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Supplier: RobotWorx
Description: longer reach.bsp; This robot can easily be repositioned for inverse kinematics. By using the Motoman CR20, a flexible handling system can be achieved under high-level clean conditions.bsp; It is ISO Class 3 and is capable of wafer cassette handling and large LCD handling.
- Load Capacity: 20 kg
- Number of Axes: 6 #
- Reach: 1658 mm
- Type: Articulated Robot
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Supplier: RobotWorx
Description: The Motoman CR3 Clean Robot is a six-axis vertically articulated robot made for cleanroom applications. The CR3 is Class 1 approved for the highest clean environmental conditions according to Federal standards. It has a wide freedom of movement for handling work.bsp; With 6 degrees of
- Load Capacity: 3 kg
- Number of Axes: 6 #
- Reach: 694 mm
- Type: Articulated Robot
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Supplier: RobotWorx
Description: The six-axis SV3CR robot is designed for use in a Class 1 cleanroom environment and is suitable for wafer handling and interbay applications. It can also be used for wafer cassette handling, disk substrate, media handling, and flat panel display applications. The robot
- Features: Ceiling Mounted, Wall Mounted
- Load Capacity: 3 kg
- Number of Axes: 6 #
- Reach: 677 mm
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Supplier: Rigaku Corporation
Description: XY? sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: Rigaku Corporation
Description: XY? sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Integrated VPD capability enables automatic VPD preparation of one
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 150 to 300 mm
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Supplier: CoorsTek
Description: End effectors, also referred to as semiconductor handling "blades", are the robot's hand to handle and move semiconductor wafers between positions. So end effectors must be dimensionally precise and thermally stable, while having a smooth, abrasion-resistant surface to safely handle
- Applications: Chemical / Materials Processing, Wear Parts / Tooling
- Shape / Form: Wafer Carrier / Holder
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Supplier: PTB Sales, Inc.
Description: Ask for current prices. Visit Genmark Automation for more information on these Axcelis tool wafer handling robots.
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Supplier: PTB Sales, Inc.
Description: Ask for current price. The SLR 200 series robot allows for manual loading and unloading of 8-inch standard SMIF pods containing a wafer or reticle cassette.
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Supplier: Filmetrics, Inc.
Description: -board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and the option to upgrade to fully robotic wafer handling. The different F60-t instruments are distinguished primarily by thickness and wavelength range.
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: Filmetrics, Inc.
Description: include automatic notch finding, automatic on-board baselining, an enclosed measurement stage with motion interlock, an industrial computer with pre-installed software, and cassette-to-cassette robotic wafer handling. The different F60-c instruments are distinguished primarily by
- Applications: Semiconductor Wafers, CVD / PVD Films
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
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Supplier: PTB Sales, Inc.
Description: Ask for current price. The Brooks FabExpress (FX3000) is a atmospheric bridge system designed to simultaneously handle 200mm and 300mm wafers. The FX3000 is optimized with the Brooks Reliance robotics automation component set (robot and aligner) and the Brooks family of Load
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Supplier: Nanotronics Imaging
Description: ' nPlace? wafer transfer system, an automatic robot system. This system features interchangeable wafer chucks and a 25 piece loading capacity. Please see Nanotronics' web site for a video demonstration of the nPlace in action.
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Measurement Capability: Defects / ADC
- Mounting / Loading: Manual Loading
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Supplier: SemiProbe
Description: a semiautomatic 300 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 300 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: a semiautomatic 100 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 100 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: a semiautomatic 200 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 200 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: SemiProbe
Description: a semiautomatic 150 mm system that meets their precise specifications and requirements. The Probe System for Life (PS4L) family of wafer probing systems is designed based on SemiProbe's patented adaptive architecture. Unlike traditional probe systems, all foundation modules - bases, stages,
- Applications: Semiconductor Wafers
- Form Factor: Wafer Probing System
- Maximum Wafer / Part Size: 150 mm
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: PTB Sales, Inc.
Description: Ask for current price. The Brooks Gemini Express 5000 (GX5000) is a vacuum cluster tool integration platform for 200mm to 300mm wafers, with the capability for two load locks and three process facets. The GX5000 handles wafers without mechanical changes, and is ideally suited for PVD
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Supplier: TSI Incorporated
Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 10 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 200 to 300 mm
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: TSI Incorporated
Description: This fully automated particle deposition system deposits PSL and SiO2 spheres as small as 20 nm. Calibrate and qualify your defect inspection tools with ease, confidence, and efficiency by producing high volumes of high-quality custom 300 mm and 200 mm calibration standards. Robotic
- Applications: Semiconductor Wafers, CVD / PVD Films
- Form Factor: Other
- Maximum Wafer / Part Size: 200 to 300 mm
- Mounting / Loading: Floor Mounted / Stand-alone
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Supplier: 3X Ceramic Parts Company Limited
Description: Alumina Ceramic Robot Arm F Type CNC machined The ceramic robot arm provided by our company is mainly divided into clamping type, bearing type and vacuum adsorption type. The sizes are 2 ", 4", 6 ", 8", 12 ", and non-standard sizes can be customized. The F-type left and right
- Compressive / Crushing Strength: 377096 psi
- Density: 3.9 g/cc
- Material Type: Alumina / Aluminum Oxide
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Supplier: Rigaku Corporation
Description: XY? sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of the contaminant
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: Rigaku Corporation
Description: 's patent pending X-Y-? sample stage system, an in-vacuum wafer robotic transfer system, and new user-friendly windows software. All of these contribute to higher throughput, higher accuracy and precision, and easy routine operation. Optional Sweeping TXRF software enables mapping of
- Applications: Semiconductor Wafers
- Area Mapping: Yes
- Form Factor: Monitor / Instrument
- Maximum Wafer / Part Size: 200 mm
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Supplier: JST Manufacturing, Inc.
Description: Whether processing 6", 8", or 12" wafers or a combination, JST can design an automated wet process tool to meet your needs. Multiple platforms are available as well as a combination acid and/or solvent tool.Multitasking is based on look ahead scheduling to ensure optimal throughput. Just load
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Supplier: Renbrandt, Inc.
Description: These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles offset and
- Bore Diameter: 0.1200 to 0.1250 inch
- Coupling Diameter: 0.7500 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Speed: 5000 rpm
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Supplier: Renbrandt, Inc.
Description: mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles offset and
- Bore Diameter: 0.1562 to 0.1850 inch
- Coupling Diameter: 1 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Speed: 5000 rpm
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Supplier: Renbrandt, Inc.
Description: Inch (38.1 mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash. Low inertia. Handles
- Bore Diameter: 0.4531 to 0.4687 inch
- Coupling Diameter: 1.5 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Speed: 5000 rpm
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Supplier: Renbrandt, Inc.
Description: OUTER DIAMETER 2 1/2 Inch (63.5 mm) These couplings are especially designed for precision instruments. encoder drives. robotics. aircraft equipment. radar. laser. optical/mechanical devices. computers. precision remote controls. UNEQUALED PERFORMANCE. Some of the features are: Zero backlash.
- Bore Diameter: 0.1875 to 0.9375 inch
- Coupling Diameter: 2.5 inch
- Coupling Type: Wafer / Flexible Disc
- Rated Torque: 240 In-lbs
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, SERVO POSITIONING CONTROLLER, WAFER HANDLING ROBOT CONTROLLER, 90-132 VAC, 47-66 HZ, 15 AMP/ 250 V. FREE 2 YEAR RADWELL WARRANTY
- Continuous Output Current: 15 amps
- Supply Voltage (AC): 132 volts
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Supplier: Prior Scientific, Inc.
Description: ideal for scanning a wide range of semiconductor wafers, photo masks, flat panel displays and printed circuit boards. The H112 can easily accommodate 12 inch (300 mm) wafers and works with many robot arm wafer loaders. In addition, the H112 can be used for transmitted
- Features: Programmable, Slide Holder
- Lighting: Reflected Light, Transmitted Light
- Maximum X-Distance: 302 mm
- Maximum Y-Distance: 302 mm
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Supplier: RS Components, Ltd.
Description: Features and Benefits. Non shorting changeover timing. Number of wafer, 1. Rotational Torque 30±3° Contact Configuration = 3P4T Contact Current Rating = 150 mA Number of Switch Positions = 4 Number of Contacts = 3 Voltage Rating = 12V dc Diameter = 26mm Dimensions = 23.6 (Dia.) x 36mm
- Maximum Current Rating: 0.1500 amps
- Maximum DC Voltage Rating: 12 volts
- Number of Poles: 3 poles
- Terminal Type: PCB Pins, Other
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Supplier: Precision Polymer Engineering Ltd.
Description: assembly and optimum friction to allow fast robotic handling. The PPE range of materials includes elastomers with both low and high coefficients of friction, to allow tailoring of wafer retention force. In addition, PPE offers dissipative end-effectors molded from unique elastomer
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Supplier: Fuji America Corporation
Description: These machines support placing small LEDs and bare dies at high-speed as well as performing hybrid production including flip chips. Hybrid placement of wafers and SMDs Wafer and reel part placement in a single unit. Supports tray part and reel part placement as well
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Supplier: SensoPart
Description: order to combat rising cost pressure in the production of solar cells. The compact sensor detects the position and any damage to wafers and cells. It allows robots to pick up and lay down wafers accurately. Wafers and solar cells with fine breakouts can be directly
- Horizontal Resolution: 1936 lines
- Lens Mount: C-Mount
- Monochrome / Color: Monochrome
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Supplier: SensoPart
Description: order to combat rising cost pressure in the production of solar cells. The compact sensor detects the position and any damage to wafers and cells. It allows robots to pick up and lay down wafers accurately. Wafers and solar cells with fine breakouts can be directly
- Application / Industry: Industrial, Other
- Horizontal Resolution: 600 lines
- Imaging Technology / Camera Type: Smart Camera
- Monochrome / Color: Monochrome
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Supplier: Broadcom Inc.
Description: scanners to servo and stepper motor feedback systems, robotic arms and wafer-handling machines. Avago also offers a wide range of accessories to complement its encoder products. These accessories include cables, connectors, code wheels and alignment tools. The company offers the
- Operating Temperature: -40 to 185 F
- Technology: Linear Encoder
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INSACO Offers Wafer Carriers With or Without Multiple Holes INSACO, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience (read more)
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PPE are experts in providing low contact force solutions for your wafer handling requirements. The PPE range of materials includes elastomers with both low and high coefficients of friction, to allow tailoring of wafer retention force. High purity elastomer materials, such as PPE (read more)
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Semiconductor and precision manufacturing often face particle contamination, thermal deformation, and mechanical wear during wafer transfer. Metal arms may introduce impurities or lose accuracy under high (read more)
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Beyond semiconductor wafer handling, these high-performance end effectors are ideal for precision machining, medical robotics demanding biocompatibility, and chemical processing equipment operating in (read more)
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High-Precision Alumina Ceramic End Effector Tailored for Semiconductor Wafer Handling This end effector is made from premium alumina ceramic, combining exceptional wear and (read more)
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of Capacities and Sizes Available in 2-axis, 3-axis, and 6-axis versions, the sensors cover capacities from 5 kg up to 5000 kg, with compact heights and versatile dimensions to suit various installation requirements. This flexibility makes them suitable for integration in robotic arms (read more)
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Torque motors have a large diameter due to the hollow shaft. This makes it possible to run the z-axis rod of a SCARA robot, with the (read more)
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Designed for wafer transfer in semiconductor equipment Compatible with robotic arms and vacuum handling systems Supports 8-inch and (read more)
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Ultratech downgraded amid slow LTP adoption Japanese wafer maker cuts jobs Wacker shutters two 200-mm wafer plants in Germany Motorola's semi separation stings Singapore center ASIC vendors mull cost issues at FSA Expo FSA panel studies time-to-market issues More readers rename Motorola SPS
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Impact of Thermal Limits on Motor Performance
For semiconductor equipment, motors are essential components, and are used in various systems such as indexing (theta) tables and wafer-handling robots. Motor torque is extremely important, but to get higher torque, you need to apply higher current. As current increases, motor winding temperature
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Suit settlement will impact Micro Linear's 3Q results Robotic Vision lands $1 million order in Thailand ASM subsidiary books assembly line orders over $20 million Infineon to offer smart card platform with Microsoft operating system NEW ORDERS & DESIGN WINS Samsung stops Rambus chip production
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
wafer demand In its electronic materials business, Japan's Shin-Etsu Chemical Ltd. (SEH) posted an operating income of 15.3 billion yen ($136.4 million) on sales of 80.3 billion yen ($715.7 million) in its first fiscal quarter ended June 30. ITRS roadmap committee wants to drop term 'technology node
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Advanced manufacturing equipment: a vertical batch furnace for 300-mm wafer processing
From the WIP area, the cassette robot moves the cassettes sequentially to the wafer robot , which places the wafers one by one in a vertical boat.
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Predicting and managing system interactions at early phase of the product development process
wafer robot arm and its motion path .
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Verification studies of thermophoretic protection for EUV masks
A test bed was assembled that included a vacuum wafer robot , thermophoretic test chamber, showerhead assembly, calibrated particle source, and a KLA/Tencor 6420 surface scanner (see Fig. 3).
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LabX.com New and Used Laboratory Equipment and Scientific Instruments
Wafer Robot .
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LabX.com New and Used Laboratory Equipment and Scientific Instruments
Wafer Robot Handler Assembly From DNS 60A Coater?
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LabX.com New and Used Laboratory Equipment and Scientific Instruments
Wafer Robot .
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Productive application of voltage contrast for detection of optically undetectable defects
Two wafer robots are used.
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Automated solar cell assembly team process research. Annual subcontract report, 1 January 1993--31 December 1993
R-8-z wafer robots , common in the semiconductor industry, were found to be too slow to meet our 4 s/cell requirement.
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Robot
Abstract：This paper surveys robotic wafer handling system for integrate circuit manufacturing,and reviews the operating principle and research results of the main components of the system,i.e., wafer robot and prealigner.
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Micro-ball wafer bumping for flip chip interconnection
Wafers are loaded from a case using wafer robot .