System-in-Package RF Design and Applications

System-in-Package RF Design and Applications

Michael P. Gaynor
BOSTON LONDON artechhouse.com

Library of Congress Cataloging-in-Publication Data

A catalog record for this book is available from the U.S. Library of Congress.

British Library Cataloguing in Publication Data

A catalogue record for this book is available from the British Library.

ISBN-10: 1-58053-905-x

ISBN-13:

978-1-58053-905-0

Cover design by
Igor Valdman

2007 ARTECH HOUSE, INC.

685 Canton Street
Norwood, MA 02062

All rights reserved. Printed and bound in the United States of America. No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording, or by any information storage and retrieval system, without permission in writing from the publisher.

All terms mentioned in this book that are known to be trademarks or service marks have been appropriately capitalized. Artech House cannot attest to the accuracy of this information. Use of a term in this book should not be regarded as affecting the validity of any trademark or service mark.

10 9 8 7 6 5 4 3 2 1

In loving memory of my parents, Philip Paul Gaynor and Betty Jane Fessett Sheldon Gaynor, for their patience with and nurturing of a stubborn, inquisitive child who wouldn't accept "because" as an answer

About the Author

Michael P. Gaynor is a technical director of RF engineering, designing power amplifier modules and front-end modules with indium phosphide semiconductors, at Xindium Technology, a start-up company that specializes in indium phosphide power amplifiers. He started his electrical engineering career...

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