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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part
- Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
- Chemical System: Epoxy (EP)
- Industry: Semiconductors / IC Packaging
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Supplier: Newark, An Avnet Company
Description: EPOXY - BLACK, THERMALLY CONDUCTIVE ENCAPSULATING & POTTING COMPOUND / Kit
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Supplier: MacDermid Alpha Electronics Solutions
Description: Highly chemical-resistant epoxy potting compound formulated for harsh conditions in under-hood applications. Product Overview ER2223 Highly Chemical Resistant Epoxy Potting Compound has been specially formulated to meet the harsh operating conditions of
- Industry: Automotive, Semiconductors / IC Packaging
- Features: Electronics, Encapsulant / Potting Compound
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
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Supplier: RS Components, Ltd.
Description: MG thermally conductive epoxy 832TC
- Features: Encapsulating / Potting Compound, Specialty / Other, Thermal Compound / Interface (Thermally Conductive)
- Chemical System: Epoxy (EP)
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Supplier: Accuris
Description: EPOXY, TWO-COMPONENT - THERMALLY CONDUCTIVE WHEN USED WITH SILICA SAND, POTTING COMPOUND
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Thermally Conductive Potting and Encapsulating Compound / 1.8 qt Kit
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Supplier: Master Bond, Inc.
Description: Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion.
- Applied Thickness / Gap Fill: 0.003 to 0.006 inch
- Viscosity: 40,000 to 80,000 cP
- Use Temperature: -100 to 400 F
- Coeff. of Thermal Expansion (CTE): 7,222,222.222222222 to 8,888,888.888888888 µin/in-F
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Supplier: Epoxies Etc...
Description: 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.
- Viscosity: 15,000 cP
- Use Temperature: -94 to 302 F
- Thermal Conductivity: 1.7307348 W/m-K
- Dielectric Strength: 480.0000000000012 kV/in
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Flexible Thermally Conductive Flame Retardant Encapsulating and Potting Compound, Meets UL 94V-0 Kit
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Industrial Adhesives - Epoxy Compound; thermally conductive; 2part; black; .5 gal liquid -- 70125873Supplier: Allied Electronics, Inc.
Description: Encapsulatind and Potting Epoxy, 190 °C Flash Point, 1.80 Specific Gravity Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Use encapsulating and
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Supplier: Techsil Limited
Description: Elecolit® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be
- Features: Electrically Conductive, Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
- Chemical System: Epoxy (EP)
- Cure / Technology: Thermosetting / Crosslinking
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 6,000 to 12,000 cP
- Use Temperature: 662 F
- Thermal Conductivity: 0.7 W/m-K
- Coeff. of Thermal Expansion (CTE): 18.333333333333332 to 72.22222222222221 µin/in-F
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant LOCTITE® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of
- Thermal Conductivity: 1.38 W/m-K
- Viscosity: 250,000 cP
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
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Supplier: Newark, An Avnet Company
Description: Epoxy - Black, Flexible Thermally Conductive Flame Retardant Encapsulating and Potting Compound, Meets UL 94V-0 (MTO = 4) Kit
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Supplier: Master Bond, Inc.
Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.
- Applied Thickness / Gap Fill: 0.002 to 0.004 inch
- Use Temperature: -112 to 400 F
- Thermal Conductivity: 2.88 to 3.1 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 19.444444444444443 µin/in-F
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Supplier: Master Bond, Inc.
Description: from metal, etc., over a wide temperature range. Physical strength thermal conductivity and electrical insulation properties of the cured EP121AO resin system are significantly superior to those exhibited by typical room temperature and also thermally cured epoxy resin systems. The
- Viscosity: 55,000 to 95,000 cP
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1.44 W/m-K
- Coeff. of Thermal Expansion (CTE): 10 to 11.67 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to withstand aggressive chemicals, and high compressive
- Applied Thickness / Gap Fill: 0.002 to 0.003 inch
- Viscosity: 50,000 to 90,000 cP
- Use Temperature: -60 to 500 F
- Thermal Conductivity: 1 to 1.15 W/m-K
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Supplier: ACCRAbond, Inc.
Description: INSTAbond® 809FR INSTAbond® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy.
- Features: Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated), UL Approved
- Chemical System: Epoxy (EP)
- Type: Thermal Compound / Thermally Conductive
- Cure / Technology: Two Component System
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 4,000 to 7,000 cP
- Use Temperature: 572 F
- Thermal Conductivity: 0.9 W/m-K
- Coeff. of Thermal Expansion (CTE): 8.333333333333334 to 35.55555555555556 µin/in-F
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 40,000 to 70,000 cP
- Use Temperature: 482 F
- Thermal Conductivity: 1.3 W/m-K
- Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 120 µin/in-F
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Supplier: Epoxy Technology
Description: including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Viscosity: 1,300 to 1,800 cP
- Use Temperature: 572 F
- Thermal Conductivity: 0.4 W/m-K
- Coeff. of Thermal Expansion (CTE): 22.22222222222222 to 105.55555555555556 µin/in-F
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Supplier: Techsil Limited
Description: MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides
- Industry: Electronics (PCB / SMT Assembly)
- Chemical System: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: 3M TC-2707 Thermally Conductive Epoxy Adhesive Gray is a two component epoxy that uses aluminum metal filler. It offers high adhesive strength, good gap filling, low viscosity for potting applications, and good surface wet out. 50 mL Duo-Pak Cartridge.
- Viscosity: 60,000 cP
- Thermal Conductivity: 0.72 W/m-K
- Chemical System: Epoxy (EP)
- Features: Thermal / Heat Conductive
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Supplier: Protavic America, Inc.
Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium
- Use Temperature: -55 to 200 F
- Coeff. of Thermal Expansion (CTE): 36.11111111111111 to 38.888888888888886 µin/in-F
- Tensile Strength (Break): 2,000 psi
- Substrate Compatibility: Ceramic / Glass, Metal, Plastic
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Supplier: Epoxies Etc...
Description: 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that does not contain any solvents. Its’ convenient 1:1 mix ratio and lack of fillers make it an ideal material for
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 0.4326837 W/m-K
- Tensile Strength (Break): 5,700 psi
- Dielectric Strength: 557.9999999999993 kV/in
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Supplier: Epoxies Etc...
Description: 50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from.
- Thermal Conductivity: 1.35574226 W/m-K
- Coeff. of Thermal Expansion (CTE): 16.5 µin/in-F
- Dielectric Strength: 390.0000000000004 kV/in
- Dielectric Constant (Relative Permittivity): 5.21
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper
- Use Temperature: 392 F
- Thermal Conductivity: 2.3076464 W/m-K
- Features: Air Setting / Film Drying, Encapsulating / Potting, Grease / Paste, Thermal / Heat Conductive
- Type: Electrical Insulation / Dielectric
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2762 FT Black, formerly Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is
- Thermal Conductivity: 1.34 W/m-K
- Dielectric Strength: 400.00000000000006 kV/in
- Viscosity: 250,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: thermally conductive properties. 1 gal Pail.
- Thermal Conductivity: 1.02 to 1.28 W/m-K
- Dielectric Strength: 365.7600000000008 to 381.0000000000008 kV/in
- Viscosity: 5,600 to 64,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents. 1 qt
- Thermal Conductivity: 1.36 W/m-K
- Tensile Strength (Break): 6,526.657771073865 to 7,977.026164645835 psi
- Viscosity: 3,000 to 10,000 cP
- Features: Encapsulant / Potting Compound
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Supplier: MacDermid Alpha Electronics Solutions
Description: A very low viscosity epoxy resin with excellent thermal stability, designed for compatibility with reflow applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use within the electronics
- Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
- Chemical System: Epoxy (EP)
- Industry: Semiconductors / IC Packaging
- Type: Thermal Compound / Thermally Conductive
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Supplier: DigiKey
Description: Thermal Epoxy, 2 Part (Order Catalyst Separately) 5 gal Container
- Use Temperature: -85 F
- Chemical System: Epoxy (EP)
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Viscosity: 40,000 cP
- Use Temperature: -55 to 150 F
- Thermal Conductivity: 1.15 W/m-K
- Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F
Find Suppliers by Category Top
Featured Products Top
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sensitive components (Bectron®, CONAP®). Epoxy and silicone potting materials that provide protection for high temperature applications (Epoxylite®, (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
potting materials are based on epoxy, polyurethane, polybutadiene and silicone and are especially designed for areas in demanding electrical and electronic applications. Additional properties such as improved heat dissipation, much greater mechanical stability at high vibrational forces, noise reduction (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications.
(read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
ELANTAS PDG, Inc. manufactures custom encapsulants and potting compounds to match your specifications. (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
QSil-553 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to (read more)
Browse Conductive Compounds Datasheets for CHT USA Inc. -
resilience not only ensures accurate billing but also plays a role in resource conservation and efficient energy management. With a rich legacy of pioneering solutions, ELANTAS PDG is at the forefront of developing exceptional conformal coatings and potting solutions tailored for the smart meter (read more)
Browse Encapsulants and Potting Compounds Datasheets for ELANTAS North America LLC -
Ellsworth Adhesives offers low pressure molding services of Mold-Man® Machines.
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Browse Encapsulants and Potting Compounds Datasheets for Ellsworth Adhesives -
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. It has a thermally conductive, electrically insulative filler material with ultra small particle sizes. (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive. “Supreme 3DM-85 is designed for heat sensitive components that cannot withstand high temperatures (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc. -
One component system Combines flexibility and toughness with high temperature resistance Ideal for potting and encapsulation Unused material is easy to reprocess Withstands rigorous thermal cycling and shocks Non halogen filler (read more)
Browse Encapsulants and Potting Compounds Datasheets for Master Bond, Inc.
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
More Information Top
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Energy Efficient Electronics Cooling Project
To provide thermal contact from the outside surface of the transformer to the copper coil, the copper tubing is potted in a thermally - conductive epoxy potting compound .
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Field Coil Insulation Testing for Pulse Power Alternators
The design for the motorettes to test transverse loads, or conditions in the hoop direction, from this previous work was used with thermally conductive thermoplastics replacing the epoxy pot- ting compounds .
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Potting Compounds And Thermally Conductive Adhesives - An Interview With Rohit Ramnath
RR: A wide range of thermally conductive adhesives and related potting compounds , including epoxy and silicone compounds are available on the market.
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MG Chemicals | Catalog Search Results | Galco Industrial Electronics
EPOXY - BLACK, THERMALLY CONDUCTIVE ENCAPSULATING & POTTING COMPOUND , TWO PART, (RATIO 1:1 .
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:: New Materials Zone ::
This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound .
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Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability
This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound .
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Challenges to machine windings used in electrical generators in wave and tidal power plants
… tape with a dielectric strength of 20 kV/mm (Type “B”) Enameled wire wrapped in insulating paper that was varnished afterwards (Type “C”) Enameled wire potted in epoxy resin (Type “D”) Enameled wire potted in thermally conductive silicon compound (Type “E”) PVC-insulated …