The impedance characteristics of a power distribution system are analyzed in the previous chapter based on a one-dimensional circuit model. While useful for understanding the principles of the overall operation of a power distribution system, a one-dimensional model is not useful in describing the distribution of power and ground across a circuit die. The size of an integrated circuit is usually considerably greater than the wavelength of the signals in the power distribution network. Furthermore, the power consumption of on-chip circuitry (and, consequently, the current drawn from the power distribution network) varies across the die area. The voltage across the on-chip power and ground distribution networks is therefore non-uniform. It is therefore necessary to consider the two-dimensional structure of the on-chip power distribution network to ensure that target performance characteristics of a power distribution system are satisfied. The on-chip power distribution network should also be considered in the context of a die-package system as the properties of the die-package interface significantly affect the constraints imposed on the electrical characteristics of the on-chip power distribution network.

The objectives of this chapter is to describe the structure of an on-chip power distribution network as well as review related tradeoffs. Various structural styles of on-chip power distribution networks are described in Section 7.1. The influence of the electrical characteristics of the die-package interface on the on-chip power and ground distribution is analyzed in Section 7.2. The influence of the on-chip power distribution network on the integrity of the on-chip signals is discussed in...