Underfill epoxy has become an essential component in ensuring the reliability and durability of electronic devices. This adhesive material is used to fill the gap between a microchip and its substrate, preventing mechanical stress and damage, and protecting against moisture and environmental
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Tensile Bond Strength Variance of Thermally Sprayed Coatings with Respect to Adhesive Type (.pdf)
A Round Robin study involving 19 coating suppliers and independent laboratories was conducted on tensile testing of thermally sprayed coatings to determine the accuracy and consistency of the tensile data among the participating labs and within a lab. One coating system (NiCrAl) and two adhesives
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Adhesives for Cryogenic Applications
Adhesives capable of functioning reliably at cryogenic temperatures play an essential role across a broad number of applications. Blended with specialized filler materials, epoxy systems are capable of maintaining performance and delivering required physical, thermal, and electrical characteristics
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
More Information Top
Indicates content that may require registration and/or purchase.
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Aavid Thermalloy - 4952G - Chemicals - Epoxy Compounds - Allied Electronics
Thermal Epoxy Adhesive 200 Gram - 2 part bag(1part hardener/1part epoxy) .
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Chemicals & Adhesives - from Allied Electronics
Thermal Epoxy Adhesive 200 Gram - 2 part bag(1part hardener/1part epoxy) .
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Aavid Thermalloy - 4951G - Chemicals - Epoxy Compounds - Allied Electronics
Thermal Epoxy Adhesive 100 Gram - 2 part bag .
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Experimental study of external heat sinks attached on an optical parallel fiber module
The driver chip was replaced by a 33-Ω resistor, which is attached at the position of the driver using a thermal epoxy adhesive (Ablebond 789-4).
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CML Innovative Technologies - 19710355 - Indicators, Panel Mount - Panel Mount Indicators - Allied Electronics
Thermal Epoxy Adhesive 200 Gram - 2 part bag(1part hardener/1part epoxy) .
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Aavid Thermalloy - 161000F00000G - Chemicals - Epoxy Compounds - Allied Electronics
Thermal Epoxy Adhesive 100 Gram - 2 part bag .
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Building materials thermal conductivity measurement and correlation with heat flow meter, laser flash analysis and TCi
Fig. 8 Correlation graph for the Epoxy adhesive thermal conductiv- ity of LFA and TCi .
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A compact high power T/R module for X-band phased array radar applications using an anodized aluminum substrate
These MMICs were mounted on the aluminum substrate by adhesive thermal epoxy and interconnected to transmission lines using gold wire bonding, as shown in Fig. 4 (c).