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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Viscosity: 15,000 cP
- Use Temperature: -94 to 302 F
- Thermal Conductivity: 1.7307348 W/m-K
- Dielectric Strength: 480.0000000000012 kV/in
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Viscosity: 17,000 to 27,000 cP
- Use Temperature: 707 F
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 66.11111111111111 µin/in-F
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Supplier: Epoxies Etc...
Description: 50-3155 is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3155 offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for applications where
- Viscosity: 3,000 to 15,000 cP
- Use Temperature: -67 to 401 F
- Thermal Conductivity: 3.6056975 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.666666666666668 µin/in-F
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Use Temperature: 221 to 500 F
- Thermal Conductivity: 1.03844088 to 1.38458784 W/m-K
- Coeff. of Thermal Expansion (CTE): 20 to 51 µin/in-F
- Tensile Strength (Break): 2,000 to 2,700 psi
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Supplier: Techsil Limited
Description: MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical
- Type: Electrically Conductive
- Features: Electronics, Thermal / Heat Conductive
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile
- Viscosity: 40,000 to 70,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 120 µin/in-F
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Supplier: Techsil Limited
Description: Elecolit® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a
- Type: Electrically Conductive
- Features: Electronics, Thermal Compound / Interface (Thermally Conductive)
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Master Bond, Inc.
Description: EP21TDCAOHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix
- Use Temperature: -100 to 350 F
- Thermal Conductivity: 1.297 to 1.441 W/m-K
- Coeff. of Thermal Expansion (CTE): 5 to 6 µin/in-F
- Tensile Strength (Break): 7,000 psi
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Supplier: Epoxy Technology
Description: optical properties. Additionally, our products are found in dental and surgical tools, catheters and diagnostic probes. EPO-TEK® epoxies also fabricate the circuitry for bench-top instruments, as well as ensure high performance in radiation detection heavy machinery. Even lifestyle devices,
- Viscosity: 1,400 to 2,200 cP
- Use Temperature: 572 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 17.77777777777778 to 62.22222222222222 µin/in-F
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Supplier: Master Bond, Inc.
Description: performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound.
- Viscosity: 10,000 to 15,000 cP
- Use Temperature: -60 to 275 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 17 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage
- Use Temperature: -100 to 400 F
- Thermal Conductivity: 1.442279 W/m-K
- Coeff. of Thermal Expansion (CTE): 0.00012222222222222221 to 0.000030555555555555554 µin/in-F
- Industry: Aerospace, Automotive, OEM / Industrial, Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: EP21TDCANHT is a two component, flexible, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally high peel strength and tensile lap shear. It has a very convenient mix
- Use Temperature: -100 to 350 F
- Thermal Conductivity: 3.17 to 3.458 W/m-K
- Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F
- Tensile Strength (Break): 7,000 psi
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Supplier: Epoxy Technology
Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical,
- Viscosity: 1,800 to 3,600 cP
- Use Temperature: -67 to 572 F
- Thermal Conductivity: 12.6 to 26.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and
- Industry: Electronics (PCB / SMT Assembly)
- Chemical System: Epoxy (EP)
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Supplier: Techsil Limited
Description: Techsil® EP25676 is a two part thermally conductive epoxy resin system with a low mix viscosity. Once mixed, this system is grey in color with a long pot life and can be cured at ambient or elevated temperatures. The flexibility of the resin and the very high filler loading make this
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials. It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Viscosity: 400,000 to 450,000 cP
- Use Temperature: 77 to 302 F
- Thermal Conductivity: 2.9 W/m-K
- Industry: Aerospace, Automotive
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Supplier: Ellsworth Adhesives
Description: 3M Thermally Conductive Epoxy Adhesive TC-2810 Cream is a two component, boron nitride filled adhesive that offers low outgassing, good thermal conductivity, and low chloride ion content. 50 mL Duo-Pak Cartridge.
- Viscosity: 40,000 to 80,000 cP
- Thermal Conductivity: 0.8 to 1.4 W/m-K
- Dielectric Strength: 750 kV/in
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: 3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications, and good surface wet out. 50 mL Duo-Pak Cartridge.
- Viscosity: 60,000 cP
- Thermal Conductivity: 0.72 W/m-K
- Chemical System: Epoxy (EP)
- Features: Thermal / Heat Conductive
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Supplier: Newark, An Avnet Company
Description: Adhesive - Thermally Conductive Epoxy, Flame Retardant, / 1.4 oz Dual Syringe
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Supplier: Newark, An Avnet Company
Description: 3M THERMALLY CONDUCTIVE EPOXY ADHESIVE TC2810, 50MLDUOPAK
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Supplier: Newark, An Avnet Company
Description: LOCTITE STYCAST 2850FT IS A BLACK, THERMALLY CONDUCTIVE EPOXY ENCAPSULANT, 1GAL CAN
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Supplier: Protavic America, Inc.
Description: Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed or pin transferred. It offers fast in-line cure at low temperature. One part premixed and
- Viscosity: 12,500 cP
- Thermal Conductivity: 2.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 66.66666666666667 µin/in-F
- Features: Ceramic / Glass, Electrical Power / HV, Electronics, Liquid, Metal, Thermal / Heat Conductive
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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium temperature and
- Use Temperature: -55 to 200 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 38.888888888888886 µin/in-F
- Tensile Strength (Break): 2,000 psi
- Features: Ceramic / Glass, Electrical Insulation / Dielectric, Electrical Power / HV, Electronics, Liquid, Metal, Plastic, Thermal / Heat Conductive
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Supplier: Allied Electronics, Inc.
Description: Cyanoacrylate Adhesive, 1.05 @ 75 ºF Specific Gravity Conductive Epoxy, Silver Epoxy Resin, Mild Odor Conductive Silver Epoxy Provides Excellent Electrical and Thermal Conductivity High Strength Conductive Bonding Repairs Defective Traces and Creates Jumpers on Boards Quick
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Supplier: Allied Electronics, Inc.
Description: Super Cyanacrylate Adhesive, 1.05 Specific Gravity, Stimulative Odor Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Epoxy- thermally conductive
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed to meet the increasing demands for efficient thermal dissipation. This compound combines ease of processing with enhanced thermal conductivity compared to
- Type: Electrically Conductive
- Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Thermally Conductive
- Chemical System: Epoxy (EP)
- Industry: Semiconductors / IC Packaging
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Supplier: Newark, An Avnet Company
Description: EPOXY - BLACK, THERMALLY CONDUCTIVE ENCAPSULATING & POTTING COMPOUND / Kit
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Supplier: Henkel Corporation - Industrial
Description: Thermally conductive Solvent-free High adhesion Two component Room temperature cure Good adhesion to a variety of substrates
- Viscosity: 20,000 cP
- Use Temperature: 76 to 230 F
- Substrate Compatibility: Ceramic / Glass, Metal
- Chemical System: Epoxy (EP)
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from.
- Thermal Conductivity: 1.35574226 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.5 µin/in-F
- Dielectric Strength: 390.0000000000004 kV/in
- Dielectric Constant (Relative Permittivity): 5.21
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Supplier: Accuris
Description: EPOXY, TWO-COMPONENT - THERMALLY CONDUCTIVE WHEN USED WITH SILICA SAND, POTTING COMPOUND
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Supplier: Allied Electronics, Inc.
Description: Thermalbond™ is a thermally conductive, high strength epoxy adhesive. Green in color, it provides exceptional adhesion to copper, aluminum, steel, glass, ceramics and most plastics. Thermalbond™ also has a coefficient of thermal expansion compatible with aluminum, copper and brass,
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar
- Viscosity: 100,000 cP
- Use Temperature: -76 to 302 F
- Thermal Conductivity: 2.5 W/m-K
- Dielectric Strength: 350 kV/in
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 2151 Blue is a two component, room temperature curing epoxy adhesive. It is electrically insulating, thermally conductive, and has high adhesion with durable, high-impact bonds. 3 g Kit.
- Viscosity: 40,000 cP
- Thermal Conductivity: 0.95 W/m-K
- Tensile Strength (Break): 7,500 psi
- Features: Ceramic / Glass, Metal, Plastic, Thermal / Heat Conductive
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Supplier: Hernon Manufacturing, Inc.
Description: Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for
- Industry: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Features: Electrical Power / HV, Electronics, Thermal / Heat Conductive
- Cure / Technology: Room Temp. Cure / Vulcanizing
- Chemical System: Silicone
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Supplier: Ellsworth Adhesives
Description: Dow DOWSIL™ 3-6751 Thermally Conductive Adhesive Gray is a two component, heat curing, low viscosity silicone that is used to cool electronics, automotives, and power supply applications during thermal transfers. It also bonds well to metals, ceramics, filled plastics, and epoxy
- Viscosity: 10,000 cP
- Thermal Conductivity: 1.1 W/m-K
- Tensile Strength (Break): 400 psi
- Elongation: 35 %
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Featured Products Top
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EP35AOLV is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against corrosion in various harsh environments and helps prolong longevity of critical (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
thermal conductivity of 2.3-2.6 W/(m•K). This epoxy exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14-16 x 10-6 in/in/°C. Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Product Advantages Easy to use, non-critical one to one mix ratio by weight Low viscosity, flows evenly and smoothly Reliable thermal conductivity and electrical insulation Low shrinkage and excellent dimensional stability Resists thermal cycling, vibration and shock Well suited for moderate to large encapsulation applications (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Key Features: Thermal conductivity exceeds 6 W/(m•K) Applicable in very thin bond lines Low thermal resistance Low coefficient of thermal expansion Used for bonding and sealing applications. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc. -
Master Bond EP3UF-1 is a one part epoxy that requires no mixing and is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi. (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
electrical systems, threatening spacecraft integrity and crew safety. This case study explores how Master Bond EP21TDCS-LO, a two-component, silver-filled epoxy, met demanding requirements in two real-world space-environment applications (read more)
Browse Conductive Compounds Datasheets for Master Bond, Inc. -
Supreme 11ANHT-2 Two component epoxy compound for bonding, coating and sealing Master Bond Supreme 11ANHT-2 is a two component thermally conductive, electrically insulating epoxy resin system for bonding, coating and (read more)
Browse Epoxy Adhesives Datasheets for Master Bond, Inc. -
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
Supreme 11AOHTLP Product Information Two component, thermally conductive, electrically insulative epoxy for bonding, sealing and coating Key Features Convenient (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
Conduct Research Top
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Thermally Conductive Epoxy for Large Potting Applications Features Low Exotherm
Master Bond EP29LPAOHT is a two component, NASA low outgassing approved epoxy system featuring a long working life of 8-10 hours per 1,000 gram batch. Due to its low exotherm and flowable consistency, this product is suitable for specialty potting applications where large masses of the epoxy need
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Conductive Adhesives for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging (.pdf)
This paper discusses silver filled and boron nitride filled epoxies for heat-sinking and thermal transfer. Case studies of thermal resistance calculations have been presented with comparisons made against eutectic die-attach.
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Silicone Based Insulation Material for High Speed/Voltage Rotating Machines
on silicone, epoxy, polyester, polyesterimide, and other polymers. Among all of these insulation materials, silicone based insulation best fits into many rotating machinery applications because of stability across a wide temperature range and the ability for highly thermally conductive designs
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Silicone Based Electrical Insulation Material for High Speed/Voltage Rotating Machines
on silicone, epoxy, polyester, polyesterimide, and other polymers. Among all of these insulation materials, silicone based insulation best fits into many rotating machinery applications because of stability across a wide temperature range and the ability for highly thermally conductive designs
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
More Information Top
Indicates content that may require registration and/or purchase.
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Thermally Conductive Adhesives Keep Things Cool
Also available are thermally conductive epoxy films that address some of the most common application issues.
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Exlar T-LAM™ Servomotors have Become the New Standard of Comparison for Maximum Torque Density and Power Efficiency
Potting a T-LAM Stator using Thermally Conductive Epoxy .
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Comparative thermal performance evaluation of graphite/epoxy fin heat sinks
These consisted of a lead tin solder, a standard industrial epoxy (LoctiteM-31CL Hysol@),and a thermally conducting epoxy (Lord Thermoset 340).
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Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
A solvent-free method for the fabrication of thermally conductive epoxy -boron nitride (BN) nanoplatelet composite material is developed in this study.
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Thermally conductive and electrically insulative nanocomposites based on hyperbranched epoxy and nano‐Al 2 O 3 particles modified epoxy resin
[37] L. Ekstrand, H. Kristiansen, J. Liu, Characterization of thermally conductive epoxy nanocomposites [M].
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Potting Compounds And Thermally Conductive Adhesives - An Interview With Rohit Ramnath
In addition, thermally conductive epoxy films that address certain application issues are also available.
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Low Outgassing Adhesives
• Master Bond Introduces Two Component, Thermally Conductive Epoxy which Resists High Temperatures .
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Thermal management of power electronics modules via acoustic micrography imaging
In this research, interfacial thermal resistance of a few common attachment materials (solder and thermally conductive epoxy with conductivity as high as 60W/m-K) between the power module and the heat spreader are characterized.
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Characterization of interfacial thermal resistance for packaging high-power electronics modules
In most power electronics modules, solder or thermally conductive epoxy is used to eliminate the air gaps from the module-heat spreader thermal interface by conforming to surface irregularities; however, these bonding agents introduce interfaces and/or interlayers of finite thickness.
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Effect of thermocouple wire size and attachment method on measurement of thermal characteristics of electronic packages
The methods of attachment included thermally conductive epoxy , non- thermally conductive epoxy, aluminum tape, and polyimide tape.