Wafer Robot

Description: The six-axis SV3CR robot is designed for use in a Class 1 cleanroom environment and is suitable for wafer handling and interbay applications. It can also be used for wafer cassette handling, disk substrate, media handling, and flat panel display applications. The robot

• Number of Axes: 6 #
• Load Capacity: 3 kg
• Reach: 677 mm
• Robot Type: Articulated Robot

Description: The Motoman CR3 Clean Robot is a six-axis vertically articulated robot made for cleanroom applications. The CR3 is Class 1 approved for the highest clean environmental conditions according to Federal standards. It has a wide freedom of movement for handling work.bsp; With 6 degrees of

• Number of Axes: 6 #
• Load Capacity: 3 kg
• Reach: 694 mm
• Robot Type: Articulated Robot

Description: The Motoman CR20 is a six-axis vertically articulated robot made for cleanroom applications. The CR20 has a wide freedom of movement for handling work.bsp; With 6 degrees of freedom, this robot is able to handle workpieces in situations where 2- or 3- axis horizontal type robots

• Number of Axes: 6 #
• Load Capacity: 20 kg
• Reach: 1,658 mm
• Robot Type: Articulated Robot

Description: End effectors, also referred to as semiconductor handling "blades", are the robot's hand to handle and move semiconductor wafers between positions. So end effectors must be dimensionally precise and thermally stable, while having a smooth, abrasion-resistant surface to safely handle

• Features: Alumina / Aluminum Oxide, Carbide Materials, Silica / Silicate Materials, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride, Quartz, Silicon Carbide, Yttria
• Applications: Chemical / Materials Processing, Wear Parts / Tooling
• Shape / Form: Wafer Carrier / Holder

Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant distribution over the

• Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
• Measurements: Area Mapping, Particle Contamination
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: Ask for current price. The SLR 200 series robot allows for manual loading and unloading of 8-inch standard SMIF pods containing a wafer or reticle cassette.

Description: Ask for current prices. Visit Genmark Automation for more information on these Axcelis tool wafer handling robots.

Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Integrated VPD capability enables automatic VPD preparation of one wafer while a TXRF

• Maximum Wafer / Part Size: 150.00000000000003 to 300.00000000000006 mm
• Measurements: Area Mapping, Particle Contamination
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: Applied Materials Precision 5000 (P5000) Cryo pumps Dry pumps Power supplies Turbo pumps VAT valves Wafer robots Water chillers Call us for the system components you need.

Description: Alumina Ceramic Robot Arm F Type CNC machined The ceramic robot arm provided by our company is mainly divided into clamping type, bearing type and vacuum adsorption type. The sizes are 2 ", 4", 6 ", 8", 12 ", and non-standard sizes can be customized. The F-type left and right vacuum

• Density: 3.8999975386044725 g/cc
• Compressive / Crushing Strength: 377,095.7823287122 psi
• Material Type: Alumina / Aluminum Oxide

Description: cassettes and press the receipe start button and let the process begin.Multiple automation platforms are available depending on your space constrainsts. JST offers front robots, rear robots or overhead robots with either front or side loading. Optional turntables are available

Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer

• Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone
• Features: Other

Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic wafer

• Maximum Wafer / Part Size: 200 to 300.00000000000006 mm
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: Floor Mounted / Stand-alone
• Features: Other

Description: The Nanotronics Imaging nSpec® is an inspection device designed for high resolution microscopy and detection of wafer defects. With particular application in silicon carbide and Galium Nitride epi wafers, the nSpec® offers fast quantification and qualification of defects with detailed

• Measurements: Defects / ADC
• Mounting / Loading: Manual Loading
• Technology: Optical / Imaging System
• Applications: Semiconductor Wafers

Description: The Brooks Automation PAVS6 is a robotic arm designed for use in the semiconductor and electronics manufacturing industries. It is a 6-axis robot that provides high precision and accuracy in its motion control, making it well-suited for tasks such as material handling, assembly, and

• Number of Axes: 6 #
• Load Capacity: 7 kg
• Reach: 770 mm
• Industry / Application: Assembly, Inspection, Material Handling (e.g., Loading/Unloading, Palletizing)

Description: The Brooks Automation PP100 is a high-performance robotic arm designed for use in the semiconductor and electronics manufacturing industries. The PP100 is a 6-axis robot that provides high precision and accuracy in its motion control, making it well-suited for tasks such as material handling,

• Number of Axes: 6 #
• Load Capacity: 2 kg
• Reach: 663 mm
• Industry / Application: Assembly, Inspection, Material Handling (e.g., Loading/Unloading, Palletizing)

Description: system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant distribution over the

• Maximum Wafer / Part Size: 200 mm
• Measurements: Area Mapping, Particle Contamination
• Mounting / Loading: Floor Mounted / Stand-alone
• Form Factor: Monitor / Instrument

Description: semiautomatic 150 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages,

• Maximum Wafer / Part Size: 150.00000000000003 mm
• Measurements: Electrical Test - Parametric / In-line
• Mounting / Loading: Manual Loading
• Technology: Optical / Imaging System

Description: DISCONTINUED BY MANUFACTURER, SERVO POSITIONING CONTROLLER, WAFER HANDLING ROBOT CONTROLLER, 90-132 VAC, 47-66 HZ, 15 AMP/ 250 V. FREE 2 YEAR RADWELL WARRANTY

• Continuous Output Current: 15 amps
• Supply Voltage (AC): 132 volts

Description: These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles offset and angular

• Bore Diameter: 0.09 to 0.185 inch
• Coupling Diameter: 0.75 inch
• Rated Torque: 1.875 In-lbs
• Rated Speed: 5,000 rpm

Description: notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and cassette-to-cassette robotic wafer handling. The different F60-c instruments are distinguished primarily by thickness and wavelength

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling. The different F60-t instruments are distinguished primarily by thickness and wavelength range. Generally shorter

• Measurements: Area Mapping
• Applications: CVD / PVD Films, Semiconductor Wafers
• Mounting / Loading: In-situ / System Mounted
• Form Factor: Monitor / Instrument

Description: masks, flat panel displays and printed circuit boards. The H112 can easily accommodate 12 inch (300 mm) wafers and works with many robot arm wafer loaders. In addition, the H112 can be used for transmitted light applications with 250 mm x 250 mm transmitted light area.

• Maximum X-Distance: 302 mm
• Maximum Y-Distance: 302 mm
• Minimum Step Size (Resolution): 0.09999999999999999 µm
• Stage Type: Motorized Stage

Description: High purity, Perlast® and Kimura® materials are widely used in wafer handling applications as end-effector pads because they provide optimized friction to maintain wafer positional accuracy, and prevent particulation due to their wholly organic nature. PPE are experts in providing

Description: sensor detects the position and any damage to wafers and cells. It allows robots to pick up and lay down wafers accurately. Wafers and solar cells with fine breakouts can be directly rejected during this step, before they can completely break up and damage other material.

• Horizontal Resolution: 600 lines
• Features: Industrial, Machine Vision Sensor, Other, Smart Camera
• Monochrome / Color: Monochrome

Description: yields the lowest total cost of ownership. APPLICATIONS: Semiconductor assembly Electronics assembly Precision machine tools Robotic handlers Wafer processing Automation

Description: These machines support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips. Hybrid placement of wafers and SMDs Wafer and reel part placement in a single unit. Supports tray part and reel part placement as well as direct pickup

Description: JST offers affordable semi-automated systems in both rotary and linear transfer designs. Rotary Transfer stations can accomodate single or dual rotary arms. JST's robot uses DC servo motors for efficient transfers with high reliability. This servomotor technology provides precise position

Description: has large clear center aperture that can be used for air or wire line feed-through or beam delivery. Semiconductor assembly Electronics assembly Precision machine tools Robotic handlers Wafer processing Automation

Description: Application Scenarios: It is widely used in step height measurement, thickness measurement, wafer surface testing, flatness measurement, center pointing, positioning of the needle of the dispenser, CNC tool positioning, and the positioning of the industrial robot. ● The laser

• Applications: Alignment / Guidance, Assembly Quality, Bar / Matrix Code, Biotechnology or Medical, Color Mark / Color Recognition, Container or Product Counting, Edge Detection, Electronics Rework, Electronics or Semiconductor Inspection, Flaw Detection, Food & Beverage, Gauging, Scanning & Dimensioning, ID

Description: servo and stepper motor feedback systems, robotic arms and wafer-handling machines. Avago also offers a wide range of accessories to complement its encoder products. These accessories include cables, connectors, code wheels and alignment tools. The company offers the industry encoder products

• Operating Temperature: -40 to 185 F
• Features: Digital, Incremental, Optical, Signal Quadrature
• Sensor Technology: Linear Encoder

Description: Hydraulic Systems Swivels and Booms Downhole Applications Aerospace Manifold Gaskets Landing Gear Systems Braking Systems Flight Controls Electronics / Semiconductor Robotic Equipment CVD / DVD Chamber Precision Pumps Seals for Wet and Dry Wafer Fabrication Life Science Advanced Analytic

• O-ring Hardness (Durometer): 50 durometer
• Synthetic Rubbers: Fluoroelastomer (FKM)

Description: applications requiring frequent directional changes. Semiconductor assembly Electronics assembly Precision machine tools Robotic handlers Wafer processing Automation

Description: assembly Electronics assembly Precision machine tools Robotic handlers Wafer processing Automation

Description: schemes, including FMCW and Doppler. Integrated digital blocks controlling the chip are implemented to support radar system design. The device is manufactured in Infineon’s B11HFC BiCMOS technology, offering a cutoff frequency higher than 300GHz. It is housed in Infineon's plastic embedded

• Input (Supply) Voltage: 1.5 volts
• Operating Temperature: -40 to 85 C
• Standards and Certifications: RoHS Compliant