Products & Services
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Supplier: Vimfun Diamond Wire Saw
Description: The SBM4- 300 is a cutting-edge multi-wire diamond cutting machine tailored for wafer slicing. Utilizing a continuous 30-kilometer diamond wire, this equipment delivers unmatched precision, efficiency, and environmental benefits, making it an ideal choice for high-demand wafer
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Supplier: Accuris
Description: Single crystal wafers for surface acoustic wave (SAW) device applications Specifications and measuring methods
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Supplier: Accuris
Description: Single crystal wafers for surface acoustic wave (SAW) devices applications - Specifications and measuring method
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Supplier: Accuris
Description: Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods
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Supplier: Accuris
Description: Single crystal wafers for surface acoustic wave (SAW) device applications \x96 Specifications and measuring methods
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Description: definition. - Etch channels maximum number at quartz wafer of seed which do not pass through from surface to back surface are classified for three grades in 4.2.13 a). Users use seed portions of quartz wafers for devices. They request quartz wafers with less etch channels in
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Supplier: CSA Group
Description: definition. - Etch channels maximum number at quartz wafer of seed which do not pass through from surface to back surface are classified for three grades in 4.2.13 a). Users use seed portions of quartz wafers for devices. They request quartz wafers with less etch channels in
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Supplier: Kayaku Advanced Materials, Inc.
Description: Designed for cavity definition and capping in applications such as BAW, SAW, and microfluidic devices, these resists provide excellent alignment accuracy, low‑temperature processing, and high‑quality bond formation. Perminex adhesives enable patterning and bonding of wafers with high
- Applications: Electronics / Microelectronics
- Thick Film Type: Resistor
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Description: Applies to single crystal wafers intended for manufacturing substrates made of synthetic quartz crystal, lithium niobate, lithium tantalate, lithium tetraborate crystals for surface acoustic wave (SAW) filters and resonators. Lays down specifications and measuring methods.
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Supplier: Acme Chip Technology Co., Limited
Description: MOSFET COOL MOS SAWED WAFER
- Packing Method: Bulk Pack
- Features: MOSFET, Other
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Description: Specifies the terms and definitions for single crystal wafers applied for surface acoustic wave (SAW) devices representing the state of the art, which are intended for use in the standards and documents of IEC technical committee 49.
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Description: IEC 61994-4-4:2018 gives the terms and definition for single crystal wafers for surface acoustic wave (SAW) devices representing the state of the art. This edition includes the following significant technical changes with respect to the previous edition: - the new terms and definitions
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Supplier: AENOR
Description: Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods
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Supplier: CSA Group
Description: IEC 61994-4-4:2010(E) specifies the terms and definitions for single crystal wafers applied for surface acoustic wave (SAW) devices representing the state of the art, which are intended for use in the standards and documents of IEC technical committee 49. This second edition cancels
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Supplier: AENOR
Description: Single crystal wafers applied for Surface Acoustic Wave (SAW) device appplications - Specifications and measuring methods
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Supplier: CSA Group
Description: IEC TS 61994-4-4:2018 is available as IEC TS 61994-4-4:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61994-4-4:2018 gives the terms and definition for single crystal wafers for
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Supplier: AENOR
Description: Single crystal wafers for surface acoustic wave (SAW) device appplications - Specifications and measuring methods (Endorsed by AENOR in February of 2006.)
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Supplier: AENOR
Description: Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods (Endorsed by AENOR in March of 2013.)
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Supplier: Chemetall
Description: Tech Cool MicroCut 28S is a fully synthetic coolant specially formulated for wire-saw cutting of the toughest materials, including ceramics and metallic alloys. This coolant can be used on annular saws for wafering ceramics, optical, electro-optical and quartz materials and is designed
- Function: Coolant (Flood / Mist), Grinding Fluid
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Supplier: CSA Group
Description: IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - and minimally or partially encapsulated die and wafers. This
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Supplier: Foctek Photonics, Inc.
Description: LiNbO3 crystals for laser frequency doublers, OPOs and quasi-phase-matched doublers, as well as waveguide substrate and SAW wafers. High quality LiNbO 3; finished components with aperture of (2 - 15) x (2 - 15) mm2 and length up to 50 mm for frequency doublers and optical parametric
- Material: LiNbO3
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Supplier: Ushio America, Inc.
Description: This projection aligner uses our unique large area projector lens technology, light source and other optical technologies developed by Ushio over many years. Provides one-shot exposure of up to 8-inch wafers without touching the mask. Large depth of field enables proper exposure of non-flat
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Supplier: ASTM International
Description: 1.1 This test method describes a technique to measure the depth of damage, on or beneath the surface of silicon wafers prior to any heat treatment of the wafer. Such damage results from mechanical surface treatments such as sawing, lapping, grinding, sandblasting, and shot peening. 1.2
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Supplier: ASTM International
Description: This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method describes a technique to measure the depth of damage, on or beneath the surface of silicon wafers prior to any heat treatment of the wafer. Such damage results from mechanical surface treatments such as
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Synthetic Oils, Greases, and Lubricants - Synthetic Slicing and Grinding Coolant -- AmberSlice™ 202ASupplier: Saint-Gobain Surface Conditioning Group
Description: in highly technical applications. AmberSlice 202A also combines a special corrosion protection package with a broad spectrum biocide to provide outstanding system protection. Recommended uses include ID sawing and edge grinding of silicon wafers and other ceramic materials. Features &
- Density / Specific Gravity (@15.6°C, 60°F): 1.06 specific gravity
- Features: Biodegradable, Low / Non-foaming, Specialty, Synthetic / Semi-synthetic
- Type / Function: Coolant (Flood / Mist), Grinding Fluid, Metal Working Fluid
- Composition / Chemistry: Water Soluble / Emulsion
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Description: are also the ideal medium for manufacturing Pockel Cells, Q-switches, Phase Modulators, Waveguide Substrate, and Surface Acoustic Wave (SAW) Wafers, etc. Hangzhou Shalom EO provides the MgO(0.6~1.0%):LiNbO3/MgO(5mol%):LiNbO3 and non-dopant LiNbO3 Crystals, custom crystals delivered in
- Surface Quality: 20-10 Scratch / Dig
- Features: Other
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Supplier: Palomar Technologies, Inc
Description: Overview The Palomar 8000i Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. Its patented Dual Z-Axis bond head enables very reliable Deep Access wire bond
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Semiconductor Materials Optical Glass Sapphire Components Quartz Processing Silicon Wafers Gemstone Cutting Advanced Ceramic Materials Manufacturing Expertise Vimfun specializes in the (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
Wafer producers frequently face kerf loss, slurry contamination, and yield instability during slicing. Traditional slurry-based cutting adds cleaning costs and environmental burden, while inconsistent cutting (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
Semiconductor and advanced material manufacturers often face kerf loss, slurry contamination, and yield instability during wafer and material slicing. Slurry-based processes increase cleaning costs and environmental (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw -
Accuracy: ≤0.03 mm Positioning Accuracy: ±0.01 mm Diamond Wire Diameter: Ø0.35–0.8 mm Applications Semiconductor Material Processing Silicon Wafer Components Optical Glass Processing (read more)
Browse Wire Cutting Machines Datasheets for Vimfun Diamond Wire Saw
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Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
used to mount the wafer during the die sawing operation. The analytical equipment and methodology used to determine the failure mechanism are described. Auger Electron Spectroscopy and X-ray Photoelectron spectroscopy are used to identify the elements and their chemical states on the die bonding
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Commentary & analysis of week's chip news Japan's Ulvac rolls out wafer cleaning system METHUEN, Mass. -- Ulvac Technologies Inc. here has expanded its semiconductor equipment portfolio, announcing a new, low-cost cleaning system for 6- and 8-inch wafer fab applications. The new system, dubbed
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Comparative Analysis of Fracture Strength of Slurry and Diamond Wire Sawn Multicrystalline Silicon Solar Wafers
Silicon wafers used as substrates for photovoltaic (PV) solar cells are normally produced by the multi-wire slurry sawing (MWSS) process.[1] MWSS utilizes a loose silicon carbide (SiC) grit based slurry and a fast moving steel wire for wafer sawing .
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Handbook of Photovoltaic Science and Engineering 2nd Edition Complete Document
W-type modules 666 wafers see silicon-wafer solar cells Wannier – Mott excitons 676 – 8, 683 water-pumping PV systems 1080, 1084, 1100 – 1 weather conditions energy collection/delivery 994, 1038 photovoltaic systems 879 – 80 web see dendritic web …
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ZCP2000ISTFA369
Failure Analysis and Elimination of Galvanic Corrosion on Bondpads During Wafer Sawing Y. N. Hua, E. C.
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15th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes; Extended Abstracts and Papers
Cracks generated during wafer sawing or laser cutting can propagate due to wafer handling and solar cell processing such as, phosphorous diffusion, anti-reflecting coating, front and back contact firing, and soldering of contact ribbons.