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Supplier: Belmont Metals, Inc.
Description: solders. Standard and special compositions are Bismuth alloyed with either Antimony, Cadmium, Copper, Indium, Lead or Tin. Category Forms: Bismuth is offered in a variety of forms such as Ingot, Lumps, Shot, Granular, Powder, Pellets or Needles. Bismuth Alloys are
- Metal / Alloy Types: Bismuth / Bismuth Alloys
- Shape / Form: Powder
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Supplier: Belmont Metals, Inc.
Description: solders. Standard and special compositions are Bismuth alloyed with either Antimony, Cadmium, Copper, Indium, Lead or Tin. Category Forms: Bismuth is offered in a variety of forms such as Ingot, Lumps, Shot, Granular, Powder, Pellets or Needles. Bismuth Alloys are
- Metal / Alloy Types: Bismuth / Bismuth Alloys
- Shape / Form: Other
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Supplier: Belmont Metals, Inc.
Description: solders. Standard and special compositions are Bismuth alloyed with either Antimony, Cadmium, Copper, Indium, Lead or Tin. Category Forms: Bismuth is offered in a variety of forms such as Ingot, Lumps, Shot, Granular, Powder, Pellets or Needles. Bismuth Alloys are
- Metal / Alloy Types: Bismuth / Bismuth Alloys
- Shape / Form: Other
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Supplier: Belmont Metals, Inc.
Description: solders. Standard and special compositions are Bismuth alloyed with either Antimony, Cadmium, Copper, Indium, Lead or Tin. Category Forms: Bismuth is offered in a variety of forms such as Ingot, Lumps, Shot, Granular, Powder, Pellets or Needles. Bismuth Alloys are
- Metal / Alloy Types: Bismuth / Bismuth Alloys
- Shape / Form: Billet / Slab / Bloom
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Supplier: Indium Corporation
Description: A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 140ºC Solidus Melting Temperature: 139ºC Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Lead Free: Yes
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Supplier: Indium Corporation
Description: Bismuth-tin wire is a good low temperature lead-free alloy. Alloy: 58Bi 42Sn Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 138ºC Eutectic Solidus Melting Temperature: 138ºC Eutectic Pb-Free: Yes
- Alloy: Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: Indium Corporation
Description: Bismuth-tin wire is a good low temperature lead-free alloy.Alloy: 57Bi 42Sn 1AgDiameter: .030"Quantity: 3 ft SpoolLiquidus Melting Temperature: 140ºC EutecticSolidus Melting Temperature: 139ºC EutecticPb-Free: Yes
- Alloy: Other
- Form / Shape: Wire
- Lead Free: Yes
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Supplier: DigiKey
Description: TIN/BISMUTH SOLDER WIRE (SN60/BI
- Form / Shape: Wire
- Melting Range: 280 to 338 F
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Supplier: Indium Corporation
Description: Fusible alloys are materials that melt at less then 300°F, well below the melting point of tin-lead eutectic solders and SAC alloys. Bismuth is the major component of many of these alloys and infl uences the melting point, as well as gives these materials the unique
- Fusible Alloy: Yes
- Metal / Alloy Types: Bismuth / Bismuth Alloys
- Tensile Strength (UTS, Break): 5400 psi
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Supplier: DigiKey
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
- Form / Shape: Wire
- Melting Range: 280 F
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Supplier: DigiKey
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
- Form / Shape: Wire
- Melting Range: 280 F
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Supplier: Accuris
Description: Method for The determination of bismuth in ingot tin, tin-lead solders and white metal bearing alloys (Photometric method) \x97 Methods for the sampling and analysis of tin and tin alloys
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Supplier: MacDermid Alpha Electronics Solutions
Description: -temperature alloy applications. The alloy also yields very low voiding in BGA solder joints, even when a traditional SAC alloy sphere is used. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallics, which have a
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Supplier: ASTM International
Description: This specification covers solder metal alloys used as solders for the purpose of joining together two or more metals at temperatures below their melting points. The solder alloy shall conform to the required chemical compositions of cadmium, zinc, tin, lead, antimony,
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Supplier: Lake Shore Cryotronics, Inc.
Description: This is a low melting point solder, nearly identical to what is commonly called Wood’s Metal. An alloy of bismuth, tin, lead, and cadmium, it is an eutectic alloy with a sharply defined melting point of 343.16 K (70 °C). Ostalloy® 158 has proven itself in production processes
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Description: ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and without silver
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Supplier: CSA Group
Description: ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
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Supplier: ASTM International
Description: This specification covers low-melting point metal alloys and soldiers, including bismuth-tin, bismuth-lead, bismuth-tin-lead, bismuth-tin-lead-cad mium, bismuth-tin-lead-ind ium-cadmium, bismuth-tin-lead-ind ium, indium-lead, indium-lead-silver, and
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Supplier: Waytek, Inc.
Description: tensile strength Translucent, adhesive-lined heat shrink tubing allows for visual inspections and seals against corrosion Solder sleeves are tin and bismuth alloy RoHS Compliant Crimped for maximum reliability, soldered for strength and conductivity, and sealed for
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Supplier: Waytek, Inc.
Description: for visual inspections and seals against corrosion Solder sleeves are tin and bismuth alloy RoHS Compliant Crimped for maximum reliability, soldered for strength and conductivity, and sealed for superior durability and protection
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Supplier: Waytek, Inc.
Description: Solder sleeves are tin and bismuth alloy Longer neck ensures a strong seal and allows multiple terminals to be stacked RoHS Compliant Crimped for maximum reliability, soldered for strength and conductivity, and sealed for superior durability and protection
- Features: RoHS, Insulated, Heat Shrink Type
- Material: Copper, Other
- North American (AWG): 18 to 22 AWG
- Terminal Type: Ring Terminal
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Supplier: Waytek, Inc.
Description: Solder sleeves are tin and bismuth alloy RoHS Compliant Crimped for maximum reliability, soldered for strength and conductivity, and sealed for superior durability and protection Longer neck ensures a strong seal and allows multiple terminals to be stacked
- Features: RoHS, Insulated, Heat Shrink Type
- Material: Other
- North American (AWG): 14 to 16 AWG
- Terminal Type: Ring Terminal
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Supplier: MacDermid Alpha Electronics Solutions
Description: components used with SnBi solders must be lead-free to prevent the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C. Low Temperature Reflow Profiles Enable the Use of Low Tg PCB Excellent Deposit Consistency Excellent deposit
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Supplier: RS Components, Ltd.
Description: Pitch = 1.27mm Contact Plating = Tin Bismuth Alloy Mounting Type = Surface Mount Termination Method = Solder Current Rating = 1A Housing Material = Polyamide
- Contact Plating: Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: SMT, Solder
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Supplier: RS Components, Ltd.
Description: Pitch = 1.27mm Contact Plating = Tin Bismuth Alloy Mounting Type = Surface Mount Termination Method = Solder Current Rating = 1A Housing Material = Polyamide
- Contact Plating: Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: SMT, Solder
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Supplier: RS Components, Ltd.
Description: Pitch = 1.27mm Contact Plating = Tin Bismuth Alloy Mounting Type = Surface Mount Termination Method = Solder Current Rating = 1A Housing Material = Polyamide
- Contact Plating: Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: SMT, Solder
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Supplier: RS Components, Ltd.
Description: Pitch = 1.27mm Contact Plating = Tin Bismuth Alloy Mounting Type = Surface Mount Termination Method = Solder Current Rating = 1A Housing Material = Polyamide
- Contact Plating: Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: SMT, Solder
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Supplier: Win Source Electronics
Description: : Surface Mount, Right Angle Operating Temperature Range: -20°C ~ 85°C Features: Solder Retention, Zero Insertion Force (ZIF) Termination: Solder Contact Finish: Tin Bismuth Contact Material: Phosphor Bronze Voltage Rating: 50V Current Rating: 0.5A Height Above
- Current Rating: 0.5000 amps
- Voltage Rating: 50 volts
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Conduct Research Top
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Solder Joint Analysis of Tin-Lead and Bismuth-based Lead-free PV Ribbons in High Throughput Manufacturing
applied it but also strongly impacts yield and throughput of the entire module factory. This paper analyses solder joints and factors affecting solder joints in high throughput manufacturing.
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How to Choose a Solder
hazardous materials) are banned from the European Union as part of the Restriction of Hazardous Substances (RoHS). Lead-free solder may contain many metals including silver, copper, tin, bismuth, indium, zinc and antimony. Hard solders have a high melting point and are usually made with a high
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Why Lead-Free Soldering is Better
. Some of the harmful alloys that are used in normal soldering are tin, copper, silver bismuth, indium, zinc, and antimony. So why are these dangerous to humans everywhere? Prior to 1930, all homes used lead pipes to transport water to and from houses. Now, most homes use copper piping. However
More Information Top
Indicates content that may require registration and/or purchase.
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http://dspace.mit.edu/bitstream/handle/1721.1/68496/770423264-MIT.pdf?sequence=2
with a low melting temperature eutectic Bismuth Tin solder (Bi5sSn42 ) with the aide .
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Principles of Soldering
The mechanical properties of bis- muth - tin solders may be improved considerably by the addition of 0.5% Ag.
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http://calhoun.nps.edu/public/bitstream/handle/10945/40009/93Sep_Vollweiler.pdf?sequence=1
copper, the copper powder was placed in a 6 molar HCI solution to remove the oxide layer prior to its addition to the molten tin - bismuth solder .
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Modern Electroplating 5th Edition
Z. Mei and J. W. Morris, Jr., “Characterization of Eutectic Tin - Bismuth Solder Joints,” J. Electron. Mat., 21, 599 (1992).
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Examination of compound formation at interface of tin–bismuth–silver solder and copper substrate by using electron probe micro analysis
The poor wettability of tin – bismuth solders may be caused by the growth of dendritic copper–tin compounds at the copper/solder interface, in contrast to the case of tin–lead solder.
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ZPRSO2004P049
The mechanical properties of bismuth - tin solders may be improved considerably by the addition of 0.5% Ag.
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The properties of tin-bismuth alloy solders
Furthermore, few studies of the mechanical properties of the bulk alloy and model solder joints have been re- ported.2-6 Tin - bismuth solders will not .
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Soldering: Understanding the Basics
In addition to the traditional tin-lead alloys, wave soldering has been adapted to other solders, including the eutectic tin - bismuth solder and the tin-lead-bismuth alloys (Ref 6.14).
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Green Electronics Design and Manufacturing: Implementing Lead-Free and RoHS-Compliant Global Products > Reliability of Green Electronic Systems
Tin / bismuth solder alloys are much less commonly used for solder attachment than are tin/silver/copper or tin/copper alloys because of the potentially deleterious effects of the interaction between tin/bismuth and tin/lead.
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Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder
0·45 g in weight, of the tin - bismuth solder alloy were cut from 6 mm dia. cast finger- mold sticks.