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Supplier: Advanced Technology Group, Inc.
Description: inventory of raw material that can be quickly configured to your specific requirements. We invite you to explore our product offerings and contact us for any questions regarding your latest project. Transistor Outlines are classic packages that are still being used in today’s
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Supplier: Broadcom Inc.
Description: The Avago HCPL-M453 is a power module interface optocoupler. This small outline high CMR, high speed, diode-transistor optocoupler is a single channel device in a five lead miniature footprint. Its SO-5 JEDEC registered (MO-155) package outline does not require "through
- Collector Emitter Breakdown Voltage: 5 volts
- Isolation Voltage: 3750 volts
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 100 C
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Supplier: Broadcom Inc.
Description: The Avago HCPL-M452 is a power module interface optocoupler. This small outline high CMR, high speed, diode-transistor optocoupler is a single channel device in a five lead miniature footprint. Its SO-5 JEDEC registered (MO-155) package outline does not require "through
- Collector Emitter Breakdown Voltage: 5 volts
- Isolation Voltage: 3750 volts
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 100 C
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Description: Qnnect, formerly Hermetic Solutions Group has extensive experience in manufacturing power packaging, including high thermal dissipation power packages and power transistor outline packages. We have the largest selection of open tooling, plus custom capabilities for
- Materials: Other
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Supplier: Materion Corporation
Description: Materion Corporation provides ceramic air cavity packages that are industry standard outlines for RF Power Transistors. These packages offer proven performance and reliability. The cost-effective packages are excellent platforms for wireless applications in the 500
- Applications: Other
- Shape / Form: Bar Stock
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Supplier: Richardson RFPD
Description: GaN Wideband Transistor 28 V, 4 W. The MAGX-011086 GaN HEMT is a wideband transistor optimized for DC - 6 GHz operation in a user friendly package ideal for high bandwidth applications. The device has been designed for saturated and linear operation with output power levels of 4
- Package Type: Other
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Supplier: Win Source Electronics
Description: Manufacturer: EPC Win Source Part Number: 870588-EPC2015 Series: eGaN® Operating Temperature Range: -40°C ~ 150°C (TJ) Features: N-Channel 40 V 33A (Ta) - Surface Mount Die Outline (11-Solder Bar) Package: Reel - TR Package: Die Mounting: Surface Mount
- Package Type: SOT3, Other
- Polarity: N-Channel
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Supplier: Win Source Electronics
Description: Manufacturer: EPC Win Source Part Number: 918396-EPC2202 Series: Automotive, AEC-Q101, eGaN® Operating Temperature Range: -40°C ~ 150°C (TJ) Features: N-Channel 80 V 18A (Ta) - Surface Mount Die Outline (6-Solder Bar) Package: Reel - TR Package: Die
- Package Type: SOT3, Other
- Polarity: N-Channel
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Supplier: Broadcom Inc.
Description: the stretched SO-8 package outline meeting 8mm creepage and clearance requirements, designed to be compatible with standard surface mount process This digital IPM optocoupler uses an insulating layer between the light emitting diode and an integrated photo detector to provide
- Isolation Voltage: 1140 volts
- Mounting Option: Surface Mount
- Operating Temperature: -40 to 125 C
- Optocoupler Input: DC
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Supplier: Broadcom Inc.
Description: the stretched SO-8 pakcage outline meeting 8mm creepage and clearance requirements, designed to be compatible with standard surface mount process. This digital IPM optocoupler uses an insulating layer between the light emitting diode and an integrated photo detector to provide
- Isolation Voltage: 1140 volts
- Mounting Option: Surface Mount
- Operating Temperature: -40 to 125 C
- Optocoupler Input: DC
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Supplier: Win Source Electronics
Description: Manufacturer: EPC Win Source Part Number: 918387-EPC2001C Series: eGaN® Operating Temperature Range: -40°C ~ 150°C (TJ) Features: N-Channel 100 V 36A (Ta) - Surface Mount Die Outline (11-Solder Bar) Package: Die Package: Reel - TR Mounting: Surface
- Package Type: SOT3, Other
- Polarity: N-Channel
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Supplier: Win Source Electronics
Description: Manufacturer: EPC Win Source Part Number: 870587-EPC2014C Series: eGaN® Operating Temperature Range: -40°C ~ 150°C (TJ) Features: N-Channel 40 V 10A (Ta) - Surface Mount Die Outline (5-Solder Bar) Package: Die Package: Reel - TR Mounting: Surface Mount
- Package Type: SOT3, Other
- Polarity: N-Channel
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Supplier: Nexperia B.V.
Description: PNP/PNP resistor-equipped transistors (see ?Simplified outline, symbol and pinning? for package details). Features and benefits Built-in bias resistors Simplified circuit design Reduction of component count Reduced pick and place costs. AEC
- Package Type: Other
- Polarity: PNP
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Supplier: Infineon Technologies AG
Description: voltage Low voltage drop Small outline SOT 343 package Potential Applications For various applications like cellular and cordless phones, DECT, WLAN, PHS and RF modems. Applications Domestic robots Designers
- Package Type: Other
- Transistor Type: MOSFET, MOSFET RF Transistors
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Supplier: Nexperia B.V.
Description: NPN resistor-equipped transistor (see "Simplified outline, symbol and pinning" for package details). Features and benefits Built-in bias resistors Simplified circuit design Reduction of component count Reduced pick and place costs. AEC-Q101
- Package Type: SOT23, Other
- Polarity: NPN
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Supplier: Nexperia B.V.
Description: PNP resistor-equipped transistor (see ?Simplified outline, symbol and pinning? for package details). Features and benefits Built-in bias resistors Simplified circuit design Reduction of component count Reduced pick and place costs
- Package Type: SOT23, Other
- Polarity: PNP
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Supplier: Nexperia B.V.
Description: PNP resistor-equipped transistor (see ?Simplified outline, symbol and pinning? for package details). Features and benefits Built-in bias resistors Simplified circuit design Reduction of component count Reduced pick and place costs
- Package Type: SOT323, Other
- Polarity: PNP
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Supplier: TE Connectivity
Description: Product Type Features Connector & Contact Terminates To : Printed Circuit Board Package Outline Dimensions : TO-5 Product Type : Socket Terminal Configuration : Contact
- Contact Plating: Gold Plating
- Current Rating: 3 amps
- Mounting: Other
- Number of Contacts: 3
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Supplier: TE Connectivity
Description: Product Type Features Connector & Contact Terminates To : Printed Circuit Board Package Outline Dimensions : TO-5 Product Type : Socket Terminal Configuration : Contact
- Contact Plating: Gold Plating
- Current Rating: 3 amps
- Mounting: Other
- Number of Contacts: 3
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Supplier: TE Connectivity
Description: Product Type Features Connector & Contact Terminates To : Printed Circuit Board Package Outline Dimensions : TO-5 Product Type : Socket Terminal Configuration : Contact
- Contact Plating: Gold Plating
- Current Rating: 3 amps
- Mounting: Other
- Number of Contacts: 3
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Supplier: TE Connectivity
Description: Product Type Features Connector & Contact Terminates To : Printed Circuit Board Package Outline Dimensions : TO-5 Product Type : Socket Terminal Configuration : Contact
- Contact Plating: Gold Plating
- Current Rating: 3 amps
- Mounting: Other
- Number of Contacts: 8
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Supplier: Rochester Electronics
Description: FOD8802A - Dual Channel OptoHiT Series, High-Temperature Phototransistor Optocoupler In Small Outline 8-Pin Package
- Package Type: Other
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Supplier: Infineon Technologies AG
Description: OptiMOS™ 5 Power Block is a leadless SMD package in a 5.0x6.0mm² package outline, including a low-side and a high-side MOSFET in a synchronous buck converter configuration. By replacing two separate discrete packages, such as SO8 or SuperSO8, with the OptiMOS™ 5 Power
- Package Type: Other
- Polarity: N-Channel, Other
- Transistor Type: MOSFET, Power MOSFET
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Supplier: Infineon Technologies AG
Description: OptiMOS™ 5 Power Block is a leadless SMD package in a 5.0x6.0mm² package outline, including a low-side and a high-side MOSFET in a synchronous buck converter configuration. By replacing two separate discrete packages, such as SO8 or SuperSO8, with the OptiMOS™ 5 Power
- Package Type: Other
- Polarity: N-Channel, Other
- Transistor Type: MOSFET, Power MOSFET
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Supplier: Infineon Technologies AG
Description: N-channel depletion mode small signal transistor for industrial and consumer applications in SOT-23-3 package The N-channel depletion mode MOSFET BSS169I in SOT-23-3 package features VDS 100 V and RDS(on),max of 12 Ohm. With an optimal price
- Package Type: SOT23, Other
- Polarity: N-Channel, Other
- Transistor Type: MOSFET
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Supplier: Microchip Technology, Inc.
Description: The SY100ELT23 are dual differential PECL-to-TTL translators. Because PECL (Positive ECL) levels are used, only +5V and ground are required. The small outline 8-lead SOIC package and the low skew, dual gate design of the ELT23 makes it ideal for applications which require the
- Input Voltage: 5 volts
- Logic Family: Transistor-Transistor Logic (TTL), PECL
- Operating Current: 30 mA
- Package: SOIC, Other
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Supplier: Littelfuse, Inc.
Description: Package: Isolation Voltage: 2500 V~ Industry convenient Outline RoHS compliant Epoxy meets UL 94V-0 Soldering Pins for PCB Mounting Backside: DCB Ceramic Reduced Weight Advanced Power Cycling Low Drain to Tab Capacitance (< 40 pF) MOSFET Low RDS(ON) and QG Fast Switching Robust Design
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Supplier: Microchip Technology, Inc.
Description: Internal charge pump to drive the gate of an N-channel power FET above supply Available in small outline SOIC packages Internal zener clamp for gate protection 60µs typical turn-on time to 50% gate overdrive Programmable over-current sensing Dynamic current threshold for high in-rush
- Transistor Type: MOSFET
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Supplier: Richardson RFPD
Description: TRANSCLAMP-1 is a clamping device designed to provide improved thermal and electrical performance for RF Power Transistors. The clamp dimensions have been optimized for most “Gemini” packaged RF power transistors. Please consult Richardson RFPD for compatibility questions. Key
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Supplier: Light in Motion LLC
Description: interfacing with various logic level circuits. Conveniently packaged in a low profile Surface Mount Package. Features Small outline Surface Mount High Noise Immunity Buffer Open Collector Reception Angle 130O RoHS compliant
- Output Type: Current Output
- Photosensor Type: PN Photodiode
- Supply Voltage: 16 volts
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Supplier: Richardson RFPD
Description: B) of +29.5 dBm at 1960 MHz, making the SKY65162-70LF ideal for use in the driver stage of infrastructure transmit chains. The SKY65162-70LF uses low-cost Surface-Mount Technology (SMT) in the form of a 4-pin, 2.4 x 4.5 mm Small Outline Transistor (SOT-89) package.
- Frequency Range: 400 to 2700 MHz
- Maximum Gain: 24 dB
- Noise Figure: 3.6 dB
- Output Intercept Point (IP3): 40 dBm
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Supplier: Richardson RFPD
Description: The HMC219B is an ultraminiature, general-purpose, double balanced mixer in an 8-lead plastic surface mini small outline package with exposed pad (MINI_SO_EP). This passive monolithic microwave integrated circuit (MMIC) mixer is fabricated in a gallium arsenide (GaAs) metal
- Conversion Loss: 9 dB
- IF Frequency Range: 0.0 to 3000 MHz
- LO - IF Isolation: 35 dB
- LO - RF Isolation: 40 dB
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Supplier: Isobaud, Inc.
Description: The IBI100 consists of a phototransistor optically coupled to an AlGaAs infrared-emitting diode in a leadless hybrid surface mount package. Features Hybrid 6-pin package 1500Vdc isolation voltage High CTR Small package outline High
- Collector Emitter Breakdown Voltage: 30 volts
- Isolation Voltage: 1500 volts
- Mounting Option: Flat Pack
- Operating Temperature: -55 to 125 C
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Supplier: Micropac Industries, Inc.
Description: The 61010 is an N-P-N Planar Silicon Photodarlington Transistor in a small outline package designed to be housing mounted. Its large effective aperture and narrow angular response make this a highly sensitive device with minimum response to off-axis or stray light. This sensor
- Dark Current: 250 nA
- Operating Temperature: -55 to 125 C
- PN, PIN, or Avalanche: PN Photodiode, PIN Photodiode
- PSD: Yes
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Supplier: Skyworks Solutions, Inc.
Description: chains. The SKY65173-70LF uses low-cost Surface-Mount Technology (SMT) in the form of a 4-pin, 2.4 x 4.5 mm Small Outline Transistor (SOT-89) package.
- Amplifier Type: Low Noise Amplifier, Power Amplifier
- Frequency Range: 869 to 960 MHz
- Maximum Gain: 16.5 dB
- Maximum Operating Voltage: 5 volts
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High performance WLAN balun using integrated passive technology on SI‐GaAs substrate
A small outline transistor packaging technology with a three‐dimensional electromagnetic simulation is reported.
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WRCIP Environmental Test Shoot-Out, PEMS vs. CHP Surface Mount Transistors
These components are manufactured in a HSOT (Hermetic Small Outline Transistor ) package by Sertech Labs, a Microsemi Company.
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A CPW FED planar monopole antenna with modified H shaped slot for WLAN/Wi‐MAX application
A small outline transistor packaging technology with a three-dimensional electromagnetic simulation is reported.
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Process Parameters in Resistance Projection Welding for Optical Transmission Device Package
Keywords acceptable welding range, helium leak test, process parameter, resistance projection welding, transistor outline package .
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Springer Handbook of Lasers and Optics
Often the detector is housed in a hermetically sealed transistor outline package (e.g. TO-5, TO-39, or TO- 8) to protect it from the environment and to RF shield integrated FETs or operational amplifiers.
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Microsensor packaging
Silicon pressure sensors have been packaged for many years in dedicated TO ( transistor outline ) packages with pressure ports in either the baseplate or the cover (e.g., In®neon KPY 40 Series [8]).
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http://dspace.mit.edu/bitstream/handle/1721.1/37686/127297129-MIT.pdf?sequence=2
Lower performance, cost sensitive devices are assembled in less expensive transistor outline package formats such as TO-46 and TO-56.[18] The butterfly package is still the most popular optoelectronic packaging choice.
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New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level
The sample is mounted on a transistor outline package (TO) (left), which is mounted on a dedicated holder with electrical connections (center) that can be placed in the nano indenter (left).
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Newport Corporation Offers Eutectic Assembly Into 'TO Packages' On The MRSI-605 Advanced Packaging Die Bonder
Transistor Outline Packages or "TO Packages" commonly called TO Cans or TO Headers are a popular package style for photonics applications.
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Colorless Optical Transmitter for Upstream WDM PON Based on Wavelength Conversion
The RSOA used in the experiment is an un- cooled device housed in a transistor outline package .