Thermoset Casting Resins

Description: requirements, phenolic resin systems have advantages over polyesters, epoxies, and vinyl esters. Cured phenolic resins from GP Chemicals are formulated to be inherently fire-resistant, demonstrate low smoke generation and high-temperature resistance. Phenolic FRP resins are used

• Filler: Aramid Fiber
• Features: Casting Resin
• Type: Composite Material, Thermoset
• Chemical System: Phenolics (Melamine, Furan)

Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use Temperature: 356 F
• Thermal Conductivity: 0.7 to 0.8 W/m-K
• Coeff. of Thermal Expansion (CTE): 75 to 97.22222222222221 µin/in-F
• Dielectric Strength: 440 kV/in

Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than

• Use Temperature: -103 to 572 F
• Thermal Conductivity: 1.80284875 W/m-K
• Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
• Tensile Strength (Break): 14,500 psi

Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use Temperature: 311 F
• Thermal Conductivity: 0.3 to 0.35 W/m-K
• Coeff. of Thermal Expansion (CTE): 41.666666666666664 to 138.88888888888889 µin/in-F
• Tensile Strength (Break): 2,900 psi

Description: Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The

• Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
• Tensile Strength (Break): 7,600 psi

Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to

• Use Temperature: 314.6 F
• Tensile Strength (Break): 7,340 psi
• Dielectric Strength: 625 kV/in
• Dielectric Constant: 3 to 3.1

Description: Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness’s from 20 A to 80 A .

• Use Temperature: 176 F
• Thermal Conductivity: 0.21634185 W/m-K
• Tensile Strength (Break): 650 psi
• Elongation: 950 %

Description: High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications.

• Use Temperature: 230 F
• Thermal Conductivity: 0.24518743 W/m-K
• Tensile Strength (Break): 1,900 psi
• Elongation: 300 %

Description: Shore 90-95 A, elastomeric coatings that have been specifically designed to reproduce exact surface details. DI-COAT E-4599 is excellent for electrical insulation applications requiring non or low sag materials. DI-COAT E-4599 are formulated to withstand high wear continuous service.

• Use Temperature: 194 F
• Tensile Strength (Break): 2,500 psi
• Elongation: 325 %
• Dielectric Strength: 350 kV/in

Description: similar to aluminum or hard plastic. In addition, we can custom mold materials to shape, and can supply 2-component liquid resins for casting in place. These materials have been used to produce waveguide loads and absorptive housings, and they can be cast directly into RF device

• Features: Casting Resin, EMI / RFI Shielding
• Chemical System: Epoxy, Silicone
• Type: Thermoset

Description: 30-3019 is an unfilled, 100% solids, very low viscosity epoxy resin system. It can also be used as a potting/casting compound in small quantities; usually less than 30 grams of material. 30-3019 can be applied by brush, spray, or dip.

• Cure / Dry Temperature: 77 to 149 F
• Operating / Use Temperature: -67 to 311 F
• Resistivity: 1,000,000,000,000 ohm-cm
• Dielectric Strength: 15,748,031.49606296 V/m

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 617 F
• Coeff. of Thermal Expansion (CTE): 23.88888888888889 to 128.33333333333334 µin/in-F
• Dielectric Constant: 3.21
• Viscosity: 11,000 to 17,000 cP

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 25.555555555555554 to 76.11111111111111 µin/in-F
• Index of Refraction: 1.5215
• Light Transmission: 50 to 98 %

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 617 F
• Coeff. of Thermal Expansion (CTE): 23.88888888888889 to 128.33333333333334 µin/in-F
• Dielectric Constant: 3.21
• Viscosity: 9,000 to 15,000 cP

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Use Temperature: 617 F
• Coeff. of Thermal Expansion (CTE): 25 to 103.88888888888889 µin/in-F
• Dielectric Constant: 2.83
• Index of Refraction: 1.5728

Description: Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500°F. It

• Use Temperature: 500 F
• Tensile Strength (Break): 11,600 to 12,100 psi
• Elongation: 3.1 to 3.4 %
• Electrical Resistivity: 10,000,000,000 to 300,000,000,000,000 ohm-cm

Description: Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight.

• Use Temperature: -60 to 250 F
• Deflection Temperature (@ 264 psi, 1.8 MPa): 150 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 33 to 44 µin/in-F

Description: Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four

• Use Temperature: -452 to 250 F
• Coeff. of Thermal Expansion (CTE): 12 µin/in-F
• Tensile Strength (Break): 2,500 to 9,400 psi
• Tensile Modulus: 420 to 440 ksi

Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.

• Use Temperature: 500 F
• Coeff. of Thermal Expansion (CTE): 22.22222222222222 µin/in-F
• Dielectric Strength: 2,300 kV/in
• Dielectric Constant (Relative Permittivity): 4.4

Description: Addition Cure Silicone Foam Properties Viscosity 5500 Description a two component silicone foam which crosslinks at room temperature by an addition cure reaction. When the A and B liquid components are thoroughly mixed in 1:1 ratio, the product will expand and cure to a foamed elastomer at room

• Form / Shape: Casting Resin / Two-part (A+B Liquids)
• Type: Closed Cellular, Rigid
• Material / Composition: Plastic / Polymer, Silicone, Thermoset / Crosslinked

Description: 20-3064 is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 80 Shore D. 20-3064 provides excellent thermal shock resistance and outstanding

• Viscosity: 40,000 cP
• Use Temperature: -94 to 212 F
• Thermal Conductivity: 0.4326837 W/m-K
• Coeff. of Thermal Expansion (CTE): 38.888888888888886 µin/in-F

Description: capillary action. Use Nuts N’ Bolts® 431 to seal pores or pinhole porosity in welded seams, tanks, castings, or metal parts. The cured adhesive is a thermoset plastic suitable for temperatures up to 400°F (204°C), and exposure to most solvents.

• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Specialty / Other, Thread Locker / Retainer
• Cure / Technology: Thermosetting / Crosslinking

Description: traditional thermoset resins, such as epoxies, including higher service temperature capability, lower moisture uptake, improved toughness, and increased chemical resistance. Thermoplastic composites can also be reheated and reformed, providing benefits for manufacturing processes such

• Industry: Aerospace, Electric Power, Semiconductor / IC's
• Filler: Aramid Fiber, Carbon / Graphite, Fiber Glass
• Material Type: Composite Material, Thermoplastic
• Chemical System: PEEK

Description: PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a convenient 1

• Viscosity: 20,000 cP
• Use Temperature: -55 to 150 F
• Dielectric Constant (Relative Permittivity): 4.3
• Substrate Compatibility: Ceramic / Glass, Metal

Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that

• Viscosity: 625 cP
• Use Temperature: -85 to 347 F
• Dielectric Constant (Relative Permittivity): 4.3
• Water Absorption: 1.5 %

Description: PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -55 to 200 F
• Thermal Conductivity: 1.3 W/m-K
• Dielectric Strength: 635.0000000000014 kV/in

Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.

• Viscosity: 40,000 cP
• Use Temperature: -55 to 150 F
• Thermal Conductivity: 1.15 W/m-K
• Coeff. of Thermal Expansion (CTE): 12.222222222222221 µin/in-F

Description: material made from epoxy resin and high performance hollow glass microspheres designed specifically for molding thermoforming plugs and other associated tooling. Supplied pre-blended, Syntac® 51 is prepared by a simple process of warming, deairing, casting, curing and post curing -

• Use Temperature: 350 F
• Thermal Conductivity: 0.12 W/m-K
• Industry: Aerospace, Automotive, Medical / Food (FDA, USDA)
• Chemical System: Epoxy

Description: INJECTION MOLDING SERVICES · Machine capacity range 90 to 800 tonnes · Injection Molding · Insert Molding · Overmolding · Rubber and Elastomer Molding Services · Plastic Injection Mold Design and Tooling · Die Casting Mold Design and Tooling · Rapid Prototype MATERIALS · Plastics ·

• Industry: Automotive, Consumer, Electrical / Electronics, Medical, Packaging
• Supplier Capability: Design Assistance, High Volume Production (Long Runs), Insert Molding / Overmolding, Low Volume Production (Short Runs), Machining, Prototype / Market Entry Molding, Tool / Mold Making
• Features: East Asia / Pacific Only
• Molding Type: Thermoplastic Injection Molding, Thermoset Injection Molding

Description: Custom OEM Plastics Molding and Manufacturing Leading companies across the U.S. rely on Osborne to help solve their most complex plastics challenges. At Osborne, we specialize in the custom liquid molding of thermoset plastics via Resin Transfer Molding (RTM) and Reaction Injection

• Services: CAD/CAM Support, Design Assistance, Model Making, Mold Texturing, Production Facilities, Prototyping, Repair and Maintenance
• Industry Served: Electrical / Electronics, Industrial, Marine, Medical, Military, Optical
• Mold Type: Lost Foam Casting, Transfer Molding
• Features: North America, United States Only