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Supplier: Protavic America, Inc.
Description: Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4 to 5
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about 1 mm in width. The glass transition temperature is over 150°C, which helps to improve the
- Coeff. of Thermal Expansion (CTE): 9.44 to 36.11 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
- Dielectric Strength: Over 381 kV/in
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Supplier: Protavic America, Inc.
Description: Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.3
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Flexible / Dampening
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Protavic America, Inc.
Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
- Coeff. of Thermal Expansion (CTE): 10 to 41.67 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.5 to 5.5
- Dielectric Strength: Over 381 kV/in
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Supplier: DigiKey
Description: Thermal Epoxy, 2 Part 25 ml Syringe
- Thermal Conductivity: 0.8000 W/m-K
- Use Temperature: -40 to 302 F
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Supplier: DigiKey
Description: Thermal Epoxy, 2 Part 45 ml Cartridge
- Thermal Conductivity: 0.8000 W/m-K
- Use Temperature: -40 to 302 F
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Supplier: DigiKey
Description: Thermal Applicator, Epoxy 50 ml Cartridges
- Use Temperature: -58 to 266 F
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Supplier: DigiKey
Description: Thermal Epoxy, 2 Part 140.5 grams
- Thermal Conductivity: 3 W/m-K
- Use Temperature: -76 to 248 F
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to
- Cure Type / Technology: Thermosetting / Crosslinking
- Features: Thermal / Heat Conductive
- Industry: Electronics
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Supplier: DuPont Electronics & Imaging
Description: Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With good processability and high thermal resistivity
- Coeff. of Thermal Expansion (CTE): 58.33 µin/in-F
- Dielectric Constant (Relative Permittivity): 2.8
- Dielectric Strength: 3124 kV/in
- Elongation: 222 %
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting
- Coeff. of Thermal Expansion (CTE): 11.67 to 52.78 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.95
- Features: Thermal / Heat Conductive
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Description: The industrial window is wide, the operating time is 120min, and the bonding strength after curing is high. It is a high-viscosity industrial-grade epoxy adhesive with long service life. Once mixed, the two-component epoxy resin cures at room temperature to form a tough,
- Cure Type / Technology: Two Component System, Room Temperature Curing
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,
- Coeff. of Thermal Expansion (CTE): 22.78 to 90 µin/in-F
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Features: Electrically Conductive, Filled, Thermal / Heat Conductive
- Industry: Electronics, Semiconductors / IC Packaging
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Supplier: Epoxies Etc...
Description: 10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 3.11
- Dielectric Strength: 550 kV/in
- Dissimilar Substrates: Yes
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Supplier: Koford Engineering, LLC
Description: bonding magnets andother applications where dissimilar materials are bonded and must withstand long term thermal cycling andthe 180°C cure temperature of E-107 cannot be tolerated. Offers much higher hot bond strength and longterm durability then modified acrylic adhesives or
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Dissimilar Substrates: Yes
- Substrate / Material Compatibility: Metal
- Use Temperature: 257 to 392 F
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Supplier: Master Bond, Inc.
Description: For advanced PCB assembly and heat sink bonding applications, Master Bond offers EP48TC, a specially formulated adhesive that features ultra low thermal resistance of 5-7 x 10-6 K•m2/W. This system uses high thermal conductive fillers and is capable of being applied in bond
- Coeff. of Thermal Expansion (CTE): 7.22 to 8.33 µin/in-F
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.7
- Dielectric Strength: 400 to 450 kV/in
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass,
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Cure Type / Technology: Two Component System
- Features: Electrical Insulating / Dielectric, Thermal / Heat Conductive
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Paper / Paperboard, Plastic, Rubber / Elastomer, Wood / Wood Product
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 2902, Epoxy, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2902 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. LOCTITE ABLESTIK 2902 passes NASA outgassing standards
- Cure Type / Technology: Two Component System
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Use Temperature: 76 to 230 F
- Viscosity: 20000 cP
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Supplier: Ellsworth Adhesives
Description: 3M Thermally Conductive Epoxy Adhesive TC-2810 Cream is a two component, boron nitride filled adhesive that offers low outgassing, good thermal conductivity, and low chloride ion content. 50 mL Duo-Pak Cartridge.
- Cure Type / Technology: Two Component System
- Dielectric Strength: 750 kV/in
- Features: Thermal / Heat Conductive
- Thermal Conductivity: 0.8000 to 1.4 W/m-K
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Description: LOCTITE® ABLESTIK ECF 561 is designed for bonding materials with mismatched coefficients of thermal expansion. Electrically conductive Flexible Removable
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: OEM / Industrial
- Thermal Conductivity: 1.6 W/m-K
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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 3.4
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Supplier: Materion Corporation
Description: Materion Advanced Chemicals silver-filled epoxy cement contains the optimum ratio of silver powder to epoxy resin. This silver-colored thick paste offers maximum thermal and electrical conductivity and mechanical strength.
- Cure Type / Technology: Two Component System
- Features: Electrically Conductive
- Industry: Electronics
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Supplier: ThreeBond International, Inc.
Description: These ThreeBond adhesives use epoxy resin as their main component. They are excellent for a myriad of purposes including general purpose adhesion and sealing, and for electronic device bonding, filling, repair, casting and impregnation. Epoxy resins, also known as polyepoxides,
- Cure Type / Technology: Single Component System
- Industry: Automotive
- Substrate / Material Compatibility: Rubber / Elastomer
- Viscosity: 28000 cP
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Supplier: Master Bond, Inc.
Description: Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 61.11 to 72.22 µin/in-F
- Dissimilar Substrates: Yes
- Elongation: 150 to 200 %
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Supplier: Richardson RFPD
Description: Epoxy Hardener (bottle 0.316 lb)
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Epoxy Adhesives - Thermally Conductive, Non-Electrically Conductive, Low Viscosity Epoxy -- G6E-TSALSupplier: Graphene Laboratories, Inc.
Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Cure Type / Technology: Two Component System, Room Temperature Curing
- Features: Electrically Conductive, Filled
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Medical / Food (Sanitary / FDA), Other
- Thermal Conductivity: 1.8 W/m-K
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Thermal Compounds and Thermal Interface Materials - Industrial Adhesives -- LOCTITE ABLESTIK CF 3350Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK CF 3366, Epoxy Film, Assembly LOCTITE® ABLESTIK CF 3366 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance suitable for extreme
- Chemical / Polymer System Type: Epoxy (EP)
- Thermal Conductivity: 7 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK 566, Epoxy Film, Assembly LOCTITE ABLESTIK 566 is designed for bonding materials with mismatched coefficients of thermal expansion. This material is the low temperature curing version of LOCTITE ABLESTIK 561 adhesive. Electrically Insulating Low temperature cure
- Adhesive: Epoxy
- Backing: Specialty / Other
- Thickness: 1.00E-3 inches
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Supplier: Master Bond, Inc.
Description: of performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17 µin/in-F
- Composition: Two Component System
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
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Supplier: GS Polymers, Inc.
Description: Two part, 4:1 thermal conductivity, higher visc., chemical & thermal res.
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dissimilar Substrates: Yes
- Features: Filled, Thermal / Heat Insulating
- Industry: OEM / Industrial
Find Suppliers by Category Top
Featured Products Top
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Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
controllers, drive systems, and power units. Thermal potting adhesives are typically two-component composite materials based on silicone, epoxy, or polyurethane resins, filled with high thermal conductivity powders. These materials offer excellent (read more)
Browse Silicone Adhesives and Sealants Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
EP40ND is a superb adhesive and bonds well to a variety of substrates including metals, ceramics, composites and plastics. It is most noteworthy for its affinity to bonding engineered plastics such as polycarbonates and acrylics. EP40ND is also capable of withstanding rigorous thermal cycling and shock. EP40ND is a reliable electrical insulator. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
values. Also, it stands up briskly to thermal cycling as well as impact and shock. The service temperature range is -60°F to +200°F. Most notably, EP3SP5FL softens markedly above 200°F and this characteristic can allow the epoxy to be more readily reworkable than most other epoxy type systems. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for (read more)
Browse UV Curing Adhesives Datasheets for Master Bond, Inc. -
Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients Master Bond Supreme 70CN is a two part epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This moderate viscosity unfilled epoxy is black in color and (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Supreme 11AOHTLP Product Information Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Key Features Convenient (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
EP42HT-2LTE Master Bond EP42HT-2LTE is an innovative, two component epoxy system with an ultra low coefficient of thermal expansion. It can be used as an adhesive, sealant, coating and, in some cases, as a casting system. EP42HT-2LTE (read more)
Browse Industrial Adhesives Datasheets for Master Bond, Inc.
Conduct Research Top
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Is Epoxy Stronger than Adhesive?
Epoxy is a term that covers a wide range of thermosetting polymer materials used in a wide range of industries today. They are adhesives, coatings, primers, sealants, and encapsulants with superior mechanical, electrical, and thermal properties. Epoxy products are typically two-part systems
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Best Top 10 Two Component Epoxy Adhesives Manufacturers And Companies In China
Two-part epoxies offer great versatility in performance and application. The two component epoxy adhesive formulations offer a wide range of properties, including chemical, optical, electrical, thermal, and mechanical resistance.
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Is Epoxy Stronger than Glue?
. In addition, epoxides can be easily cured or reacted with different curing agents to form rigid, durable thermoset polymers. Cured epoxy polymers are used in various applications, including adhesives, coatings, composites, and electrical laminates.
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The Benefits And Applications Of Underfill Epoxy Encapsulants In Electronics
Underfill epoxy has become an essential component in ensuring the reliability and durability of electronic devices. This adhesive material is used to fill the gap between a microchip and its substrate, preventing mechanical stress and damage, and protecting against moisture and environmental
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Tensile Bond Strength Variance of Thermally Sprayed Coatings with Respect to Adhesive Type (.pdf)
A Round Robin study involving 19 coating suppliers and independent laboratories was conducted on tensile testing of thermally sprayed coatings to determine the accuracy and consistency of the tensile data among the participating labs and within a lab. One coating system (NiCrAl) and two adhesives
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Adhesives for Cryogenic Applications
Adhesives capable of functioning reliably at cryogenic temperatures play an essential role across a broad number of applications. Blended with specialized filler materials, epoxy systems are capable of maintaining performance and delivering required physical, thermal, and electrical characteristics
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Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
Low coefficient of thermal expansion (CTE) epoxies play an important role in the engineering and construction of electronic circuit boards as well as having great adhesive properties for other assembly operations. These epoxies are used for a variety of different applications such as encapsulation
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
More Information Top
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Aavid Thermalloy - 4952G - Chemicals - Epoxy Compounds - Allied Electronics
Thermal Epoxy Adhesive 200 Gram - 2 part bag(1part hardener/1part epoxy) .
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Chemicals & Adhesives - from Allied Electronics
Thermal Epoxy Adhesive 200 Gram - 2 part bag(1part hardener/1part epoxy) .
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Aavid Thermalloy - 4951G - Chemicals - Epoxy Compounds - Allied Electronics
Thermal Epoxy Adhesive 100 Gram - 2 part bag .
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Experimental study of external heat sinks attached on an optical parallel fiber module
The driver chip was replaced by a 33-Ω resistor, which is attached at the position of the driver using a thermal epoxy adhesive (Ablebond 789-4).
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CML Innovative Technologies - 19710355 - Indicators, Panel Mount - Panel Mount Indicators - Allied Electronics
Thermal Epoxy Adhesive 200 Gram - 2 part bag(1part hardener/1part epoxy) .
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Aavid Thermalloy - 161000F00000G - Chemicals - Epoxy Compounds - Allied Electronics
Thermal Epoxy Adhesive 100 Gram - 2 part bag .
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Building materials thermal conductivity measurement and correlation with heat flow meter, laser flash analysis and TCi
Fig. 8 Correlation graph for the Epoxy adhesive thermal conductiv- ity of LFA and TCi .
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A compact high power T/R module for X-band phased array radar applications using an anodized aluminum substrate
These MMICs were mounted on the aluminum substrate by adhesive thermal epoxy and interconnected to transmission lines using gold wire bonding, as shown in Fig. 4 (c).
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