UV Resin

Description: Low intensity UV Curable Resins. These products are water clear and cure to a smooth, bubble free finish. Low cost, low intensity lights are all that is needed to cure these unique polymer systems.

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Features: Protective, Weather / UV Resistant
• Form: Liquid
• Industry: Other

Description: UV Cure 7155TM and 7156TM are low intensity UV Curable Resins. These products are water clear and cure to a smooth, bubble free finish. Low cost, low intensity lights are all that is needed to cure these unique polymer systems. UV Cure 7155TM and 7156TM also have superior

• Chemical / Polymer System Type: Epoxy
• Compound Type: Liquid
• Dielectric Constant: 3.16
• Electrical Resistivity: 1.62E9 ohm-cm

Description: Our UV curable resins are materials that are polymerized and cured in a short time by the energy radiated from ultraviolet irradiation devices. We offer our UV curing adhesives in many variations to meet almost any industrial need. Curing is completed in several seconds through

• Chemical / Polymer System Type: Silicone
• Elongation: 500 %
• Substrate / Material Compatibility: Rubber / Elastomer
• Viscosity: 330000 cP

Description: Polymer Resin

• Compound Type: Molding Resin
• Filler Material: Unfilled
• Melt Flow Index (MFI): 5.5 g / 10 minutes

Description: Polymer Resin

• Compound Type: Molding Resin
• Filler Material: Unfilled

Description: Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C.

• Cure Type / Technology: Reactive / Moisture Cured, UV / Radiation Cured (also EB, Light)
• Elongation: 15 %
• Industry: Electronics
• Use Temperature: -63.4 to 399 F

Description: To avoid hydrolytic degradation during processing, Vandar resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40°F (-40°C) at 250°F (121°C) for 4 hours.

• Compound Type: Molding Resin
• Deflection Temperature (@ 264 psi, 1.8 MPa): 120 F
• Elongation: 150 %
• Filler Material: Unfilled

Description: To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40°F (-40°C) at 250°F (121°C) for 4 hours.

• Compound Type: Molding Resin
• Deflection Temperature (@ 264 psi, 1.8 MPa): 131 F
• Elongation: 45 %
• Filler Material: Unfilled

Description: It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials.

• Chemical / Polymer System Type: Acrylic / Polyacrylate
• Cure Type / Technology: Reactive / Moisture Cured, UV / Radiation Cured (also EB, Light)
• Industry: Electronics
• Use: Conformal Coating, Encapsulant / Potting Compound

Description: Delrin® 527UV NC010 is a medium viscosity acetal homopolymer resin with UV stabilizers developed for automotive interior applications. It has improvements in UV aging characteristics and thermal stability over Delrin® 507. Pushing the Limits: Delrin® High Performance

• Chemical / Polymer System Type: Acetal
• Coeff. of Thermal Expansion (CTE): 1 µin/in-F
• Dielectric Constant: 3.4
• Elongation: 200 %

Description: Delrin® 527UV BK701 is a medium viscosity black acetal homopolymer resin with UV stabilizers developed for automotive interior applications. It has improvements in UV aging characteristics and thermal stability over Delrin® 507. Pushing the Limits: Delrin® High

• Chemical / Polymer System Type: Acetal
• Coeff. of Thermal Expansion (CTE): 0.8889 µin/in-F
• Industry: Other
• Material Type / Grade: Thermoplastic

Description: UV Cure 60-7105 is a low viscosity urethane adhesive, coating and potting compound. This UV curable resin exhibits outstanding adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Elongation: 20 %
• Features: Encapsulanting / Potting, Elastomeric
• Industry: OEM / Industrial

Description: UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound and coating. This UV Curable Resin is formulated to provide excellent water and chemical resistance. It is a good choice for potting electronic assemblies exposed to excessive moisture. UV Cure 7114

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Features: Encapsulanting / Potting, Elastomeric
• Industry: OEM / Industrial
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic

Description: Delrin® 127UV BK701 is a high viscosity, UV stabilized acetal homopolymer. It has excellent impact strength, UV resistance and thermal stability. It is well suited for automotive interior applications. Pushing the Limits: Delrin® High Performance Acetal Resin Solutions

• Chemical / Polymer System Type: Acetal
• Coeff. of Thermal Expansion (CTE): 0.8889 µin/in-F
• Industry: Automotive
• Material Type / Grade: Thermoplastic

Description: Delrin® 127UV is a high viscosity acetal homopolymer with UV stabilizers developed for automotive interior applications. It has improvements in UV aging characteristics and thermal stability over Delrin ® 107. Pushing the Limits: Delrin® High Performance Acetal Resin

• Chemical / Polymer System Type: Acetal
• Coeff. of Thermal Expansion (CTE): 0.9444 µin/in-F
• Dielectric Constant: 3.3
• Elongation: 250 %

Description: Suitable for stress-sensitive materials, PC/PVC strong bonding. This product shows excellent adhesion to most substrates including glass, many plastics and most metals.

• Composition: Single Component System
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Elongation: 250 %
• Industry: Electronics

Description: Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 33 to 39 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.76
• Dissimilar Substrates: Yes

Description: General Polymers 3526 LOW TEMPERATURE MULTIPURPOSE EPOXY RESIN is a two-component, high solids epoxy resin designed for use in concrete toppings, slurries, machine grouting, beam repair and preservation of concrete where rapid cure, moisture tolerance and chemical resistance are

• Chemistry: Epoxy, Resin Base / Polymer Binder
• Features: Anti-Static / ESD Control, Chemical / Oil Resistant, Conductive, Weather / UV Resistant
• Form: Liquid
• Substrate / Surface: Concrete / Masonry

Description: UV-curable cationic epoxy adhesive. Designed for use in sealing glass lid of packages of area image sensors such as CCD and CMOS.

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Industry: Electronics
• Viscosity: 27000 cP

Description: ThreeBond 3114 is an epoxy resin based solvent- free ultraviolet-curing resin. Since the resin cures through optical cationic polymerization it is not inhibited from curing by oxygen, and it excels in surface curability. TB3114 cures to a free, fast setting anaerobic reactive

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)

Description: on aircraft, automobiles, and solar panels. LUMIFLON coatings protect steel, aluminum and other metals as well as concrete from degradation by UV light, wind and rain, and corrosion. A transparent fluor resin, LUMIFLON can be used to make both clear and pigmented coatings. Because of

• Filler Material: Unfilled
• Industry: Aerospace, Automotive, Composite Structures
• Process Type: Molding Resin

Description: Mainly used for polycarbonate bonding, and will not produce stress cracking under typical compression stress. It can be quickly cured under sufficient UV or visible light to form a flexible and transparent adhesive layer. This product is suitable for most substrates, including Glass, many

• Elongation: 265 %
• Industry: Medical / Food (Sanitary / FDA)
• Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic
• Use Temperature: -67 to 302 F

Description: (Known as HYSOL UV3000 ) LOCTITE ECCOBOND UV 3000 is a UV curable adhesive designed for high throughput assembly operations. This adhesive can withstand exposure to temperatures as high as 200°C. It can be used for glass bonding as well as lens attach applications on photonics,

• Coeff. of Thermal Expansion (CTE): 41.67 µin/in-F
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Industry: Electronics
• Viscosity: 5300 cP

Description: is excellent even when exposed to adverse environmental conditions including heat and moisture. The superior performance profile of the Master Bond UV10 and UV10TK is due to their unique chemical composition. Master Bond UV10 and UV10TK are based on a polyfunctional epoxy

• Coeff. of Thermal Expansion (CTE): Over 33 µin/in-F
• Dielectric Constant (Relative Permittivity): Over 3.45
• Dissimilar Substrates: Yes
• Elongation: 4 %

Description: LOCTITE UV8800M is a UV cure encapsulant for smart card and other COB applications.

• Coeff. of Thermal Expansion (CTE): 22.78 µin/in-F
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Form: Specialty / Other
• Industry: Electronics

Description: Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): Over 33 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.76
• Dissimilar Substrates: Yes

Description: Master Bond UV15FL is a new one component, high strength, low viscosity, flexible UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 42 to 47 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.81
• Dissimilar Substrates: Yes

Description: ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued shrinkage and movement. Bond lines are clear, colorless and exhibit low shrinkage during the curing

• Chemical / Polymer System Type: Specialty / Other
• Composition: Two Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
• Dielectric Constant (Relative Permittivity): 4.3

Description: LUMIFLON® is the first solvent-soluble fluoropolymer resin for coatings that can be cured at room temperature or at elevated temperatures. LUMIFLON resins, used in topcoats, are ultra-weatherable, and maintain their excellent appearance on buildings, bridges, and other structures, as

• Filler Material: Unfilled
• Industry: Aerospace, Automotive, Composite Structures
• Process Type: Molding Resin

Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electroni c casting and encapsulating applications that require

• Chemical / Polymer System Type: Polyurethane (PU, PUR)
• Composition: Two Component System, Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
• Dielectric Constant (Relative Permittivity): 4.3

Description: Thermosetting resin and UV curable resin - Determination of shrinkage by continuous measurement method

Description: Thermosetting resin and UV curable resin \x97 Determination of shrinkage by continuous measurement method

Description: A new series of water clear casting resins that are mercury free, have high physical properties, and are available in multiple gel times. Exceptional clarity with refractive indices ranging from 1.502-1.585 Available in 10, 20 and 40 min. gel times

• Elongation: 13 %
• Filler Material: Unfilled
• Industry: Tooling / Molds
• Tensile Strength (Break): 6800 psi

Description: HYSOL UV3001 is a UV cure adhesive designed for high throughput assembly operations. It can withstand exposure to temperatures as high as 200°C. It is the 4 µm glass rod spacer version of UV3000 adhesive.

• Industry: Electronics

Description: Eastman Spectar UV™ copolyester (PETG) extrudes into plastic sheet that is sparkling clear, tough, chemically resistant, odor free, versatile, easy to work with and affordable. Its toughness allows fabricators to use thinner gauge sheet than with other common materials, resulting in lower

• Chemical / Polymer System Type: Polyester (PET, PBT)
• Material Type / Grade: Thermoplastic

Description: General Polymers 4844 PAce-Cote is a unique high solids resin utilizing polyaspartic technology. It has been formulated to to produce a fast curing, durable coating with excellent ultraviolet and weathering characteristics, matched with good chemical resistance, high temperature performance

• Chemistry: Resin Base / Polymer Binder, Other
• Features: Chemical / Oil Resistant, Heat Resistant / High Temperature, Weather / UV Resistant
• Form: Liquid
• Operating / Use Temperature: Up to 300 F

Description: Material Status Commercial: Active Availability Asia Pacific Features Good UV Resistance Uses Bottles

• Material Type / Grade: Thermoplastic
• Pellets: Yes
• Process Type: Film Grade Resin
• Tensile Strength (Break): 6960 psi

Description: Simplify your Masking Process prior to surface preparation & finishing operations. Formulated to have no effect on alloys, CM Mask cures in seconds upon exposure to UV light; offering increased productivity, lower assembly costs and enhanced worker and environmental safety. When cured with

• Form: Liquid
• Industry: OEM / Industrial
• Technology: Radiation Cured - UV Irradiation
• Type: Masking Compounds

Description: high intensity long wavelength UV light (365 nm). Full strength will be reached in 24 hours. Cure fillets at UV light irradiances above 60 milliwatts/cm² to insure proper cure.

• Composition: Single Component System
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
• Form: Specialty / Other
• Industry: Electronics, Electrical Power / HV

Description: Material Status Commercial: Active Availability Asia Pacific Features Good UV Resistance Medium Impact Resistance

• Material Type / Grade: Thermoplastic
• Pellets: Yes
• Process Type: Molding Resin
• Tensile Strength (Break): 6540 psi

Description: Material Status Commercial: Active Availability Asia Pacific Features Good UV Resistance Forms Pellets Processing Method Extrusion

• Material Type / Grade: Thermoplastic
• Pellets: Yes
• Process Type: Extrusion Grade Resin
• Tensile Strength (Break): 2840 psi

Description: Resin Designs UV 165-183 UV Curing Adhesive Pink is a one component, thixotropic, fast-curing urethane acrylate that bonds well with a variety of substrates. Provides the ability to fluoresce under black light for adhesive visibility during bonded assembly inspection. UV

• Cure Type / Technology: Single Component System
• Substrate / Material Compatibility: Plastic
• Viscosity: 7000 to 90000 cP

Description: Epoxy adhesive formulated with 100% solids, has no odor, and no solvents

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 41.67 µin/in-F
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Dielectric Strength: 400 kV/in