Products & Services
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Supplier: Belmont Metals, Inc.
Description: . Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt
- Applications: Chemical / Materials Processing, Other
- Metal / Alloy Types: Tin / Tin Alloy
- Shape / Form: Other
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Supplier: Belmont Metals, Inc.
Description: . Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt
- Applications: Chemical / Materials Processing, Other
- Metal / Alloy Types: Lead / Lead Alloy, Tin / Tin Alloy
- Shape / Form: Other
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Supplier: Belmont Metals, Inc.
Description: . Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt
- Applications: Chemical / Materials Processing, Other
- Metal / Alloy Types: Tin / Tin Alloy
- Shape / Form: Other
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Supplier: Belmont Metals, Inc.
Description: . Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt
- Applications: Chemical / Materials Processing, Other
- Metal / Alloy Types: Tin / Tin Alloy
- Shape / Form: Other
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Supplier: Indium Corporation
Description: Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are triangular in shape (1.4 lbs./bar) packed 18 bars/box 25 lbs./box Minimum order quantity is: 25 lbs.
- Alloy: Tin-Silver (Sn-Ag), Other
- Form / Shape: Other
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Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties; good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
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Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Indium Corporation
Description: A low temperature lead-free alloy that is more malleable than BiSn. Alloy: 57Bi 42Sn 1.0Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 140ºC Solidus Melting Temperature: 139ºC Pb-Free: Yes
- Alloy: Tin-Silver (Sn-Ag)
- Lead Free: Yes
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into
- Alloy: Tin-Lead (Sn-Pb)
- Approvals / Conformance: ASTM / UNS
- Conductivity: 5.86E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
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Supplier: Technic, Inc.
Description: Technistan Ag is a patent-pending high speed plating process that deposits a semi-bright to full bright tin-silver alloy in the range of 90-99% tin. Technistan Ag deposits have an extremely stable alloy composition across a wide range of plating process variables. Even
- Chemical / Process: Tin Plating
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Supplier: Accuris
Description: Method for The determination of silver in solders (Volumetric: ammonium thiocyanate method) Methods for the sampling and analysis of tin and tin alloys
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Supplier: RS Components, Ltd.
Description: Tin and silver alloy in packaging suitable for wave soldering machines and tinning crucibles. Bar dimensions: 380 x 15 x 8 mm. Product Form = Granules Melting Point = +221°C Percent Silver = 4% Percent Tin = 96% Product Weight = 500g
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Powder
- Melting Range: 430 F
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Supplier: RS Components, Ltd.
Description: Lead-free alloy for use with wave soldering machines and tinning crucibles. Complies with Directive RoHS 2002 / 95 / CE. Product Form = Wire Melting Point = +228°C Percent Silver = 0.3% Percent Tin = 99% Product Weight = 280g Percent Copper = 0.7%
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 442 F
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Supplier: RS Components, Ltd.
Description: Lead-free alloy for use with wave soldering machines and tinning crucibles. Complies with Directive RoHS 2002 / 95 / CE. Product Form = Granules Melting Point = +217 - +228°C Percent Silver = 0.3% Percent Tin = 80 - 100% Product Weight = 500g Percent Copper = 0.7%
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Powder
- Melting Range: 423 to 442 F
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Description: ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and without
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Supplier: RS Components, Ltd.
Description: the soldering tip. Reduced Fe leaching. Application: For use in hand soldering and automatic solder feed applications Wire Diameter = 1mm Model Number = WSW SAC LO Product Form = Wire Melting Point = +217 °C, +221 °C Percent Silver = 3% Percent Tin = 96.5% Flux
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 to 430 F
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Supplier: ASTM International
Description: This specification covers solder metal alloys used as solders for the purpose of joining together two or more metals at temperatures below their melting points. The solder alloy shall conform to the required chemical compositions of cadmium, zinc, tin, lead,
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Supplier: Waldom Electronics
Description: .032 DIAMETER IN INCH 0.032 INCH DIAMETER 60 TIN/38 LEAD/2 SILVER FILLER METAL DIAMETER IN INCH - UOM IN
- Diameter / Thickness: 0.0320 inch
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Description: Flat, Shaped and Round Wire APPLICATIONS Cupronickels Alloys: Condensers; Evaporator and heat exchanger application; Ferrules; Applications where biofouling is a concern; Silver colored coinage. Copper-Nickel-Tin Alloys: Relay springs; Switch springs; Lead frames
- Alloy: Yes
- Applications: Electrical / HV Parts, Electronics / RF-Microwave, Marine, Other
- Features: Corrosion Resistant, Cold Work (Die / Mold)
- Metal / Alloy Types: Copper, Brass or Bronze Alloy (UNS C)
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Supplier: CSA Group
Description: ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
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Supplier: Umicore Metal Deposition Solutions
Description: . The trademark MIRALLOY® comes from the English words “mirror“ and “alloy“. It refers to the Bronze Age, when copper and tin were used to make mirrored alloys. MIRALLOY® denotes electroplating processes for the deposition of alloy coatings of copper and tin
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Supplier: MacDermid Alpha Electronics Solutions
Description: A lead-free alloy delivering best-in-class yield, outperforming Sn/Cu-based materials. Product Overview SAC305 alloy is a proven, industry-standard lead-free solder composed of tin, silver, and copper, offering excellent thermal fatigue resistance and reliable
- Lead Free: Yes
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Supplier: Washington Alloy Co.
Description: and shiny – will not discolor or tarnish. Columbia 14G offers higher tensile strength than lead-tin solders. Deposits are corrosion resistant and can be chrome plated. Description Acid core, cadmium free-lead free general purpose silver bearing solder
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Supplier: MacDermid Alpha Electronics Solutions
Description: Silver-free lead-free alloy for wave, selective and rework applications. Product Overview ALPHA SnCX Plus 07 is a no-silver, lead-free alloy designed as a replacement for SnPb, SAC305, and other low-silver SAC alloys in wave soldering, selective
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Supplier: Cole-Parmer
Description: levers. These low cost but well built relays have solder-free construction and no internal wires. Relays have a non-polarized green LED indicator for easy verification of operating status. Contact material is silver tin oxide indium for the two-pole relays and gold-silver
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Supplier: ILSCO Corporation
Description: 16 AWG MIN. CONDUCTOR SIZE 14 AWG MAX. CONDUCTOR SIZE 10 PER BAG STANDARD PACKAGE NON INSULATED INSULATION TYPE ILSCO[R] BRAND MATERIAL ELECTRO TIN PLATED HIGH STRENGTH COPPER ALLOY SILVER SOLDER BRAZED SEAM WIDTH 1/4 INCH
- International (mm2): 1.31 to 2.08 mm2
- Terminal Type: Other
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Supplier: Components Corporation
Description: tin finish. Materials: Contact Material: .015" x .040" Phosphor Bronze #510 Alloy, 1/2 hard Finish: .0001 Matte Tin over .0001 Nickel or .0001" Min. Silver over .00005" Min. Copper Tape Material: 12mm Wide; Pitch: 4mm; Conductive
- Features: Plated Holes
- Packing Method: Tape Reel, Bulk
- Standards / Compliances: REACH, RoHS Compliant
- Type / Mounting: Surface Mount
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Supplier: MacDermid Alpha Electronics Solutions
Description: -Based Electrolytes for Semiconductor Wafer Plating The process is suited for high-speed electrodeposition, producing smooth surface morphology, solderable reflowed bumps with tight control of alloy compositions. Pre-Reflow Uniformity, Wide Process Window, Tin-Silver Capping
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Supplier: TE Connectivity
Description: Contact Finish : Silver Contact Timing : Non-Shorting Keylock Switch Contact Current Rating (AMP) : 3 Terminals/Fixed Contact Material : Tin-Lead Plate Electrical Characteristics
- Actuator Material: Metallic
- Actuator Specifications: Keylock
- Base Material: Metallic
- Maximum AC Voltage Rating: 125 volts
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1294261-S1017 Category: Connectors, Interconnects>Barrel - Power Connectors Series: S10 Features: Strain Relief Connector Type: Plug Termination: Solder Package: Bulk Contact Material: Copper Alloy Gender: Female Shielding
- Current Rating: 11 amps
- Voltage Rating: 24 volts
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Supplier: Win Source Electronics
Description: : Solder Connector Style: BNC Housing Color: Silver Number of Ports: 1 Standard Package: 1 Mounting: Through Hole, Right Angle Impedance: 50Ohm Body Material: Zinc Alloy Shield Termination: Solder Body Finish: Nickel Center Contact Material: Phosphor Bronze
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Supplier: Win Source Electronics
Description: Manufacturer: CUI Devices Win Source Part Number: 811372-SJ1-2503A Packaging: Bulk Mounting Style: Through Hole, Right Angle Connector Type: Phone Jack Termination: Solder Contact Material: Brass; Copper Alloy Gender: Female Shielding: Unshielded Housing
- Number of Contacts: 3 #
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Supplier: TE Connectivity
Description: : Tactile Contact Features Contact Base Material : Copper Alloy Contact Current Rating (MAMP) : 50 Switch Contact Plating Material : Silver Dimensions
- Actuator Specifications: Other
- Base Material: Thermoplastic / Plastic
- Configuration: Normally Open (NO)
- Pushbutton Material: Thermoplastic / Plastic
Find Suppliers by Category Top
Featured Products Top
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ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. Advancing Performance with Innolot MXE (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
-quality lead-free alloy that is capable of soldering at a temperature lower than standard tin silver copper alloys. ALPHA HRL3 solder alloy is able to demonstrate reliability performance comparable to standard tin silver copper alloys (SAC305). To ensure consistent sphere size, uniformity, and alloy content, ALPHA Solder Spheres are manufactured to the highest quality control standards. (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
award celebrates a collaboration of more than two decades, during which MacDermid Alpha has supplied advanced solder alloys, pastes, adhesives, and cleaners to support Syrma SGS’s expansion into one of India’s most technologically advanced manufacturers. In 2025, MacDermid Alpha (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
compatibility, improved coplanarity, and EH&S compliance. MICROFAB TS-650 NXG is designed for lead-free and capping applications, providing exceptional within-wafer (WIW), within-die (WID), and within-feature (WIF) uniformity. The tunable tin-silver alloy produced by MICROFAB TS-650 NXG removes the (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
The automotive, communication infrastructure, and consumer electronics components industry require higher processing power for increased reliability. To satisfy these requirements, high reliability solder alloys, along with protective and reinforcement polymers the life of electronic components (read more)
Browse Filler Alloys and Consumables Datasheets for MacDermid Alpha Electronics Solutions -
, this new preform technology is offered in all SAC, Innolot and low-temp SnBi alloys. For more information on ALPHA® AccuFlux™ BTC-578 Solder Preforms, visit the Alpha website (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
. “Reliability is never the result of a single material or process,” said Scott Lewin, Technical Business Development Director at MacDermid Alpha Electronics Solutions. “It comes from selecting a coordinated set of materials engineered to work together - solder pastes, alloys, reinforcements (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
QQB575) and are available in tinned copper, silver plated copper and bare copper constructions. Cooner Wire’s braided copper strap provides high performance, high flexibility and is available in (read more)
Browse Bare Conductor Wire and Cable Datasheets for Cooner Wire Company -
circular mil area of any AWG size. We stock flexible wire rope in tinned copper, bare copper and silver-plated copper. Also known as grounding (read more)
Browse Wire Rope and Mechanical Cable Datasheets for Cooner Wire Company
Conduct Research Top
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Induction Soldering 101: An Introduction For Beginners
joined, but the most common fillers for induction soldering include alloys such as tin-silver, tin-zinc, and tin-lead.
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Why Lead-Free Soldering is Better
. Some of the harmful alloys that are used in normal soldering are tin, copper, silver bismuth, indium, zinc, and antimony. So why are these dangerous to humans everywhere? Prior to 1930, all homes used lead pipes to transport water to and from houses. Now, most homes use copper piping. However
More Information Top
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Ultrasound diagnostics of the superconducting cable connections between the main ring magnets of LHC
Each cable joint or splice is made inside a specifically designed cable junction box as shown in Figure 1 which allows the 2 cables together with 3 strips of tin / silver soldering alloy to be reliably and accurately superimposed and held …
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Characterization of lead-free solder by reliability testing
In this paper, a chip scale package (CSP) is used to investigate the characteristics of the tin - silver solder alloy .
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Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies > SOLDER JOINTS
These materials, however, maintain excellent wetting and creep strength, similar to the tin - silver solder alloys .
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Solid State Lighting Reliability
Tin silver copper solder alloy (Sn–Ag–Cu) AuSn .
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Evaluation of interconnect technologies for power semiconductor devices
Eutectic lead-tin solder was used instead of the preferred higher melting point tin - silver solder alloy , for reasons discussed later.
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FlashSoldering update-extending fine magnet wire joining applications
The authors have only experimented with 90/10 and 63/37 tin-lead and 9614 tin - silver solder alloys .
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Effects of rare earths on properties and microstructures of lead-free solder alloys
M. Pei, J.M. Qu, Effect of Lanthanum doping on the micro- structure of tin - silver solder alloys .
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Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
To meet the ever-demanding challenges, lead- free solders such as tin - silver solder alloys have re- ceived considerable attention.
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ZCP2012IBSCLFS
… No. 9, 2001, 1050-1059 [8] Anon, "Rare-Earth solders Make Better Bounds", Photonics Spectra, Vol. 36, No. 5 (2002), 139 [9] M. Pei and J. Qu, "Effect of Lanthanum Doping on the Microstructure of Tin - Silver Solder Alloys " J. Elect.
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ZCP2012IBSC221
… No. 9, 2001, 1050-1059 [8] Anon, "Rare-Earth solders Make Better Bounds", Photonics Spectra, Vol. 36, No. 5 (2002), 139 [9] M. Pei and J. Qu, "Effect of Lanthanum Doping on the Microstructure of Tin - Silver Solder Alloys " J. Elect.