Wet Etching

Description: JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. It's automated

Description: JST offers affordable semi-automated systems in both rotary and linear transfer designs. Rotary Transfer stations can accomodate single or dual rotary arms. JST's robot uses DC servo motors for efficient transfers with high reliability. This servomotor technology provides precise position

Description: Vertical processing is widely acknowledged as the preferred method for achieving optimum side-to-side and edge-to-edge uniformity. Technic’s MP200CS is an advanced roll-to-roll wet processing system that offers a variety of key benefits for today’s flexible printed circuits, metal foils, and

Description: Technic has long been pioneer in the ongoing development of printed circuit board wet processing equipment and chemistry. Our ongoing commitment to application research and in-house product development has enabled us to continuously offer our customers the most advanced technology available

• Machinery Type: Continuous Web - Reel to Reel
• Process / Technology: Electroplating
• Application / Industry: Printed Circuit Boards (PCB)

Description: Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal gate through JDP (Joint Development Program) with

• Applications: Etching - Plasma / Wet
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Plasma) etch system provides superior performance in profile control as well as in higher etching rate and selectivity compared to conventional ion-milling processes. Applicable wafer diameter 150mm, 200mm

• Applications: Etching - Plasma / Wet
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Next generation memories such as FeRAM (Ferroelectric Random Access Memory), ReRAM (Resistance Random Access Memory) and MRAM (Magnetoresistive Random Access Memory) require etching of novel non-volatile materials. However, by-product adhesion inside of etch chamber causes significant

• Applications: Etching - Plasma / Wet
• Mounting / Loading: Floor Mounted / Stand-alone

Description: Terra’s comprehensive range of constant-temperature baths, etching baths, dump risers, and other processing equipment is ideally suited for the high-purity requirements of the semiconductor industry. Microprocessor controls ensure the integrity of your operations.

Description: Ideal for etching, stripping and cleaning Ultra-pure, 99.995% contaminant-free processing vessel is ideal for critical chemistries Externally bonded 5-sided circuit heating element provides efficient, even heating for improved process yields Redundant safety features minimize potential damage

Description: The CS-137 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use BHF solution to etch silicon oxide and remove particles from the wafer surface. The CS-137 continually

Description: Ideal for etching, stripping and cleaning Seamless quartz vessel is 99.995% contaminant-free Externally bonded 5-sided circuit heating element provides efficient, even heating for improved process yields Redundant safety features minimize potential damage caused by runaway temperatures PVDF

Description: Precisely controlled low- or high-temperature processing (when used with RCe recirculating module) Natural polypropylene tank is ideal for etching, stripping, and developing with HF, KOH, CrO, and other chemistries (PVDF also available) Also functions as a stand-alone ambient-temperature bath

Description: Wafer gripper for extreme fast, reliable, precise and gentle handling of wet wafers in wet bench applications Handling of wafers after etching and cleaning processes Loading and unloading of conveyor belts Fully or partially automated production of silicon wafers with maximum

Description: AirClean® Systems’ wet scrubber system is a wet contact scrubber that is suitable for water soluble gases. Each scrubber is constructed from thermoplastics that are resistant to the gases being scrubbed. Scrubber Features: Direct mounting to fume hood exhaust eliminates contaminated

• Pollutants Scrubbed: Acid
• Orientation: Vertical
• Process Type: Wet

Description: Wafer gripper for extreme fast, reliable, precise and gentle handling of wet wafers in wet bench applications Handling of wafers after etching and cleaning processes Loading and unloading of conveyor belts Fully or partially automated production of silicon wafers with maximum

Description: Low viscosity, solvent-free photo-curable NIL resist specifically designed for use with rigid and gas-impermeable working stamps like COC, COP, OrmoStamp®, or glass. Mask for pattern transfer processes (dry and wet etching) No adhesion promoter or primer necessary Very low release

• Applications: Electronics / Microelectronics
• Thick Film Type: Resistor

Description: alloys. For aluminum alloys: vapor or non-etching alkaline degreasing; sulfuric acid-sodium dichromate or sulfuric acid-ferric sulfate solution etching; phosphoric and sulfuric acid anodizing; propriety cleaning; secondary bonding; brush plate bond etching; mechanical abrasion;

Description: The Hiden Plasma Workstation, an integrated RF-ICP reactor / plasma analyser system for all you plasma process studies.

• Form Factor: Controller, Monitor / Instrument
• Measurements: Deposition Rate
• Applications: Etching - Plasma / Wet, Optical Components
• Mounting / Loading: In-situ / System Mounted

Description: The ESPion advanced Langmuir probe for rapid, reliable and accurate plasma diagnostics for industry and academia.

• Form Factor: Controller, Wafer Probing System
• Measurements: Deposition Rate
• Applications: Etching - Plasma / Wet
• Mounting / Loading: In-situ / System Mounted

Description: The Hiden EQP is a combined Mass / Energy analyser for the analysis of positive AND negative ions, neutrals, and radicals from plasma processes.

• Form Factor: Controller, Monitor / Instrument
• Measurements: Deposition Rate, Endpoint Detection / Plasma Diagnostics
• Applications: Etching - Plasma / Wet, Optical Components
• Mounting / Loading: In-situ / System Mounted

Description: Tronics will take on your MEMS project and bring it to production, whether it is a mature product or still a concept requiring prototyping iterations. Our goal is to establish reliable supply chains for your MEMS products. We have strong experience of industrializing complex MEMS with sensitive

• Services: Design / Engineering, Production, Prototyping, R & D / Development
• Capabilities: Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer Bonding, Wet / Chemical Etching
• Features: Europe Only, Specialty / Other
• Materials: Quartz, SOI, Silicon

Description: chromate finish (Mil-C-5541) Etching Satin (Type II) Off-Site Finishing Services Bright Dip Wet Painting Film coating

• Materials: Aluminum
• Coating Capabilities: Chemical Finish / Conversion, Painting, Powder Coating, Screen Printing / Selective Coating
• Industry Served: Commercial / Professional, OEM / Industrial
• Functions & Features: Conductive, Corrosion / Rust Preventive

Description: No Description Provided

• Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Screen Printing, Wafer Bonding,
• Materials: Compound Semiconductor, Glass, Quartz, SOI, Silicon
• Services: Design / Engineering, Pilot / Scale-Up, Production, Prototyping, R & D / Development
• Features: Midwest US Only, North America, Specialty / Other, United States Only

Description: its measurements is guaranteed. Features: Precision measurement from 0.1 to 2000ppmV Fast response in both dry to wet and wet to dry transitions Simple, low cost, on-site maintenance with long service intervals Dryer can be replaced by the user in 10 minutes Accuracy of 0.1ppmV or 10%

• Instrument Type: Analyzer
• Features: Self Calibration
• Measurement Type: Trace

Description: No Description Provided

• Capabilities: 2D / Surface Micromachining, 3D / Bulk Micromachining, Dielectric / CVD Thin Film, Dry Etching (Plasma / RIE), Inspection / Testing, LIGA, Metallization - Electroplating, Metallization - PVD Thin Film, Oxidation / Doping, Packaging / Backend Processing, Photolithography, Wafer Bonding, Wet /
• Materials: Ceramic, Compound Semiconductor, Glass, Metal / Nickel, Polymer / Organic, Quartz, SOI, Silicon
• Services: Design / Engineering, Pilot / Scale-Up, Production, Prototyping, R & D / Development
• Features: North America, Southwest US Only, Specialty / Other, United States Only

Description: Mo/Cu wet etching. In electrode layers, copper is mostly used in combination with a molybdenum adhesion promotion layer/diffusion barrier. To structure the Mo-Cu multilayers, we have worked together with the Korean Aerospace University and leading chemicals manufacturers to develop a

• Type: Sputtering Target

Description: The CS-153 is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use FPM solution to etch silicon oxide and remove particles from the wafer surface. The CS-153 continually

• Process Media Temperature: 68 to 176 F
• Operating Temperature: 68 to 77 F
• Electrical Output: Analog Current Output, Switch / Alarm Relay Output
• Display Type: Digital Display

Description: The CS-153N is a high-precision chemical solution concentration monitor designed to meet the strict demands of semiconductor wet-etching processes. Etching processes use HF/HNO3 solution to etch silicon oxide and remove particles from the wafer surface. The CS-153N continually

• Process Media Temperature: 68 to 176 F
• Operating Temperature: 68 to 77 F
• Electrical Output: Analog Current Output, Switch / Alarm Relay Output
• Display Type: Digital Display

Description: by coils. While the material is properly magnetized, the magnetic particles may be applied by either the dry method, wet method, or fluorescent method. The parts shall also be sufficiently demagnetized after inspection so that residual or leakage fields will not interfere with future

Description: to characterization of stainless steel surfaces that are smoother than Ra = 0.25 [mu]m, as determined by a contact-stylus profilometer and defined by ANSI B46.1. The magnifications and height scales used in this test method were chosen with this smoothness in mind. 1.2.2 Intentional etching

Description: hairline, auto degreasing or cleaning, laser etching for precise finishing needs Cleanroom manufacturing Class 100 to Class 100K, ultrasonic cleaning Levelling with CMM (Coordinate Measuring Machine) Complete assembly solutions including rivets, studs, brackets, NC riveting, auto tapping

• Secondary Operations: CNC Machining, Drilling / Tapping, Heat Treating / Stress Relieving, Painting / Powder Coating, Tool Making, Welding
• Features: East Asia / Pacific Only, Europe Only, North America, Oceania Only, Other
• Materials: Ferrous Metals, Nonferrous Metals
• Stamping Capabilities: Progressive Dies

Description: to characterization of stainless steel surfaces that are smoother than Ra = 0.25 μm, as determined by a contact-stylus profilometer and defined by ANSI B46.1. The magnifications and height scales used in this test method were chosen with this smoothness in mind. 1.2.2 Intentional etching or

Description: ability to perform precise blending and dilution automatically. In processes like Chemical Mechanical Planarization (CMP) or wet etching, chemicals often require exact mixing ratios to be effective. By utilizing PLC automation and non-contact sensors, the CDM eliminates human error,

• Body Material: Stainless Steel

Description: pressure regulators, the CDS prevents “shedding”—the release of metal ions or particles into the chemical stream. This is vital for sub-micron fabrication, where even a single contaminant can lead to catastrophic yield loss during wet etching or CMP processes. Safety is equally

• Body Material: Stainless Steel

Description: material science. By using 316L electropolished stainless steel with a 5Ra surface finish, the equipment prevents corrosion and “shedding,” ensuring the chemical remains as pure at the point of use as it was at the source. This is critical for processes like Wet Etching and Chemical

• Body Material: Stainless Steel