Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Indium Corporation
Description: Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are triangular in shape (1.4 lbs./bar) packed 18 bars/box 25 lbs./box Minimum order quantity is: 25 lbs.
- Features: Other
- Solder Alloy: Tin-Silver (Sn-Ag)
-
Supplier: Belmont Metals, Inc.
Description: Solders Featuring Body solders, Lead-base, Lead-free solders, Low melting solders, Miter-Al-braze (MAB), Tin-Antimony solders, Tin-base, Tin-Cadmium solders, Tin-Lead solders, Tin-Zinc solders Soldering is a
- Features: Other, Solid Wire
-
Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties; good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Size: 1.00" x .002" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Features: Strip / Sheet / Foil
- Solder Alloy: Tin-Silver (Sn-Ag)
-
-
Supplier: Allied Electronics, Inc.
Description: Fast-acting and instant wetting design allows for faster soldering. The non-corrosive, non-conductive flux is ideal where a strong, long-lasting bond is needed. Available in any size ranging from 0.005" to 0.250". Also available for Fed Spec QQ-S-571d. Two standard put-ups: 1 Lb. and 5 Lbs. spools;
-
Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Diameter / Thickness: 0.3 inch
- Features: Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
-
Supplier: Technic, Inc.
Description: will have a consistent alloy in all areas of the part. This is very important, as the melting temperature of the alloy can range from 221° C at the tin-silver eutectic – 96.5% Sn/3.5% Ag to over 300° C for the silver rich 90/10 deposit. Therefore, the alloy
- Chemical / Composition: Tin Plating
-
Supplier: Accuris
Description: Method for The determination of silver in solders (Volumetric: ammonium thiocyanate method) Methods for the sampling and analysis of tin and tin alloys
-
Supplier: Belmont Metals, Inc.
Description: are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt Alloys, Bronze Alloys, ACS Grade for Chemical use
- Applications: Chemical / Materials Processing
- Features: Non-ferrous - Any Type, Other, Tin / Tin Alloy
- Type: White / Low Melting (UNS L)
-
Supplier: Belmont Metals, Inc.
Description: are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt Alloys, Bronze Alloys, ACS Grade for Chemical use
- Applications: Chemical / Materials Processing
- Features: Lead / Lead Alloy, Non-ferrous - Any Type, Other, Tin / Tin Alloy
- Type: White / Low Melting (UNS L)
-
Supplier: Belmont Metals, Inc.
Description: are added to tin-lead solders to increase their strength. These solders can be used for joints subjected to high or even subzero service temperatures. Applications Casting, Plating, Solder, Babitt Alloys, Bronze Alloys, ACS Grade for Chemical use
- Applications: Chemical / Materials Processing
- Features: Non-ferrous - Any Type, Other, Tin / Tin Alloy
- Type: White / Low Melting (UNS L)
-
Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire,
- Melting Range: 460 F
- Conductivity: 58,580,000,000 µS/cm
- Approvals / Conformance: ASTM / UNS
- Product Form: Paste, Powder, Preform
-
Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
-
Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Features: Flux Cored Wire, Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview The Innolot alloy offers creep resistance properties that significantly improve reliability over standard Tin-Silver-Copper (SAC) and SnAg alloys. These preforms are available in a wide range of sizes, with 3N or 4N purity, and bondline control.
-
Supplier: Indium Corporation
Description: This alloy has excellent thermal fatigue properties. Good high temperature lead-free alloy. Alloy: 96.5Sn 3.5Ag Diameter: .030" Quantity: 3 ft Spool Liquidus Melting Temperature: 221ºC Eutectic Solidus Melting Temperature: 221ºC Eutectic Pb-Free: Yes
- Diameter / Thickness: 0.03 inch
- Features: Solid Wire
- Solder Alloy: Tin-Silver (Sn-Ag)
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Product Overview ALPHA SACX Plus 0307 is a low-silver, lead-free alloy designed as a replacement for SnPb, SAC305, and other low-silver Tin-Silver-Copper (SAC) alloys, including the original SACX 0307, in wave soldering, lead tinning, and rework processes.
- Solder Alloy: Lead Free
-
Supplier: ASTM International
Description: This specification covers solder metal alloys used as solders for the purpose of joining together two or more metals at temperatures below their melting points. The solder alloy shall conform to the required chemical compositions of cadmium, zinc, tin, lead,
-
Supplier: RS Components, Ltd.
Description: Tin-Ag-Cu alloy lead free solder, 0.4mm
- Diameter / Thickness: 0.014960638 inch
- Features: Other, Solid Wire
- Solder Alloy: Tin-Lead (Sn-Pb), Tin-Silver (Sn-Ag)
-
Supplier: ASTM International
Description: 1.1 This specification covers metal alloys (commonly known as soft solders), including zinc-aluminum, zinc-aluminum-copper, zinc-tin, zinc-tin-copper, zinc-cadmium-tin, zinc-cadmium, tin-zinc, cadmium-zinc, cadmium-zinc-silver, and
-
Description: ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tin-bismuth; tin-copper, with and without
-
Supplier: CSA Group
Description: ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
-
Supplier: ASTM International
Description: This specification covers low-melting point metal alloys and soldiers, including bismuth-tin, bismuth-lead, bismuth-tin-lead, bismuth-tin-lead-cadmium, bismuth-tin-lead-indium-cadmium, bismuth-tin-lead-indium, indium-lead, indium-lead-silver, and
-
Supplier: Allied Electronics, Inc.
Description: Solder Termination, Female Cable Connector All metal for EMI applications. Standard threaded coupling. Die-cast brass shells with nickel-plating for 6 mm cables, 24-20 AWG wires. IP Rating: IP67 (water resistant). Current Rating: 60-250 V, 3-5 A. Shielded. Solder area is
-
Supplier: Allied Electronics, Inc.
Description: Solder Termination, Female Cable Connector All metal for EMI applications. Standard threaded coupling. Die-cast brass shells with nickel-plating for 6 mm cables, 24-20 AWG wires. IP Rating: IP67 (water resistant). Current Rating: 60-250 V, 3-5 A. Shielded. Solder area is
-
Supplier: Allied Electronics, Inc.
Description: Solder Termination, Male Cable Connector All metal for EMI applications. Standard threaded coupling. Die-cast brass shells with nickel-plating for 6 mm cables, 24-20 AWG wires. IP Rating: IP67 (water resistant). Current Rating: 60-250 V, 3-5 A. Shielded. Solder area is
-
Supplier: Waldom Electronics
Description: .032 DIAMETER IN INCH 0.032 INCH DIAMETER 60 TIN/38 LEAD/2 SILVER FILLER METAL DIAMETER IN INCH - UOM IN
- Diameter / Thickness: 0.032 inch
-
Description: Flat, Shaped and Round Wire APPLICATIONS Cupronickels Alloys: Condensers; Evaporator and heat exchanger application; Ferrules; Applications where biofouling is a concern; Silver colored coinage. Copper-Nickel-Tin Alloys: Relay springs; Switch springs; Lead frames;
- UNS Number: 72,500
- Tensile Strength (UTS, Break): 43,000 psi
- Yield Strength (YS): 19,000 psi
- Elongation: 35 %
-
Supplier: Umicore Materials
Description: MIRALLOY® comes from the English words “mirror“ and “alloy“. It refers to the Bronze Age, when copper and tin were used to make mirrored alloys. MIRALLOY® denotes electroplating processes for the deposition of alloy coatings of copper and tin or of copper,
-
Supplier: Umicore Metal Deposition Solutions
Description: MIRALLOY® comes from the English words “mirror“ and “alloy“. It refers to the Bronze Age, when copper and tin were used to make mirrored alloys. MIRALLOY® denotes electroplating processes for the deposition of alloy coatings of copper and tin or of copper,
-
Supplier: MacDermid Alpha Electronics Solutions
Description: Tin-silver bump metallization bath allows high-speed electro-deposition of smooth, fine-grained, uniform tin silver alloy bumps. Product Overview MICROFAB TS-650 NXG is the tin-silver bump, pillar, and capping metallization process for wafer level
-
Supplier: ILSCO Corporation
Description: 22 AWG MIN. CONDUCTOR SIZE 18 AWG MAX. CONDUCTOR SIZE 10 PER BAG STANDARD PACKAGE NON INSULATED INSULATION TYPE ILSCO[R] BRAND MATERIAL ELECTRO TIN PLATED HIGH STRENGTH COPPER ALLOY SILVER SOLDER BRAZED SEAM WIDTH 1/4 INCH
- International (mm2): 0.32552 to 0.82301 mm2
- Features: Other
-
Supplier: Washington Alloy Co.
Description: higher tensile strength than lead-tin solders. Deposits are corrosion resistant and can be chrome plated. Description Acid core, cadmium free-lead free general purpose silver bearing solder. Applications Columbia 14G is a low temperature silver bearing
-
Supplier: ILSCO Corporation
Description: 16 AWG MIN. CONDUCTOR SIZE 14 AWG MAX. CONDUCTOR SIZE 10 PER BAG STANDARD PACKAGE NON INSULATED INSULATION TYPE ILSCO[R] BRAND MATERIAL ELECTRO TIN PLATED HIGH STRENGTH COPPER ALLOY SILVER SOLDER BRAZED SEAM SIZE 0.49 INCH L X 0.187 INCH W X 0.16 INCH THK
- International (mm2): 1.30864 to 2.0808 mm2
- Features: Other
-
Supplier: ILSCO Corporation
Description: 4 AWG MAX. CONDUCTOR SIZE UL, CSA APPROVAL 90 DEG C TEMPERATURE RATING 10 PER BAG STANDARD PACKAGE #10 STUD SIZE NON INSULATED INSULATION TYPE ILSCO[R] BRAND MATERIAL ELECTRO TIN PLATED HIGH STRENGTH COPPER ALLOY SIZE 1.3 INCH L X 0.66 INCH W FEATURES SILVER SOLDER BRAZED
- International (mm2): 21.149 mm2
- Terminal Type: Wire Lug
-
Supplier: Cole-Parmer
Description: relays have solder-free construction and no internal wires. Relays have a non-polarized green LED indicator for easy verification of operating status. Contact material is silver tin oxide indium for the two-pole relays and gold-silver alloy on silver for
Find Suppliers by Category Top
Featured Products Top
-
ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. Advancing Performance with Innolot MXE (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
-quality lead-free alloy that is capable of soldering at a temperature lower than standard tin silver copper alloys. ALPHA HRL3 solder alloy is able to demonstrate reliability performance comparable to standard tin silver copper alloys (SAC305). To ensure consistent sphere size, uniformity, and alloy content, ALPHA Solder Spheres are manufactured to the highest quality control standards. (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha's® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
award celebrates a collaboration of more than two decades, during which MacDermid Alpha has supplied advanced solder alloys, pastes, adhesives, and cleaners to support Syrma SGS’s expansion into one of India’s most technologically advanced manufacturers. In 2025, MacDermid Alpha (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
compatibility, improved coplanarity, and EH&S compliance. MICROFAB TS-650 NXG is designed for lead-free and capping applications, providing exceptional within-wafer (WIW), within-die (WID), and within-feature (WIF) uniformity. The tunable tin-silver alloy produced by MICROFAB TS-650 NXG removes the (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
The automotive, communication infrastructure, and consumer electronics components industry require higher processing power for increased reliability. To satisfy these requirements, high reliability solder alloys, along with protective and reinforcement polymers the life of electronic components (read more)
Browse Filler Alloys and Consumables Datasheets for MacDermid Alpha Electronics Solutions -
, this new preform technology is offered in all SAC, Innolot and low-temp SnBi alloys. For more information on ALPHA® AccuFlux™ BTC-578 Solder Preforms, visit the Alpha website (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
. “Reliability is never the result of a single material or process,” said Scott Lewin, Technical Business Development Director at MacDermid Alpha Electronics Solutions. “It comes from selecting a coordinated set of materials engineered to work together - solder pastes, alloys, reinforcements (read more)
Browse Solder Datasheets for MacDermid Alpha Electronics Solutions -
QQB575) and are available in tinned copper, silver plated copper and bare copper constructions. Cooner Wire’s braided copper strap provides high performance, high flexibility and is available in (read more)
Browse Bare Conductor Wire and Cable Datasheets for Cooner Wire Company -
circular mil area of any AWG size. We stock flexible wire rope in tinned copper, bare copper and silver-plated copper. Also known as grounding (read more)
Browse Wire Rope and Mechanical Cable Datasheets for Cooner Wire Company
Conduct Research Top
-
Induction Soldering 101: An Introduction For Beginners
joined, but the most common fillers for induction soldering include alloys such as tin-silver, tin-zinc, and tin-lead.
-
Why Lead-Free Soldering is Better
. Some of the harmful alloys that are used in normal soldering are tin, copper, silver bismuth, indium, zinc, and antimony. So why are these dangerous to humans everywhere? Prior to 1930, all homes used lead pipes to transport water to and from houses. Now, most homes use copper piping. However
More Information Top
Indicates content that may require registration and/or purchase.
-
Ultrasound diagnostics of the superconducting cable connections between the main ring magnets of LHC
Each cable joint or splice is made inside a specifically designed cable junction box as shown in Figure 1 which allows the 2 cables together with 3 strips of tin / silver soldering alloy to be reliably and accurately superimposed and held …
-
Characterization of lead-free solder by reliability testing
In this paper, a chip scale package (CSP) is used to investigate the characteristics of the tin - silver solder alloy .
-
Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies > SOLDER JOINTS
These materials, however, maintain excellent wetting and creep strength, similar to the tin - silver solder alloys .
-
Solid State Lighting Reliability
Tin silver copper solder alloy (Sn–Ag–Cu) AuSn .
-
Evaluation of interconnect technologies for power semiconductor devices
Eutectic lead-tin solder was used instead of the preferred higher melting point tin - silver solder alloy , for reasons discussed later.
-
FlashSoldering update-extending fine magnet wire joining applications
The authors have only experimented with 90/10 and 63/37 tin-lead and 9614 tin - silver solder alloys .
-
Effects of rare earths on properties and microstructures of lead-free solder alloys
M. Pei, J.M. Qu, Effect of Lanthanum doping on the micro- structure of tin - silver solder alloys .
-
Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
To meet the ever-demanding challenges, lead- free solders such as tin - silver solder alloys have re- ceived considerable attention.
-
ZCP2012IBSCLFS
… No. 9, 2001, 1050-1059 [8] Anon, "Rare-Earth solders Make Better Bounds", Photonics Spectra, Vol. 36, No. 5 (2002), 139 [9] M. Pei and J. Qu, "Effect of Lanthanum Doping on the Microstructure of Tin - Silver Solder Alloys " J. Elect.
-
ZCP2012IBSC221
… No. 9, 2001, 1050-1059 [8] Anon, "Rare-Earth solders Make Better Bounds", Photonics Spectra, Vol. 36, No. 5 (2002), 139 [9] M. Pei and J. Qu, "Effect of Lanthanum Doping on the Microstructure of Tin - Silver Solder Alloys " J. Elect.